ESP32-C6-WROOM-1
ESP32-C6-WROOM-1U
Datasheet
Module that supports 2.4 GHz Wi-Fi 6 (802.11 ax), Bluetooth® 5 (LE), Zigbee and Thread
(802.15.4)
Built around ESP32-C6 series of SoCs, 32-bit RISC-V single-core microprocessor
Flash up to 16 MB
23 GPIOs, rich set of peripherals
On-board PCB antenna or external antenna connector
ESP32-C6-WROOM-1
ESP32-C6-WROOM-1U
Pre-release v0.6
Espressif Systems
Copyright © 2023
www.espressif.com
1 Module Overview
1 Module Overview
Note:
Check the link or the QR code to make sure that you use the latest version of this document:
https://espressif.com/documentation/esp32-c6-wroom-1-wroom-1u_datasheet_en.pdf
1.1 Features
– 20 MHz and 40 MHz bandwidth
CPU and On-Chip Memory
– Data rate up to 150 Mbps
• ESP32-C6 embedded, 32-bit RISC-V single-core
microprocessor, up to 160 MHz
– Wi-Fi Multimedia (WMM)
• ROM: 320 KB
– TX/RX A-MPDU, TX/RX A-MSDU
• HP SRAM: 512 KB
– Immediate Block ACK
• LP SRAM: 16 KB
– Fragmentation and defragmentation
– Transmit opportunity (TXOP)
Wi-Fi
– Automatic Beacon monitoring (hardware
• 1T1R in 2.4 GHz band
TSF)
• Operating frequency: 2412 ~ 2484 MHz
– 4 × virtual Wi-Fi interfaces
• IEEE 802.11ax-compliant
– Simultaneous support for Infrastructure BSS
– 20 MHz-only non-AP mode
in Station mode, SoftAP mode, Station +
SoftAP mode, and promiscuous mode
– MCS0 ~MCS9
Note that when ESP32-C6 scans in Station
– Uplink and downlink OFDMA, especially
mode, the SoftAP channel will change along
suitable for simultaneous connections in
with the Station channel
high-density environments
– 802.11mc FTM
– Downlink MU-MIMO (multi-user, multiple
input, multiple output) to increase network
Bluetooth
capacity
– Beamformee that improves signal quality
• Bluetooth LE: Bluetooth 5.3 certified
– Channel quality indication (CQI)
• Bluetooth mesh
– DCM (dual carrier modulation) to improve
• High power mode (20 dBm)
link robustness
• Speed: 125 Kbps, 500 Kbps, 1 Mbps, 2 Mbps
– Spatial reuse to maximize parallel
• Advertising extensions
transmissions
• Multiple advertisement sets
– Target wake time (TWT) that optimizes
• Channel selection algorithm #2
power saving mechanisms
• Fully compatible with IEEE 802.11b/g/n protocol
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1 Module Overview
• Internal co-existence mechanism between Wi-Fi
Note:
and Bluetooth to share the same antenna
* Please refer to ESP32-C6 Series Datasheet for
detailed information about the module peripherals.
IEEE 802.15.4
Integrated Components on Module
• Compliant with IEEE 802.15.4-2015 protocol
• 40 MHz crystal oscillator
• OQPSK PHY in 2.4 GHz band
• SPI flash
• Data rate: 250 Kbps
Antenna Options
• Thread 1.3
• On-board PCB antenna (ESP32-C6-WROOM-1)
• Zigbee 3.0
• External antenna via a connector
(ESP32-C6-WROOM-1U)
Peripherals
Operating Conditions
• GPIO, SPI, parallel IO interface, UART, I2C, I2S,
RMT (TX/RX), pulse counter, LED PWM, USB
Serial/JTAG controller, MCPWM, SDIO2.0 slave
controller, GDMA, TWAI® controller, on-chip
debug functionality via JTAG, event task matrix,
ADC, temperature sensor, general-purpose
timers, watchdog timers, etc.
• Operating voltage/Power supply: 3.0 ~ 3.6 V
• Operating ambient temperature:
– 85 °C version module: –40 ~ 85 °C
– 105 °C version module: –40 ~ 105 °C
1.2 Description
ESP32-C6-WROOM-1 and ESP32-C6-WROOM-1U are two powerful, general-purpose Wi-Fi, IEEE 802.15.4,
and Bluetooth LE modules. The rich set of peripherals and high performance make the module an ideal choice
for smart homes, industrial automation, health care, consumer electronics, etc.
ESP32-C6-WROOM-1 comes with a PCB antenna. ESP32-C6-WROOM-1U comes with a connector for an
external antenna. They both feature an external SPI flash up to 16 MB.
Both ESP32-C6-WROOM-1 and ESP32-C6-WROOM-1U come in two versions:
• 85 °C version
• 105 °C version
The two versions only vary in maximum ambient temperature and flash part number. In this datasheet unless
otherwise stated, ESP32-C6-WROOM-1 refers to the ESP32-C6-WROOM-1 module in 85 °C and 105 °C
versions, and ESP32-C6-WROOM-1U refers to the ESP32-C6-WROOM-1U module in 85 °C and 105 °C
versions.
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1 Module Overview
The series comparison for the two modules is as follows:
Table 1: ESP32-C6-WROOM-1 (ANT) Series Comparison1
Ordering Code
ESP32-C6-WROOM-1-N4
ESP32-C6-WROOM-1-H4
Flash
Size2
(°C)
(mm)
–40 ∼ 85
4 MB (Quad SPI)
ESP32-C6-WROOM-1-N8
8 MB (Quad SPI)
ESP32-C6-WROOM-1-N16
16 MB (Quad SPI)
1
Ambient Temp.1
–40 ∼ 105
18.0 × 25.5 × 3.2
–40 ∼ 85
This table shares the same notes presented in Table 2 below.
Table 2: ESP32-C6-WROOM-1U (CONN) Series Comparison
Ordering Code
ESP32-C6-WROOM-1U-N4
ESP32-C6-WROOM-1U-H4
Flash
Size2
(°C)
(mm)
–40 ∼ 85
4 MB (Quad SPI)
–40 ∼ 105
ESP32-C6-WROOM-1U-N8
8 MB (Quad SPI)
ESP32-C6-WROOM-1U-N16
16 MB (Quad SPI)
1
Ambient Temp.1
18.0 × 19.2 × 3.2
–40 ∼ 85
Ambient temperature specifies the recommended temperature range of the environment
immediately outside the Espressif module.
2
For details, refer to Section 8.1 Physical Dimensions.
At the core of the modules is ESP32-C6, a 32-bit RISC-V single-core processor.
ESP32-C6 integrates a rich set of peripherals including SPI, parallel IO interface, UART, I2C, I2S, RMT (TX/RX),
LED PWM, USB Serial/JTAG controller, MCPWM, SDIO2.0 slave controller, GDMA, TWAI® controller, on-chip
debug functionality via JTAG, event task matrix, as well as up to 23 GPIOs, etc.
Note:
* For more information on ESP32-C6, please refer to ESP32-C6 Series Datasheet.
