DPG60C300QB
HiPerFRED²
VRRM
=
I FAV
= 2x
30 A
t rr
=
35 ns
300 V
High Performance Fast Recovery Diode
Low Loss and Soft Recovery
Common Cathode
Part number
DPG60C300QB
Backside: cathode
1
2
3
Features / Advantages:
Applications:
Package: TO-3P
● Planar passivated chips
● Very low leakage current
● Very short recovery time
● Improved thermal behaviour
● Very low Irm-values
● Very soft recovery behaviour
● Avalanche voltage rated for reliable operation
● Soft reverse recovery for low EMI/RFI
● Low Irm reduces:
- Power dissipation within the diode
- Turn-on loss in the commutating switch
● Antiparallel diode for high frequency
switching devices
● Antisaturation diode
● Snubber diode
● Free wheeling diode
● Rectifiers in switch mode power
supplies (SMPS)
● Uninterruptible power supplies (UPS)
● Industry standard outline
compatible with TO-247
● RoHS compliant
● Epoxy meets UL 94V-0
Disclaimer Notice
Information furnished is believed to be accurate and reliable. However, users should independently
evaluate the suitability of and test each product selected for their own applications. Littelfuse products are not designed for,
and may not be used in, all applications. Read complete Disclaimer Notice at www.littelfuse.com/disclaimer-electronics.
IXYS reserves the right to change limits, conditions and dimensions.
© 2020 IXYS all rights reserved
Data according to IEC 60747and per semiconductor unless otherwise specified
20200211c
DPG60C300QB
Ratings
Fast Diode
Conditions
Symbol
VRSM
Definition
max. non-repetitive reverse blocking voltage
TVJ = 25°C
VRRM
max. repetitive reverse blocking voltage
TVJ = 25°C
IR
reverse current, drain current
VF
forward voltage drop
I FAV
average forward current
VF0
threshold voltage
rF
slope resistance
R thJC
thermal resistance junction to case
min.
typ.
max. Unit
300
V
300
V
VR = 300 V
TVJ = 25°C
1
µA
VR = 300 V
TVJ = 150°C
0.1
mA
IF =
30 A
TVJ = 25°C
1.34
V
IF =
60 A
1.63
V
IF =
30 A
1.06
V
IF =
60 A
TVJ = 150 °C
TC = 140 °C
rectangular
1.39
V
T VJ = 175 °C
30
A
TVJ = 175 °C
0.70
V
10.5
mΩ
d = 0.5
for power loss calculation only
0.95 K/W
K/W
R thCH
thermal resistance case to heatsink
Ptot
total power dissipation
I FSM
max. forward surge current
t = 10 ms; (50 Hz), sine; VR = 0 V
TVJ = 45°C
VR = 150 V f = 1 MHz
TVJ = 25°C
50
pF
TVJ = 25 °C
3
A
CJ
junction capacitance
I RM
max. reverse recovery current
t rr
reverse recovery time
0.3
TC = 25°C
IF =
IXYS reserves the right to change limits, conditions and dimensions.
© 2020 IXYS all rights reserved
30 A; VR = 200 V
-di F /dt = 200 A/µs
160
360
W
A
TVJ = 125 °C
7
A
TVJ = 25 °C
35
ns
TVJ = 125 °C
55
ns
Data according to IEC 60747and per semiconductor unless otherwise specified
20200211c
DPG60C300QB
Package
Ratings
TO-3P
Symbol
I RMS
Definition
Conditions
RMS current
per terminal
min.
TVJ
virtual junction temperature
T op
operation temperature
Tstg
storage temperature
-55
typ.
max.
50
Unit
A
-55
175
°C
-55
150
°C
150
°C
1)
5
Weight
MD
mounting torque
FC
mounting force with clip
Product Marking
Logo
Part Number
Date Code
Lot#
g
0.8
1.2
Nm
20
120
N
Part description
D
P
G
60
C
300
QB
IXYS
yywwZ
=
=
=
=
=
=
=
Diode
HiPerFRED
extreme fast
Current Rating [A]
Common Cathode
Reverse Voltage [V]
TO-3P (3)
1234
Location
Ordering
Standard
Ordering Number
DPG60C300QB
Similar Part
DPG60C300HB
DPG60C300HJ
DPG60C300PC
DPF60C300HB
Package
TO-247AD (3)
ISOPLUS247 (3)
TO-263AB (D2Pak) (2)
TO-247AD (3)
DPG80C300HB
TO-247AD (3)
Equivalent Circuits for Simulation
I
V0
R0
Marking on Product
DPG60C300QB
* on die level
Delivery Mode
Tube
Code No.
501894
Voltage class
300
300
300
300
300
T VJ = 175°C
Fast
Diode
V 0 max
threshold voltage
0.7
V
R0 max
slope resistance *
7.9
mΩ
IXYS reserves the right to change limits, conditions and dimensions.
© 2020 IXYS all rights reserved
Quantity
30
Data according to IEC 60747and per semiconductor unless otherwise specified
20200211c
DPG60C300QB
Outlines TO-3P
1
IXYS reserves the right to change limits, conditions and dimensions.
© 2020 IXYS all rights reserved
2
3
Data according to IEC 60747and per semiconductor unless otherwise specified
20200211c
DPG60C300QB
Fast Diode
16
80
70
0.4
14
IF = 60 A
30 A
15 A
60
50
IF
TVJ = 150°C
Qrr
40
[A]
IF = 60 A
30 A
15 A
12
0.3
IRM 10
8
30
[A]
[μC]
0.2
20
6
25°C
TVJ = 125°C
VR = 200 V
10
0.1
0.0
0.4
0.8
1.2
1.6
2
0
2.0
VF [V]
Fig. 1 Forward current
IF versus VF
200
400
600
0
70
400
600
TVJ = 125°C
VR = 200 V
1.2
200
600
-diF /dt [A/μs]
Fig. 3 Typ. reverse recov. current
IRM versus -diF /dt
-diF /dt [A/μs]
Fig. 2 Typ. reverse recov. charge
Qrr versus -diF /dt
1.4
TVJ = 125°C
VR = 200 V
4
VFR
tfr
60
500
50
400
12
10
1.0
Kf 0.8
tfr
IF = 60 A
30 A
40
15 A
[ns]
trr
0.6
IRM
[ns]
30
0.4
8
TVJ = 125°C
VR = 200 V
IF = 30 A
300
200
VFR
6
[V]
4
Qrr
0.2
20
0
40
80
120
160
100
0
400
600
0
-diF /dt [A/μs]
TVJ [°C]
Fig. 4 Typ. dynamic parameters
Qrr, IRM versus TVJ
16
200
2
600
400
-diF /dt [A/μs]
Fig. 6 Typ. forward recov. voltage VFR
Fig. 5 Typ. reverse recov. time
trr versus -diF /dt
VFR & time tfr versus diF /dt
1.0
TVJ = 125°C
14
VR = 200 V
0.8
12
10
Erec
200
8
IF = 15 A
ZthJC
30 A
60 A
[K/W]
0.6
0.4
[μJ] 6
Rthi [K/W]
0.1311
0.1377
0.3468
0.2394
0.095
4
0.2
2
0.0
0
200
400
600
-diF /dt [A/μs]
Fig. 7 Typ. recovery energy
Erec versus -diF /dt
IXYS reserves the right to change limits, conditions and dimensions.
© 2020 IXYS all rights reserved
1
10
100
1000
ti [s]
0.0018
0.002
0.012
0.07
0.345
10000
t [ms]
Fig. 8 Transient thermal impedance junction to case
Data according to IEC 60747and per semiconductor unless otherwise specified
20200211c
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