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1Z38400002

1Z38400002

  • 厂商:

    YL(惠伦晶体)

  • 封装:

    XO-4P_1612(METRIC)

  • 描述:

    无源晶振 38.4MHz ±10ppm 8pF 50Ω SMD1612_4P -30℃~+105℃

  • 数据手册
  • 价格&库存
1Z38400002 数据手册
PRODUCT SPECIFICATION SHEET Customer Customer P/N - Product Type Temperature Sensing Crystal Part Number 1Z38400002 Part Description Nominal Frequency Prepared Li Xiang Reviewed Kuro Peng Approved Xing Yue Date Version B2 SMD TSX 1.6 x 1.2 (TH + Xtal) 38.4 Customer's Approval & Date: 2022-6-10 廣東惠倫晶體科技股份有限公司 中 国 广 东 省 东 莞 市 黄 江 镇 东 环 路 鸡 啼 岗 段 68 号 68 Donghuan Road, Jitigang Village, Huangjiang, Dongguan, Guangdong Province, P. R. China WEB : http://www.dgylec.com/ TEL : +86 ( 0 ) 769 - 38879888 FAX : +86 ( 0 ) 769 - 38879889 EMAIL : yl@dgylec.com FAITH LONG CRYSTAL Proprietary and Confidential Information RoHS COMPLIANT Pb Lead-Free Moisture Sensitivity Level 1 Page 1 of 14 SMD TSX 1.6 x 1.2 (TH + Xtal) PN: 1Z38400002 Ver. B2 CONTENTS # Item 1 History of Specification Revision 3 2 Electrical Specifications 4 3 4 5 6 Page 2.1 Specifications for operation condition and electrical characteristics 4 2.2 Specifications for crystal drive level dependency (DLD) 5 2.3 Specifications for GPS quality 6 2.4 NTC thermistor specification table 7 Product Design 8 3.1 Package dimensions and pad functions 8 3.2 Recommended land pattern 8 3.3 Recommended reflow profile 8 3.4 Marking definition 9 3.5 Recommended reflow profile 9 3.6 Structure illustration 10 Reliability Assurance 11 4.1 Mechanical endurance 11 4.2 Environmental endurance 11 Taping and Packing 12 5.1 Tape and reel 12 5.2 Packing standard 13 Specification of the Environment-related Substances FAITH LONG CRYSTAL Proprietary and Confidential Information 14 Page 2 of 14 SMD TSX 1.6 x 1.2 (TH + Xtal) PN: 1Z38400002 Ver. B2 1. History of Specification Revision Ver. Content Date Reviser Remark A0 Initial released. 2017-5-10 N/A K. Yasuda A1 Add revision record sheet. 2018-4-10 P.2 K. Yasuda A2 #3 Change reference temperature from 30℃ to 29℃. 2018-5-29 P.2 K. Yasuda A3 Correct Suggested Reflow Profile. 2019-3-8 P.2 Chen XuanRu A4 P.8 Delete Pressure Cooker Storage; P.10 Change packaging requirement; P.11 Change Specification of the environment-related substances. 2020-3-20 P.4 P.5 Chen XuanRu B0 P.3 Change ESR, change item 20. 2020-7-22 P.3 Chen XuanRu B1 Update marking 2021-10-13 P.2 May B2 Add ESD & MSL 2022-6-10 P.2 Li Xiang FAITH LONG CRYSTAL Proprietary and Confidential Information Page 3 of 14 SMD TSX 1.6 x 1.2 (TH + Xtal) PN: 1Z38400002 Ver. B2 2. Electrical Specifications 2.1 Specifications for operation condition and electrical characteristics # Parameter Min. Typ. 1 Nominal frequency 38.400000 2 Crystal cut type AT-cut 3 Mode of vibration Fundamental 4 ESD HBM>2000V 5 MSL Level 1 Load capacitance (C ) 6 8.0 L 7 Drive level 10 8 Operating temperature range -30 9 Storage temperature range -40 - Max. 200 +105 +105 Unit MHz pF mW °C °C Remark JESD22-A114-B IPC/JEDEC J-STD-033C Note 1. 