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843001AGI-22LF

843001AGI-22LF

  • 厂商:

    RENESAS(瑞萨)

  • 封装:

    TSSOP-24

  • 描述:

    IC SYNTHESIZER LVPECL 24-TSSOP

  • 数据手册
  • 价格&库存
843001AGI-22LF 数据手册
FemtoClock™ Crystal/LVCMOS-to-3.3V, 2.5V LVPECL Frequency Synthesizer 843001I-22 DATA SHEET General Description Features The 843001I-22 is a a highly versatile, low phase noise LVPECL/LVCMOS Synthesizer which can generate low jitter reference clocks for a variety of communications applications and is a member of the family of high performance clock solutions from IDT. The dual crystal interface allows the synthesizer to support up to two communication standards in a given application (i.e. 1GB Ethernet with a 25MHz crystal and 1Gb Fibre Channel using a 26.5625MHz crystal). The rms phase jitter performance is typically less than 1ps, thus making the device acceptable for use in demanding applications such as OC48 SONET and 10Gb Ethernet. The 843001I-22 is packaged in a small 24-pin TSSOP package. • One 3.3Vdifferential LVPECL output pair and one LVCMOS/LVTTL single-ended reference clock output • Selectable crystal oscillator interface or LVCMOS/LVTTL single-ended input • • • VCO range: 490MHz – 640MHz • RMS phase jitter @ 125MHz (1.875MHz - 20MHz): 0.50ps (typical) • • • Control Input Function Table Input Output frequency range: 49MHz – 640MHz Supports the following applications: SONET, Ethernet, Fibre Channel, Serial ATA, and HDTV Full 3.3V or 2.5V supply mode -40°C to 85°C ambient operating temperature Available in lead-free (RoHS 6) package Outputs OE Q/nQ REF_OUT 0 High-Impedance High-Impedance 1 High-Impedance Active FLOAT Active High-Impedance Pin Assignment VCCO_LVCMOS N0 N1 N2 VCCO_LVPECL Q nQ VEE VCCA VCC XTAL_OUT1 XTAL_IN1 Block Diagram 3 N2:N0 SEL0 Pulldown N XTAL_IN0 00 11 XTAL_OUT0 XTAL_IN1 OSC 01 Phase Detector VCO 490MHz-640MHz 10 01 00 XTAL_OUT1 CLK Pulldown 24 23 22 21 20 19 18 17 16 15 14 13 REF_OUT VEE OE M2 M1 M0 MR SEL1 SEL0 CLK XTAL_IN0 XTAL_OUT0 843001I-22 SEL1 Pulldown OSC 1 2 3 4 5 6 7 8 9 10 11 12 10 000 001 010 011 100 101 000 001 010 011 ÷1 ÷2 ÷3 ÷4 (default) 100 101 110 111 ÷5 ÷6 ÷8 ÷10 Q 24-Lead TSSOP 4.4mm x 7.8mm x 0.925mm package body G Package Top View nQ M ÷18 ÷22 ÷24 ÷25 ÷32 (default) ÷40 MR Pulldown M2:M0 3 REF_CLK OE Pullup/Pulldown 843001I-22 Rev B 11/16/15 1 ©2015 Integrated Device Technology, Inc. 843001I-22 DATA SHEET Table 1. Pin Descriptions Number Name 1 VCCO_LVCMOS Power Type 2, 3 N0, N1 Input Pullup 4 N2 Input Pulldown Description Output supply pin for REF_CLK output. Output divider select pins. Default ÷4. LVCMOS/LVTTL interface levels. See Table 3C. 5 VCCO_LVPECL Power Output supply pin for LVPECL output. 6, 7 Q, nQ Output Differential output pair. LVPECL interface levels. 8, 23 VEE Power Negative supply pins. 9 VCCA Power Analog supply pin. 10 VCC Power Core supply pin. 11, 12 XTAL_OUT1, XTAL_IN1 Input Parallel resonant crystal interface. XTAL_OUT1 is the output, XTAL_IN1 is the input. 13, 14 XTAL_OUT0, XTAL_IN0 Input Parallel resonant crystal interface. XTAL_OUT0 is the output, XTAL_IN0 is the input. 15 CLK Input Pulldown LVCMOS/LVTTL clock input. 16, 17 SEL0, SEL1 Input Pulldown Input MUX select pins. LVCMOS/LVTTL interface levels. See Table 3D. Active HIGH Master Reset. When logic HIGH, the internal dividers are reset causing the true output Q to go low and the inverted output nQ to go high. When logic LOW, the internal dividers and the outputs are enabled. LVCMOS/LVTTL interface levels. 