1.3 Applications
• Smart Home
• POS machines
• Industrial Automation
• Service robot
• Health Care
• Audio Devices
• Consumer Electronics
• Generic Low-power IoT Sensor Hubs
• Smart Agriculture
• Generic Low-power IoT Data Loggers
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Contents
Contents
1
Module Overview
2
1.1
Features
2
1.2
Description
3
1.3
Applications
4
2
Block Diagram
9
3
Pin Definitions
10
3.1
Pin Layout
10
3.2
Pin Description
10
3.3
Strapping Pins
11
3.3.1
SDIO Sampling and Driving Clock Edge Control
13
3.3.2
Chip Boot Mode Control
13
3.3.3
ROM Messages Printing Control
13
3.3.4
JTAG Signal Source Control
14
4
Electrical Characteristics
15
4.1
Absolute Maximum Ratings
15
4.2
Recommended Operating Conditions
15
4.3
DC Characteristics (3.3 V, 25 °C)
15
4.4
Current Consumption Characteristics
16
4.4.1
Current Consumption in Active Mode
16
4.4.2
Current Consumption in Other Modes
17
5
RF Characteristics
18
5.1
Wi-Fi Radio (2.4 GHz/5 GHz)
18
5.1.1
Wi-Fi RF Transmitter (TX) Characteristics
18
5.1.2
Wi-Fi RF Receiver (RX) Characteristics
19
5.2
5.3
Bluetooth 5 (LE) Radio
21
5.2.1
Bluetooth LE RF Transmitter (TX) Characteristics
21
5.2.2
Bluetooth LE RF Receiver (RX) Characteristics
22
802.15.4 Radio
24
5.3.1
802.15.4 RF Transmitter (TX) Characteristics
25
5.3.2
802.15.4 RF Receiver (RX) Characteristics
25
6
Module Schematics
26
7
Peripheral Schematics
28
8
Physical Dimensions and PCB Land Pattern
29
8.1
Physical Dimensions
29
8.2
Recommended PCB Land Pattern
30
8.3
Dimensions of External Antenna Connector
32
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Contents
9
Product Handling
33
9.1
Storage Conditions
33
9.2
Electrostatic Discharge (ESD)
33
9.3
Soldering Profile
33
9.3.1
33
9.4
Reflow Profile
Ultrasonic Vibration
34
10 Related Documentation and Resources
35
Revision History
36
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List of Tables
List of Tables
1
ESP32-C6-WROOM-1 (ANT) Series Comparison
4
2
ESP32-C6-WROOM-1U (CONN) Series Comparison
4
3
Pin Definitions
10
4
Default Configuration of Strapping Pins
12
5
Description of Timing Parameters for the Strapping Pins
12
6
SDIO Input Sampling Edge/Output Driving Edge Control
13
7
Boot Mode Control
13
8
ROM Messages Printing Control
14
9
JTAG Signal Source Control
14
10
Absolute Maximum Ratings
15
11
Recommended Operating Conditions
15
12
DC Characteristics (3.3 V, 25 °C)
15
13
Current Consumption for Wi-Fi (2.4 GHz) in Active Mode
16
14
Current Consumption for Bluetooth LE in Active Mode
16
15
Current Consumption for 802.15.4 in Active Mode
16
16
Current Consumption in Modem-sleep Mode
17
17
Current Consumption in Low-Power Modes
17
18
Wi-Fi RF Characteristics
18
19
TX Power with Spectral Mask and EVM Meeting 802.11 Standards
18
20
TX EVM Test
18
21
RX Sensitivity
19
22
Maximum RX Level
20
23
RX Adjacent Channel Rejection
20
24
Bluetooth LE RF Characteristics
21
25
Bluetooth LE - Transmitter Characteristics - 1 Mbps
21
26
Bluetooth LE - Transmitter Characteristics - 2 Mbps
21
27
Bluetooth LE - Transmitter Characteristics - 125 Kbps
22
28
Bluetooth LE - Transmitter Characteristics - 500 Kbps
22
29
Bluetooth LE - Receiver Characteristics - 1 Mbps
22
30
Bluetooth LE - Receiver Characteristics - 2 Mbps
23
31
Bluetooth LE - Receiver Characteristics - 125 Kbps
24
32
Bluetooth LE - Receiver Characteristics - 500 Kbps
24
33
802.15.4 RF Characteristics
24
34
802.15.4 Transmitter Characteristics - 250 Kbps
25
35
802.15.4 Receiver Characteristics - 250 Kbps
25
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List of Figures
List of Figures
1
ESP32-C6-WROOM-1 Block Diagram
9
2
ESP32-C6-WROOM-1U Block Diagram
9
3
Pin Layout (Top View)
10
4
Visualization of Timing Parameters for the Strapping Pins
13
5
ESP32-C6-WROOM-1 Schematics
26
6
ESP32-C6-WROOM-1U Schematics
27
7
Peripheral Schematics
28
8
ESP32-C6-WROOM-1 Physical Dimensions
29
9
ESP32-C6-WROOM-1U Physical Dimensions
29
10
ESP32-C6-WROOM-1 Recommended PCB Land Pattern
30
11
ESP32-C6-WROOM-1U Recommended PCB Land Pattern
31
12
Dimensions of External Antenna Connector
32
13
Reflow Profile
33
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2 Block Diagram
2 Block Diagram
40 MHz
Crystal
3V3
Antenna
RF Matching
ESP32-C6
GPIOs
SPICS0
SPICLK
SPID
SPIQ
SPIHD
SPIWP
VDD_SPI
EN
GND
QSPI Flash
Figure 1: ESP32-C6-WROOM-1 Block Diagram
40 MHz
Crystal
3V3
Antenna
RF Matching
GND
ESP32-C6
GPIOs
SPICS0
SPICLK
SPID
SPIQ
SPIHD
SPIWP
VDD_SPI
EN
QSPI Flash
Figure 2: ESP32-C6-WROOM-1U Block Diagram
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3 Pin Definitions
3 Pin Definitions
3.1 Pin Layout
The pin diagram below shows the approximate location of pins on the module. For the actual diagram drawn to
scale, please refer to Figure 8.1 Physical Dimensions.
The pin diagram is applicable for ESP32-C6-WROOM-1 and ESP32-C6-WROOM-1U, but the latter has no
keepout zone.
Keepout Zone
GND
1
28
GND
3V3
2
27
IO2
EN
3
26
IO3
IO4
4
25
TXD0
24
RXD0
23
IO15
GND
GND
GND
GND
29
GND
GND
GND
GND
GND
5
IO5
6
IO6
IO7
7
22
NC
IO0
8
21
IO23
IO1
9
20
IO22
IO8
10
19
IO21
IO10
11
18
IO20
IO11
12
17
IO19
IO12
13
16
IO18
IO13
14
15
IO9
Figure 3: Pin Layout (Top View)
Pin Layout (Top View)
3.2 Pin Description
The module has 29 pins. See pin definitions in Table 3 Pin Definitions.
For peripheral pin configurations, please refer to ESP32-C6 Series Datasheet.
Table 3: Pin Definitions
Name
No.
GND
1
Type1 Function
P
Ground
Cont’d on next page
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3 Pin Definitions
Table 3 – cont’d from previous page
Name
1
No.
Type
3V3
2
P
EN
3
I
Function
Power supply
High: on, enables the chip.
Low: off, the chip powers off.
Note: Do not leave the EN pin floating.
IO4
4
I/O/T
MTMS, GPIO4, LP_GPIO4, LP_UART_RXD, ADC1_CH4, FSPIHD
IO5
5
I/O/T
MTDI, GPIO5, LP_GPIO5, LP_UART_TXD, ADC1_CH5, FSPIWP
IO6
6
I/O/T
MTCK, GPIO6, LP_GPIO6, LP_I2C_SDA, ADC1_CH6, FSPICLK
IO7
7
I/O/T
MTDO, GPIO7, LP_GPIO7, LP_I2C_SCL, FSPID
IO0
8
I/O/T
GPIO0, XTAL_32K_P, LP_GPIO0, LP_UART_DTRN, ADC1_CH0
IO1
9
I/O/T
GPIO1, XTAL_32K_N, LP_GPIO1, LP_UART_DSRN, ADC1_CH1
IO8
10
I/O/T
GPIO8
IO10
11
I/O/T
GPIO10
IO11
12
I/O/T
GPIO11
IO12
13
I/O/T
GPIO12, USB_D-
IO13
14
I/O/T
GPIO13, USB_D+
IO9
15
I/O/T
GPIO9
IO18
16
I/O/T
GPIO18, SDIO_CMD, FSPICS2
IO19
17
I/O/T
GPIO19, SDIO_CLK, FSPICS3
IO20
18
I/O/T
GPIO20, SDIO_DATA0, FSPICS4
IO21
19
I/O/T
GPIO21, SDIO_DATA1, FSPICS5
IO22
20
I/O/T
GPIO22, SDIO_DATA2
IO23
21
I/O/T
GPIO23, SDIO_DATA3
NC
22
—
IO15
23
I/O/T
GPIO15
RXD0
24
I/O/T
U0RXD, GPIO17, FSPICS1
TXD0
25
I/O/T
U0TXD, GPIO16, FSPICS0
IO3
26
I/O/T
GPIO3, LP_GPIO3, LP_UART_CTSN, ADC1_CH3
IO2
27
I/O/T
GPIO2, LP_GPIO2, LP_UART_RTSN, ADC1_CH2, FSPIQ
GND
28
P
Ground
EPAD
29
P
Ground
1
NC
P: power supply; I: input; O: output; T: high impedance.