10 Initial frequency tolerance -10 - +10 ppm At 25±3°C, drive level 10mW 11 Frequency drift after reflow -2.0 - +2.0 ppm After two times of reflow 12 Frequency tolerance over temperature -12 - +12 ppm Within -30°C to +85°C. Above +85°C see Note 2. 13 14 15 16 17 18 Frequency aging Equivalent series resistance (ESR) Insulation resistance Quality factor (Q) Spurious mode series resistance Pullability -0.7 500 75,000 1,100 7 - +0.7 50 16 ppm/yr Ω MΩ Ω ppm/pF Note 3. Note 4. Within ±1 MHz offset. Specified at max drive level. 𝐶2 𝑡 = 𝑡0 − 3𝐶3 19 Inflection point 27.5 - 30.5 °C 20 First-order curve fitting parameter (C1) -0.4 - -0.1 ppm/°C Note 5. 21 Second-order curve fitting parameter (C2) -4.5 0 +4.5 x10-4 ppm/°C2 Note 5. 22 Third-order curve fitting parameter (C3) +8.5 +10.0 +11.5 x10 3 ppm/°C -5 Note 5. Note 1 Note 2 Note 3 The load capacitance is measured according to IEC Standard #60444-8. Above 85°C, the frequency tolerance over temperature is bound by the third order coefficient range. The ESR max is specified at max drive level minimum Q, drives a smaller ESR; that is, design the crystal to the minimum Q. Note 4 Note 5 The minimum Q value calculated from ESR and L is smaller than this specification. The curve fitting parameter is obtained from the QTI crystal curve fitting algorithm, using the temperature inflection point t0 = 24.5°C (option A), or t0 = 27.5°C (option B). Refer to Curve Fit Calculation Table Spreadsheet (80-V9695-23). FAITH LONG CRYSTAL Proprietary and Confidential Information Page 4 of 14 SMD TSX 1.6 x 1.2 (TH + Xtal) PN: 1Z38400002 Ver. B2 2. Electrical Specifications (Cont.) 2.2 Specifications for crystal drive level dependency (DLD) # Parameter Min. 1 Drive level measurement condition 0.01 Typ. Max. Unit Remarks - 250 mW Drive level from 0.01 μW to 250 μW to 0.01 μW 2 Number of points 3 DLD Frequency (Maximum - Minimum) - - 6 ppm Define as FDLD. Note 6. 4 DLD Frequency (Repeatability) - - 0.7 ppm Define as FDLDH. Note 7. 5 DLD ESR (Maximum) - - 20 % Define as RLD2. Note 8. 6 DLD ESR (Repeatability) - - 10 % Define as DLDH3. Note 7 and Note 9. Note 6 Note 7 Note 8 Note 9 Note 10 Note 11 29 points 15 points up and 15 points down = 29 total data points. Maximum - minimum: Difference between the maximum and minimum in a two-way measurement. Repeatability of the two-way measurement is defined in the above Drive level measurement condition. Maximum: ESR at 250 μW drive level is 30 Ω. For DLD ESR (Repeatability), the change rate is defined as (ESR2 - ESR1)/ESR1. ESR1: This is the first measurement on each drive level. ESR2: This is the second measurement on each drive level. FAITH LONG CRYSTAL Proprietary and Confidential Information Page 5 of 14 SMD TSX 1.6 x 1.2 (TH + Xtal) PN: 1Z38400002 Ver. B2 2. Electrical Specifications (Cont.) 2.3 Specifications for GPS quality # Parameter 1 Min. Drive level measurement condition Typ. Max. 250 Unit Remarks mW All measurements in GPS quality are taken at 250 μ W drive level. 