18 MR Input Pulldown 19, 20 M0, M1 Input Pulldown 21 M2 Input Pullup 22 OE Input 24 REF_OUT Output Feedback divider select pins. Default value = ÷32. See Table 3B. LVCMOS/LVTTL interface levels. 3-State clock output enable, (High/Low/Float). See page 1, Control Input Function Table. Reference clock output. LVCMOS/LVTTL interface levels. NOTE: Pullup and Pulldown refer to internal input resistors. See Table 2, Pin Characteristics, for typical values. Table 2. Pin Characteristics Symbol Parameter CIN Input Capacitance 4 pF RPULLUP Input Pullup Resistor 51 k RPULLDOWN Input Pulldown Resistor 51 k ROUT Output Impedance 15  Rev B 11/16/15 Test Conditions REF_OUT 2 Minimum Typical Maximum Units FEMTOCLOCK™ CRYSTAL/LVCMOS-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER 843001I-22 DATA SHEET Function Tables Table 3A. Common Configuration Table Input Reference Clock (MHz) M Divider Value N Divider Value VCO (MHz) Output Frequency (MHz) Application 27 22 8 594 74.25 HDTV 22.4 25 8 560 70 24.75 24 8 594 74.25 HDTV 25 24 3 600 200 Processor 14.8351649 40 8 593.4066 74.1758245 HDTV 19.44 32 4 622.08 155.52 SONET 19.44 32 8 622.08 77.76 SONET 19.44 32 1 622.08 622.08 SONET 19.44 32 2 622.08 311.04 SONET 19.53125 32 4 625 156.25 10 GigE 20 25 2 500 250 Ethernet 25 25 5 625 125 1 GigE 25 25 10 625 62.5 1 GigE 25 24 6 600 100 PCI Express 25 24 4 600 150 SATA 25 24 8 600 75 SATA 26.5625 24 6 637.5 106.25 Fibre Channel 1 26.5625 24 3 637.5 212.5 4 Gig Fibre Channel 26.5625 24 4 637.5 159.375 10 Gig Fibre Channel 31.25 18 3 562.5 187.5 12 GigE Table 3B. Programmable M Output Divider Function Table Inputs Input Frequency (MHz) M2 M1 M0 M Divider Value 0 0 0 18 27.22 35.56 0 0 1 22 22.27 29.09 0 1 0 24 20.41 26.67 0 1 1 25 19.6 25.6 1 0 0 32 15.31 20 1 0 1 40 12.25 16 Minimum Maximum FEMTOCLOCK™ CRYSTAL/LVCMOS-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER 3 Rev B 11/16/15 843001I-22 DATA SHEET Table 3C. Programmable N Output DividerFunction Table Inputs N2 N1 N0 M Divider Value 0 0 0 1 0 0 1 2 0 1 0 3 0 1 1 4 (default) 1 0 0 5 1 0 1 6 1 1 0 8 1 1 1 10 Table 3D. Bypass Mode Function Table Inputs SEL1 SEL0 Reference PLL Mode 0 0 XTAL0 Active 0 1 XTAL1 Active 1 0 CLK Active 1 1 CLK Bypass Rev B 11/16/15 4 FEMTOCLOCK™ CRYSTAL/LVCMOS-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER 843001I-22 DATA SHEET Absolute Maximum Ratings NOTE: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These ratings are stress specifications only. Functional operation of product at these conditions or any conditions beyond those listed in the DC Characteristics or AC Characteristics is not implied. Exposure to absolute maximum rating conditions for extended periods may affect product reliability. Item Rating Supply Voltage, VCC 4.6V Inputs, VI -0.5V to VCC + 0.5V Outputs, IO (LVPECL) Continuous Current Surge Current 50mA 100mA Outputs, VO (LVCMOS) -0.5V to VCCO_LVCMOS + 0.5V Package Thermal Impedance, JA 70C/W (0 mps) Storage Temperature, TSTG -65C to 150C DC Electrical Characteristics Table 4A. Power Supply DC Characteristics, VCC = VCCO_LVCMOS = VCCO_LVPECL = 3.3V ± 10%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter VCC Test