PRODUCT SPECIFICATION SHEET
Customer
Customer P/N
-
Product Type
Temperature Sensing Crystal
Part Number
1Z38400002
Part Description
Nominal Frequency
Prepared
Li Xiang
Reviewed
Kuro Peng
Approved
Xing Yue
Date
Version
B2
SMD TSX 1.6 x 1.2 (TH + Xtal)
38.4
Customer's Approval & Date:
2022-6-10
廣東惠倫晶體科技股份有限公司
中 国 广 东 省 东 莞 市 黄 江 镇 东 环 路 鸡 啼 岗 段 68 号
68 Donghuan Road, Jitigang Village, Huangjiang,
Dongguan, Guangdong Province, P. R. China
WEB : http://www.dgylec.com/
TEL : +86 ( 0 ) 769 - 38879888
FAX : +86 ( 0 ) 769 - 38879889
EMAIL : yl@dgylec.com
FAITH LONG CRYSTAL Proprietary and Confidential Information
RoHS
COMPLIANT
Pb
Lead-Free
Moisture Sensitivity Level 1
Page 1 of 14
SMD TSX 1.6 x 1.2 (TH + Xtal)
PN: 1Z38400002
Ver.
B2
CONTENTS
#
Item
1
History of Specification Revision
3
2
Electrical Specifications
4
3
4
5
6
Page
2.1 Specifications for operation condition and electrical characteristics
4
2.2 Specifications for crystal drive level dependency (DLD)
5
2.3 Specifications for GPS quality
6
2.4 NTC thermistor specification table
7
Product Design
8
3.1 Package dimensions and pad functions
8
3.2 Recommended land pattern
8
3.3 Recommended reflow profile
8
3.4 Marking definition
9
3.5 Recommended reflow profile
9
3.6 Structure illustration
10
Reliability Assurance
11
4.1 Mechanical endurance
11
4.2 Environmental endurance
11
Taping and Packing
12
5.1 Tape and reel
12
5.2 Packing standard
13
Specification of the Environment-related Substances
FAITH LONG CRYSTAL Proprietary and Confidential Information
14
Page 2 of 14
SMD TSX 1.6 x 1.2 (TH + Xtal)
PN:
1Z38400002
Ver.
B2
1. History of Specification Revision
Ver.
Content
Date
Reviser
Remark
A0
Initial released.
2017-5-10
N/A
K. Yasuda
A1
Add revision record sheet.
2018-4-10
P.2
K. Yasuda
A2
#3 Change reference temperature from 30℃
to 29℃.
2018-5-29
P.2
K. Yasuda
A3
Correct Suggested Reflow Profile.
2019-3-8
P.2
Chen XuanRu
A4
P.8 Delete Pressure Cooker Storage; P.10
Change packaging requirement; P.11 Change
Specification of the environment-related
substances.
2020-3-20
P.4 P.5
Chen XuanRu
B0
P.3 Change ESR, change item 20.
2020-7-22
P.3
Chen XuanRu
B1
Update marking
2021-10-13
P.2
May
B2
Add ESD & MSL
2022-6-10
P.2
Li Xiang
FAITH LONG CRYSTAL Proprietary and Confidential Information
Page 3 of 14
SMD TSX 1.6 x 1.2 (TH + Xtal)
PN: 1Z38400002
Ver.
B2
2. Electrical Specifications
2.1 Specifications for operation condition and electrical characteristics
#
Parameter
Min.
Typ.
1
Nominal frequency
38.400000
2
Crystal cut type
AT-cut
3
Mode of vibration
Fundamental
4
ESD
HBM>2000V
5
MSL
Level 1
Load
capacitance
(C
)
6
8.0
L
7
Drive level
10
8
Operating temperature range
-30
9
Storage temperature range
-40
-
Max.
200
+105
+105
Unit
MHz
pF
mW
°C
°C
Remark
JESD22-A114-B
IPC/JEDEC J-STD-033C
Note 1.
