ADG781BCP

a FEATURES 1.8 V to 5.5 V Single Supply Low On Resistance (2.5 Typ) Low On-Resistance Flatness (0.5 ) –3 dB Bandwidth > 200 MHz Rail-to-Rail Operation 20-Lead 4 mm 4 mm Chip Scale Package Fast Switching Times t ON = 16 ns t OFF = 10 ns Typical Power Consumption (< 0.01 W) TTL/CMOS Compatible For Functionally Equivalent Devices in 16-Lead TSSOP and SOIC Packages, See ADG711/ADG712/ADG713 APPLICATIONS Battery Powered Systems Communication Systems Sample Hold Systems Audio Signal Routing Video Switching Mechanical Reed Relay Replacement IN1 IN2 2.5 Quad SPST Switches in Chip Scale Package ADG781/ADG782/ADG783 FUNCTIONAL BLOCK DIAGRAMS S1 IN1 S1 IN1 S1 D1 S2 IN2 D2 S3 D3 S4 IN4 D4 D1 S2 IN2 D1 S2 D2 S3 IN3 D2 ADG781 IN3 S3 IN3 ADG782 ADG783 D3 S4 IN4 D4 IN4 D3 S4 D4 SWITCHES SHOWN FOR A LOGIC “1” INPUT GENERAL DESCRIPTION PRODUCT HIGHLIGHTS The ADG781, ADG782, and ADG783 are monolithic CMOS devices containing four independently selectable switches. These switches are designed on an advanced submicron process that provides low power dissipation and high switching speed, low on resistance, low leakage currents and high bandwidth. They are designed to operate from a single 1.8 V to 5.5 V supply, making them ideal for use in battery powered instruments and with the new generation of DACs and ADCs from Analog Devices. Fast switching times and high bandwidth make the part suitable for video signal switching. The ADG781, ADG782, and ADG783 contain four independent single-pole/single throw (SPST) switches. The ADG781 and ADG782 differ only in that the digital control logic is inverted. The ADG781 switches are turned on with a logic low on the appropriate control input, while a logic high is required to turn on the switches of the ADG782. The ADG783 contains two switches whose digital control logic is similar to the ADG781, while the logic is inverted on the other two switches. Each switch conducts equally well in both directions when ON. The ADG783 exhibits break-before-make switching action. The ADG781/ADG782/ADG783 are available in 20-lead chip scale packages. 1. 20-Lead 4 mm 4 mm Chip Scale Package (CSP). 2. 1.8 V to 5.5 V Single Supply Operation. The ADG781, ADG782, and ADG783 offer high performance and are fully specified and guaranteed with 3 V and 5 V supply rails. 3. Very Low RON (4.5 Ω max at 5 V, 8 Ω max at 3 V). At supply voltage of 1.8 V, RON is typically 35 Ω over the temperature range. 4. Low On-Resistance Flatness. 5. –3 dB Bandwidth >200 MHz. 6. Low Power Dissipation. CMOS construction ensures low power dissipation. 7. Fast tON/tOFF. 8. Break-Before-Make Switching. This prevents channel shorting when the switches are configured as a multiplexer (ADG783 only). R EV. A Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 2002 ADG781/ADG782/ADG783–SPECIFICATIONS Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON) On-Resistance Match Between Channels (∆RON) On-Resistance Flatness (RFLAT(ON)) LEAKAGE CURRENTS Source OFF Leakage IS (OFF) Drain OFF Leakage ID (OFF) Channel ON Leakage ID, IS (ON) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH DYNAMIC CHARACTERISTICS2 tON tOFF Break-Before-Make Time Delay, tD (ADG783 Only) Charge Injection Off Isolation B Version –40 C to +25 C +85 C 0 V to VDD 2.5 4 4.5 0.05 0.4 1.0 ± 0.01 ± 0.1 ± 0.01 ± 0.1 ± 0.01 ± 0.1 Unit V Ω typ Ω max Ω typ Ω max Ω typ Ω max nA typ nA max nA typ nA max nA typ nA max V min V max µA typ µA max ns typ ns max ns typ ns max ns typ ns min pC typ dB typ dB typ dB typ MHz typ pF typ pF typ pF typ µA typ µA max (VDD = 5 V 10%, GND = 0 V. All specifications –40 C to +85 C unless otherwise noted.) Test Conditions/Comments VS = 0 V to VDD, IS = –10 mA; Test Circuit 1 VS = 0 V to VDD, IS = –10 mA VS = 0 V to VDD, IS = –10 mA VDD = 5.5 V; VS = 4.5 V/1 V, VD = 1 V/4.5 V; Test Circuit 2 VS = 4.5 V/1 V, VD = 1 V/4.5 V; Test Circuit 2 VS = VD = 1 V, or 4.5 V; Test Circuit 3 0.5 ± 0.2 ± 0.2 ± 0.2 2.4 0.8 0.005 ± 0.1 11 16 6 10 6 1 3 –58 –78 –90 200 10 10 22 0.001 1.0 VIN = VINL or VINH Channel-to-Channel Crosstalk Bandwidth –3 dB CS (OFF) CD (OFF) CD, CS (ON) POWER REQUIREMENTS IDD RL = 300 Ω, CL = 35 pF, VS = 3 V; Test Circuit 4 RL = 300 Ω, CL = 35 pF, VS = 3 V; Test Circuit 4 RL = 300 Ω, CL = 35 pF, VS1 = VS2 = 3 V; Test Circuit 5 VS = 2 V; RS = 0 Ω, CL = 1 nF; Test Circuit 6 RL = 50 Ω, CL = 5 pF, f = 10 MHz RL = 50 Ω, CL = 5 pF, f = 1 MHz; Test Circuit 7 RL = 50 Ω, CL = 5 pF, f = 10 MHz; Test Circuit 8 RL = 50 Ω, CL = 5 pF; Test Circuit 9 f = 1 MHz f = 1 MHz f = 1 MHz VDD = 5.5 V Digital Inputs = 0 V or 5.5 V NOTES 1 Temperature ranges are as follows: B Version: –40 °C to +85°C. 2 Guaranteed by design, not subject to production test. Specifications subject to change without notice. –2– REV. A ADG781/ADG782/ADG783 SPECIFICATIONS1 Parameter ANALOG SWITCH Analog Signal Range On Resistance (RON) (VDD = 3 V 10%, GND = 0 V. All specifications –40 C to +85 C unless otherwise noted.) B Version –40 C to +25 C +85 C 0 V to VDD 5.5 10 0.5 2.5 Unit V Ω typ Ω max Ω typ Ω max Ω typ nA typ nA max nA typ nA max nA typ nA max V min V max µA typ µA max ns typ ns max ns typ ns max ns typ ns min pC typ dB typ dB typ dB typ MHz typ pF typ pF typ pF typ µA typ µA max Test Conditions/Comments 5 0.1 On-Resistance Match Between Channels (∆RON) On-Resistance Flatness (RFLAT(ON)) LEAKAGE CURRENTS Source OFF Leakage IS (OFF) Drain OFF Leakage ID (OFF) Channel ON Leakage ID, IS (ON) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH DYNAMIC CHARACTERISTICS2 tON tOFF Break-Before-Make Time Delay, tD (ADG783 Only) Charge Injection Off Isolation VS = 0 V to VDD, IS = –10 mA; Test Circuit 1 VS = 0 V to VDD, IS = –10 mA VS = 0 V to VDD, IS = –10 mA VDD = 3.3 V; VS = 3 V/1 V, VD = 1 V/3 V; Test Circuit 2 VS = 3 V/1 V, VD = 1 V/3 V; Test Circuit 2 VS = VD = 1 V, or 3 V; Test Circuit 3 ± 0.01 ± 0.1 ± 0.01 ± 0.1 ± 0.01 ± 0.1 ± 0.2 ± 0.2 ± 0.2 2.0 0.8 0.005 ± 0.1 13 20 7 12 7 1 3 –58 –78 –90 200 10 10 22 0.001 1.0 VIN = VINL or VINH Channel-to-Channel Crosstalk Bandwidth –3 dB CS (OFF) CD (OFF) CD, CS (ON) POWER REQUIREMENTS IDD RL = 300 Ω, CL = 35 pF, VS = 2 V; Test Circuit 4 RL = 300 Ω, CL = 35 pF, VS = 2 V; Test Circuit 4 RL = 300 Ω, CL = 35 pF, VS1 = VS2 = 2 V; Test Circuit 5 VS = 1.5 V; RS = 0 Ω, CL = 1 nF; Test Circuit 6 RL = 50 Ω, CL = 5 pF, f = 10 MHz RL = 50 Ω, CL = 5 pF, f = 1 MHz; Test Circuit 7 RL = 50 Ω, CL = 5 pF, f = 10 MHz; Test Circuit 8 RL = 50 Ω, CL = 5 pF; Test Circuit 9 f = 1 MHz f = 1 MHz f = 1 MHz VDD = 3.3 V Digital Inputs = 0 V or 3.3 V NOTES 1 Temperature ranges are as follows: B Version: –40 °C to +85°C. 2 Guaranteed by design, not subject to production test. Specifications subject to change without notice. REV. A –3– ADG781/ADG782/ADG783 ABSOLUTE MAXIMUM RATINGS 1 (TA = 25°C unless otherwise noted.) Lead Temperature, Soldering (10 sec) . . . . . . . . . . . . 300°C IR Reflow (