Conditions Minimum Typical Maximum Units Core Supply Voltage 2.97 3.3 3.63 V VCCA Analog Supply Voltage 2.97 3.3 3.63 V VCCO_PECL, VCCO_CMOS Output Supply Voltage 2.97 3.3 3.63 V IEE Power Supply Current 160 mA ICCO_LVPECL + ICCO_LVCMOS Output Supply Current 8 mA Table 4B. Power Supply DC Characteristics, VCC = VCCO_LVCMOS = VCCO_LVPECL = 2.5V ± 5%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter VCC Minimum Typical Maximum Units Core Supply Voltage 2.375 2.5 2.625 V VCCA Analog Supply Voltage 2.375 2.5 2.625 V VCCO_PECL, VCCO_CMOS Output Supply Voltage 2.375 2.5 2.625 V IEE Power Supply Current 155 mA ICCO_LVPECL + ICCO_LVCMOS Output Supply Current 8 mA FEMTOCLOCK™ CRYSTAL/LVCMOS-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER Test Conditions 5 Rev B 11/16/15 843001I-22 DATA SHEET Table 4C. LVCMOS/LVTTL DC Characteristics, VCC = VCCO_LVCMOS = 3.3V ± 10% or 2.5V ± 5%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter VIH Input High Voltage VIM Input Medium Voltage VIL Input Low Voltage IIH IIM IIL Test Conditions Minimum VCC = 3.63V VCC = 2.625V Typical Maximum Units 2 VCC + 0.3 V 1.7 VCC + 0.3 V VCC = 3.63V V VCC = 2.625V V VCC = 3.63V -0.3 0.8 V VCC = 2.625V -0.3 0.7 V CLK, M0, M1, N2, MR, OE, SEL0, SEL1 VCC = VIN = 3.63V or 2.625V 150 µA M2, N0, N1 VCC = VIN = 3.63V or 2.625V 5 µA Input High Current Input Medium Current µA CLK, M0, M1, N2, MR, OE, SEL0, SEL1 VCC = 3.63V or 2.625V, VIN = 0V -5 µA M2, N0, N1, OE VCC = 3.63V or 2.625V, VIN = 0V -150 µA VCCO_LVCMOS = 3.63V 2.6 V VCCO_LVCMOS = 2.625V 1.8 V Input Low Current VOH Output High Voltage: NOTE 1 REF_OUT VOL Output Low Voltage: NOTE 1 REF_OUT VCCO_LVCMOS = 3.63V or 2.625V 0.5 V NOTE 1: Output terminated with 50 to VCCO _LVCMOS/2. See Parameter Measurement Information Section, "3.3V LVCMOS Output Load Test Circuit Diagram”. Table 4D. LVPECL DC Characteristics, VCC = VCCO_LVPECL = 3.3V ± 10% or 2.5V ± 5%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter VOH Output High Current; NOTE 1 VOL Output Low Current; NOTE 1 VSWING Peak-toPeak Output Voltage Swing Test Conditions Minimum Typical Maximum Units VCCO – 1.4 VCCO – 0.9 µA VCCO – 2.0 VCCO – 1.7 µA 0.6 1.0 V NOTE 1: Outputs termination with 50 to VCCO_LVPECL – 2V. Rev B 11/16/15 6 FEMTOCLOCK™ CRYSTAL/LVCMOS-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER 843001I-22 DATA SHEET Table 5. Crystal Characteristics Parameter Test Conditions Minimum Maximum Units 35.55 MHz Equivalent Series Resistance (ESR) 50  Shunt Capacitance 7 pF Drive Level 1 mW Mode of Oscillation Typical Fundamental Frequency 14 NOTE: Characterized using an 18pF parallel resonant crystal. Table 6. Input Frequency Characteristics, VCC = VCCO_LVCMOS = VCCO_LVPECL 3.3V ± 10%, VEE = 0V,TA = -40°C to 85°C Symbol Parameter fIN Input Frequency Test Conditions Minimum CLK SEL1 = 1, SEL0 = 0 CLK SEL1 = 1, SEL0 = 0 Typical Maximum Units 14 35.55 MHz DC 250 MHz AC Electrical Characteristics Table 7A. AC Characteristics, VCC = VCCO_LVCMOS = VCCO_LVPECL = 3.3V ± 10%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter Test Conditions fOUT Output Frequency tjit(Ø) RMS Phase Jitter, (Random); NOTE 1 fVCO PLL VCO Lock Range tR / tF Output Rise/Fall Time odc Output Duty Cycle Minimum Typical 49 125MHz, (1.875MHz – 20MHz) Maximum Units 640 MHz 0.50 ps 490 640 MHz Q/nQ 20% to 80% 200 500 ps REF_OUT 