TPS22980RGPR

TPS22980 www.ti.com SLVSB61C – DECEMBER 2011 – REVISED SEPTEMBER 2013 3.3V TO 18V MUX with Overcurrent Limit Check for Samples: TPS22980 FEATURES APPLICATIONS • • • • • • • • • • 1 • Powered From 3.3V 4.5V to 19.8V High Voltage Switch 3V to 3.6V Switch Adjustable Current Limit Thermal Shutdown Make Before Break Switch High Voltage Discharge Before Low Voltage Make Reverse Current Blocking Notebook Computers Desktop Computers Power Management Systems DESCRIPTION The TPS22980 is a current-limited power mux providing a connection to a peripheral device from either a low voltage supply (3.0V up to 3.6V) or a high voltage supply (5V up to 18V). The desired output is selected by digital control signals. The high voltage (VHV) and low voltage (V3P3) switch current limits are set with external resistance. Once the current limit is reached, the TPS22980 will control the switch to maintain the current at the limit. When the high voltage supply is not present, the TPS22980 will maintain the connection to the output from the low voltage supply. When a high voltage line and high voltage enable signal is detected by the device, the high voltage switch will be turned on in conjunction with the low voltage switch until a reverse current is detected by the low voltage switch. The low voltage switch is then disabled allowing a seamless transition from a low voltage to a high voltage supply with minimal drop and shoot-through current. To prevent current backflow during a transition from a VHV connection to a V3P3 connection, the TPS22980 will break the VHV connection and discharge the output to approximately 3.3V. Once the output reaches 3.3V the device will connect V3P3 switch. If a load is present, the output will transition to 0V before returning to 3.3V. The TPS22980 is available in a 4mm x 4mm x 1mm QFN package. RSVD Figure 1. Typical Application 1 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2011–2013, Texas Instruments Incorporated TPS22980 SLVSB61C – DECEMBER 2011 – REVISED SEPTEMBER 2013 www.ti.com These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. TOP VIEW / FOOTPRINT 18 V3P3 V3P3 RSVD OUT GND OUT HV_EN GND GND GND GND EN 11 1 2 3 4 5 Exposed Pad (Connect to GND) 10 ISET_S0 V3P3 20 9 ISET_S3 V3P3 19 GND GND GND EN ISET_V3P3 9 ISET_S3 VHV RSVD 16 10 ISET_S0 6 GND 8 17 20 5 VHV S0 7 4 7 VHV 19 3 VHV 18 ISET_V3P3 2 6 V3P3OUT 8 1 Exposed Pad (Connect to GND) 15 14 13 12 11 HV_EN V3P3OUT 12 OUT 17 13 GND S0 14 OUT 16 15 RSVD RSVD BOTTOM VIEW Package Size: 4mm x 4mm x 1mm height, Pad Pitch: 0.5mm PIN FUNCTIONS PIN NO. DESCRIPTION NAME 1 2 GND Device ground EN Device Enable. VHV High voltage power supply input. Place a minimum of 0.1µF capacitor as close to this pin as possible. 8 ISET_V3P3 Sets the current limit for V3P3. Place resistor between this pin and GND. See Equation 1 to calculate resistor value. 9 ISET_S3 Sets the current limit for VHV in S3 mode. Place resistor between this pin and GND. See Equation 1 to calculate resistor value. 10 ISET_S0 Sets the current limit for VHV in S0 mode. Place resistor between this pin and GND. See Equation 1 to calculate resistor value. 11 3 4 5 6 7 HV_EN High voltage output enable. 12, 14 OUT Power output. Place a minimum of 1µF capacitor as close to this pin as possible. 13 GND Device ground. RSVD Reserved. Must Tie to GND. 17 S0 When this pin is asserted, the device is put in S0 mode. Otherwise the device operates in S3 mode. 18 V3P3OUT 3.3V bypass output. Place a minimum of 0.1µF capacitor as close to this pin as possible. V3P3 3.3V power supply input. Place a minimum of 0.1µF capacitor as close to this pin as possible. 