3.3 Strapping Pins
Note:
The content below is excerpted from ESP32-C6 Series Datasheet > Section Strapping Pins. For the strapping pin mapping
between the chip and modules, please refer to Chapter 6 Module Schematics.
At each startup or reset, a chip requires some initial configuration parameters, such as in which boot mode to
load the chip, etc. These parameters are passed over via the strapping pins. After reset, the strapping pins
operate as regular IO pins.
The parameters controlled by the given strapping pins at chip reset are as follows:
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3 Pin Definitions
• SDIO sampling and driving clock edge – MTMS and MTDI
• Chip boot mode – GPIO8 and GPIO9
• ROM code printing to UART – GPIO8
• JTAG signal source – GPIO15
GPIO9 is connected to the chip’s internal weak pull-up resistor at chip reset. This resistor determines the default
bit value of GPIO9. Also, the resistor determines the bit value if GPIO9 is connected to an external
high-impedance circuit.
Table 4: Default Configuration of Strapping Pins
Strapping Pin
Default Configuration
Bit Value
MTMS
Floating
–
MTDI
Floating
–
GPIO8
Floating
–
GPIO9
Pull-up
1
GPIO15
Floating
–
To change the bit values, the strapping pins should be connected to external pull-down/pull-up resistances. If the
ESP32-C6 is used as a device by a host MCU, the strapping pin voltage levels can also be controlled by the host
MCU.
All strapping pins have latches. At system reset, the latches sample the bit values of their respective strapping
pins and store them until the chip is powered down or shut down. The states of latches cannot be changed in
any other way. It makes the strapping pin values available during the entire chip operation, and the pins are freed
up to be used as regular IO pins after reset.
Regarding the timing requirements for the strapping pins, there are such parameters as setup time and hold time.
For more information, see Table 5 and Figure 4.
Table 5: Description of Timing Parameters for the Strapping Pins
Parameter
tSU
Description
Min (ms)
Setup time is the time reserved for the power rails to stabilize before
the CHIP_PU pin is pulled high to activate the chip.
0
Hold time is the time reserved for the chip to read the strapping pin
tH
values after CHIP_PU is already high and before these pins start
3
operating as regular IO pins.
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3 Pin Definitions
tSU
tH
VIL_nRST
CHIP_PU
VIH
Strapping pin
Figure 4: Visualization of Timing Parameters for the Strapping Pins
3.3.1 SDIO Sampling and Driving Clock Edge Control
The strapping pin MTMS and MTDI can be used to decide on which clock edge to sample signals and drive
output lines. See Table 6 SDIO Input Sampling Edge/Output Driving Edge Control.
Table 6: SDIO Input Sampling Edge/Output Driving Edge Control
MTMS
MTDI
Edge behavior
– (Floating)
– (Floating)
0
0
Falling edge sampling, falling edge output
0
1
Falling edge sampling, rising edge output
1
0
Rising edge sampling, falling edge output
1
1
Rising edge sampling, rising edge output
Default Configuration
3.3.2 Chip Boot Mode Control
GPIO8 and GPIO9 control the boot mode after the reset is released. See Table 7 Boot Mode Control Boot Mode
Control.
Table 7: Boot Mode Control
Boot Mode
GPIO8
GPIO9
Default Configuration
– (Floating)
1 (Pull-up)
SPI Boot (default)
Any value
1
1
0
0
0
Download Boot
Invalid combination
1
1
This combination triggers unexpected behavior
and should be avoided.
3.3.3 ROM Messages Printing Control
During boot process the messages by the ROM code can be printed to:
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3 Pin Definitions
• USB Serial/JTAG controller. For this, EFUSE_DIS_USB_SERIAL_JTAG_ROM_PRINT should be 0 and
USB Serial/JTAG controller should be enabled.
• UART0. For this, set EFUSE_DIS_USB_SERIAL_JTAG_ROM_PRINT to 1. In this case,
EFUSE_UART_PRINT_CONTROL and GPIO8 control ROM messages printing as shown in Table 8 ROM
Messages Printing Control.
Table 8: ROM Messages Printing Control
eFuse1
GPIO8
ROM Code Printing
0
Ignored
Always enabled
1
2
3
1
0
Enabled
1
Disabled
0
Disabled
1
Enabled
Ignored
Always disabled
eFuse: EFUSE_UART_PRINT_CONTROL
3.3.4 JTAG Signal Source Control
The strapping pin GPIO15 can be used to control the source of JTAG signals during the early boot process. This
pin does not have any internal pull resistors and the strapping value must be controlled by the external circuit that
cannot be in a high impedance state.
As Table 9 shows, GPIO15 is used in combination with EFUSE_DIS_PAD_JTAG, EFUSE_DIS_USB_JTAG, and
EFUSE_JTAG_SEL_ENABLE.
Table 9: JTAG Signal Source Control
eFuse 1a eFuse 2b eFuse 3c GPIO15
0
0
0
Ignored
1
JTAG Signal Source
USB Serial/JTAG Controller
0
JTAG pins MTDI, MTCK, MTMS, and MTDO
1
USB Serial/JTAG Controller
0
1
Ignored
Ignored
JTAG pins MTDI, MTCK, MTMS, and MTDO
1
0
Ignored
Ignored
USB Serial/JTAG Controller
1
1
Ignored
Ignored
JTAG is disabled
a
eFuse 1: EFUSE_DIS_PAD_JTAG
b
eFuse 2: EFUSE_DIS_USB_JTAG
c
eFuse 3: EFUSE_JTAG_SEL_ENABLE
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4 Electrical Characteristics
4 Electrical Characteristics
The values presented in this section are preliminary and may change with the final release of this
datasheet.
4.1 Absolute Maximum Ratings
Stresses above those listed in Table 10 Absolute Maximum Ratings may cause permanent damage to the device.
These are stress ratings only and functional operation of the device at these or any other conditions beyond
those indicated under Table 11 Recommended Operating Conditions is not implied. Exposure to
absolute-maximum-rated conditions for extended periods may affect device reliability.
Table 10: Absolute Maximum Ratings
Symbol
Parameter
Min
Max
Unit
VDD33
Power supply voltage
–0.3
3.6
V
TST ORE
Storage temperature
–40
105
°C
4.2 Recommended Operating Conditions
Table 11: Recommended Operating Conditions
Symbol
Parameter
Min
Typ
Max
Unit
VDD33
Power supply voltage
3.0
3.3
3.6
V
IV DD
Current delivered by external power supply
0.5
—
—
A
TA
Operating ambient temperature
–40
—
85 °C version
105 °C version
85
°C
105
4.3 DC Characteristics (3.3 V, 25 °C)
Table 12: DC Characteristics (3.3 V, 25 °C)
Symbol
Parameter
CIN
Pin capacitance
VIH
Min
—
High-level input voltage
0.75 × VDD
1
Typ
Max
Unit
2
—
pF
—
1
VDD + 0.3
V
1
VIL
Low-level input voltage
–0.3
—
0.25 × VDD
IIH
High-level input current
—
—
50
nA
Low-level input current
—
—
50
nA
—
—
IIL
VOH
VOL
2
2
High-level output voltage
0.8 × VDD
Low-level output voltage
1
V
V
1
—
—
0.1 × VDD
V
—
40
—
mA
—
28
—
mA
—
45
—
kΩ
1
IOH
IOL
RP U
High-level source current (VDD = 3.3 V, VOH >=
2.64 V, PAD_DRIVER = 3)
Low-level sink current (VDD1 = 3.3 V, VOL =
0.495 V, PAD_DRIVER = 3)
Pull-up resistor
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4 Electrical Characteristics
RP D
VIH_nRST
VIL_nRST
Pull-down resistor
—
Chip reset release voltage
0.75 × VDD
Chip reset voltage
1
–0.3
1
VDD is the I/O voltage for pins of a particular power domain.