20% to 80% 200 700 ps 45 55 % ƒ  250MHz 44 56 % Q/nQ REF_OUT NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium has been reached under these conditions. NOTE 1: Phase jitter measured using a crystal interface. FEMTOCLOCK™ CRYSTAL/LVCMOS-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER 7 Rev B 11/16/15 843001I-22 DATA SHEET Table 7B. AC Characteristics, VCC = VCCO_LVCMOS = VCCO_LVPECL = 2.5V ± 5%, VEE = 0V, TA = -40°C to 85°C Symbol Parameter fOUT Output Frequency tjit(Ø) RMS Phase Jitter, (Random); NOTE 1 fVCO PLL VCO Lock Range tR / tF Output Rise/Fall Time odc Output Duty Cycle Test Conditions Minimum Typical 49 125MHz, (1.875MHz – 20MHz) Maximum Units 640 MHz 0.50 ps 490 640 MHz Q/nQ 20% to 80% 200 500 ps REF_OUT 20% to 80% 300 800 ps 45 55 % 44 56 % Q/nQ REF_OUT ƒ  250MHz NOTE: Electrical parameters are guaranteed over the specified ambient operating temperature range, which is established when the device is mounted in a test socket with maintained transverse airflow greater than 500 lfpm. The device will meet specifications after thermal equilibrium has been reached under these conditions. NOTE 1: Phase jitter measured using a crystal interface. Rev B 11/16/15 8 FEMTOCLOCK™ CRYSTAL/LVCMOS-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER 843001I-22 DATA SHEET Typical Phase Noise at 125MHz . 0 -20 125MHz RMS Phase Jitter (Random) 1.875MHz to 20MHz = 0.50ps (typical)  -10 10Gb Ethernet Filter -30 -40 -50 -70 -80 -90 -100 -110  Noise Power dBc Hz -60 -120 Raw Phase Noise Data -130 -140 -150  -160 -170 Phase Noise Result by adding a 10Gb Ethernet filter to raw data -180 -190 100 1k 10k 100k 1M 10M 100M Offset Frequency (Hz) FEMTOCLOCK™ CRYSTAL/LVCMOS-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER 9 Rev B 11/16/15 843001I-22 DATA SHEET Parameter Measurement Information 2V 1.65V±5% VCC, VCCA, VCCO_LVPECL Qx SCOPE SCOPE VCC, VCCA, VCCO_LVCMOS Qx GND nQx VEE -1.65V±5% -1.3V± 0.165V 3.3V LVPECL Output Load AC Test Circuit 3.3V LVCMOS Output Load AC Test Circuit 2V 1.25V±5% VCC, Qx SCOPE SCOPE VCC, VCCA, VCCO_LVCMOS VCCA, VCCO_LVPECL nQx Qx GND VEE -1.25V±5% -0.5V±0.125V 2.5V LVPECL Output Load AC Test Circuit 2.5V LVCMOS Output Load AC Test Circuit Phase Noise Plot V Noise Power CCO_CMOS 2 REF_OUT t PW t Phase Noise Mask f1 Offset Frequency odc = PERIOD t PW x 100% t PERIOD f2 RMS Jitter = Area Under the Masked Phase Noise Plot RMS Phase Jitter Rev B 11/16/15 LVCMOS Output Duty Cycle/Pulse Width/Period 10 FEMTOCLOCK™ CRYSTAL/LVCMOS-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER 843001I-22 DATA SHEET Parameter Measurement Information, continued nQ 80% 80% Q 20% 20% REF_OUT LVPECL Output Duty Cycle/Pulse Width/Period tR tF LVCMOS Output Rise/Fall Time nQ Q LVPECL Output Rise/Fall Time Application Information Power Supply Filtering Technique As in any high speed analog circuitry, the power supply pins are vulnerable to random noise. To achieve optimum jitter performance, power supply isolation is required. The 843001I-22 provides separate power supplies to isolate any high switching noise from the outputs to the internal PLL. VCC, VCCA, VCCO_X should be individually connected to the power supply plane through vias, and 0.01µF bypass capacitors should be used for each pin. Figure 1 illustrates this for a generic VCC pin and also shows that VCCA requires that an