2 Residual frequency stability slope 1 -100 - +100 ppb/°C Within -30°C to -15°C. Note 13 and Note 14 (Condition 1A). 3 Residual frequency stability slope 2 -50 - +50 ppb/°C Within -15°C to +70°C. Note 13 and Note 14 (Condition 1A). 4 Residual frequency stability slope 3 -100 - +100 ppb/°C Within +70°C to +85°C. Note 13 and Note 14 (Condition 1A). 5 5°C small orbit hysteresis 1-1 -100 - +100 ppb/°C Within -30°C to -15°C. Note 15 (Condition 1B). 6 5°C small orbit hysteresis 1-2 -50 - +50 ppb/°C Within -15°C to +70°C. Note 15 (Condition 1B). 7 5°C small orbit hysteresis 1-3 -100 - +100 ppb/°C Within +70°C to +85°C. Note 15 (Condition 1B). 8 5°C small orbit hysteresis 2 100 (magnitude) ppb pk-pk Note 16. Note 13 Note 14 Residual = difference from fifth-order curve fit. Must meet below 1A (Note 14) and 1B (Note 15) conditions: Condition 1A – Test condition (continuous temperature rate change of ~1.0°C/min.):  Measure F/T points every 1°C, heating up from -30 to +85°C, subtract a fifth-order polynomial best fit and then calculate the slope of the residual. Note 15 Condition 1B – Hysteresis 1 test condition (continuous temperature rate change of ~1.0°C/minute):  Measure F/T points every 0.5°C while cycling temperature over a 5°C small temperature orbit; an example 5°C small orbit temperature cycle is +30°C to +35°C to +30°C.  During every individual heating/cooling cycle, there should be 11 points. Discard the first point of each heating and cooling cycle. This leaves 10 points for each heating and cooling cycle. Subtract the fifthorder polynomial best fit from 1A for each of the 10 points, and then calculate the slope of the residual for each of these heating and cooling 10 point curves. Note 16 Hysteresis 2 test condition (continuous temperature rate change of ~1.0°C/min.):  Measure F/T points every 0.5°C while cycling temperature over a 5°C small temperature orbit; an example 5°C small orbit temperature cycle is +30°C to +35°C to +30°C.  During every individual heating/cooling cycle there should be 11 points; discard the first and last point of each heating and cooling cycle, which results in 9 temperature points. Calculate the average measured peak-to-peak frequency difference for these 9 temperature points.  The average difference is the magnitude of the small orbit hysteresis 2. FAITH LONG CRYSTAL Proprietary and Confidential Information Page 6 of 14 SMD TSX 1.6 x 1.2 (TH + Xtal) PN: 1Z38400002 Ver. B2 2. Electrical Specifications (Cont.) 2.4 NTC thermistor specification table # Parameter 1 Operating temperature range 2 Storage temperature range 3 Resistance 4 B-constant 5 Tolerance Min. -30 -40 - FAITH LONG CRYSTAL Proprietary and Confidential Information Typ. 100 4,250 - Max. +105 +105 1 Unit °C °C kΩ K % Remarks At 25°C At 25°C - 50°C Page 7 of 14 PN: 1Z38400002 SMD TSX 1.6 x 1.2 (TH + Xtal) Ver. B2 3. Product Design 3.1 Package dimensions and pad functions Top view (Unit : mm) 3.2 Pad connection diagram and function Bottom view 1.6± 0.1 0.1 1.6± #3 #1 #2 #1 #2 #4 #3 1.2± 0.1 #4 0.22 0.65 Max. Lateral