ADG784BCP

a CMOS 3 V/5 V, Wide Bandwidth Quad 2:1 Mux in Chip Scale Package ADG784 FEATURES Low Insertion Loss and On Resistance: 4
Typical On-Resistance Flatness 200 MHz Single 3 V/5 V Supply Operation Rail-to-Rail Operation Very Low Distortion: 200 MHz. 3. Ultralow Power Dissipation. 4. Extended Signal Range. The ADG784 is fabricated on a CMOS process giving an increased signal range that fully extends to the supply rails. 5. Low Leakage over Temperature. 6. Break-Before-Make Switching. This prevents channel shorting when the switches are configured as a multiplexer. 7. Crosstalk is typically –70 dB @ 30 MHz. 8. Off isolation is typically –60 dB @ 10 MHz. 9. Available in Chip Scale Package (CSP). REV. 0 Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781/329-4700 www.analog.com Fax: 781/326-8703 © Analog Devices, Inc., 2001 ADG784–SPECIFICATIONS SINGLE SUPPLY (V DD = 5 V  10%, GND = 0 V. All specifications TMIN to TMAX unless otherwise noted.) Parameter B Version TMIN to 25C TMAX ANALOG SWITCH Analog Signal Range On Resistance (RON) 2.2 0 V to VDD 5 On Resistance Match Between Channels (∆RON) 0.15 0.5 On Resistance Flatness (RFLAT(ON)) 0.5 1 LEAKAGE CURRENTS Source OFF Leakage IS (OFF) Drain OFF Leakage ID (OFF) Channel ON Leakage ID, IS (ON) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH ± 0.01 ± 0.5 ± 0.01 ± 0.5 ± 0.01 ± 0.5 tOFF Break-Before-Make Time Delay, tD Off Isolation Channel-to-Channel Crosstalk Bandwidth –3 dB Distortion Charge Injection CS (OFF) CD (OFF) CD, CS (ON) Test Conditions/Comments V Ω typ Ω max VD = 0 V to VDD, IS = –10 mA Ω typ Ω max Ω typ Ω max 2.4 0.8 V min V max ± 0.5 µA typ µA max VIN = VINL or VINH 10 20 4 8 5 1 –65 –75 240 0.5 10 10 20 30 ns typ ns max ns typ ns max ns typ ns min dB typ dB typ MHz typ % typ pC typ pF typ pF typ pF typ RL = 100 Ω, CL = 35 pF, VS = 3 V; Test Circuit 4 RL = 100 Ω, CL = 35 pF, VS = 3 V; Test Circuit 4 RL = 100 Ω, CL = 35 pF, VS1 = VS2 = 5 V; Test Circuit 5 RL = 100 Ω, f = 10 MHz; Test Circuit 7 RL = 100 Ω, f = 10 MHz; Test Circuit 8 RL = 100 Ω; Test Circuit 6 RL = 100 Ω CL = 1 nF; Test Circuit 9 f = 1 kHz f = 1 kHz f = 1 MHz 1 0.001 IIN IO VD = 0 V to VDD; IS = –10 mA ±1 ±1 POWER REQUIREMENTS IDD VD = 0 V to VDD, IS = –10 mA nA typ nA max nA typ nA max nA typ nA max ±1 0.001 DYNAMIC CHARACTERISTICS2 tON Unit 1 100 µA max µA typ µA typ mA max VD = 4.5 V, VS = 1 V; VD = 1 V, VS = 4.5 V; Test Circuit 2 VD = 4.5 V, VS = 1 V; VD = 1 V, VS = 4.5 V; Test Circuit 2 VD = VS = 4.5 V; VD = VS = 1 V; Test Circuit 3 VDD = 5.5 V Digital Inputs = 0 V or VDD VIN = 5 V VS/VD = 0 V NOTES 1 Temperature ranges are as follows: B Version, –40°C to +85°C. 2 Guaranteed by design, not subject to production test. Specifications subject to change without notice. –2– REV. 0 ADG784 SINGLE SUPPLY (VDD = 3 V  10%, GND = 0 V. All specifications TMIN to TMAX unless otherwise noted.) Parameter B Version TMIN to 25C TMAX ANALOG SWITCH Analog Signal Range On Resistance (RON) 4 0 V to VDD 10 On Resistance Match Between Channels (∆RON) ±1 VD = 3 V, VS = 1 V; VD = 1 V, VS = 3 V; Test Circuit 2 VD = 3 V, VS = 1 V; VD = 1 V, VS = 3 V; Test Circuit 2 VD = VS = 3 V; VD = VS = 1 V; Test Circuit 3 2.0 0.4 V min V max ± 0.5 µA typ µA max VIN = VINL or VINH 12 25 5 10 5 1 –65 –75 240 2 3 10 20 30 ns typ ns max ns typ ns max ns typ ns min dB typ dB typ MHz typ % typ pC typ pF typ pF typ pF typ RL = 100 Ω, CL = 35 pF, VS = 1.5 V; Test Circuit 4 RL = 100 Ω, CL = 35 pF, VS = 1.5 V; Test Circuit 4 RL = 100 Ω, CL = 35 pF, VS1 = VS2 = 3 V; Test Circuit 5 RL = 50 Ω, f = 10 MHz; Test Circuit 7 RL = 50 Ω, f = 10 MHz; Test Circuit 8 RL = 50 Ω; Test Circuit 6 RL = 50 Ω CL = 1 nF; Test Circuit 9 f = 1 kHz f = 1 kHz f = 1 MHz 4 Drain OFF Leakage ID (OFF) Channel ON Leakage ID, IS (ON) DIGITAL INPUTS Input High Voltage, VINH Input Low Voltage, VINL Input Current IINL or IINH ±1 ±1 0.001 DYNAMIC CHARACTERISTICS2 tON tOFF Break-Before-Make Time Delay, tD Off Isolation Channel-to-Channel Crosstalk Bandwidth –3 dB Distortion Charge Injection CS (OFF) CD (OFF) CD, CS (ON) VD = 0 V to VDD, IS = –10 mA nA typ nA max nA typ nA max nA typ nA max 2 ± 0.01 ± 0.5 ± 0.01 ± 0.5 ± 0.01 ± 0.5 V Ω typ Ω max VD = 0 V to VDD, IS = –10 mA 0.5 LEAKAGE CURRENTS Source OFF Leakage IS (OFF) Test Conditions/Comments Ω typ Ω max Ω typ Ω max 0.15 On Resistance Flatness (RFLAT(ON)) Unit VD = 0 V to VDD, IS = –10 mA POWER REQUIREMENTS IDD µA max µA typ µA typ mA max 1 0.001 IIN IO 1 100 VDD = 3.3 V Digital Inputs = 0 V or VDD VIN = 3 V VS/VD = 0 V NOTES 1 Temperature ranges are as follows: B Version, –40°C to +85°C. 2 Guaranteed by design, not subject to production test. Specifications subject to change without notice. Table I. Truth Table REV. 0 EN IN D1 D2 D3 D4 Function 1 0 0 X 0 1 Hi-Z S1A S1B Hi-Z S2A S2B Hi-Z S3A S3B Hi-Z S4A S4B DISABLE IN = 0 IN = 1 –3– ADG784 ABSOLUTE MAXIMUM RATINGS 1 TERMINOLOGY (TA = 25°C unless otherwise noted.) VDD GND S D IN EN RON ∆RON Most Positive Power Supply Potential. Ground (0 V) Reference. Source Terminal. May be an input or output. Drain Terminal. May be an input or output. Logic Control Input. Logic Control Input. Ohmic resistance between D and S. On Resistance match between any two channels i.e., RON max – RON min. RFLAT(ON) Flatness is defined as the difference between the maximum and minimum value of on resistance as measured over the specified analog signal range. Source Leakage Current with the switch “OFF.” IS (OFF) ID (OFF) Drain Leakage Current with the switch “OFF.” ID, IS (ON) Channel Leakage Current with the switch “ON.” VD (VS) Analog Voltage on Terminals D, S. CS (OFF) “OFF” Switch Source Capacitance. CD (OFF) “OFF” Switch Drain Capacitance. CD, CS (ON) “ON” Switch Capacitance. tON Delay between applying the digital control input and the output switching on. See Test Circuit 4. tOFF Delay between applying the digital control input and the output switching Off. tD “OFF” time or “ON” time measured between the 90% points of both switches, when switching from one address state to another. See Test Circuit 5. Crosstalk A measure of unwanted signal that is coupled through from one channel to another as a result of parasitic capacitance. Off Isolation A measure of unwanted signal coupling through an “OFF” switch. Bandwidth Frequency response of the switch in the ON state measured at 3 dB down. Distortion RFLAT(ON)/RL VDD to GND . . . . . . . . . . . . . . . . . . . . . . . . . . –0.3 V to +6 V Analog, Digital Inputs2 . . . . . . . . . . –0.3 V to VDD + 0.3 V or 30 mA, Whichever Occurs First Continuous Current, S or D . . . . . . . . . . . . . . . . . . . . 100 mA Peak Current, S or D . . . . . . . . . . . . . . . . . . . . . . . . . . 300 mA (Pulsed at 1 ms, 10% Duty Cycle max) Operating Temperature Range Industrial (B Version) . . . . . . . . . . . . . . . . –40°C to +85°C Storage Temperature Range . . . . . . . . . . . . –65°C to +150°C Junction Temperature . . . . . . . . . . . . . . . . . . . . . . . . . . 150°C Chip Scale Package θJA Thermal Impedance . . . . . . . . . . . . . . . . . . . . . . 32°C/W Lead Temperature, Soldering Vapor Phase (60 sec) . . . . . . . . . . . . . . . . . . . . . . . . . 215°C Infrared (15 sec) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 220°C ESD . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 kV NOTES 1 Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. This is a stress rating only; functional operation of the device at these or any other conditions above those listed in the operational sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Only one absolute maximum rating may be applied at any one time. 2 Overvoltages at IN, S or D will be clamped by internal diodes. Current should be limited to the maximum ratings given. 20 19 18 17 16 IN NC VDD NC EN PIN CONFIGURATION 1 2 3 4 5 NC = NO CONNECT PIN 1 INDICATOR ADG784 TOP VIEW 15 14 13 12 11 S4A S4B D4 S3A S3B D2 6 NC 7 GND 8 NC 9 D3 10 S1A S1B D1 S2A S2B NOTE: EXPOSED PAD TIED TO SUBSTRATE, GND. ORDERING GUIDE Model Temperature Range Package Description Package Option ADG784BCP –40°C to +85°C Chip Scale Package CP-20 CAUTION ESD (electrostatic discharge) sensitive device. Electrostatic charges as high as 4000 V readily accumulate on the human body and test equipment and can discharge without detection. Although the ADG784 features proprietary ESD protection circuitry, permanent damage may occur on devices subjected to high-energy electrostatic discharges. Therefore, proper ESD precautions are recommended to avoid performance degradation or loss of functionality. –4– WARNING! ESD SENSITIVE DEVICE REV. 0 Typical Performance Characteristics–ADG784 5.0 0 TA = 25C 4.5 VDD = 2.7V VDD = 5V 4.0 3.0 ON RESPONSE – dB RON –
3.5 VDD = 3.0V 2.5 VDD = 4.5V 2.0 1.5 –2 –4 VDD = 5.0V 1.0 0.5 0 1.3 2.5 3.7 VS OR VD DRAIN OR SOURCE VOLTAGE – V –6 10k 4.9 100k 10M 1M FREQUENCY – Hz 100M TPC 4. On Response vs. Frequency TPC 1. On Resistance as a Function of VD (VS) for Various Single Supplies 3.0 0 VDD = 5V VDD = 5V RL = 100