additional 10 resistor along with a 10F bypass capacitor be connected to the VCCA pin. FEMTOCLOCK™ CRYSTAL/LVCMOS-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER 3.3V or 2.5V VCC .01µF 10Ω .01µF 10µF VCCA Figure 1. Power Supply Filtering 11 Rev B 11/16/15 843001I-22 DATA SHEET Crystal Input Interface The 843001I-22 has been characterized with 18pF parallel resonant crystals. The capacitor values shown in Figure 2 below were determined using a 26.5625MHz, 18pF parallel resonant crystal and were chosen to minimize the ppm error. XTAL_IN C1 22pF X1 18pF Parallel Crystal XTAL_OUT C2 22pF Figure 2. Crystal Input Interface LVCMOS to XTAL Interface The XTAL_IN input can accept a single-ended LVCMOS signal through an AC coupling capacitor. A general interface diagram is shown in Figure 3. The XTAL_OUT pin can be left floating. The input edge rate can be as slow as 10ns. For LVCMOS signals, it is recommended that the amplitude be reduced from full swing to half swing in order to prevent signal interference with the power rail and to reduce noise. This configuration requires that the output impedance of the driver (Ro) plus the series resistance (Rs) equals VDD the transmission line impedance. In addition, matched termination at the crystal input will attenuate the signal in half. This can be done in one of two ways. First, R1 and R2 in parallel should equal the transmission line impedance. For most 50 applications, R1 and R2 can be 100. This can also be accomplished by removing R1 and making R2 50. By overdriving the crystal oscillator, the device will be functional, but note, the device performance is guaranteed by using a quartz crystal. VDD R1 Ro Rs 0.1µf 50Ω XTAL_IN Zo = Ro + Rs R2 XTAL_OUT Figure 3. General Diagram for LVCMOS Driver to XTAL Input Interface Rev B 11/16/15 12 FEMTOCLOCK™ CRYSTAL/LVCMOS-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER 843001I-22 DATA SHEET Recommendations for Unused Input and Output Pins Inputs: Outputs: Crystal Inputs LVPECL Outputs For applications not requiring the use of the crystal oscillator input, both XTAL_IN and XTAL_OUT can be left floating. Though not required, but for additional protection, a 1k resistor can be tied from XTAL_IN to ground. The unused LVPECL output pair can be left floating. We recommend that there is no trace attached. Both sides of the differential output pair should either be left floating or terminated. LVCMOS Output CLK Input All unused LVCMOS output can be left floating. We recommend that there is no trace attached. For applications not requiring the use of the clock input, it can be left floating. Though not required, but for additional protection, a 1k resistor can be tied from the CLK input to ground. LVCMOS Control Pins All control pins have internal pullups or pulldowns; additional resistance is not required but can be added for additional protection. A 1k resistor can be used. Termination for 3.3V LVPECL Outputs The clock layout topology shown below is a typical termination for LVPECL outputs. The two different layouts mentioned are recommended only as guidelines. transmission lines. Matched impedance techniques should be used to maximize operating frequency and minimize signal distortion. Figures 4A and 4B show two different layouts which are recommended only as guidelines. Other suitable clock layouts