HCM1103-R36-R

Technical Data 4449 Effective July 2017 Supersedes June 2012 HCM1103 High current power inductors Applications Product features • 11.5 x 10.3 x 3.0 mm maximum surface mount package • Iron powder core material • Magnetically shielded, low EMI • High current carrying capacity, low core losses • Inductance range from 0.12 µH to 22.0 µH • Current range from 3.0 A to 75 A • Halogen free, lead free, RoHS compliant • Voltage Regulator Module (VRM) • Multi-phase regulators • Point-of-load modules • Desktop and server VRMs and EVRDs • Base station equipment • Notebook and laptop regulators • Battery power systems • Graphics cards • Data networking and storage systems Environmental Data • Storage temperature range (Component): -55 °C to +125 °C • Operating temperature range: -55 °C to +125 °C (ambient plus self-temperature rise) • Solder reflow temperature: J-STD-020 (latest revision) compliant HALOGEN Pb HF FREE  Technical Data 4449 Effective July 2017  Product Specifications Part Number6 HCM1103-R12-R HCM1103-R36-R HCM1103-R47-R HCM1103-R68-R HCM1103-1R0-R HCM1103-2R2-R HCM1103-3R3-R HCM1103-4R7-R HCM1103-8R2-R HCM1103-100-R HCM1103-150-R HCM1103-220-R OCL1 ±20% (µH) 0.12 0.36 0.47 0.68 1.0 2.2 3.3 4.7 8.2 10.0 15.0 22.0 FLL min.2 (µH) 0.07 0.26 0.33 0.38 0.56 1.2 1.9 2.6 4.6 5.6 8.4 12.3 Irms3 (A) 30 23 20 21 15 13 9.0 7.0 5.0 5.0 4.0 3.0 1. Open Circuit Inductance (OCL) Test Parameters: 100 kHz, 0.25 Vrms, 0.0 Adc @ +25 °C 2. Full Load Inductance (FLL) Test Parameters: 100 kHz, 0.25 Vrms, Isat @ +25 °C. 3. Irms: DC current for an approximate temperature rise of 40 °C without core loss. Derating is necessary for AC currents. PCB layout, trace thickness and width, air-flow and proximity of other heat generating components will affect the temperature rise. It is recommended that the temperature of the part not exceed +125 °C under worst case operating conditions verified in the end application. Isat4 @ +25 °C (A) 75 28 26 23 21 16 14 13 8.5 7.5 6.0 5.0 DCR (mΩ) @ +20 °C Typical DCR (mΩ) @ +20 °C Maximum 0.55 1.10 1.50 2.90 5.50 8.40 14.5 20.5 35.0 40.0 59.0 90.0 0.61 1.30 2.00 3.40 6.00 9.00 16.0 22.5 38.5 44.0 65.0 99.0 K-Factor5 1200 711 515 510 377 264 230 205 153 141 114 91 4. Isat: Peak current for approximately 30% rolloff at +25 °C 5. K-factor: Used to determine Bp-p for core loss (see graph). Bp-p = K * L * ∆I. Bp-p:(Gauss), K: (K-factor from table), L: (Inductance in µH), ∆I (peak-to-peak ripple current in Amps). 6. Part Number Definition: HCM1103-xxx-R HCM1103 = Product code and size xxx= Inductance value in µH, R = decimal point, if no R is present then third character = number of zeros. -R suffix = RoHS compliant Dimensions (mm) Top View HCM1103-R36-R & HCM1103-R47-R Top View HCM1103-R12-R & HCM1103-R68-R to HCM1103-220R Side View Bottom View wlyy R wlyy R Part Marking: xxx = Inductance value in uH, R = decimal point, if no R is present then third character = # of zeros. wlyy = (Date code), R = Revision Level All soldering surfaces to be coplanar within 0.10 millimeters. Tolerances are ±0.3 millimeters unless stated otherwise. HCM1103-R36-R and HCM1103-R47-R Color: Top Grey HCM1103-R12-R and HCM1103-R68-R to HCM1103-220-R Color : Top Grey Do not route traces or vias underneath the inductor 2 www.eaton.com/electronics Recommended Pad Layout Schematic HCM1103 High current power inductors Technical Data 4449 Effective July 2017 Packaging information (mm) wlyy R Supplied in tape and reel packaging, 1000 parts per 13” diameter reel. wlyy R Temperature rise vs. total loss 6 0 .0 Temperature Rise (°C) 5 0 .0 4 0 .0 HCM1103-R12-R HCM1103-R36-R HCM1103-R47-R 3 0 .0 HCM1103-R68-R HCM1103-1R0-R HCM1103-2R2-R HCM1103-3R3-R 2 0 .0 HCM1103-4R7-R HCM1103-8R2-R HCM1103-100-R HCM1103-150-R 1 0 .0 HCM1103-220-R 0 .0 0 .0 0 .2 0 .4 0 .6 0 .8 1 .0 1 .2 1 .4 1 .6 Total Loss (W) www.eaton.com/electronics 3  Technical Data 4449 Effective July 2017  Core loss vs. Bp-p HCM1103-; R36-R and R47-R 10000 300K 1000 200K 100K Core Loss (mW) 50K 100 25K 10 1 0.1 10 100 1000 10000 Bp-p (Gauss) HCM1103-; R12-R, R68-R through 220-R 10000.0 500K 300K 200K 1000.0 100K Core Loss (mW) 50K 25K 100.0 10.0 1.0 0.1 10 100 1000 Bp-p (Gauss) 4 www.eaton.com/electronics 10000 HCM1103 High current power inductors Technical Data 4449 Effective July 2017 Inductance characteristics HCM1103-; R36-R, R47-R HCM1103-R12-R 100% 100% 90% 90% 80% 80% % of OCL 110% % of OCL 110% 70% 70% 60% 60% 50% 50% 40% 40% 30% 0 10 20 30 40 50 60 70 HCM1103-R36-R HCM1103-R47-R 30% 80 0 Idc (A) 5 10 15 HCM1103-; R68-R, 1R0-R 35 40 45 100% 90% 90% 80% 80% % of OCL % of OCL 30 110% 100% 70% 60% 70% 60% 50% 50% HCM1103-R68-R 40% 0 HCM1103-2R2-R 40% HCM1103-1R0-R HCM1103-3R3-R 5 10 15 20 25 30 35 40 30% Idc(A) 0 2 4 6 8 10 HCM1103-4R7-R 14 16 18 20 22 24 26 HCM1103-; 8R2-R, 100-R 110% 100% 100% 90% 80% 80% % of OCL 90% 70% 70% 60% 60% 50% 50% HCM1103-8R2-R 40% 40% HCM1103-100-R 30% 30% 12 Idc (A) 110% % of OCL 25 HCM1103-; 2R2-R, 3R3-R 110% 30% 20 Idc (A) 0 2 4 6 8 Idc (A) 10 12 14 16 18 0 2 4 8 6 10 12 14 Idc (A) www.eaton.com/electronics 5  Technical Data 4449 Effective July 2017  Inductance characteristics 110% 100% 90% % of OCL 80% 70% 60% 50% HCM1103-150-R 40% 30% HCM1103-220-R 0 2 4 6 Idc (A) 6 www.eaton.com/electronics 8 10 12  Technical Data 4449 Effective July 2017  Solder reflow profile TP TC -5°C tP Max. Ramp Up Rate = 3°C/s Max. Ramp Down Rate = 6°C/s Temperature TL Preheat A T smax t Table 1 - Standard SnPb Solder (Tc) Package Thickness Volume mm3