IRLL024ZTR
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N-Channel 60-V (D-S) MOSFET
FEATURES
PRODUCT SUMMARY
VDS (V)
60
RDS(on) (Ω)
ID (A)
0.029 at VGS = 10 V
7.0
0.033 at VGS = 4.5 V
5.6
• Halogen-free According to IEC 61249-2-21
Definition
• TrenchFET® Power MOSFETs
• 175 °C Maximum Junction Temperature
• Compliant to RoHS Directive 2002/95/EC
D
SOT-223
D
G
G
D
S
S
N-Channel MOSFET
ABSOLUTE MAXIMUM RATINGS TA = 25 °C, unless otherwise noted
Symbol
VDS
VGS
Parameter
Drain-Source Voltage
Gate-Source Voltage
Continuous Drain Current (TJ = 175 °C)a
TA = 25 °C
TA = 70 °C
7.0
6.1
IDM
IAS
EAS
Pulsed Drain Current
Avalanche Current
Single Pulse Avalanche Energy
Maximum Power Dissipationa
ID
10 s
TA = 25 °C
TA = 70 °C
PD
TJ, Tstg
Operating Junction and Storage Temperature Range
3.3
2.3
Steady State
60
± 20
6.0
5.0
40
15
11
1.7
1.2
- 55 to 175
Unit
V
A
mJ
W
°C
THERMAL RESISTANCE RATINGS
Parameter
Maximum Junction-to-Ambient a
Maximum Junction-to-Foot (Drain)
Symbol
t ≤ 10 s
Steady State
Steady State
RthJA
RthJF
Typical
36
75
17
Maximum
45
90
20
Unit
°C/W
Notes:
a. Surface Mounted on 1" x 1" FR4 board.
1
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SPECIFICATIONS TJ = 25 °C, unless otherwise noted
Parameter
Static
Drain-Source Breakdown Voltage
Gate Threshold Voltage
Gate-Body Leakage
Symbol
Test Conditions
Min.
VDS
VGS = 0 V, ID = 250 µA
60
VGS(th)
VDS = VGS, ID = 250 µA
1
IGSS
VDS = 0 V, VGS = ± 20 V
± 100
VDS = 60 V, VGS = 0 V
1
VDS = 60 V, VGS = 0 V, TJ = 55 °C
20
Zero Gate Voltage Drain Current
IDSS
On-State Drain Currenta
ID(on)
Drain-Source On-State Resistancea
RDS(on)
Forward Transconductancea
Diode Forward Voltage
VDS ≥ 5 V, VGS = 10 V
a
Typ.
Max.
Unit
V
3
nA
µA
40
A
VGS = 10 V, ID = 6.0 A
0.028
VGS = 10 V, ID = 6.0 A, TJ = 125 °C
0.032
VGS = 10 V, ID = 6.0 A, TJ = 175 °C
0.040
VGS = 4.5 V, ID = 5.1 A
0.033
Ω
gfs
VDS = 15 V, ID = 6.0 A
25
VSD
IS = 1.7 A, VGS = 0 V
0.8
1.2
18
27
VDS = 30 V, VGS = 10 V, ID = 6.0 A
3.4
S
V
Dynamicb
Total Gate Charge
Qg
Gate-Source Charge
Qgs
Gate-Drain Charge
Qgd
Rg
Gate Resistance
VGS = 0.1 V, f = 5 MHz
0.5
td(on)
Turn-On Delay Time
VDD = 30 V, RL = 30 Ω
ID ≅ 1 A, VGEN = 10 V, Rg = 6 Ω
tr
Rise Time
td(off)
Turn-Off Delay Time
Fall Time
tf
Source-Drain Reverse Recovery Time
trr
nC
5.3
IF = 1.7 A, dI/dt = 100 A/µs
1.4
2.4
10
20
10
20
25
50
12
24
50
80
Ω
ns
Notes:
a. Pulse test; pulse width ≤ 300 µs, duty cycle ≤ 2 %.
b. Guaranteed by design, not subject to production testing.