may exist and it would be recommended that the board designers simulate to guarantee compatibility across all printed circuit and clock component process variations. The differential outputs are low impedance follower outputs that generate ECL/LVPECL compatible outputs. Therefore, terminating resistors (DC current path to ground) or current sources must be used for functionality. These outputs are designed to drive 50 R3 125 3.3V R4 125 3.3V 3.3V Zo = 50 + _ Input Zo = 50 R1 84 Figure 4A. 3.3V LVPECL Output Termination FEMTOCLOCK™ CRYSTAL/LVCMOS-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER R2 84 Figure 4B. 3.3V LVPECL Output Termination 13 Rev B 11/16/15 843001I-22 DATA SHEET Termination for 2.5V LVPECL Outputs level. The R3 in Figure 5B can be eliminated and the termination is shown in Figure 5C. Figure 5A and Figure 5B show examples of termination for 2.5V LVPECL driver. These terminations are equivalent to terminating 50 to VCC – 2V. For VCCO = 2.5V, the VCCO – 2V is very close to ground 2.5V 2.5V VCCO = 2.5V 2.5V VCCO = 2.5V R1 250 R3 250 50 + 50 + 50 – 50 – 2.5V LVPECL Driver R1 50 2.5V LVPECL Driver R2 62.5 R4 62.5 R2 50 R3 18 Figure 5A. 2.5V LVPECL Driver Termination Example Figure 5B. 2.5V LVPECL Driver Termination Example 2.5V VCCO = 2.5V 50 + 50 – 2.5V LVPECL Driver R1 50 R2 50 Figure 5C. 2.5V LVPECL Driver Termination Example Rev B 11/16/15 14 FEMTOCLOCK™ CRYSTAL/LVCMOS-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER 843001I-22 DATA SHEET Schematic Layout and C5 may be slightly adjusted for optimizing frequency accuracy. Two examples of LVPECL terminations and one example of LVCMOS are shown in this schematic. Additional termination approaches are shown in the LVPECL Termination Application Note. Figure 6 shows an example of 843001I-22 application schematic. In this example, the device is operated at VCC = VCCO_LVCMOS = VCCO_LVPECL = 3.3V. The 18pF parallel resonant 25MHz crystal is used. The C1 = C2 = 22pF and C4 = C5 = 22pF are recommended for frequency accuracy. For different board layouts, the C1, C2, C4 Logic Control Input Examples Set Logic Input to '1' VCC RU1 1K Set Logic Input to '0' VCC RU2 Not Install To Logic Input pins RD1 Not Install R1 33 To Logic Input pins Zo = 50 Ohm REF_OUT RD2 1K 3.3V LVCMOS VCC VCCO_LVCMOS R2 133 U1 Zo = 50 Ohm VCCO_LVPECL N0 N1 N2 VCC R4 VCC 10 VCCA C7 0.1u C6 10u Q nQ VCC XTAL_OUT1 XTAL_IN1 C3 .1uf 1 2 3 4 5 6 7 8 9 10 11 12 VCCO_LVCMOS REF_OUT N0 VEE N1 OE M2 N2 VCCO_LVPECL M1 Q M0 nQ MR VEE SEL1 VCCA SEL0 VCC CLK XTAL_OUT1 XTAL_IN0 XTAL_IN1 XTAL_OUT0 RU3 1K 24 23 22 21 20 19 18 17 16 15 14 13 R3 133 Q TL2 OE M2 M1 M0 MR SEL1 SEL0 CLK XTAL_IN0 XTAL_OUT0 + Zo = 50 Ohm /Q RD3 1K - TL3 R5 82.5 VCC=3.3V R6 82.5 VCCO_LVCMOS=3.3V VCCO_LVPECL=3.3V F p 8 1 C2 22pF X2 26.5625MHz F p 8 1 X1 25MHz C4 22pF Zo = 50 Ohm Q C5 22pF + C1 22pF Zo = 50 Ohm /Q - VDD VCCO R7 50 Q1 (U1:1) VDDO (U1:5) Ro ~ 7 Ohm R9 43 C8 .1uf C9 .1uf Zo = 50 Ohm Optional LVPECL Y-Termination R8 50 R10 50 Driv er_LVCMOS 843001I-22 Layout Example FEMTOCLOCK™ CRYSTAL/LVCMOS-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER 15 Rev B 11/16/15 843001I-22 DATA SHEET Power Considerations This section provides information on power dissipation and junction temperature for the 843001I-22. Equations and example calculations are also provided. 