15 16 19 20 EP 2 GND Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links :TPS22980 TPS22980 www.ti.com SLVSB61C – DECEMBER 2011 – REVISED SEPTEMBER 2013 ABSOLUTE MAXIMUM RATINGS over operating free-air temperature range (unless otherwise noted) (1) (2) VALUE (3) –0.3 to 3.6 Input voltage range on EN, HVEN, ISET_V3P3, ISET_S0, ISET_S3, S0 (3) –0.3 to V3P3+0.3 Input voltage range on V3P3 (VDD) VI Input voltage range on VHV (3) –0.3 to 20 Output voltage range at OUT (3) –0.3 to 20 UNIT V Output voltage range at V3P3OUT (3) –0.3 to V3P3+0.3 TA Operating ambient temperature range –40 to 85 °C TJ Maximum operating junction temperature 110 °C –65 to 150 °C (MAX) Tstg Storage temperature range ESD Rating (1) (2) (3) Charge Device Model (JESD 22 C101) 500 V 2 kV Human Body Model (JESD 22 A114) Stresses beyond those listed under absolute maximum ratings may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under recommended operating conditions is not implied. Exposure to absolute–maximum–rated conditions for extended periods may affect device reliability. In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be de-rated. Maximum ambient temperature [TA(max)] is dependent on the maximum operating junction temperature [TJ(max)], the maximum power dissipation of the device in the application [PD(max)], and the junction-to-ambient thermal resistance of the part/package in the application (θJA), as given by the following equation: TA(max) = TJ(max) – (θJA × PD(max)) All voltage values are with respect to network ground terminal. THERMAL INFORMATION TPS22980 THERMAL METRIC (1) RGP UNITS 16 PINS θJA Junction-to-ambient thermal resistance 38.9 θJCtop Junction-to-case (top) thermal resistance 30.7 θJB Junction-to-board thermal resistance 11.5 ψJT Junction-to-top characterization parameter 0.4 ψJB Junction-to-board characterization parameter 11.4 θJCbot Junction-to-case (bottom) thermal resistance 2.2 (1) °C/W For more information about traditional and new thermal metrics, see the IC Package Thermal Metrics application report, SPRA953. Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links :TPS22980 3 TPS22980 SLVSB61C – DECEMBER 2011 – REVISED SEPTEMBER 2013 www.ti.com RECOMMENDED OPERATING CONDITIONS V3P3 Supply voltage range VHV MIN MAX 3.0 3.6 UNIT 4.5 19.8 V 0 500 mA V ILIM3P3OUT V3P3OUT Switch current range VIH Input logic high EN, HV_EN, S0 V3P3-0.6 V3P3 VIL Input logic low EN, HV_EN, S0 0 0.6 V RSET_V3P3 3.3V switch current limit set resistance 25.3 402 kΩ RSET_S0 VHV switch current limit in S0 mode set resistance 25.3 402 kΩ RSET_S3 VHV switch current limit in S3 mode set resistance 25.3 402 kΩ V ELECTRICAL CHARACTERISTICS Unless otherwise noted the specification applies over the VDD range and operating junction temp –40°C ≤ TJ ≤ 85°C. Typical values are for V3P3 = 3.3V, VHV = 15V, and TJ = 25°C. PARAMETER TEST CONDITIONS MIN TYP 3 3.3 MAX UNIT POWER SUPPLIES AND CURRENTS V3P3 V3P3 Input voltage range VHV VHV Input voltage range 3.6 V 19.8 V IVHVACT Active quiescent current from VHV HV_EN = 1, EN = 1 IVHVSD Shutdown leakage current from VHV HV_EN = 0, EN = 0 or 1 150 µA 30 IDDACT Active quiescent current from V3P3 µA EN = 1, HV_EN = 0 200 IDDACTHV µA Active quiescent current from V3P3 EN = 1, HV_EN = 1 150 µA IDDSD Shutdown Quiescent Current from V3P3 EN = 0, OUT = 0V 10 µA IDIS OUT Discharge Current EN = 1, VHV = 5V HV_EN = 1 → 0 10 mA IIN HV_EN, EN, S0, S3 Input pin leakage V=0V 1 µA V = V3P3 1 µA 4.5 5 SWITCH AND RESISTANCE CHARACTERISTICS RSHV VHV Switch resistance VHV = 5 V to 18V, IVHV = 1.5 A 250 mΩ RS3P3 V3P3 Switch resistance V3P3 = 3.3 V, IV3P3 = 1.5 A 250 mΩ RS3P3BYP V3P3 Bypass switch resistance V3P3 = 3.3 V, IV3P3 = 500 mA 500 mΩ ROUTDIS OUT Pulldown resistance when disabled