10
Initial frequency tolerance
-10
-
+10
ppm
At 25±3°C, drive level
10mW
11
Frequency drift after reflow
-2.0
-
+2.0
ppm
After two times of reflow
12
Frequency tolerance over temperature
-12
-
+12
ppm
Within -30°C to +85°C.
Above +85°C see Note 2.
13
14
15
16
17
18
Frequency aging
Equivalent series resistance (ESR)
Insulation resistance
Quality factor (Q)
Spurious mode series resistance
Pullability
-0.7
500
75,000
1,100
7
-
+0.7
50
16
ppm/yr
Ω
MΩ
Ω
ppm/pF
Note 3.
Note 4.
Within ±1 MHz offset.
Specified at max drive
level.
𝐶2
𝑡 = 𝑡0 −
3𝐶3
19
Inflection point
27.5
-
30.5
°C
20
First-order curve fitting parameter (C1)
-0.4
-
-0.1
ppm/°C
Note 5.
21
Second-order curve fitting parameter
(C2)
-4.5
0
+4.5
x10-4
ppm/°C2
Note 5.
22
Third-order curve fitting parameter (C3)
+8.5
+10.0
+11.5
x10
3
ppm/°C
-5
Note 5.
Note 1
Note 2
Note 3
The load capacitance is measured according to IEC Standard #60444-8.
Above 85°C, the frequency tolerance over temperature is bound by the third order coefficient range.
The ESR max is specified at max drive level minimum Q, drives a smaller ESR; that is, design the crystal to the
minimum Q.
Note 4
Note 5
The minimum Q value calculated from ESR and L is smaller than this specification.
The curve fitting parameter is obtained from the QTI crystal curve fitting algorithm, using the temperature
inflection point t0 = 24.5°C (option A), or t0 = 27.5°C (option B). Refer to Curve Fit Calculation Table
Spreadsheet (80-V9695-23).
FAITH LONG CRYSTAL Proprietary and Confidential Information
Page 4 of 14
SMD TSX 1.6 x 1.2 (TH + Xtal)
PN: 1Z38400002
Ver.
B2
2. Electrical Specifications (Cont.)
2.2 Specifications for crystal drive level dependency (DLD)
#
Parameter
Min.
1
Drive level measurement condition
0.01
Typ.
Max.
Unit
Remarks
-
250
mW
Drive level from 0.01 μW
to 250 μW to 0.01 μW
2
Number of points
3
DLD Frequency (Maximum - Minimum)
-
-
6
ppm
Define as FDLD.
Note 6.
4
DLD Frequency (Repeatability)
-
-
0.7
ppm
Define as FDLDH.
Note 7.
5
DLD ESR (Maximum)
-
-
20
%
Define as RLD2.
Note 8.
6
DLD ESR (Repeatability)
-
-
10
%
Define as DLDH3.
Note 7 and Note 9.
Note 6
Note 7
Note 8
Note 9
Note 10
Note 11
29
points
15 points up and 15
points down = 29 total
data points.
Maximum - minimum: Difference between the maximum and minimum in a two-way measurement.
Repeatability of the two-way measurement is defined in the above Drive level measurement condition.
Maximum: ESR at 250 μW drive level is 30 Ω.
For DLD ESR (Repeatability), the change rate is defined as (ESR2 - ESR1)/ESR1.
ESR1: This is the first measurement on each drive level.
ESR2: This is the second measurement on each drive level.
FAITH LONG CRYSTAL Proprietary and Confidential Information
Page 5 of 14
SMD TSX 1.6 x 1.2 (TH + Xtal)
PN: 1Z38400002
Ver.
B2
2. Electrical Specifications (Cont.)
2.3 Specifications for GPS quality
#
Parameter
1
Min.
Drive level measurement condition
Typ.
Max.
250
Unit
Remarks
mW
All measurements in GPS
quality are taken at 250 μ
W drive level.
2
Residual frequency stability slope 1
-100
-
+100
ppb/°C
Within -30°C to -15°C.
Note 13 and Note 14
(Condition 1A).
3
Residual frequency stability slope 2
-50
-
+50
ppb/°C
Within -15°C to +70°C.