2
VOH and VOL are measured using high-impedance load.
45
—
—
1
—
kΩ
VDD + 0.3
0.25 × VDD
V
1
V
4.4 Current Consumption Characteristics
4.4.1 Current Consumption in Active Mode
The current consumption measurements are taken with a 3.3 V supply at 25 °C ambient temperature.
TX current consumption is rated at a 100% duty cycle.
RX current consumption is rated when the peripherals are disabled and the CPU idle.
Table 13: Current Consumption for Wi-Fi (2.4 GHz) in Active Mode
Work Mode
RF Condition
TX
Active (RF working)
RX
Description
Peak (mA)
802.11b, 1 Mbps, DSSS @ 20.5 dBm
382
802.11g, 54 Mbps, OFDM @ 19.0 dBm
316
802.11n, HT20, MCS7 @ 18.0 dBm
295
802.11n, HT40, MCS7 @ 17.5 dBm
280
802.11ax, MCS9 @ 15.5 dBm
251
802.11b/g/n, HT20
78
802.11n, HT40
82
802.11ax, HE20
78
Table 14: Current Consumption for Bluetooth LE in Active Mode
Work Mode
RF Condition
TX
Active (RF working)
RX
Description
Peak (mA)
Bluetooth LE @ 20.0 dBm
322
Bluetooth LE @ 9.0 dBm
190
Bluetooth LE @ 0 dBm
130
Bluetooth LE @ –24.0 dBm
90
Bluetooth LE
73
Table 15: Current Consumption for 802.15.4 in Active Mode
Work Mode
RF Condition
TX
Active (RF working)
RX
Espressif Systems
Description
Peak (mA)
802.15.4 @ 20.0 dBm
316
802.15.4 @ 12.0 dBm
190
802.15.4 @ 0 dBm
120
802.15.4 @ –24.0 dBm
84
802.15.4
73
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4 Electrical Characteristics
Note:
The content below is excerpted from Section Current Consumption in Other Modes in ESP32-C6 Series Datasheet.
4.4.2 Current Consumption in Other Modes
Table 16: Current Consumption in Modem-sleep Mode
Typ (mA)
CPU Frequency
Mode
(MHz)
Description
160
Modem-sleep2,3
80
1
All Peripherals
All Peripherals
Clocks Disabled
Clocks Enabled1
CPU is running
27
38
CPU is idle
17
28
CPU is running
19
30
CPU is idle
14
25
In practice, the current consumption might be different depending on which peripherals are
enabled.
2
In Modem-sleep mode, Wi-Fi is clock gated.
3
In Modem-sleep mode, the consumption might be higher when accessing flash.
Table 17: Current Consumption in Low-Power Modes
Mode
Description
Typ (µA)
CPU and wireless communication modules are powered down, peLight-sleep
ripheral clocks are disabled, and all GPIOs are high-impedance
CPU, wireless communication modules and peripherals are powered down, and all GPIOs are high-impedance
180
35
Deep-sleep
RTC timer and LP memory are powered on
7
Power off
CHIP_PU is set to low level, the chip is powered off
1
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5 RF Characteristics
5 RF Characteristics
This section contains tables with RF characteristics of the Espressif product.
The RF data is measured at the antenna port, where RF cable is connected, including the front-end loss. The
external antennas used for the tests on the modules with external antenna connectors have an impedance
of 50 Ω.
Devices should operate in the center frequency range allocated by regional regulatory authorities. The target
center frequency range and the target transmit power are configurable by software. See ESP RF Test Tool and
Test Guide for instructions.
Unless otherwise stated, the RF tests are conducted with a 3.3 V (±5%) supply at 25 ºC ambient temperature.
5.1 Wi-Fi Radio (2.4 GHz/5 GHz)
Table 18: Wi-Fi RF Characteristics
Name
Description
Center frequency range of operating channel
2412 ~ 2484 MHz
Wi-Fi wireless standard
IEEE 802.11b/g/n/ax
5.1.1 Wi-Fi RF Transmitter (TX) Characteristics
Table 19: TX Power with Spectral Mask and EVM Meeting 802.11 Standards
Min
Typ
Max
(dBm)
(dBm)
(dBm)
802.11b, 1 Mbps, DSSS
—
20.5
—
802.11b, 11 Mbps, CCK
—
20.5
—
802.11g, 6 Mbps, OFDM
—
20.0
—
802.11g, 54 Mbps, OFDM
—
19.0
—
802.11n, HT20, MCS0
—
19.0
—
802.11n, HT20, MCS7
—
18.0
—
802.11n, HT40, MCS0
—
18.5
—
802.11n, HT40, MCS7
—
17.5
—
802.11ax, HE20, MCS0
—
19.0
—
802.11ax, HE20, MCS9
—
15.5
—
Rate
Table 20: TX EVM Test1
Rate
Min
Typ
Limit
(dB)
(dB)
(dB)
802.11b, 1 Mbps, DSSS
—
–25.0
–10.0
802.11b, 11 Mbps, CCK
—
–25.0
–10.0
Cont’d on next page
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5 RF Characteristics
Table 20 – cont’d from previous page
Rate
Min
Typ
Limit
(dB)
(dB)
(dB)
802.11g, 6 Mbps, OFDM
—
–24.0
–5.0
802.11g, 54 Mbps, OFDM
—
–28.0
–25.0
802.11n, HT20, MCS0
—
–27.5
–5.0
802.11n, HT20, MCS7
—
–30.0
–27.0
802.11n, HT40, MCS0
—
–27.0
–5.0
802.11n, HT40, MCS7
—
–29.5
–27.0
802.11ax, HE20, MCS0
—
–27.0
–5.0
802.11ax, HE20, MCS9
—
–34.0
–32.0
1
EVM is measured at the corresponding typical TX power provided
in Table 19 TX Power with Spectral Mask and EVM Meeting 802.11
Standards above.
5.1.2 Wi-Fi RF Receiver (RX) Characteristics
For RX tests, the PER (packet error rate) limit is 8% for 802.11b, and 10% for 802.11g/n/ax.
