DATA SHEET
SPARK GAP PROTECTORS
POWER SUPPLIES
BK3-MH series
Product specification– February 23, 2021 V.1
RoHS compliant & Halogen free
Circuit Protection
SPARK GAP
Product Specification
BK3-MH SERIES
Spark Gap (SPG) Data Sheet
Features
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Approximately zero leaking current before clamping voltage
Less decay at on/off state.
High capability to withstand repeated lightning strikes.
Low electrode capacitance(≤0.8pF) and high isolation(≥100MΩ).
RoHS compliant.
Bilateral symmetrical.
Temperature, humidity and lightness insensitive.
Operating temperature: -40℃ ~ +85℃
Storage temperature: -40℃ ~ +125℃
Meets MSL level 1, per J-STD-020
Safety certification: UL
Applications
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Power Supplies
Motor sparks eliminating
Relay switching spark absorbing
Data line pulse guarding
Electronic devices requiring UL497A and UL497B compliant
Telephone/Fax/Modem
High frequency signal transmitters/receivers
Satellite antenna
Radio amplifiers
Alarm systems
Cathode ray tubes in Monitors/TVs
Dimensions
d
1.8
t
D
1.2
L
2.4
Symbol
Dimension (mm)
L
4.0±0.5
D
Φ2.1±0.5
d
Φ2.0±0.5
t
0.4±0.1
1.2
Recommended Pad Size(mm)
Circuit Protection
Product Specification
SPARK GAP
BK3-MH SERIES
Electrical Characteristics
Part Number
DC
Spark-over
Voltage
Type
①
Minimum
Insulation
Resistance
Maximum
Capacitance
(1KHz-6VMAX)
Vs(V)
Test
Voltage(V)
IROHM
(MΩ)
C(pf)
Surge
Current
Capacity
(8/20μs)
Surge
Voltage
Capacity
(10/700μs)
BK33000702-M
H
140±30%
50
100
0.8
500A
4KV
BK32001002-M
H
200±20%
100
100
0.8
500A
4KV
BK32001102-M
H
220±20%
100
100
0.8
500A
4KV
BK32001502-M
H
300±20%
100
100
0.8
500A
4KV
BK32002002-M
H
400±20%
250
100
0.8
500A
4KV
BK32002502-M
H
500±20%
250
100
0.8
500A
4KV
BK32003002-M
H
600±20%
250
100
0.8
500A
4KV
BK32003502-M
H
700±20%
250
100
0.8
500A
4KV
BK32005002-M
H
1000±20%
500
100
0.8
500A
4KV
Note:① Specific code by request.
Test Methods and Results
Items
DC Spark-over
Voltage
Insulation
Resistance
Capacitance
Static Life
Surge Current
Capacity
Cold Resistance
Heat Resistance
Humidity Resistance
Temperature Cycle
Solder Ability
Solder Heat
Test Method
Measure starting discharge voltage (Vs) by
gradually increasing applied DC voltage. Test
current is 0.5mA max. And the DC voltage
ascends up within 100V/s(Vs<1000V) or
500V/s(Vs≥1000V).
Measure the insulation resistance across the
terminal at regular voltage. But the test voltage
doesn’t over the DC spark-over voltage.
Measure the electrostatic capacitance by
applying a voltage of less than 6V (at 1KHz)
between terminals.
10KV with 1500pf condenser is discharged
through 0Ω resistor. 200 times at an interval of
10sec.
1.2/50μs & 8/20μs, 500A, ±5 times, each time
interval 60 seconds. Thereafter, outer
appearance shall be visually examined.
Measurement after -40℃/1000 HRS & normal
temperature/2 HRS.
Measurement after 125℃/1000 HRS & normal
temperature/2 HRS.
Measurement after humidity 90~95℃(45℃)
/1000 HRS & normal temperature/2 HRS.
10 times repetition of cycle -40℃/30min
→normal, temp/2 min →125℃/30min,
measurement after normal temp/2 HRS.
Apply flux and immerse in molten solder
230±5℃ for 3sec up to the point of 1.5mm
from body. Check for solder adhesion.
Measurement after lead wire is dipped up to
the point of 1.5mm from body into 260±5℃
solder for 10sec.
Standard
Meet specified value.
Rate-of-change, within ±30%
insulation resistance & capacitance,
conformed to rated spec.
No crack and no failures
Features are conformed to rated
spec.
Lead wire is evenly covered by
solder.
Conformed to rated spec.
Circuit Protection
Product Specification
SPARK GAP
BK3-MH SERIES
Recommended Soldering Conditions
Flow Soldering Conditions
Air Priheat
Soldering
Reflow Soldering Conditions
Air Priheat
Cooling
Cooling
260℃
260℃
250
250
△T
Temperature (℃)
△T
Temperature (℃)
Soldering
200
150
150~180℃
200
150
150~180℃
100
100
50
50
0
0
60~120 sec
60~120 sec
3~4 sec
10 sec. or less
60 sec. or less
1) Time shown in the above figures is measured from the point when chip surface reaches temperature.
2) Temperature difference in high temperature part should be within 110℃.
3) After soldering, do not force cool, allow the parts to cool gradually.
Hand Soldering
Solder iron temperature: 350±5℃
Heating time: 3 seconds max.
General attention to soldering
● High soldering temperatures and long soldering times can cause leaching of the termination, decrease in
adherence strength, and the change of characteristic may occur.
● For soldering, please refer to the soldering curves above. However, please keep exposures to temperatures
exceeding 200℃ to fewer than 50 seconds.
● Please use a mild flux (containing less than 0.2wt% CI). Also, if the flux is water soluble, be sure to wash
thoroughly to remove any residue from the underside of components that could affect resistance.
Cleaning
When using ultrasonic cleaning, the board may resonate if the output power is too high. Since this vibration
can cause cracking or a decrease in the adherence of the termination, we recommend that you use the
conditions below.
Frequency: 40kHz max.
Output power: 20W/liter
Cleaning time: 5 minutes max.
Circuit Protection
Product Specification
SPARK GAP
BK3-MH SERIES
Packaging
Tape
P0
P1
P2
D0
B
T
E
F
A
A
D1
B
W
B0
K0
Symbol
Dimension (mm)
W
12.00±0.20
P0
4.00±0.10
P1
4.00±0.10
P2
2.00±0.05
D0
Φ1.5±0.05
D1
Φ1.0±0.10
E
1.75±0.10
F
5.50±0.05
A0
2.40±0.10
B0
4.20±0.10
K0
2.20±0.10
T
0.25±0.05
D
178.0±3.0
d
13.0±1.0
L
15.0±3.0
SECTION B-B
A0
SECTION A-A
Reel
d
D
L
Quantity: 2000PCS
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