Note 13 and Note 14
(Condition 1A).
4
Residual frequency stability slope 3
-100
-
+100
ppb/°C
Within +70°C to +85°C.
Note 13 and Note 14
(Condition 1A).
5
5°C small orbit hysteresis 1-1
-100
-
+100
ppb/°C
Within -30°C to -15°C.
Note 15 (Condition 1B).
6
5°C small orbit hysteresis 1-2
-50
-
+50
ppb/°C
Within -15°C to +70°C.
Note 15 (Condition 1B).
7
5°C small orbit hysteresis 1-3
-100
-
+100
ppb/°C
Within +70°C to +85°C.
Note 15 (Condition 1B).
8
5°C small orbit hysteresis 2
100 (magnitude)
ppb pk-pk
Note 16.
Note 13
Note 14
Residual = difference from fifth-order curve fit. Must meet below 1A (Note 14) and 1B (Note 15) conditions:
Condition 1A – Test condition (continuous temperature rate change of ~1.0°C/min.):
Measure F/T points every 1°C, heating up from -30 to +85°C, subtract a fifth-order polynomial best fit
and then calculate the slope of the residual.
Note 15
Condition 1B – Hysteresis 1 test condition (continuous temperature rate change of ~1.0°C/minute):
Measure F/T points every 0.5°C while cycling temperature over a 5°C small temperature orbit; an
example 5°C small orbit temperature cycle is +30°C to +35°C to +30°C.
During every individual heating/cooling cycle, there should be 11 points. Discard the first point of each
heating and cooling cycle. This leaves 10 points for each heating and cooling cycle. Subtract the fifthorder polynomial best fit from 1A for each of the 10 points, and then calculate the slope of the residual
for each of these heating and cooling 10 point curves.
Note 16
Hysteresis 2 test condition (continuous temperature rate change of ~1.0°C/min.):
Measure F/T points every 0.5°C while cycling temperature over a 5°C small temperature orbit; an
example 5°C small orbit temperature cycle is +30°C to +35°C to +30°C.
During every individual heating/cooling cycle there should be 11 points; discard the first and last point
of each heating and cooling cycle, which results in 9 temperature points. Calculate the average
measured peak-to-peak frequency difference for these 9 temperature points.
The average difference is the magnitude of the small orbit hysteresis 2.
FAITH LONG CRYSTAL Proprietary and Confidential Information
Page 6 of 14
SMD TSX 1.6 x 1.2 (TH + Xtal)
PN: 1Z38400002
Ver.
B2
2. Electrical Specifications (Cont.)
2.4 NTC thermistor specification table
#
Parameter
1
Operating temperature range
2
Storage temperature range
3
Resistance
4
B-constant
5
Tolerance
Min.
-30
-40
-
FAITH LONG CRYSTAL Proprietary and Confidential Information
Typ.
100
4,250
-
Max.
+105
+105
1
Unit
°C
°C
kΩ
K
%
Remarks
At 25°C
At 25°C - 50°C
Page 7 of 14
PN: 1Z38400002
SMD TSX 1.6 x 1.2 (TH + Xtal)
Ver.
B2
3. Product Design
3.1 Package dimensions and pad functions
Top view
(Unit : mm)
3.2 Pad connection diagram and function
Bottom view
1.6± 0.1
0.1
1.6±
#3
#1
#2
#1
#2
#4
#3
1.2± 0.1
#4
0.22
0.65 Max.
Lateral view
Bottom view
Pad
1
2
3
4
Function
Xtal in
Thermistor out, connecting to ground
Xtal out
Thermistor in
#1
#2
#4
#3
0.3
0.1
0.15
1.01
3.3 Recommended land pattern
(Unit : mm)
FAITH LONG CRYSTAL Proprietary and Confidential Information
Page 8 of 14
PN: 1Z38400002
SMD TSX 1.6 x 1.2 (TH + Xtal)
Ver.
