TAI-TECH
TBM02-190700939
Power Inductor
HPC5020B-R47Y
ECN HISTORY LIST
REV
1.0
DATE
P1
DESCRIPTION
APPROVED
CHECKED
DRAWN
楊祥忠
詹偉特
張嘉玲
19/08/01 新發行
備
註
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TAI-TECH
TBM02-190700939
Power Inductor
P2
HPC5020B-R47Y
1. Features
Halogen
1. This specification applies Low Profile Power Inductors.
2. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
3. Operating temperature:-40~+125℃(Including self-temperature rise)
Halogen-free
2. Dimension
H
I
R47
G
I
Series
A(mm)
B(mm)
C(mm)
D(mm)
E(mm)
F(mm)
G(mm)
H(mm)
I(mm)
HPC5020B
4.9±0.2
4.9±0.2
2.0 max.
1.2±0.2
3.3±0.2
1.3 typ.
3.6 ref.
4.0 ref.
1.5 ref.
3. Part Numbering
HPC
5020
B
A
B
C
-
R47
Y
D
E
A: Series
B: Dimension
C: Control S/N
D: Inductance
R47=0.47uH
E: Inductance Tolerance
Y=±30%
4. Specification
TAI-TECH
Part Number
Inductance
(uH)
HPC5020B-R47Y
0.47
Tolerance Test Frequency
(%)
(Hz)
±30%
SRF
(MHz) min.
DCR
(Ω) ±20%
I sat
(A) max.
I rms
(A) max.
230
0.012
6.1
5.0
1V100K
Note:
Isat:Based on inductance change (△L/L0:≦-30%)@ ambient temp. 25℃
Irms:Based on temperature rise (△T:40℃ typ.)
HPC5020B-R47
HPC5020B-R47
0.8
20
0.6
0
-10
L(%)
INDUCTANCE(uH)
10
0.4
-20
-30
0.2
-40
-50
-60
0.1
1
10
100
1000
0
1
FREQUENCY(MHz)
2
3
4
5
DC CURRENT(A)
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6
7
8
TAI-TECH
Core chipping
TBM02-190700939
P3
The appearance standard of the chipping size on top side, and bottom side ferrite core is listed below.
Type
L
W
HPC5020B
1.5mm Max.
1.5mm Max.
Void appearance tolerance Limit
Size of voids occurring to coating resin is specified below.
Exposed wire tolerance limit of coating resin part on product side.
Size of exposed wire occurring to coating resin is specified below.
1. Width direction(dimension a):Acceptable when a≦w/2
Nonconforming when a>w/2
2. Length direction(dimension b):Dimension b is not specified.
3. The total area of exposed wire occurring to each sides is
not greater than 50% of coating resin area, and is acceptable.
External appearance criterion for exposed wire
Exposed end of the winding wire at the secondary side should be 3mm and below.
5. Electrode appearance criterion for exposed wire
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TAI-TECH
TBM02-190700939
P4
6. Material List
No.
Item
Material
1
Core
Ni-Zn ferrite
2
Wire
Enameled Copper Wire
3
Glue
Epoxy with magnetic powder
4
Terminal
Ag/Ni/Sn+Sn Solder
5
Ink
Epoxy resin
Color : silver
7. Reliability and Test Condition
Item
Performance
Operating temperature
-40~+125℃ (Including self - temperature rise)
Storage temperature
-40~+125℃ (on board)
Test Condition
Electrical Performance Test
HP4284A,CH11025,CH3302,CH1320,CH1320S
LCR Meter.
Inductance
Refer to standard electrical characteristics list.
DCR
Saturation Current (Isat)
CH16502,Agilent33420A Micro-Ohm Meter.
Saturation DC Current (Isat) will cause L0
to drop △L(%)
△L≦30%
Heat Rated Current (Irms) will cause the coil temperature rise
△T(℃)
Heat Rated Current (Irms)
Approximately △T40℃
1.Applied the allowed DC current
2.Temperature measured by digital surface thermometer
Reliability Test
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles)
Temperature: 125±2℃
Applied current:rated current
Duration:1000±12hrs
Measured at room temperature after placing for 24±2 hrs
Life Test
Load Humidity
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Humidity:85±2﹪R.H,
Temperature:85℃±2℃
Duration:1000hrs Min. with 100% rated current
Measured at room temperature after placing for 24±2 hrs
Moisture Resistance
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification Reflow
Profiles
1. Baked at50℃ for 25hrs, measured at room temperature after
placing for 4 hrs.
2. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in 2.5hrs.
3. Raise temperature to 65±2℃ 90-100%RH in 2.5hrs, and
keep 3 hours, cool down to 25℃ in
2.5hrs,keep at 25℃ for 2 hrs then keep at -10℃ for 3 hrs
4. Keep at 25℃ 80-100%RH for 15min and vibrate at the
frequency of 10 to 55 Hz to 10 Hz, measure at
room temperature after placing for 1~2 hrs.
Appearance:No damage.
Inductance:within±10% of initial value
RDC:within ±15% of initial value and shall not
exceed the specification value
Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC
J-STD-020DClassification
Reflow Profiles
Condition for 1 cycle
Step1:-40±2℃ 30±5min
Step2:25±2℃ ≦0.5min
Step3:125±2℃ 30±5min
Number of cycles: 500
Measured at room temperature after placing for 24±2 hrs
Thermal shock
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TAI-TECH
TBM02-190700939
Item
Performance
P5
Test Condition
Oscillation Frequency: 10Hz~2KHz~10Hz for 20 minutes
Equipment: Vibration checker
Total Amplitude:10g
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)
Vibration
Shall be mounted on a FR4 substrate of the
following dimensions:
>=0805 inch(2012mm):40x100x1.2mm
=0805 inch(2012mm):1.2mm
0805inch(2012mm):1kg ,
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