view Bottom view Pad 1 2 3 4 Function Xtal in Thermistor out, connecting to ground Xtal out Thermistor in #1 #2 #4 #3 0.3 0.1 0.15 1.01 3.3 Recommended land pattern (Unit : mm) FAITH LONG CRYSTAL Proprietary and Confidential Information Page 8 of 14 PN: 1Z38400002 SMD TSX 1.6 x 1.2 (TH + Xtal) Ver. B2 3. Product Design (Cont.) 3.4 Marking definition Frequency EX: 38.400MHz = 384 YL lot (2 digits) year month code Administrative Symbo Table of Year and Month code Month JAN FEB Year 2021 2022 2023 2024 2025 2026 2027 2028 A N a n B P b p MAR APR MAY JUN JUL AUG SEP OCT NOV DEC C Q c q D R d r E S e s F T f t G U g u H V h v J W j w K X k x L Y l y M Z m z 3.5 Recommended reflow profile 10 sec. Max. Temp. (1) Total time : 360 sec. Max. (2) Solder melting point : 225℃ 260 5 220 60 sec. Max. 180 150 120 sec. Max. Time (sec.) FAITH LONG CRYSTAL Proprietary and Confidential Information Page 9 of 14 SMD TSX 1.6 x 1.2 (TH + Xtal) PN: 1Z38400002 Ver. B2 3. Product Design (Cont.) 3.6 Structure illustration # 1 Components Cap (Lid) 2 Base (Package) 3 4 5 6 Pad (Package) Crystal blank Electrode Conductive adhesive 7 Thermistor 8 Solder Materials Kovar (Fe + Co + Ni) Ceramic (AI2O3) + Kovar (Fe + Co + Ni) Ni + Au SiO2 Cr + Nobel material Ag Alumina Ceramics (Al2O3), Ni + Ag+ Sn QTY 1 Finish/Specifications Ni plating 1 Alumina ceramics 4 1 2 2 Tungsten metalization + Ni plating + Au plating - 1 - Sn + Ag + Cu 2 - FAITH LONG CRYSTAL Proprietary and Confidential Information Silicone resin Page 10 of 14 SMD TSX 1.6 x 1.2 (TH + Xtal) PN: 1Z38400002 Ver. B2 4. Reliability Assurance 4.1 Mechanical endurance # Item Test Condition Reference 1 Drop test 150 cm height, fall freely onto stainless plate, 3 times. JIS C6701 2 Shock test 150 g weight, 150 cm height onto concrete floor. Each direction (±x, ±y, ±z) for 3 cycles. IEC-68-02-27 3 Mechanical shock Half sine wave 1000 G. Three mutually perpendicular axes, each axis for 3 times. Duration time 1.0ms. MIL-STD-202F 4 Vibration 10 to 55 Hz 0.75mm, 55 to 2000Hz 20G, 4 hours to each three axis (x, y, z). Total test time 6 hours. MIL-STD-883E 5 Gross Leak Standard sample for automatic gross leak detector. Test pressure: 2kg /cm2. MIL-STD-883E 6 Fine Leak Helium bombing 4.5 kgf/cm for 2 hours. Solderability Temperature : 260°C ± 5°C Immersing depth : 0.5 mm minimum Immersion time : 5 ± 1 seconds Flux : Rosin resin methyl alcohol solvent (1:4) 7 *Storage conditions :18 months 4.2 Environmental endurance # Item 2 MIL-STD-883E GB/T 2424.17-2008 / IEC 60068-244:1995;GB/T 2423.28-2005 / IEC 60068-2-20:1979 *Constant humidity :40~70% Test Condition Reference 1 High temperature storage Temperature : +125°C ± 3°C Duration : 500 ± 12 hours MIL-STD-883E 2 Low temperature storage Temperature : -40°C ± 3°C Duration : 500 ± 12 hours MIL-STD-883E Total 100 cycles of the following temperature cycle 1 cycle 3 Thermal shock (Air to Air) 125 ± 3 oC MIL-STD-883E 25 oC -40 ± 3 oC 10 min. 10 min. 10 min. max. 4 High temperature & humidity Temperature : 85°C ± 