B2
3. Product Design (Cont.)
3.4 Marking definition
Frequency
EX: 38.400MHz = 384
YL
lot (2 digits)
year month code
Administrative Symbo
Table of Year and Month code
Month
JAN FEB
Year
2021
2022
2023
2024
2025
2026
2027
2028
A
N
a
n
B
P
b
p
MAR
APR
MAY
JUN
JUL
AUG
SEP
OCT
NOV
DEC
C
Q
c
q
D
R
d
r
E
S
e
s
F
T
f
t
G
U
g
u
H
V
h
v
J
W
j
w
K
X
k
x
L
Y
l
y
M
Z
m
z
3.5 Recommended reflow profile
10 sec. Max.
Temp.
(1) Total time : 360 sec. Max.
(2) Solder melting point : 225℃
260 5
220
60 sec. Max.
180
150
120 sec. Max.
Time (sec.)
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Page 9 of 14
SMD TSX 1.6 x 1.2 (TH + Xtal)
PN: 1Z38400002
Ver.
B2
3. Product Design (Cont.)
3.6 Structure illustration
#
1
Components
Cap (Lid)
2
Base (Package)
3
4
5
6
Pad (Package)
Crystal blank
Electrode
Conductive adhesive
7
Thermistor
8
Solder
Materials
Kovar (Fe + Co + Ni)
Ceramic (AI2O3) +
Kovar (Fe + Co + Ni)
Ni + Au
SiO2
Cr + Nobel material
Ag
Alumina Ceramics
(Al2O3), Ni + Ag+ Sn
QTY
1
Finish/Specifications
Ni plating
1
Alumina ceramics
4
1
2
2
Tungsten metalization + Ni plating + Au plating
-
1
-
Sn + Ag + Cu
2
-
FAITH LONG CRYSTAL Proprietary and Confidential Information
Silicone resin
Page 10 of 14
SMD TSX 1.6 x 1.2 (TH + Xtal)
PN: 1Z38400002
Ver.
B2
4. Reliability Assurance
4.1 Mechanical endurance
#
Item
Test Condition
Reference
1
Drop test
150 cm height, fall freely onto stainless plate, 3 times.
JIS C6701
2
Shock test
150 g weight, 150 cm height onto concrete floor.
Each direction (±x, ±y, ±z) for 3 cycles.
IEC-68-02-27
3
Mechanical shock
Half sine wave 1000 G. Three mutually perpendicular
axes, each axis for 3 times. Duration time 1.0ms.
MIL-STD-202F
4
Vibration
10 to 55 Hz 0.75mm, 55 to 2000Hz 20G, 4 hours to each
three axis (x, y, z). Total test time 6 hours.
MIL-STD-883E
5
Gross Leak
Standard sample for automatic gross leak detector.
Test pressure: 2kg /cm2.
MIL-STD-883E
6
Fine Leak
Helium bombing 4.5 kgf/cm for 2 hours.
Solderability
Temperature : 260°C ± 5°C
Immersing depth : 0.5 mm minimum
Immersion time : 5 ± 1 seconds
Flux : Rosin resin methyl alcohol solvent (1:4)
7
*Storage conditions :18 months
4.2 Environmental endurance
#
Item
2
MIL-STD-883E
GB/T 2424.17-2008
/ IEC 60068-244:1995;GB/T
2423.28-2005 / IEC
60068-2-20:1979
*Constant humidity :40~70%
Test Condition
Reference
1
High temperature storage
Temperature : +125°C ± 3°C
Duration : 500 ± 12 hours
MIL-STD-883E
2
Low temperature storage
Temperature : -40°C ± 3°C
Duration : 500 ± 12 hours
MIL-STD-883E
Total 100 cycles of the following temperature cycle
1 cycle
3
Thermal shock
(Air to Air)
125 ± 3 oC
MIL-STD-883E
25 oC
-40 ± 3 oC
10 min.
10 min.
10 min. max.
4
High temperature &
humidity
Temperature : 85°C ± 3°C
Humidity : RH 85%
Duration : 500 hours
FAITH LONG CRYSTAL Proprietary and Confidential Information
JIS C5023
Page 11 of 14
SMD TSX 1.6 x 1.2 (TH + Xtal)
PN: 1Z38400002
Ver.