Table 21: RX Sensitivity
Min
Typ
Max
(dBm)
(dBm)
(dBm)
802.11b, 1 Mbps, DSSS
—
–99.2
—
802.11b, 2 Mbps, DSSS
—
–96.8
—
802.11b, 5.5 Mbps, CCK
—
–93.6
—
802.11b, 11 Mbps, CCK
—
–90.0
—
802.11g, 6 Mbps, OFDM
—
–94.0
—
802.11g, 9 Mbps, OFDM
—
–93.0
—
802.11g, 12 Mbps, OFDM
—
–92.4
—
802.11g, 18 Mbps, OFDM
—
–90.0
—
802.11g, 24 Mbps, OFDM
—
–86.8
—
802.11g, 36 Mbps, OFDM
—
–83.0
—
802.11g, 48 Mbps, OFDM
—
–78.8
—
802.11g, 54 Mbps, OFDM
—
–77.6
—
802.11n, HT20, MCS0
—
–93.6
—
802.11n, HT20, MCS1
—
–92.0
—
802.11n, HT20, MCS2
—
–89.4
—
802.11n, HT20, MCS3
—
–86.0
—
802.11n, HT20, MCS4
—
–82.8
—
802.11n, HT20, MCS5
—
–78.6
—
802.11n, HT20, MCS6
—
–77.0
—
802.11n, HT20, MCS7
—
–75.4
—
802.11n, HT40, MCS0
—
–91.0
—
802.11n, HT40, MCS1
—
–89.6
—
Rate
Cont’d on next page
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Table 21 – cont’d from previous page
Min
Typ
Max
(dBm)
(dBm)
(dBm)
802.11n, HT40, MCS2
—
–87.0
—
802.11n, HT40, MCS3
—
–83.4
—
802.11n, HT40, MCS4
—
–80.4
—
802.11n, HT40, MCS5
—
–76.2
—
802.11n, HT40, MCS6
—
–74.6
—
802.11n, HT40, MCS7
—
–73.2
—
802.11ax, HE20, MCS0
—
–93.8
—
802.11ax, HE20, MCS1
—
–91.0
—
802.11ax, HE20, MCS2
—
–88.0
—
802.11ax, HE20, MCS3
—
–85.6
—
802.11ax, HE20, MCS4
—
–82.0
—
802.11ax, HE20, MCS5
—
–78.0
—
802.11ax, HE20, MCS6
—
–76.6
—
802.11ax, HE20, MCS7
—
–74.4
—
802.11ax, HE20, MCS8
—
–70.8
—
802.11ax, HE20, MCS9
—
–68.6
—
Rate
Table 22: Maximum RX Level
Min
Typ
Max
(dBm)
(dBm)
(dBm)
802.11b, 1 Mbps, DSSS
—
5
—
802.11b, 11 Mbps, CCK
—
5
—
802.11g, 6 Mbps, OFDM
—
5
—
802.11g, 54 Mbps, OFDM
—
0
—
802.11n, HT20, MCS0
—
5
—
802.11n, HT20, MCS7
—
0
—
802.11n, HT40, MCS0
—
5
—
802.11n, HT40, MCS7
—
0
—
802.11ax, HE20, MCS0
—
5
—
802.11ax, HE20, MCS9
—
0
—
Rate
Table 23: RX Adjacent Channel Rejection
Rate
Min
Typ
Max
(dB)
(dB)
(dB)
802.11b, 1 Mbps, DSSS
—
38
—
802.11b, 11 Mbps, CCK
—
38
—
802.11g, 6 Mbps, OFDM
—
31
—
802.11g, 54 Mbps, OFDM
—
20
—
Cont’d on next page
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5 RF Characteristics
Table 23 – cont’d from previous page
Rate
Min
Typ
Max
(dB)
(dB)
(dB)
802.11n, HT20, MCS0
—
31
—
802.11n, HT20, MCS7
—
16
—
802.11n, HT40, MCS0
—
28
—
802.11n, HT40, MCS7
—
10
—
802.11ax, HE20, MCS0
—
25
—
802.11ax, HE20, MCS9
—
2
—
5.2 Bluetooth 5 (LE) Radio
Table 24: Bluetooth LE RF Characteristics
Name
Description
Center frequency range of operating channel
2402 ~ 2480 MHz
RF transmit power range
–24.0 ~ 20.0 dBm
5.2.1 Bluetooth LE RF Transmitter (TX) Characteristics
Table 25: Bluetooth LE - Transmitter Characteristics - 1 Mbps
Parameter
Description
Carrier frequency offset and drift
Modulation characteristics
Min
Max
Unit
Max. |fn |n=0, 1, 2, 3, ...k
—
1.3
—
kHz
Max. |f0 − fn |n=2, 3, 4, ...k
—
1.5
—
kHz
Max. |fn − fn−5 |n=6, 7, 8, ...k
—
0.9
—
kHz
|f1 − f0 |
—
0.6
—
kHz
∆ F 1avg
—
249.9
—
kHz
—
212.1
—
kHz
∆ F 2avg /∆ F 1avg
—
0.88
—
—
± 2 MHz offset
—
–29
—
dBm
± 3 MHz offset
—
–36
—
dBm
> ± 3 MHz offset
—
–39
—
dBm
Min. ∆ F 2max (for at least
99.9% of all ∆ F 2max )
In-band emissions
Typ
Table 26: Bluetooth LE - Transmitter Characteristics - 2 Mbps
Parameter
Carrier frequency offset and drift
Description
Min
Max
Unit
Max. |fn |n=0, 1, 2, 3, ...k
—
2.2
—
kHz
Max. |f0 − fn |n=2, 3, 4, ...k
—
1.1
—
kHz
Max. |fn − fn−5 |n=6, 7, 8, ...k
—
1.1
—
kHz
|f1 − f0 |
—
0.5
—
kHz
∆ F 1avg
—
499.4
—
kHz
Cont’d on next page
Modulation characteristics
Espressif Systems
Typ
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Table 26 – cont’d from previous page
Parameter
Description
Min
Min. ∆ F 2max (for at least
Max
Unit
—
443.5
—
kHz
∆ F 2avg /∆ F 1avg
—
0.95
—
—
± 4 MHz offset
—
–40
—
dBm
± 5 MHz offset
—
–41
—
dBm
> ± 5 MHz offset
—
–42
—
dBm
99.9% of all ∆ F 2max )
In-band emissions
Typ
Table 27: Bluetooth LE - Transmitter Characteristics - 125 Kbps
Parameter
Description
Carrier frequency offset and drift
Modulation characteristics
Min
Max
Unit
Max. |fn |n=0, 1, 2, 3, ...k
—
0.7
—
kHz
Max. |f0 − fn |n=1, 2, 3, ...k
—
0.3
—
kHz
|f0 − f3 |
—
0.1
—
kHz
Max. |fn − fn−3 |n=7, 8, 9, ...k
—
0.4
—
kHz
∆ F 1avg
—
250.0
—
kHz
—
238.0
—
kHz
± 2 MHz offset
—
–29
—
dBm
± 3 MHz offset
—
–36
—
dBm
> ± 3 MHz offset
—
–39
—
dBm
Min. ∆ F 1max (for at least
99.9% of all ∆ F 1max )
In-band emissions
Typ
Table 28: Bluetooth LE - Transmitter Characteristics - 500 Kbps
Parameter
Description
Carrier frequency offset and drift
Modulation characteristics
Min
Max
Unit
Max. |fn |n=0, 1, 2, 3, ...k
—
0.5
—
kHz
Max. |f0 − fn |n=1, 2, 3, ...k
—
0.3
—
kHz
|f0 − f3 |
—
0.1
—
kHz
Max. |fn − fn−3 |n=7, 8, 9, ...k
—
0.4
—
kHz
∆ F 2avg
—
230.7
—
kHz
—
217.6
—
kHz
± 2 MHz offset
—
–28
—
dBm
± 3 MHz offset
—
–36
—
dBm
> ± 3 MHz offset
—
–39
—
dBm
Min. ∆ F 2max (for at least
99.9% of all ∆ F 2max )
In-band emissions
Typ
5.2.2 Bluetooth LE RF Receiver (RX) Characteristics
Table 29: Bluetooth LE - Receiver Characteristics - 1 Mbps
Parameter
Description
Min
Sensitivity @30.8% PER
—
—
Maximum received signal @30.8% PER
—
—
Typ
Max
Unit
–98.0
—
dBm
8
—
dBm
Cont’d on next page
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Table 29 – cont’d from previous page
Parameter
Description
Min
F = F0 MHz
—
7
—
dB
F = F0 + 1 MHz
—
4
—
dB
F = F0 – 1 MHz
—
3
—
dB
F = F0 + 2 MHz
—
–21
—
dB
F = F0 – 2 MHz
—
–22
—
dB
F = F0 + 3 MHz
—
–28
—
dB
F = F0 – 3 MHz
