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NCP2809BGEVB

NCP2809BGEVB

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    -

  • 描述:

    EVAL BOARD FOR NCP2809B

  • 数据手册
  • 价格&库存
NCP2809BGEVB 数据手册
NCP2809 Series Audio Power Amplifier, Stereo Headphone 135 mW The NCP2809 is a cost−effective stereo audio power amplifier capable of delivering 135 mW of continuous average power per channel into 16  loads. The NCP2809 audio power amplifier is specifically designed to provide high quality output power from low supply voltage, requiring very few external components. Since NCP2809 does not require bootstrap capacitors or snubber networks, it is optimally suited for low−power portable systems. NCP2809A has an internal gain of 0 dB while specific external gain can externally be set withNCP2809B. If the application allows it, the virtual ground provided by the device can be connected to the middle point of the headset (Figure 1). In such case, the two external heavy coupling capacitors typically used can be removed. Otherwise, you can also use both outputs in single ended mode with external coupling capacitors (Figure 43). Due to its excellent Power Supply Rejection Ratio (PSRR), it can be directly connected to the battery, saving the use of an LDO. Features • • • • • • • • • • 135 mW to a 16  Load from a 5.0 V Power Supply Excellent PSRR (85 dB Typical): Direct Connection to the Battery “Pop and Click” Noise Protection Circuit Ultra Low Current Shutdown Mode 2.2 V–5.5 V Operation Outstanding Total Harmonics Distortion + Noise (THD+N): Less than 0.01% External Turn−on and Turn−off Configuration Capability Thermal Overload Protection Circuitry NCP2809B available in Ultra Thin UDFN Package (3x3) Pb−Free Packages are Available Typical Applications • • • • Cellular Phone Portable Stereo MP3 Player Personal and Notebook Computers http://onsemi.com MARKING DIAGRAM MAx AYWG G Micro10 DM SUFFIX CASE 846B 10 1 2809B ALYWG G 10 PIN DFN MU SUFFIX CASE 506AT x A L Y W G = E for NCP2809A C for NCP2809B = Assembly Location = Wafer Lot = Year = Work Week = Pb−Free Package (Note: Microdot may be in either location) PIN CONNECTIONS IN_R 1 10 SD BYP 2 3 9 8 REF_I 4 7 VP IN_L 5 6 OUT_L OUT_R VM OUT_I (Top View) Micro10 IN_R 1 10 SD BYP 2 3 9 8 REF_I 4 7 VP IN_L 5 6 OUT_L OUT_R VM OUT_I (Top View) UDFN10 ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 22 of this data sheet. © Semiconductor Components Industries, LLC, 2008 April, 2008 − Rev. 11 1 Publication Order Number: NCP2809/D NCP2809 Series VP 1 F CS VP CI AUDIO INPUT 20 k IN_L 390 nF VP BYPASS Cbypass 20 k BYPASS + OUT_L + - OUT_I HEADPHONE JACK LEFT VMC BRIDGE SLEEVE 1 F REF_I CI AUDIO INPUT IN_R 20 k 390 nF 20 k SHUTDOWN VIH RIGHT OUT_R + - VM VIL SHUTDOWN CONTROL Figure 1. NCP2809A Typical Application Schematic without Output Coupling Capacitor (NOCAP Configuration) VP 1 F CS VP AUDIO INPUT CI 20 k IN_L 390 nF VP BYPASS CI BYPASS VMC BRIDGE 1 F AUDIO INPUT 20 k + OUT_L + - OUT_I Cout REF_I OUT_R + - IN_R HEADPHONE JACK LEFT NC NC 220 F + SLEEVE RIGHT Cout 20 k 390 nF 220 F + 20 k SHUTDOWN VIH VIL VM SHUTDOWN CONTROL Figure 2. NCP2809A Typical Application Schematic with Output Coupling Capacitor TIP (LEFT) RING SLEEVE (RIGHT) Figure 3. Typical 3−Wire Headphone Plug http://onsemi.com 2 NCP2809 Series 20 k VP 1 F AUDIO INPUT CI 20 k VP IN_L 390 nF VP BYPASS Cbypass AUDIO INPUT CI CS BYPASS + OUT_L + - OUT_I HEADPHONE JACK LEFT VMC BRIDGE SLEEVE 1 F 20 k REF_I OUT_R + - IN_R RIGHT 390 nF SHUTDOWN SHUTDOWN CONTROL VM VIH VIL 20 k Figure 4. NCP2809B Typical Application Schematic without Output Coupling Capacitor (NOCAP Configuration) 20 k VP 1 F CS VP AUDIO INPUT CI 20 k IN_L VP 390 nF BYPASS 1 F Cbypass AUDIO INPUT CI 20 k BYPASS VMC BRIDGE + OUT_L + - OUT_I IN_R 390 nF SHUTDOWN VIH VIL VM Cout REF_I + - 220 F + OUT_R HEADPHONE JACK LEFT NC SLEEVE NC 220 F + RIGHT Cout SHUTDOWN CONTROL 20 k Figure 5. NCP2809B Typical Application Schematic with Output Coupling Capacitor