EN = 0 1.5 2.5 4 kΩ VHV Input Falling 3.6 4 VOLTAGE THESHOLDS VHVUVLO VHV Under voltage lockout V3P3UVLO V3P3 Under voltage lockout VHV Input Rising V3P3 Input Falling 4 1.8 V3P3 Input Rising 4.3 2.25 2.25 2.5 120 130 V V THERMAL SHUTDOWN TSD Shutdown Temperature TSDHYST Shutdown Hysteresis 4 110 10 Submit Documentation Feedback °C °C Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links :TPS22980 TPS22980 www.ti.com SLVSB61C – DECEMBER 2011 – REVISED SEPTEMBER 2013 ELECTRICAL CHARACTERISTICS (continued) Unless otherwise noted the specification applies over the VDD range and operating junction temp –40°C ≤ TJ ≤ 85°C. Typical values are for V3P3 = 3.3V, VHV = 15V, and TJ = 25°C. PARAMETER TEST CONDITIONS MIN TYP MAX RSET_S0, 3 = 402 kΩ 100 110 150 RSET_S0, 3 = 80.6 kΩ 495 525 555 RSET_S0, 3 = 26.7 kΩ 1515 1575 1635 RSET_V3P3 = 402 kΩ 100 110 150 UNIT CURRENT LIMIT ILIMHV ILIM3P3 VHV Switch current limit state S0 or S3 V3P3 Switch current limit mA RSET_V3P3 = 80.6 kΩ 495 525 555 RSET_V3P3 = 26.7 kΩ 1515 1575 1635 mA 10 27 45 mA 100 µS IREV3P3 V3P3 Switch Reverse Current Limit TV3P3RC V3P3 Switch Reverse Current Response Time VOUT = V3P3 → V3P3 + 20mV TVHVSC VHV Switch short circuit response time COUT = 20 pF 8 µs TV3P3SC V3P3 Switch short circuit response time COUT = 20 pF 8 µs TRANSITION DELAYS T3P3OFF VHV to V3P3 off time COUT = 1.1µF, EN = 1, HV_EN = 1→0 6 ms T0-3.3V 0V to 3.3V ramp time COUT ≤ 20 pF 6 ms T3.3V-VHV 3.3V to VHV ramp time COUT ≤ 20 pF 6 ms TVHV-3.3V VHV to 3.3V ramp time COUT ≤ 20 pF 23 ms TLIM Overcurrent response time COUT ≤ 20 pF 0.5 ms FUNCTIONAL BLOCK DIAGRAM 6 VHV 3 7 1 VTHV 10 9 11 5 S0 ISET_S0 Switch CTRL Logic ISET_S3 ISET_V3P3 OUT OUT EN 12 14 13 V3P3 19 2 8 HV_EN Thermal shutdown 20 17 V3P3OUT EN 18 4 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links :TPS22980 5 TPS22980 SLVSB61C – DECEMBER 2011 – REVISED SEPTEMBER 2013 www.ti.com APPLICATION INFORMATION CURRENT LIMIT The TPS22980 provides current limiting in the power switches. Both the VHV supply current limit and the V3P3 supply current limit are adjustable by external resistors. Figure 2 shows a simplified view of the TPS22980 current limit function. Both the VHV supply current limit and the V3P3 supply current limit are adjustable by external resistors. VHV 4.5 - 18V IREF _HV Switch CTRL Logic OUT I REF_V3P3 3.3V Figure 2. Simplified Current Limit Diagram The current limit thresholds, IREF_HV and IREF_V3P3, are set with three external resistors as shown in Figure 3. When the TPS22980 is passes the V3P3 voltage, the current limit is set by RISET_V3P3. The VHV path has two modes that support two different current limits which are selected by the S0 pin. When S0 is asserted high, RISET_S0 sets the current limit. When S0 is low, RISET_S3 sets the current limit. This allows the system to have two separate VHV current limits for different modes such as active and sleep. RSET_V3P3 ISET_V3P3 RSET_S3 ISET_S3 RSET_S0 ISET_S0 Figure 3. External RSET Resistances to Set Current Limits CURRENT LIMIT THRESHOLD 6 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links :TPS22980 TPS22980 www.ti.com SLVSB61C – DECEMBER 2011 – REVISED SEPTEMBER 2013 60% 1800 1600 50% % - variance from min - A ILIMHV/V3P3 - A 1400 1200 1000 800 min typ max 600 400 40% 30% min typ max 20% 10% 200 0 0% 0 50 100 150 200 250 300 RISET_S0/S3/V3P3 - W 350 400 Figure 4. ILIM vs RSET for VHV and V3P3 450 0 50 100 150 200 250 300 RISET_S0/S3/V3P3 - W 350 400 450 Figure 5. Percent Variance from min ILIM vs RSET Figure 4 shows the minimum, typical, and maximum current limit for either supply versus its corresponding RISET value. Equation 1 is used to determine the RISET needed to