—
–36
—
dB
F ≥ F0 + 4 MHz
—
–27
—
dB
F ≤ F0 – 4 MHz
—
–36
—
dB
Image frequency
—
—
–26
—
dB
Adjacent channel to
F = Fimage + 1 MHz
—
–29
—
dB
image frequency
F = Fimage – 1 MHz
—
–28
—
dB
30 MHz ~ 2000 MHz
—
–16
—
dBm
2003 MHz ~ 2399 MHz
—
–24
—
dBm
2484 MHz ~ 2997 MHz
—
–16
—
dBm
3000 MHz ~ 12.75 GHz
—
–1
—
dBm
—
—
–27
—
dBm
Max
Unit
Co-channel
Adjacent channel
C/I and receiver
selectivity performance
Out-of-band blocking performance
Intermodulation
Typ
Max
Unit
Table 30: Bluetooth LE - Receiver Characteristics - 2 Mbps
Parameter
Description
Sensitivity @30.8% PER
—
—
–95.0
—
dBm
Maximum received signal @30.8% PER
—
—
8
—
dBm
F = F0 MHz
—
8
—
dB
F = F0 + 2 MHz
—
3
—
dB
F = F0 – 2 MHz
—
2
—
dB
F = F0 + 4 MHz
—
–23
—
dB
F = F0 – 4 MHz
—
–25
—
dB
F = F0 + 6 MHz
—
–31
—
dB
F = F0 – 6 MHz
—
–35
—
dB
F ≥ F0 + 8 MHz
—
–36
—
dB
F ≤ F0 – 8 MHz
—
–36
—
dB
Image frequency
—
—
–23
—
dB
Adjacent channel to
F = Fimage + 2 MHz
—
–30
—
dB
image frequency
F = Fimage – 2 MHz
—
3
—
dB
30 MHz ~ 2000 MHz
—
–18
—
dBm
2003 MHz ~ 2399 MHz
—
–28
—
dBm
2484 MHz ~ 2997 MHz
—
–16
—
dBm
3000 MHz ~ 12.75 GHz
—
–1
—
dBm
—
—
–29
—
dBm
Co-channel
C/I and receiver
Adjacent channel
selectivity performance
Out-of-band blocking performance
Intermodulation
Espressif Systems
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Table 31: Bluetooth LE - Receiver Characteristics - 125 Kbps
Parameter
Description
Max
Unit
Sensitivity @30.8% PER
—
—
–105.5
—
dBm
Maximum received signal @30.8% PER
—
—
8
—
dBm
F = F0 MHz
—
2
—
dB
F = F0 + 1 MHz
—
–1
—
dB
F = F0 – 1 MHz
—
–3
—
dB
F = F0 + 2 MHz
—
–31
—
dB
F = F0 – 2 MHz
—
–27
—
dB
F = F0 + 3 MHz
—
–33
—
dB
F = F0 – 3 MHz
—
–42
—
dB
F ≥ F0 + 4 MHz
—
–31
—
dB
F ≤ F0 – 4 MHz
—
–48
—
dB
Image frequency
—
—
–31
—
dB
Adjacent channel to
F = Fimage + 1 MHz
—
–36
—
dB
image frequency
F = Fimage – 1 MHz
—
–33
—
dB
Co-channel
Adjacent channel
C/I and receiver
selectivity performance
Min
Typ
Table 32: Bluetooth LE - Receiver Characteristics - 500 Kbps
Parameter
Description
Max
Unit
Sensitivity @30.8% PER
—
—
–101.5
—
dBm
Maximum received signal @30.8% PER
—
—
8
—
dBm
F = F0 MHz
—
4
—
dB
F = F0 + 1 MHz
—
1
—
dB
F = F0 – 1 MHz
—
–1
—
dB
F = F0 + 2 MHz
—
–23
—
dB
F = F0 – 2 MHz
—
–24
—
dB
F = F0 + 3 MHz
—
–33
—
dB
F = F0 – 3 MHz
—
–41
—
dB
F ≥ F0 + 4 MHz
—
–31
—
dB
F ≤ F0 – 4 MHz
—
–41
—
dB
Image frequency
—
—
–30
—
dB
Adjacent channel to
F = Fimage + 1 MHz
—
–35
—
dB
image frequency
F = Fimage – 1 MHz
—
–27
—
dB
Co-channel
Adjacent channel
C/I and receiver
selectivity performance
Min
Typ
5.3 802.15.4 Radio
Table 33: 802.15.4 RF Characteristics
Name
Description
Center frequency range of operating channel
2405 ~ 2480 MHz
1
Zigbee in the 2.4 GHz range supports 16 channels at 5 MHz spacing from
channel 11 to channel 26.
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5.3.1 802.15.4 RF Transmitter (TX) Characteristics
Table 34: 802.15.4 Transmitter Characteristics - 250 Kbps
Parameter
Min
RF transmit power range
–24.0
—
20.0
dBm
—
13%
—
—
EVM
Typ
Max
Unit
5.3.2 802.15.4 RF Receiver (RX) Characteristics
Table 35: 802.15.4 Receiver Characteristics - 250 Kbps
Parameter
Description
Sensitivity @1% PER
—
—
Maximum received signal @1% PER
—
Adjacent channel
Relative jamming level
Alternate channel
Espressif Systems
Max
Unit
–104.0
—
dBm
—
8
—
dBm
F = F0 + 5 MHz
—
27
—
dB
F = F0 – 5 MHz
—
32
—
dB
F = F0 + 10 MHz
—
47
—
dB
F = F0 – 10 MHz
—
50
—
dB
25
Min
Typ
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6 Module Schematics
This is the reference design of the module.
GND
40MHz
GND XOUT
C4
TBD
2
The value of R4 varies with the actual
PCB board.
VDD33
GND
GND
GPIO23
GPIO22
GPIO21
GPIO20
GPIO19
GPIO18
GND
C9
10uF
1uF
0.1uF
0.1uF
GND
GND
GND
GND
ANT1
C11
TBD
LNA_IN
C12
CHIP_EN
PCB_ANT
TBD
ESP32-C6-WROOM-1 & WROOM-1U Datasheet v0.6
GND
GND
The values of C11, L2 and C12
vary with the actual PCB board.
NC: No component.
TBD
GND
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
1
2
3
4
5
6
7
8
9
10
ANT
VDDA3P3
VDDA3P3
CHIP_EN
VDDPST1
XTAL_32K_P
XTAL_32K_N
GPIO2
GPIO3
MTMS
VDD33
C15
U1
0.1uF
GND
3V3
EN
IO4
IO5
IO6
IO7
IO0
IO1
IO8
IO10
IO11
IO12
IO13
C10
VDD33
0.1uF
ESP32-C6-WROOM-1(Pin-out)
U0RXD
U0TXD
VDDPST2
GPIO15
SPID
SPICLK
SPIHD
VDD_SPI
SPIWP
SPIQ
30
29
28
27
26
25
24
23
22
21
MTDI
MTCK
MTDO
GPIO8
GPIO9
GPIO10
GPIO11
GPIO12
GPIO13
SPICS0
L2
GND
R3
499
U0RXD
U0TXD
R16
R15
R14
0
0
0
GPIO15
SPID
SPICLK
SPIHD
R13
R10
0
0
SPIWP
SPIQ
C16
C17
0.1uF
1uF
VDD_SPI
ESP32-C6-QFN40
GND
GND
GND
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
GPIO10
GPIO11
GPIO12
GPIO13
SPICS0
RF_ANT
1
2
R4
C8
40
39
38
37
36
35
34
33
32
31
GND
C7
GND
0
2.0nH(0.1nH)
C6
VDDA2
XTAL_P
XTAL_N
VDDA1
SDIO_DATA3
SDIO_DATA2
SDIO_DATA1
SDIO_DATA0
SDIO_CLK
SDIO_CMD
L1
R17
41
GND
11
12
13
14
15
16
17
18
19
20
VDD33
1
2
3
4
5
6
7
8
9
10
11
12
13
14
VDD_SPI
R8
10K(NC)
8
10nF
CHIP_EN
GPIO4
GPIO5
D1 GPIO6
ESD GPIO7
GPIO0
GPIO1
GPIO8
GPIO10
GND
GPIO11
GPIO12
GPIO13
ESP32-C6-WROOM-1
29
EPAD 28
GND 27
IO2 26
IO3 25
TXD0 24
RXD0 23
IO15 22
NC 21
IO23 20
IO22 19
IO21 18
IO20 17
IO19 16
IO18 15
IO9
SPICS0
1
SPICLK
6
SPIHD
7
VCC
1uF
0
C2
26
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C3
GND
U3
/CS
CLK
/HOLD
U2
GND
VDD33
GND
1
TBD
XIN
C1
The values of C1 and C4 vary with
the selection of the crystal.