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
40
40
VGS = 10 V thru 5 V
32
ID - Drain Current (A)
ID - Drain Current (A)
32
24
4V
16
8
24
16
TC = 150 °C
8
25 °C
3V
0
0.0
- 55 °C
0
0.5
1.0
1.5
2.0
2.5
VDS - Drain-to-Source Voltage (V)
Output Characteristics
3.0
0
1
2
3
4
5
VGS - Gate-to-Source Voltage (V)
Transfer Characteristics
2
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TYPICAL CHARACTERISTICS
25 °C, unless otherwise noted
1400
0.06
1200
Ciss
C - Capacitance (pF)
RDS(on) - On-Resistance (Ω)
0.06
0.05
VGS = 4.5 V
0.04
VGS = 10 V
0.03
1000
800
600
400
Coss
0.02
200
0.01
0
0
8
16
24
32
Crss
0
40
10
20
40
50
60
VDS - Drain-to-Source Voltage (V)
ID - Drain Current (A)
On-Resistance vs. Drain Current
Capacitance
10
2.2
ID = 6.0 A
ID = 6.0 V
2.0
VGS = 10 V
8
VDS = 30 V
RDS(on) - On-Resistance
(Normalized)
VGS - Gate-to-Source Voltage (V)
30
6
4
1.8
1.6
1.4
1.2
1.0
2
0.8
0
0
4
8
16
12
0.6
- 50
20
- 25
0
Qg - Total Gate Charge (nC)
25
50
75
100
125
150
175
TJ - Junction Temperature (°C)
On-Resistance vs. Junction Temperature
Gate Charge
50
0.06
TJ = 175 °C
RDS(on) - On-Resistance (Ω)
IS - Source Current (A)
0.05
TJ = 25 °C
10
0.04
ID = 6.0 A
0.03
0.02
0.01
1
0.00
0.00
0.5
1.0
1.5
2.0
VSD - Source-to-Drain Voltage (V)
Source-Drain Diode Forward Voltage
2.5
0
2
4
6
8
10
VGS - Gate-to-Source Voltage (V)
On-Resistance vs. Gate-to-Source Voltage
3
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0.8
50
0.4
40
0.0
30
Power (W)
VGS(th) Variance (V)
TYPICAL CHARACTERISTICS 25 °C, unless otherwise noted
ID = 250 µA
- 0.4
- 0.8
20
10
- 1.2
- 50
0
- 25
0
25
50
75
100
125
150
175
0.01
0.1
1
TJ - Temperature (°C)
10
100
1000
Time (s)
Single Pulse Power
Threshold Voltage
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
Notes:
0.1
PDM
0.1
0.05
t1
t2
1. Duty Cycle, D =
0.02
t1
t2
2. Per Unit Base = RthJA = 75 °C/W
3. TJM - TA = PDMZthJA(t)
Single Pulse
4. Surface Mounted
0.01
10-4
10-3
10 -2
10-1
1
10
100
600
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Ambient
2
Normalized Effective Transient
Thermal Impedance
1
Duty Cycle = 0.5
0.2
0.1
0.1
0.05
0.02
Single Pulse
0.01
10-4
10-3
10-2
10-1
1
10
Square Wave Pulse Duration (s)
Normalized Thermal Transient Impedance, Junction-to-Foot
4
IRLL024ZTR
www.VBsemi.tw
SOT-223 (HIGH VOLTAGE)
B
D
A
3
0.08 (0.003)
B1
C
0.10 (0.004) M C B M
A
4
3
H
E
0.20 (0.008) M C A M
L1
1
2
3
4xL
3xB
e
θ
0.10 (0.004) M C B M
e1
4xC
MILLIMETERS
INCHES
DIM.
MIN.
MAX.
MIN.
MAX.
A
1.55
1.80
0.061
0.071
B
0.65
0.85
0.026
0.033
B1
2.95
3.15
0.116
0.124
C
0.25
0.35
0.010
0.014
D
6.30
6.70
0.248
0.264
E
3.30
3.70
0.130
e
2.30 BSC
e1
4.60 BSC
0.181 BSC
H
6.71
7.29
0.264
L
0.91
-
0.036
L1
θ
0.061 BSC
-
0.146
0.0905 BSC
0.287
0.0024 BSC
10'
-
10'
ECN: S-82109-Rev. A, 15-Sep-08
DWG: 5969
Notes
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
2. Dimensions are shown in millimeters (inches).
3. Dimension do not include mold flash.
4. Outline conforms to JEDEC outline TO-261AA.
5
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