3°C Humidity : RH 85% Duration : 500 hours FAITH LONG CRYSTAL Proprietary and Confidential Information JIS C5023 Page 11 of 14 SMD TSX 1.6 x 1.2 (TH + Xtal) PN: 1Z38400002 Ver. B2 5. Taping and Packing 5.1 Tape and reel (EIA-481-2) Direction of feed Index mark Direction of products Carrier tape Reel Cover tape Reel label (Model, Qty, Lot, ...) Package Type Dimension (Unit : mm) A0 B0 1.45±0.1 1.85±0.1 1612 TSX (8mm) P1 P2 4.00±0.1 2.00±0.1 Standard Reel Quantity is 3000 pcs per reel. The inspection standard of tape tension Item K0 0.8±0.10 D1 1.20±0.1 T 0.25±0.05 D0 1.55±0.05 W 8.00±0.3 P0 4.00±0.1 E 1.75±0.1 Defect Method F 3.50±0.1 Appearance All 1. The tape is not coincidence 2. The bubble Visual inspection Tape tension 1612 - 8mm Overstep 34±6g (28 to 40g) Pull test FAITH LONG CRYSTAL Proprietary and Confidential Information Page 12 of 14 SMD TSX 1.6 x 1.2 (TH + Xtal) PN: 1Z38400002 Ver. B2 5. Taping and Packing (Cont.) 5.2 Packing standard Out-going packing instruction Reel packing Name:Reel Standard:Diameter 18cm Material:Plastics Name:Anti-static shielding bag Standard:205250mm Material:APET/CPP Inner packing Name:Bubble wrap Standard:430330(t)20mm Material:HDPE Quantity : Max.15 reels Carton Name:Carton Standard:400400(H)280mm Material:AB corrugated paper Quantity:4 bags L1 L2 The label information Label Label Drawing Name of Article Spec. L1 条码标签 Bar Code Label (Chintz Paper) 1. Part No. 2. Lot No. 3. Q'ty 4. Freq. 7050mm White L2 条码标签 Bar Code Label (Chintz Paper) 1. Part No. 2. Date Code 3. Q'ty 4. Freq. 7050mm White Remark: Label size Printing Specifications on the label is for default templates purpose and may change with different product. If any specified requirements for labels packaging is needed, please provide the instruction information. FAITH LONG CRYSTAL Proprietary and Confidential Information Page 13 of 14 SMD TSX 1.6 x 1.2 (TH + Xtal) PN: 1Z38400002 Ver. B2 6. Specification of the Environment-related Substances # Range Banned Substances Max. concentration (ppm; mg/kg) Product Packing 1 镉及镉化合物 Cadmium and cadmium compounds 100 100 2 铅及铅化合物 Lead and lead compounds 1000 100 3 汞及汞化合物 Mercury and mercury compounds 1000 100 4 六价铬化合物 +6 Hexavalent-Chromium VI (Cr ) 1000 100 5 聚溴联苯 PBB Polybrominated biphenyls 1000 N/A 6 聚溴二苯醚 PBDE Polybrominated diphenyl ethers 1000 N/A 7 邻苯二甲酸二(2-乙基己基)酯 DEHP Di (2-ethylhexyl) phthalate 1000 N/A 8 邻苯二甲酸丁苄酯 BBP Butyl Benzyl Phthalate 1000 N/A 9 邻苯二甲酸二丁酯 DBP Dibutyl Phthalate 1000 N/A 10 邻苯二甲酸二异丁酯 DIBP Diisobutyl Phthalate 1000 N/A 11 氟(F)、氯(Cl)、溴(Br)、碘(I) Fluorine, Chlorine, Bromine, Iodine 900、900、900、900 注:Br + Cl<1000 N/A 12 包装材料中重金属(汞、镉、六价铬、 铅、PBB、PBDE)之总量 Heavy metals (mercury, cadmium, lead, Cr+6,PBB and PBDE) in packing materials N/A 100 铅(Pb) + 镉(Cd) + 汞(Hg) + 六价 铬(Cr+6)
1Z38400002 价格&库存

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1Z38400002
  •  国内价格
  • 1+1.33200
  • 30+1.28700
  • 100+1.24200
  • 500+1.15200
  • 1000+1.10700
  • 2000+1.08000

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