HMPS751

HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6317-B Issued Date : 1992.09.09 Revised Date : 2000.10.01 Page No. : 1/4 HMPS751 PNP SILICON TRANSISTOR Description Amplifier Transistor Absolute Maximum Ratings • Maximum Temperatures Storage Temperature ............................................................................................ -55 ~ +150 °C Junction Temperature ................................................................................... +150 °C Maximum • Maximum Power Dissipation Total Power Dissipation (Ta=25°C) ............................................................................... 625 mW • Maximum Voltages and Currents (Ta=25°C) VCBO Collector to Base Voltage ....................................................................................... -80 V VCEO Collector to Emitter Voltage .................................................................................... -60 V VEBO Emitter to Base Voltage ............................................................................................ -5 V IC Collector Current ............................................................................................................. -2 A Characteristics (Ta=25°C) Symbol BVCBO BVCEO BVEBO ICBO IEBO *VCE(sat)1 *VCE(sat)2 *VBE(sat) VBE(on) *hFE1 *hFE2 *hFE3 *hFE4 fT Min. -80 -60 -5 75 75 75 40 75 Typ. Max. -0.1 -0.1 -0.5 -0.3 -1.2 -1 Unit V V V uA uA V V V V Test Conditions IC=-100uA, IE=0 IC=-10mA, IB=0 IE=-10uA, IE=0 VCB=-80V, IE=0 VEB=-4V, IC=0 IC=-2A, IB=-200mA IC=-1A, IB=-100mA IC=-1A, IB=-100mA IC=-1A, VCE=-2V IC=-50mA, VCE=-2V IC=-500mA, VCE=-2V IC=-1A, VCE=-2 IC=-2A, VCE=-2V VCE=-5V, IC=-50mA, f=100MHz *Pulse Test : Pulse Width ≤380us, Duty Cycle≤2% MHz HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Characteristics Curve Current Gain & Collector Current 1000 10 Spec. No. : HE6317-B Issued Date : 1992.09.09 Revised Date : 2000.10.01 Page No. : 2/4 Saturation Voltage & Collector Current Current Gain-hFE 100 Saturation Voltage (V) VCE=2V 1 VBE(sat) @ IC=10IB 10 0.1 VCE(sat) @ IC=10IB 1 0.01 0.1 1 10 100 1000 10000 0.01 0.1 1 10 100 1000 10000 Collector Current-IC (mA) Collector Current-IC (mA) On Voltage & Collector Current 1 1000 Cutoff Frequency & Collector Current Cutoff Frequency (MHz) On Voltage (mV) VBE(ON) @ VCE=2V 100 VCE=5V 10 0.1 0.01 0.1 1 10 100 1000 10000 1 1 10 100 1000 Collector Current-IC (mA) Collector Current-IC (mA) Capacitance & Reverse-Biased Voltage 100 10000 Safe Operating Area PT=1ms PT=100ms Collector Current-IC (mA) Cob 1000 PT=1s Capacitance (pF) 10 100 10 1 0.1 1 10 100 1 1 10 100 Reverse-Biased Voltage (V) Forward Voltage-V CE (V) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. Spec. No. : HE6317-B Issued Date : 1992.09.09 Revised Date : 2000.10.01 Page No. : 3/4 PD-Ta 700 600 Power Dissipation-PD(mW) 500 400 300 200 100 0 0 20 40 60 80 100 o 120 140 160 Ambient Temperature-Ta( C) HSMC Product Specification HI-SINCERITY MICROELECTRONICS CORP. TO-92 Dimension A B 12 3 Spec. No. : HE6317-B Issued Date : 1992.09.09 Revised Date : 2000.10.01 Page No. : 4/4 α2 Marking : HSMC Logo Part Number Date Code Rank Product Series α3 Laser Mark HSMC Logo Product Series C D Part Number H I E F G Ink Mark Style : Pin 1.Emitter 2.Base 3.Collector α1 3-Lead TO-92 Plastic Package HSMC Package Code : A *:Typical DIM A B C D E F Inches Min. Max. 0.1704 0.1902 0.1704 0.1902 0.5000 0.0142 0.0220 *0.0500 0.1323 0.1480 Millimeters Min. Max. 4.33 4.83 4.33 4.83 12.70 0.36 0.56 *1.27 3.36 3.76 DIM G H I α1 α2 α3 Inches Min. Max. 0.0142 0.0220 *0.1000 *0.0500 *5° *2° *2° Millimeters Min. Max. 0.36 0.56 *2.54 *1.27 *5° *2° *2° Notes : 1.Dimension and tolerance based on our Spec. dated Apr. 25,1996. 2.Controlling dimension : millimeters. 3.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 4.If there is any question with packing specification or packing method, please contact your local HSMC sales office. Material : • Lead : 42 Alloy ; solder plating • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice: • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of HSMC. • HSMC reserves the right to make changes to its products without notice. • HSMC semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems. • HSMC assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. Head Office And Factory : • Head Office (Hi-Sincerity Microelectronics Corp.) : 10F.,No. 61, Sec. 2, Chung-Shan N. Rd. Taipei Taiwan R.O.C. Tel : 886-2-25212056 Fax : 886-2-25632712, 25368454 • Factory 1 : No. 38, Kuang Fu S. Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5983621~5 Fax : 886-3-5982931 • Factory 2 : No. 17-1, Ta-Tung Rd., Fu-Kou Hsin-Chu Industrial Park Hsin-Chu Taiwan. R.O.C Tel : 886-3-5977061 Fax : 886-3-5979220 HSMC Product Specification