TAI-TECH
P1
SMD Power Inductor
HPC8040NF-Series
ECN HISTORY LIST
REV
DATE
DESCRIPTION
APPROVED
CHECKED
DRAWN
1.0
14/08/07
新發行
楊祥忠
詹偉特
徐允珮
備
註
TAI-TECH
P2
SMD Power Inductor
HPC8040NF-Series
1. Features
1. This specification applies Low Profile Power Inductors.
2. 100% Lead(Pb) & Halogen-Free and RoHS compliant.
2. Dimension
Halogen
Pb
Halogen-free
Pb-free
Recommendend Land pattern
2R2
B(mm)
B’(mm)
C(mm)
D(mm)
E(mm)
F(mm)
L(mm)
G(mm)
H(mm)
HPC8040NF 8.0±0.3 8.0±0.3
Series
A(mm)
6.3±0.2
3.7±0.3
2.0±0.3
6.0±0.3
5.5±0.3
8.5
5.3
6.3
3. Part Numbering
HPC
8040
N
A
B
C
A: Series
B: Dimension
C: Type
D: Inductance
E: Inductance Tolerance
.
-
2R2
Y
D
E
A/B*C
2R2=2.20uh 100=10uh,101=100uh,102=1000uh
K=±10%,M=±20%,Y=±30%.
marking direction cannot decide polarity. Color: Black, unidirectional
magnetic shielding
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P3
4. Specification
Part Number
Inductance
L0 (uH)
@0A
Rated current
Tolerance
Tempetature current
I rms (A)
Saturation current
I sat (A)
Typ
Max
Typ
Max
DCR
(mΩ) @25℃
±20%.
HPC8040NF-1R0YTH
1.00
±30%
8.50
8.00
13.80
13.00
8.2
HPC8040NF-1R4YTH
1.40
±30%
8.20
7.80
11.80
11.20
10.0
HPC8040NF-1R5YTH
1.50
±30%
8.00
7.70
11.50
11.00
10.0
HPC8040NF-2R2YTH
2.20
±30%
7.40
6.90
9.80
9.20
11.5
HPC8040NF-3R3YTH
3.30
±30%
6.60
6.20
8.00
7.50
15.0
HPC8040NF-4R7MTH
4.70
±20%
5.80
5.30
6.70
6.00
19.5
HPC8040NF-5R6MTH
5.60
±20%
5.40
5.20
6.20
5.80
22.0
HPC8040NF-6R8MTH
6.80
±20%
5.10
5.00
5.60
5.10
25.0
HPC8040NF-100MTH
10.0
±20%
4.60
4.20
5.00
4.30
33.0
HPC8040NF-150MTH
15.0
±20%
3.60
3.20
4.00
3.60
50.0
HPC8040NF-220MTH
22.0
±20%
2.90
2.45
3.10
2.80
73.0
HPC8040NF-330MTH
33.0
±20%
2.30
2.10
2.60
2.10
100
HPC8040NF-470MTH
47.0
±20%
2.00
1.70
2.20
1.90
135
HPC8040NF-560MTH
56.0
±20%
1.75
1.60
1.90
1.60
160
HPC8040NF-680MTH
68.0
±20%
1.65
1.50
1.75
1.50
205
HPC8040NF-820MTH
82.0
±20%
1.40
1.30
1.60
1.40
230
HPC8040NF-101MTH
100
±20%
1.20
1.10
1.45
1.20
300
HPC8040NF-121MTH
120
±20%
1.10
1.00
1.30
1.10
350
HPC8040NF-151MTH
150
±20%
0.98
0.90
1.20
1.03
410
HPC8040NF-181MTH
180
±20%
0.91
0.83
1.04
0.94
490
HPC8040NF-221MTH
220
±20%
0.85
0.76
0.99
0.90
610
Note:
1. All test data referenced to 25℃ ambient , Ls:1MHz/1V.
2. Testing Instrument : HP4284A,CH11025,CH3302,CH1320 ,CH1320S LCR METER / Rdc:CH502BC MICRO OHMMETER.
3. Heat Rated Current (Irms) will cause the coil temperature rise approximately Δt of 40℃ (keep 1min.).
4. Saturation Current (Isat) will cause L0
to drop 30% typical. (keep quickly).
5. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and
thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application.
6. Special inquiries besides the above common used types can be met on your requirement.
TAI-TECH
P4
5. Material List
b
a
c
d
NO
Items
Materials
a
Core
Ferrite Core
b
Wire
Copper Wire
c
Coating
Epoxy with magnetic
d
Solder
Lead free
6. Reliability and Test Condition
Item
Performance
Operating temperature
-40~+125℃
Storage temperature
-40~+125℃ (on board)
Test Condition
Electrical Performance Test
Inductance
Refer to standard electrical characteristics list.
DCR
HP4284A,CH11025,CH3302,CH1320,CH1320S
LCR Meter.
CH502BC,Agilent33420A Micro-Ohm Meter.
Saturation Current (Isat)
△L30% typical.
Saturation DC Current (Isat) will cause L0
to drop △L(%)(keep quickly).
Heat Rated Current (Irms)
Approximately △T≦40℃
Heat Rated Current (Irms) will cause the coil temperature rise
△T(℃) without core loss.
1.Applied the allowed DC current(keep 1 min.).
2.Temperature measured by digital surface thermometer
Reliability Test
Life Test
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles)
Temperature:125±2℃(Bead)
Temperature: 85±2℃(Inductor)
Applied current:rated current
Duration:1000±12hrs
Measured at room temperature after placing for 24±2 hrs
Load Humidity
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC
J-STD-020DClassification Reflow Profiles
Humidity:85±2﹪R.H,
Temperature:85℃±2℃
Duration:1000hrs Min. with 100% rated current
Measured at room temperature after placing for 24±2 hrs
Thermal
shock
Preconditioning: Run through IR reflow for 2
times.( IPC/JEDEC J-STD-020DClassification
Reflow Profiles
Condition for 1 cycle
Step1:-40±2℃ 30±5min
Step2:25±2℃ ≦0.5min
Step3:105±2℃ 30±5min
Number of cycles: 500
Measured at room temperature after placing for 24±2 hrs
Appearance:No damage.
Inductance:within±10% of initial value
Q:Shall not exceed the specification value.
RDC:within ±15% of initial value and shall not
exceed the specification value
Vibration
Shock
Bending
Oscillation Frequency: 10~2K~10Hz for 20 minutes
Equipment: Vibration checker
Total Amplitude:1.52mm±10%
Testing Time : 12 hours(20 minutes, 12 cycles each of 3
orientations)。
Type
Peak
value
(g’s)
Normal
duration (D)
(ms)
Wave
form
Velocity
change
(Vi)ft/sec
SMD
1500
0.5
Half-sine
15.4
Lead
100
6
Half-sine
12.3
Shall be mounted on a FR4 substrate of the
following dimensions: >=0805:40x100x1.2mm
=0805:1.2mm
0805:1kg ,
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