Y1
3
GND
4
GND
4
Espressif Systems
6 Module Schematics
GND
Figure 5: ESP32-C6-WROOM-1 Schematics
DI
DO
/WP
FLASH
5
SPID
2
SPIQ
3
SPIWP
GPIO2
GPIO3
U0TXD
U0RXD
GPIO15
GPIO23
GPIO22
GPIO21
GPIO20
GPIO19
GPIO18
GPIO9
GND XOUT
TBD
VDD33
GND
GND
GPIO23
GPIO22
GPIO21
GPIO20
GPIO19
GPIO18
GND
0.1uF
0.1uF
TBD
LNA_IN
ANT1
CHIP_EN
CONN
GND
L2
D2
ESD(NC)
GND
C11
TBD
GND
ESP32-C6-WROOM-1 & WROOM-1U Datasheet v0.6
The values of C11, L2 and C12
vary with the actual PCB board.
C12
TBD
GPIO0
GPIO1
GPIO2
GPIO3
GPIO4
GND
1
2
3
4
5
6
7
8
9
10
ANT
VDDA3P3
VDDA3P3
CHIP_EN
VDDPST1
XTAL_32K_P
XTAL_32K_N
GPIO2
GPIO3
MTMS
VDD33
C15
U1
0.1uF
C10
ESP32-C6-WROOM-1U(Pin-out)
U0RXD
U0TXD
VDDPST2
GPIO15
SPID
SPICLK
SPIHD
VDD_SPI
SPIWP
SPIQ
30
29
28
27
26
25
24
23
22
21
R3
499
U0RXD
U0TXD
R16
R15
R14
0
0
0
GPIO15
SPID
SPICLK
SPIHD
R13
R10
0
0
SPIWP
SPIQ
C16
C17
0.1uF
1uF
VDD_SPI
ESP32-C6-QFN40
GND
NC: No component.
VDD33
0.1uF
MTDI
MTCK
MTDO
GPIO8
GPIO9
GPIO10
GPIO11
GPIO12
GPIO13
SPICS0
RF_ANT
GND
GND
GND
GND
GPIO5
GPIO6
GPIO7
GPIO8
GPIO9
GPIO10
GPIO11
GPIO12
GPIO13
SPICS0
3
1
GND
R4
1uF
40
39
38
37
36
35
34
33
32
31
10uF
GND
C9
27
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C8
VDDA2
XTAL_P
XTAL_N
VDDA1
SDIO_DATA3
SDIO_DATA2
SDIO_DATA1
SDIO_DATA0
SDIO_CLK
SDIO_CMD
GND
C7
GND
0
2.0nH(0.1nH)
C6
GND
2
R17
41
L1
GND
11
12
13
14
15
16
17
18
19
20
VDD33
EPAD
GND
IO2
IO3
TXD0
RXD0
IO15
NC
IO23
IO22
IO21
IO20
IO19
IO18
IO9
GND
3V3
EN
IO4
IO5
IO6
IO7
IO0
IO1
IO8
IO10
IO11
IO12
IO13
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VDD_SPI
R8
10K(NC)
8
10nF
1
2
3
4
5
6
7
8
9
10
11
12
13
14
SPICS0
1
SPICLK
6
SPIHD
7
VCC
1uF
CHIP_EN
GPIO4
GPIO5
D1 GPIO6
ESD GPIO7
GPIO0
GPIO1
GPIO8
GPIO10
GPIO11
GND
GPIO12
GPIO13
ESP32-C6-WROOM-1U
/CS
CLK
/HOLD
U2
DI
DO
GND
C2
0
C3
GND
U3
4
40MHz
C4
2
The value of R4 varies with the actual
PCB board.
VDD33
GND
1
TBD
XIN
C1
The values of C1 and C4 vary with
the selection of the crystal.
Y1
3
GND
4
GND
/WP
FLASH
GND
Figure 6: ESP32-C6-WROOM-1U Schematics
5
SPID
2
SPIQ
3
SPIWP
GPIO2
GPIO3
U0TXD
U0RXD
GPIO15
GPIO23
GPIO22
GPIO21
GPIO20
GPIO19
GPIO18
GPIO9
6 Module Schematics
Espressif Systems
GND
7 Peripheral Schematics
7 Peripheral Schematics
This is the typical application circuit of the module connected with peripheral components (for example, power
supply, antenna, reset button, JTAG interface, and UART interface).
GND
VDD33
VDD33
R1
TBD
SW1
R2
C4
U1
C1
C2
22uF
0.1uF
EN
0
0.1uF
GND
C3
TBD
GND
EN
IO4
IO5
IO6
IO7
IO0
IO1
IO8
IO10
IO11
IO12
IO13
GND
JP4
4
3
2
1
4
3
2
1
GND
TMS
TDI
TCK
TDO
1
2
3
4
5
6
7
8
9
10
11
12
13
14
GND
ESP32-C6-WROOM-1
ESP32-C6-WROOM-1U
EPAD
GND
IO2
IO3
TXD0
RXD0
IO15
NC
IO23
IO22
IO21
IO20
IO19
IO18
IO9
GND
3V3
EN
IO4
IO5
IO6
IO7
IO0
IO1
IO8
IO10
IO11
IO12
IO13
29
28
27
26
25
24
23
22
21
20
19
18
17
16
15
VDD33
IO2
IO3
TXD0
RXD0
IO15
JP1
1
2
3
4
IO23
IO22
IO21
IO20
IO19
IO18
IO9
UART
GND
JP2
1
2
JTAG
C5
Boot Option
12pF(NC)
JP3
R5
X1
32.768KHz(NC)
1
GND
X1: ESR
= Max. 70 KΩ
R3
0(NC)
R4
0(NC)
R6
R7
C7
2
GND
C6
USB_D+
USB_D-
TBD
TBD
NC
IO8
1
2
GND
VDD33
R8
10K
1
2
3
4
TBD
2
1
C8
TBD
2
1
USB
NC: No component.
12pF(NC)
GND
GND
Figure 7: Peripheral Schematics
• Soldering the EPAD to the ground of the base board is not a must, however, it can optimize thermal
performance. If you choose to solder it, please apply the correct amount of soldering paste. Too much
soldering paste may increase the gap between the module and the baseboard. As a result, the adhesion
between other pins and the baseboard may be poor.
• To ensure that the power supply to the ESP32-C6 chip is stable during power-up, it is advised to add an
RC delay circuit at the EN pin. The recommended setting for the RC delay circuit is usually R = 10 kΩ and
C = 1 µF. However, specific parameters should be adjusted based on the power-up timing of the module
and the power-up and reset sequence timing of the chip. For ESP32-C6’s power-up and reset sequence
timing diagram, please refer to ESP32-C6 Series Datasheet > Section Power Supply.
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8 Physical Dimensions and PCB Land Pattern
8 Physical Dimensions and PCB Land Pattern
8.1 Physical Dimensions
Unit: mm
3.1±0.15
0.8
0.8
0.45
12.29
1.05
0.98
28 x 0.45
7.495
3.3
0.45
0.8
0.