B2
5. Taping and Packing
5.1 Tape and reel (EIA-481-2)
Direction of feed
Index mark
Direction of products
Carrier tape
Reel
Cover tape
Reel label (Model, Qty, Lot, ...)
Package Type
Dimension (Unit : mm)
A0
B0
1.45±0.1
1.85±0.1
1612 TSX (8mm)
P1
P2
4.00±0.1
2.00±0.1
Standard Reel Quantity is 3000 pcs per reel.
The inspection standard of tape tension
Item
K0
0.8±0.10
D1
1.20±0.1
T
0.25±0.05
D0
1.55±0.05
W
8.00±0.3
P0
4.00±0.1
E
1.75±0.1
Defect
Method
F
3.50±0.1
Appearance
All
1. The tape is not coincidence
2. The bubble
Visual inspection
Tape tension
1612 - 8mm
Overstep 34±6g (28 to 40g)
Pull test
FAITH LONG CRYSTAL Proprietary and Confidential Information
Page 12 of 14
SMD TSX 1.6 x 1.2 (TH + Xtal)
PN: 1Z38400002
Ver.
B2
5. Taping and Packing (Cont.)
5.2 Packing standard
Out-going packing instruction
Reel packing
Name:Reel
Standard:Diameter 18cm
Material:Plastics
Name:Anti-static shielding bag
Standard:205250mm
Material:APET/CPP
Inner packing
Name:Bubble wrap
Standard:430330(t)20mm
Material:HDPE
Quantity : Max.15 reels
Carton
Name:Carton
Standard:400400(H)280mm
Material:AB corrugated paper
Quantity:4 bags
L1
L2
The label information
Label
Label Drawing
Name of Article
Spec.
L1
条码标签
Bar Code Label
(Chintz Paper)
1. Part No.
2. Lot No.
3. Q'ty
4. Freq.
7050mm
White
L2
条码标签
Bar Code Label
(Chintz Paper)
1. Part No.
2. Date Code
3. Q'ty
4. Freq.
7050mm
White
Remark:
Label size
Printing
Specifications on the label is for default templates purpose and may change with different product.
If any specified requirements for labels packaging is needed, please provide the instruction information.
FAITH LONG CRYSTAL Proprietary and Confidential Information
Page 13 of 14
SMD TSX 1.6 x 1.2 (TH + Xtal)
PN: 1Z38400002
Ver.
B2
6. Specification of the Environment-related Substances
#
Range
Banned Substances
Max. concentration (ppm; mg/kg)
Product
Packing
1
镉及镉化合物
Cadmium and cadmium compounds
100
100
2
铅及铅化合物
Lead and lead compounds
1000
100
3
汞及汞化合物
Mercury and mercury compounds
1000
100
4
六价铬化合物
+6
Hexavalent-Chromium VI (Cr )
1000
100
5
聚溴联苯 PBB
Polybrominated biphenyls
1000
N/A
6
聚溴二苯醚 PBDE
Polybrominated diphenyl ethers
1000
N/A
7
邻苯二甲酸二(2-乙基己基)酯 DEHP
Di (2-ethylhexyl) phthalate
1000
N/A
8
邻苯二甲酸丁苄酯 BBP
Butyl Benzyl Phthalate
1000
N/A
9
邻苯二甲酸二丁酯 DBP
Dibutyl Phthalate
1000
N/A
10
邻苯二甲酸二异丁酯 DIBP
Diisobutyl Phthalate
1000
N/A
11
氟(F)、氯(Cl)、溴(Br)、碘(I)
Fluorine, Chlorine, Bromine, Iodine
900、900、900、900
注:Br + Cl<1000
N/A
12
包装材料中重金属(汞、镉、六价铬、
铅、PBB、PBDE)之总量
Heavy metals (mercury, cadmium, lead,
Cr+6,PBB and PBDE) in packing materials
N/A
100
铅(Pb) + 镉(Cd) + 汞(Hg) + 六价
铬(Cr+6)
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