CPI201210UF-1R5M-0A8

TAI-TECH TBM01-140400755 High Current Ferrite Chip Inductor (Lead Free) CPI201210UF-Series ECN HISTORY LIST REV DATE DESCRIPTION 1.0 13/06/06 變更可靠度條件 2.0 14/01/24 APPROVED CHECKED DRAWN 楊祥忠 羅培君 張嘉玲 楊祥忠 羅培君 張嘉玲 變更電鍍錫層厚度 3.0um min.=>3.5um min. 備 註 www.tai-tech.com.tw P1. TAI-TECH TBM01-140400755 High Current Ferrite Chip Inductor (Lead Free) P2. CPI201210UF-Series 1.Features 1. 2.0x1.25 mm and 1.0 mm in height (very compact size): CAE and fine printing technology made this compact size possible 2. Stable minimum DC resistance in the class. 3. High speed mounting: Using SMT mounter makes less than a second mounting possible. 4. Excellent mounting strength by SMD chip making. 5. Reduced noise over 2/3 of coil inductor by optimal design of CAD Completely lead-free product and support lead-free solder. Halogen Pb Halogen-free Pb-free 2. Dimensions Chip Size Series A(mm) B(mm) C(mm) D(mm) 201210 2.0±0.2 1.25±0.2 1.0 max. 0.5±0.3 3. Part Numbering CPI 201210 U F A B C A: Series B: Dimension C: Category Code D: Material E: Inductance F: Inductance Tolerance G: Rated Current D - 2R2 M E - F 0A8 G LxW Lead Free Material 2R2=2.2uH M=±20% 0A8=800mA 4.Specification Tai-Tech DCR (Ω) Test Frequency Rated Current (MHz) (mA) max. max. typ. Inductance(uH) Part Number CPI201210UF-R47M-1A2 0.47±20% 1 1200 0.08 0.06 CPI201210UF-1R0M-1A0 1.0±20% 1 1000 0.14 0.11 CPI201210UF-1R5M-0A8 1.5±20% 1 800 0.20 0.15 CPI201210UF-2R2M-0A8 2.2±20% 1 800 0.20 0.15 CPI201210UF-3R3M-0A7 3.3±20% 1 700 0.24 0.20 CPI201210UF-4R7M-0A7 4.7±20% 1 700 0.28 0.23 ● Rated Current： based on temperature rise test Inductance-Frequency Characteristics „ 100 CPI201210UF L vs DC Bias 100 INDUCTANCE (uH) INDUCTANCE(uH) Inductance VS DC Bias Current „ CPI201210UF L vs Freq. 10 4R7 3R3 2R2 1R5 1R0 1 R47 10 4R7 3R3 2R2 1R5 1 1R0 R47 0.1 0.1 1 10 100 1000 10 100 1000 DC CURRENT(mA) FREQUENCY(MHz) www.tai-tech.com.tw 10000 TAI-TECH TBM01-140400755 P3. 5. Reliability and Test Condition Item Performance Test Condition -40~+85℃ (Including self-temperature rise) Operating Temperature Transportation Storage Temperature -For long storage conditions, please see the -40~+85℃ Application Notice Agilent4291 Agilent E4991 Inductance (Ls) Agilent4287 Refer to standard electrical characteristics list Agilent16192 DC Resistance Agilent 4338 Rated Current DC Power Supply Over Rated Current requirements, there will be some risk 1. Applied the allowed DC current. 2. Temperature measured by digital surface thermometer. Rated Current < 1A ∆T 20℃Max Temperature Rise Test Resistance to Soldering Heat Rated Current ≧ 1A ∆T 40℃Max Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Preheat: 150℃,60sec. Solder: Sn99.5%-Cu0.5% Solder tamperature: 260±5℃ Flux for lead free: Rosin. 9.5% Temperature ramp/immersion and immersion rate: 25±6 mm/s Dip time: 10±1sec. Depth: completely cover the termination. Preheating Dipping Natural cooling 260° C 150° C 60 second Preheating Dipping Natural cooling More than 95% of the terminal Solderability electrode should be covered 245° C 150° C with solder. Terminal strength Bending Vibration Test 60 second 4±1 second Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Appearance：No damage. Impedance：within±10% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value Appearance：No damage. Impedance：within±15% of initial value Inductance：within±10% of initial value Q：Shall not exceed the specification value. RDC：within ±15% of initial value and shall not exceed the specification value 10±1.0 second Preheat: 150℃,60sec. Solder: Sn99.5%-Cu0.5% Solder tamperature: 245±5℃ Flux for lead free: Rosin. 