set a minimum ILIM for a given supply and mode. Figure 5 shows the approximate variation from the set minimum ILIM value to the typical and maximum ILIM values. RISET = 40 kΩ ´ Amps ILIMmin (1) where: RISET = external resistor used to set the current limit for V3P3, VHV (S0), or VHV (S3), and ILIMmin = current limit for V3P3, VHV (S0), or VHV (S3) set by the external RISET resistor. Each resistor is placed between the corresponding ISET pin and GND, as shown in Figure 3, providing a minimum current limit between 100mA and 1.5A. TRANSITION DELAYS Output transitions of the TPS22980 voltages are shown in Figure 6. When the device transitions from VHV to V3P3 at the output, the power switches both turn off until the output falls to near the V3P3 voltage. During this time, a discharge current (IDIS) pulls OUT down. If a load on the line is also pulling OUT down, the output can drop to 0V due to the switch off time of T3P3OFF. Figure 7 shows the voltage drop on the output during this transition with no output capacitance. Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links :TPS22980 7 TPS22980 SLVSB61C – DECEMBER 2011 – REVISED SEPTEMBER 2013 www.ti.com Figure 6. Allowable Voltage Transitions Figure 7. Voltage Drop During Transitions from VHV DIGITAL CONTROL SIGNALS The voltage at OUT is controlled by two digital logic input signals, EN and HV_EN. HV_EN controls the state of the VHV switch and EN controls the state of V3P3 switch. Table 1 lists the possible output states given the conditions of the digital logic signals. State PD indicates a pulldown resistance of ROUTDIS to GND. Table 1. Output State of OUT Given the States EN and HV_EN 8 EN HV_EN OUT 0 0 PD 0 1 PD 1 0 V3P3 1 1 VHV Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links :TPS22980 TPS22980 www.ti.com SLVSB61C – DECEMBER 2011 – REVISED SEPTEMBER 2013 Figure 8 shows possible combinations of EN and HV_EN controlling OUT of the TPS22980. EN HV_EN HV_UVLO HV_EN & HV_UVLO S3P3 SHV 18 V OUT 3.3 V 3.3 V 0V IDIS Figure 8. Logic Waveforms Displaying the Transition Between VHV and V3P3 OVER-CURRENT LIMIT AND SHORT CIRCUIT PROTECTION When the load at OUT attempts to draw more current than the limit set by the external RISET resistors for the V3P3 switch and VHV switch (for both S0 and S3 modes), the device will operate in a constant current mode while lowering the output voltage. Figure 9 shows the delay, tLIM, which occurs when an over-current fault is detected until the output current is lowered to ILIMHV tolerances for VHV or ILIM3V3 tolerances for V3P3 as shown in Figure 4. Output Voltage t Load Current OC Limit tLIM delay Figure 9. Overcurrent Output Response All short circuit conditions are treated as over-current conditions. In the event of a short circuit, the device will limit the output current to the corresponding RSET value and continue to do so until thermal shutdown is encountered or the short circuit condition is removed. Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links :TPS22980 9 TPS22980 SLVSB61C – DECEMBER 2011 – REVISED SEPTEMBER 2013 www.ti.com Reverse Current Protection Reverse current protection for the V3P3 supply to OUT triggers at IREV3P3 causing the V3P3 supply switch to open. When the HV_EN signal is not asserted and reverse current protection is triggered, a discharge current source is turned on to bring the output voltage to 3.3V nominal. Thermal Shutdown The device enters thermal shutdown when junction temperature reaches TSD. The device will resume the previous state on power up once the junction temperature has dropped by 10°C. Connect thermal vias to the exposed GND pad underneath the device package for improved thermal diffusion. UVLO