–10 2.5 –20 RON –
2.0 1.5 ATTENUATION – dB +85C +25C –40C 1.0 –30 –40 –50 –60 –70 –80 0.5 –90 0 1.3 2.5 3.7 VS OR VO DRAIN OR SOURCE VOLTAGE – V –100 100k 4.9 4.5 –10 +85C –20 RON –
ATTENUATION – dB 3.5 +25C 2.5 –40C 2.0 1.5 1.0 VDD = 5V RL = 100
V P-P = 0.316V –30 –40 –50 –60 –70 –90 –100 100k 0.6 1.1 1.6 2.1 2.6 VS OR VD DRAIN OR SOURCE VOLTAGE – V TPC 3. On Resistance as a Function of VD (VS) for Different Temperatures with 3 V Single Supplies REV. 0 1G –80 0.5 0 100M 0 VDD = 3V 3.0 10M FREQUENCY – Hz TPC 5. Off Isolation vs. Frequency TPC 2. On Resistance as a Function of VD (VS) for Different Temperatures with 5 V Single Supplies 4.0 1M 1M 10M FREQUENCY – Hz 100M TPC 6. Crosstalk vs. Frequency –5– 1G ADG784 20 VDD = 5V TA = 25 C CHARGE INJECTION – pC 15 10 5 0 –5 –10 0 0.5 1.0 1.5 3.0 3.5 2.0 2.5 SOURCE VOLTAGE – V 4.0 4.5 5.0 TPC 7. Charge Injection vs. Source Voltage 10 BASE TX+ TX1 10 BASE TX– ADG784 100 BASE TX+ TX2 100 BASE TX– RJ45 10 BASE TX+ RX1 10 BASE TX– TRANSFORMER 100 BASE TX+ RX2 100 BASE TX– 10 BASE TX 100 BASE TX Figure 1. Full Duplex Transceiver TX1 120
100
RX1 Figure 2. Loop Back Figure 3. Line Termination –6– Figure 4. Line Clamp REV. 0 ADG784 Test Circuits IDS V1 IS (OFF) S VS A D ID (OFF) S D VS RON = V1/IDS Test Circuit 1. On Resistance ID (ON) S A VD D A VD VS Test Circuit 2. Off Leakage Test Circuit 3. On Leakage 5V 0.1F VIN 3V VDD 50% S 50% VOUT D 90% VS RL 100
IN CL 35pF 90% VOUT t OFF t ON EN GND Test Circuit 4. Switching Times 5V 0.1F VDD 3V S1A VOUT D1 VS VIN RL 100
VS CL 35pF 50% 50% 0V S1B VOUT 50% 50% VS DECODER tD EN tD GND Test Circuit 5. Break-Before-Make Time Delay VDD VDD 0.1F 0.1F ADG784 ADG784 NETWORK ANALYZER S1A NETWORK ANALYZER S1A 50
50
VS IN VIN VS IN VOUT D1 VIN 50
EN GND Test Circuit 6. Bandwidth REV. 0 VOUT D1 50
EN 50
GND Test Circuit 7. Off Isolation –7– ADG784 VDD 0.1F NETWORK ANALYZER ADG784 50
S2A C02374–2.5–4/01(0) VS S1A VOUT 50
IN D1 VIN D2 EN 50
GND Test Circuit 8. Channel-to-Channel Crosstalk 5V VDD VS ADG784 S1A D1 VOUT CL 1nF S1B S2A D2 VOUT CL 1nF S2B S3A QINJ = CL  VOUT D4 VOUT CL 1nF S4B VOUT VOUT D3 VOUT CL 1nF S3B S4A 3V VIN 1-OF-2 DECODER EN IN Test Circuit 9. Charge Injection OUTLINE DIMENSIONS Dimensions shown in inches and (mm). 20-Lead CSP (CP-20) 0.024 (0.60) 0.017 (0.42) 0.009 (0.24) 0.024 (0.60) 0.017 (0.42) 16 0.009 (0.24) 15 0.157 (4.0) BSC SQ PIN 1 INDICATOR TOP VIEW 0.148 (3.75) BSC SQ 0.031 (0.80) MAX 0.026 (0.65) NOM 12 MAX 0.035 (0.90) MAX 0.033 (0.85) NOM SEATING PLANE 0.020 (0.50) BSC 0.008 (0.20) REF 0.012 (0.30) 0.009 (0.23) 0.007 (0.18) 0.030 (0.75) 0.022 (0.60) 0.014 (0.50) 0.010 (0.25) MIN 20 1 0.080 (2.25) 0.083 (2.10) SQ 0.077 (1.95) BOTTOM VIEW 11 10 PRINTED IN U.S.A. RS 6 5 0.080 (2.00) REF 0.002 (0.05) 0.0004 (0.01) 0.0 (0.0) CONTROLLING DIMENSIONS ARE IN MILLIMETERS –8– REV. 0