http://onsemi.com 3 NCP2809 Series PIN FUNCTION DESCRIPTION Pin Type Symbol 1 I IN_R 2 I SHUTDOWN 3 I BYPASS 4 O REF_I 5 I IN_L 6 O OUT_L 7 I VP 8 O OUT_I 9 I VM 10 O OUT_R Description Negative input of the second amplifier. It receives the audio input signal. Connected to the input capicator Cin (NCP2809A) or the external Rin (NCP2809B). The device enters in shutdown mode when a a low level is applied on this pin. Bypass capacitor pin which provides the common mode voltage (VP/2). Virtual ground amplifier feed back. This pin sets the stereo headset ground. In order to improve crosstalk, this pin must be connected as close as possible to the ground connection of the headset (ideally at the ground pin of the headset connector). When one uses bypassing capacitors, this pin must be left unconnected. Negative input of the first amplifier. It receives the audio input signal. Connected to the input capacitor Cin (NCP2809A) or the external Rin (NCP2809B). Stereo headset amplifier analog output left. This pin will output the amplified analog signal and, depending on the application, must be coupled with a capacitor or directly connected to the left loudspeaker of the headset. This output is able to drive a 16  load in a single−ended configuration. Positive analog supply of the cell. Range: 2.2 V – 5.5 V Virtual ground for stereo Headset common connection. This pin is directly connected to the common connection of the headset when use of bypassing capacitor is not required. When one uses bypassing capacitors, this pin must be left unconnected. Analog Ground Stereo headset amplifier analog output right. This pin will output the amplified analog signal and, depending on the application, must be coupled with a capacitor or directly connected to the right loudspeaker of the headset. This output is able to drive a 16  load in a single−ended configuration. MAXIMUM RATINGS (TA = +25°C) Symbol Value Unit Vp 6.0 V Op Vp 2.2 to 5.5 V Input Voltage Vin −0.3 to VCC + 0.3 V Max Output Current Iout 250 mA Power Dissipation Pd Internally Limited − Operating Ambient Temperature TA −40 to +85 °C Max Junction Temperature TJ 150 °C Tstg −65 to +150 °C RJA 200 240 °C/W − 8000 200 V ±100 mA Rating Supply Voltage Operating Supply Voltage Storage Temperature Range Thermal Resistance, Junction−to−Air ESD Protection Micro10 UDFN Human Body Model (HBM) (Note 1) Machine Model (MM) (Note 2) Latch up current at Ta = 85_C (Note 3) Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. 1. Human Body Model, 100 pF discharged through a 1.5 k resistor following specification JESD22/A114 8.0 kV can be applied on OUT_L, OUT_R, REF_I and OUT_I outputs. For other pins, 2.0 kV is the specified voltage. 2. Machine Model, 200 pF discharged through all pins following specification JESD22/A115. 3. Maximum ratings per JEDEC standard JESD78. *This device contains 752 active transistors and 1740 MOS gates. http://onsemi.com 4 NCP2809 Series ELECTRICAL CHARACTERISTICS All the parameters are given in the capless configuration (typical application). The following parameters are given for the NCP2809A and NCP2809B mounted externally with 0 dB gain, unless otherwise noted. (For typical values TA = 25°C, for min and max values TA = −40°C to 85°C, TJmax = 125°C, unless otherwise noted.) Characteristic Min (Note 4) Typ Max (Note 4) 1.54 1.84 2.8 3.6 1.0 +25 mV 10 600 nA Symbol Conditions IDD Vin = 0 V, RL = 16  Vp = 2.4 V Vp = 5.0 V Output Offset Voltage Voff Vp = 2.4 V Vp = 5.0 V Shutdown Current ISD Vp = 5.0 V Shutdown Voltage High (Note 5) VSDIH − Shutdown Voltage Low VSDIL − Turning On Time (Note 6) TWU Cby = 1.0 F 285 ms Turning Off Time (Note 6) TSD Cby = 1.0 F 50 ms Vloadpeak Vp = 2.4 V, RL = 16  Vp = 5.0 V, RL = 16  0.9 2.05 V Supply Quiescent Current Max Output Swing Max Rms Output Power POrms mA −25 1.2 V 0.4 0.82 1.94 Vp = 2.4 V, RL = 32  Vp = 5.0 V, RL = 32  1.04 2.26 Vp = 2.4 V, RL = 16 , THD+N
NCP2809BGEVB 价格&库存

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