When the VHV rail reaches the under-voltage lockout threshold of VHVUVLO while HV_EN is high, the device will switch back to V3P3. Once the UVLO condition has cleared, the device will switch to VHV again. When the V3P3 rail reaches the under-voltage lockout threshold of V3P3UVLO, regardless of the states of any digital logic controls, the device will open all switches and enter a reset condition. Input Inductive Bounce at Short Circuit When the TPS22980 is operating at high currents and high input voltage on VHV, a short circuit condition can cause the input to exceed the maximum safe operating condition for VHV. When a significant inductance is present at the VHV input, sudden turn off of current through the device may produce a large enough inductive voltage bounce that exceeds the maximum safe operating condition and may damage the TPS22980. To prevent this, reduce any inductance at the input. Input capacitors, such as 4.7µF, can reduce the supply bounce and are recommended. Single Point Failure Protection The TPS22980 current limits are set by the RISET resistances. Shorting one of these resistance would result in a single point failure that removes the current limiter for that particular input and mode. Without current limiting, an excessive current load may damage the TPS22980 and the system. To prevent a single point failure from occurring, the RISET resistances can be divided into two series resistances each as shown in Figure 10. Failure of a single resistance will not result in runaway current and damage. Figure 10. RISET Division to Prevent Single Point Failure 10 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links :TPS22980 TPS22980 www.ti.com SLVSB61C – DECEMBER 2011 – REVISED SEPTEMBER 2013 REVISION HISTORY Changes from Original (December 2011) to Revision A Page • Changed Typical Application figure. ..................................................................................................................................... 1 • Added bottom view pin out information. ............................................................................................................................... 2 • Updated Pin Functions Table. .............................................................................................................................................. 2 • Added reverse current and thermal shutdown parameters to the ELECTRICAL CHARACTERISTICS table. .................... 4 • Updated the APPLICATION INFORMATION section. .......................................................................................................... 6 Changes from Revision A (February 2012) to Revision B • Page Changed bottom view pin out information. ........................................................................................................................... 2 Changes from Revision B (April 2012) to Revision C Page • Removed ordering information table. .................................................................................................................................... 2 • Added ROUTDIS parameter to the Electrical Characteristics table. ......................................................................................... 4 • Updated the DIGITAL CONTROL SIGNALS section. .......................................................................................................... 8 Submit Documentation Feedback Copyright © 2011–2013, Texas Instruments Incorporated Product Folder Links :TPS22980 11 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TPS22980RGPR ACTIVE QFN RGP 20 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 PS22980 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of