9.5% Depth: completely cover the termination. Dip time: 4±1sec. Preconditioning: Run through IR reflow for 2 times.( IPC/JEDEC J-STD-020D Classification Reflow Profiles) Component mounted on a PCB apply a force (>0805:1kg =0805:40x100x1.2mm =0805:1.2mm 1GΩ Derating **Derating Curve Derated Current(A) 6 For the ferrite chip bead which withstanding current over 1.5A, as the operating temperature over 85℃, the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve. 5 4 3 2 1 6A 5A 4A 3A 2A 1.5A 1A 0 85 125 Environment Temperature+△Temperature(°C) 6.Soldering and Mounting 6-1. Recommended PC Board Pattern Land Patterns For Reflow Soldering Chip Size Serie Type CPI 201210 A(mm) B(mm) C(mm) D(mm) 2.0±0.20 1.25±0.20 1.0 max. 0.5±0.30 L(mm) G(mm) H(mm) 3.00 1.00 1.00 L H P4. PC board should be designed so that products can prevent damage from mechanical stress when warping the board. G 6-2. Soldering Mildly activated rosin fluxes are preferred. The terminations are suitable for re-flow soldering systems. If hand soldering cannot be avoided, the preferred technique is the utilization of hot air soldering tools. Note. If wave soldering is used ,there will be some risk. Re-flow soldering temperatures below 240 degrees, there will be non-wetting risk 6-2.1 Lead Free Solder re-flow: Recommended temperature profiles for lead free re-flow soldering in Figure 1. (Refered to J-STD-020C) www.tai-tech.com.tw TAI-TECH TBM01-140400755 P5. 6-2.2 Soldering Iron: Products attachment with a soldering iron is discouraged due to the inherent process control limitations. If a soldering iron must be employed the following precautions are recommended. for Iron Soldering in Figure 2. •Preheat circuit and products to 150℃ •350℃ tip temperature (max) •Never contact the ceramic with the iron tip •1.0mm tip diameter (max) Iron Soldering Reflow Soldering PRE-HEATING SOLDERING 20~40s 60~150s 200 150 60~180s SOLDERING within 4~5s TEMPERATURE(° C) 217 PRE-HEATING NATURAL COOLING TP(260° C / 40s max.) TEMPERATURE(° C) •Use a 20 watt soldering iron with tip diameter of 1.0mm •Limit soldering time to 4~5sec. NATURAL COOLING 350 150 Gradual cooling Over 60s 480s max. 25 TIME(sec.) TIME( sec.) Reflow times: 3 times max Fig.1 Iron Soldering times：1 times max Fig.2 6-2.3 Solder Volume: Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in right side: Minimum fillet height = soldering thickness + 25% product height Upper limit Recommendable t 7. Packaging Information 7-1. Reel Dimension COVER TAPE Type A(mm) B(mm) C(mm) D(mm) 7”x8mm 10±1.5 50 or more 13±0.2 178±2.0 C B D 2.0±0.5 A EMBOSSED CARRIER 7-2 Tape Dimension / 8mm ■Material of taping is plastic Size A(mm) B(mm) K(mm) F(mm) T(mm) 201210 1.55±0.1 2.30±0.1 1.30 max. 4.0±0.1 0.30±0.05 www.tai-tech.com.tw TAI-TECH TBM01-140400755 7-3. Packaging Quantity Chip size 201210 Reel 3000 7-4. Tearing Off Force F Top cover tape The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. 165° to180° Base tape Room Temp. Room Humidity Room atm Tearing Speed (℃) (%) (hPa) mm/min 5~35 45~85 860~1060 300 Application Notice •Storage Conditions To maintain the solder ability of terminal electrodes: 1. TAI-TECH products meet IPC/JEDEC J-STD-020D standard-MSL, level 1. 2. Temperature and humidity conditions: Less than 40℃ and 60% RH. 3. Recommended products should be used within 12 months from the time of delivery. 4. The packaging material should be kept where no chlorine or sulfur exists in the air. •Transportation 1.Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 2. The use of tweezers or vacuum pick up is strongly recommended for individual components. 3. Bulk handling should ensure that abrasion and mechanical shock are minimized. www.tai-tech.com.tw P6.