28 x 0.9
17.6
28 x Ø0.55
Ø
1.5
3.3
1.27
15.8
5
25.5±0.25
16.51
28 x 0.9
1.27
6
18±0.25
28 x 0.85
Top View
Bottom View
Side View
Figure 8: ESP32-C6-WROOM-1 Physical Dimensions
Unit: mm
18±0.25
3.2±0.15
0.8
12.29
7.495
3.3
0.45
0.8
28 x 0.9
1.1
13.05
17.5
28 x 0.45
0.8
0.45
2.46
28 x Ø0.55
15.65
1.5
16.51
28 x 0.9
1.27
10.75
19.2±0.25
3.3
1.27
3
28 x 0.85
1.08
Top View
Bottom View
Side View
Figure 9: ESP32-C6-WROOM-1U Physical Dimensions
Note:
For information about tape, reel, and product marking, please refer to Espressif Module Packaging Information.
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8 Physical Dimensions and PCB Land Pattern
8.2 Recommended PCB Land Pattern
This section provides the following resources for your reference:
• Figures for recommended PCB land patterns with all the dimensions needed for PCB design. See Figure
10 ESP32-C6-WROOM-1 Recommended PCB Land Pattern and Figure 11 ESP32-C6-WROOM-1U
Recommended PCB Land Pattern.
• Source files of recommended PCB land patterns to measure dimensions not covered in Figure 10. You can
view the source files for ESP32-C6-WROOM-1 with Autodesk Viewer.
Unit: mm
Via for thermal pad
Copper
3.3
1.27
3.3
25.5
28
12.29
1.5
0.8
0.45
0.45
0.8
28x0.9
1
16.51
6
Antenna Area
28x1.5
7.49
18
7.495
15
14
0.5
17.5
Figure 10: ESP32-C6-WROOM-1 Recommended PCB Land Pattern
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8 Physical Dimensions and PCB Land Pattern
Unit: mm
Via for thermal pad
Copper
18
28x1.5
28
12.29
19.2
1.27
3.3
0.45
0.8
28x0.9
1.5
16.51
0.8
0.45
1.19
3.3
1
7.495
15
14
0.5
17.5
Figure 11: ESP32-C6-WROOM-1U Recommended PCB Land Pattern
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8 Physical Dimensions and PCB Land Pattern
8.3 Dimensions of External Antenna Connector
ESP32-C6-WROOM-1U uses the first generation external antenna connector as shown in Figure 12 Dimensions
of External Antenna Connector. This connector is compatible with the following connectors:
• U.FL Series connector from Hirose
• MHF I connector from I-PEX
• AMC connector from Amphenol
Unit: mm
Figure 12: Dimensions of External Antenna Connector
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9 Product Handling
9 Product Handling
9.1 Storage Conditions
The products sealed in moisture barrier bags (MBB) should be stored in a non-condensing atmospheric
environment of < 40 °C and 90%RH. The module is rated at the moisture sensitivity level (MSL) of 3.
After unpacking, the module must be soldered within 168 hours with the factory conditions 25±5 °C and
60%RH. If the above conditions are not met, the module needs to be baked.
9.2 Electrostatic Discharge (ESD)
• Human body model (HBM): ±2000 V
• Charged-device model (CDM): ±500 V
9.3 Soldering Profile
9.3.1 Reflow Profile
Temperature (℃)
Solder the module in a single reflow.
Peak Temp.
235 ~ 250 ℃
250
Preheating zone
150 ~ 200 ℃
60 ~ 120 s
217
200
Reflow zone
217 ℃ 60 ~ 90 s
Cooling zone
–1 ~ –5 ℃/s
Soldering time
> 30 s
Ramp-up zone
1 ~ 3 ℃/s
100
50
25
Time (sec.)
0
0
50
100
150
200
250
Ramp-up zone — Temp.: 25 ~ 150 ℃ Time: 60 ~ 90 s Ramp-up rate: 1 ~ 3 ℃/s
Preheating zone — Temp.: 150 ~ 200 ℃ Time: 60 ~ 120 s
Reflow zone — Temp.: >217 ℃
60 ~ 90 s; Peak Temp.: 235 ~ 250 ℃ Time: 30 ~ 70 s
Cooling zone — Peak Temp. ~ 180 ℃ Ramp-down rate: –1 ~ –5 ℃/s
Solder — Sn-Ag-Cu (SAC305) lead-free solder alloy
Figure 13: Reflow Profile
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9 Product Handling
9.4 Ultrasonic Vibration
Avoid exposing Espressif modules to vibration from ultrasonic equipment, such as ultrasonic welders or
ultrasonic cleaners. This vibration may induce resonance in the in-module crystal and lead to its malfunction or
even failure. As a consequence, the module may stop working or its performance may deteriorate.
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10 Related Documentation and Resources
10
Related Documentation and Resources
Related Documentation
• ESP32-C6 Series Datasheet – Specifications of the ESP32-C6 hardware.
• ESP32-C6 Technical Reference Manual – Detailed information on how to use the ESP32-C6 memory and peripherals.
• ESP32-C6 Hardware Design Guidelines – Guidelines on how to integrate the ESP32-C6 into your hardware product.
• Certificates
https://espressif.com/en/support/documents/certificates
• Documentation Updates and Update Notification Subscription
https://espressif.com/en/support/download/documents
Developer Zone
• ESP-IDF and other development frameworks on GitHub.
https://github.com/espressif
• ESP32 BBS Forum – Engineer-to-Engineer (E2E) Community for Espressif products where you can post questions,
share knowledge, explore ideas, and help solve problems with fellow engineers.
https://esp32.com/
• The ESP Journal – Best Practices, Articles, and Notes from Espressif folks.
https://blog.espressif.com/
• See the tabs SDKs and Demos, Apps, Tools, AT Firmware.
https://espressif.com/en/support/download/sdks-demos
Products
• ESP32-C6 Series SoCs – Browse through all ESP32-C6 SoCs.
https://espressif.com/en/products/socs?id=ESP32-C6
• ESP32-C6 Series Modules – Browse through all ESP32-C6-based modules.
https://espressif.com/en/products/modules?id=ESP32-C6
• ESP32-C6 Series DevKits – Browse through all ESP32-C6-based devkits.
https://espressif.com/en/products/devkits?id=ESP32-C6
• ESP Product Selector – Find an Espressif hardware product suitable for your needs by comparing or applying filters.
https://products.espressif.com/#/product-selector?language=en
Contact Us
• See the tabs Sales Questions, Technical Enquiries, Circuit Schematic & PCB Design Review, Get Samples
(Online stores), Become Our Supplier, Comments & Suggestions.
https://espressif.com/en/contact-us/sales-questions
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Revision History
Revision History
Date
Version
Release notes
2023-04-17
v0.6
Added information about ESP32-C6-WROOM-1U module
2023-02-16
v0.5
Preliminary release
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Disclaimer and Copyright Notice
Information in this document, including URL references, is subject to change without notice.
ALL THIRD PARTY’S INFORMATION IN THIS DOCUMENT IS PROVIDED AS IS WITH NO
WARRANTIES TO ITS AUTHENTICITY AND ACCURACY.
NO WARRANTY IS PROVIDED TO THIS DOCUMENT FOR ITS MERCHANTABILITY, NONINFRINGEMENT, FITNESS FOR ANY PARTICULAR PURPOSE, NOR DOES ANY WARRANTY
OTHERWISE ARISING OUT OF ANY PROPOSAL, SPECIFICATION OR SAMPLE.
All liability, including liability for infringement of any proprietary rights, relating to use of information
in this document is disclaimed. No licenses express or implied, by estoppel or otherwise, to any
intellectual property rights are granted herein.
The Wi-Fi Alliance Member logo is a trademark of the Wi-Fi Alliance. The Bluetooth logo is a
registered trademark of Bluetooth SIG.
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All trade names, trademarks and registered trademarks mentioned in this document are property
of their respective owners, and are hereby acknowledged.
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