1. Power Dissipation. The total power dissipation for the 843001I-22 is the sum of the core power plus the power dissipated in the load(s). The following is the power dissipation for VCC = 3.3V + 5% = 3.465V, which gives worst case results. NOTE: Please refer to Section 3 for details on calculating power dissipated in the load. • Power (core)MAX = VCC_MAX * IEE_MAX = 3.465V * 160mA = 554.4mW • Power (outputs)MAX = 30mW/Loaded Output pair Total Power_MAX (3.3V, with all outputs switching) = 554.4mW + 30mW = 584.4mW 2. Junction Temperature. Junction temperature, Tj, is the temperature at the junction of the bond wire and bond pad and directly affects the reliability of the device. The maximum recommended junction temperature for HiPerClockS devices is 125°C. The equation for Tj is as follows: Tj = JA * Pd_total + TA Tj = Junction Temperature JA = Junction-to-Ambient Thermal Resistance Pd_total = Total Device Power Dissipation (example calculation is in section 1 above) TA = Ambient Temperature In order to calculate junction temperature, the appropriate junction-to-ambient thermal resistance JA must be used. Assuming a moderate air flow of 1 meter per second and a multi-layer board, the appropriate value is 65°C/W per Table 8 below. Therefore, Tj for an ambient temperature of 85°C with all outputs switching is: 85°C + 0.584W * 65°C/W = 123°C. This is below the limit of 125°C. This calculation is only an example. Tj will obviously vary depending on the number of loaded outputs, supply voltage, air flow and the type of board (single layer or multi-layer). Table 8. Thermal Resitance JA for 24 Lead TSSOP, Forced Convection JA vs. Air Flow Meters per Second Multi-Layer PCB, JEDEC Standard Test Boards Rev B 11/16/15 0 1 2.5 70°C/W 65°C/W 62°C/W 16 FEMTOCLOCK™ CRYSTAL/LVCMOS-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER 843001I-22 DATA SHEET 3. Calculations and Equations. The purpose of this section is to derive the power dissipated into the load. LVPECL output driver circuit and termination are shown in Figure 7. VCCO Q1 VOUT RL 50Ω VCCO - 2V Figure 7. LVPECL Driver Circuit and Termination To calculate worst case power dissipation into the load, use the following equations which assume a 50 load, and a termination voltage of VCCO – 2V. • For logic high, VOUT = VOH_MAX = VCCO_MAX – 0.9V (VCCO_MAX - VOH_MAX) = 0.9V • For logic low, VOUT = VOL_MAX = VCOO_MAX – 1.7V (VCCO_MAX - VOL_MAX) = 1.7V Pd_H is power dissipation when the output drives high. Pd_L is the power dissipation when the output drives low. Pd_H = [(VOH_MAX – (VCCO_MAX - 2V))/R ] * (VCCO_MAX - VOH_MAX) = [(2V - (VCCO_MAX - VOH_MAX))/R ] * (VCCO_MAX - VOH_MAX) = [(2V - 0.9V)/50] * 0.9V = 19.8mW L L Pd_L = [(VOL_MAX (VCCO_MAX - 2V))/R ] * (VCCO_MAX - VOL_MAX) = [(2V - (VCCO_MAX - VOL_MAX))/R ] * (VCCO_MAX - VOL_MAX) = [(2V - 1.7V)/50] * 1.7V = 10.2mW – L L Total Power Dissipation per output pair = Pd_H + Pd_L = 30mW FEMTOCLOCK™ CRYSTAL/LVCMOS-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER 17 Rev B 11/16/15 843001I-22 DATA SHEET Reliability Information Table 9. JA vs. Air Flow Table for a 24 Lead TSSOP JA vs. Air Flow Meters per Second Multi-Layer PCB, JEDEC Standard Test Boards 0 1 2.5 70°C/W 65°C/W 62°C/W Transistor Count The transistor count for 843001I-22 is: 3881 Package Outline and Package Dimensions Package Outline - G Suffix for 24 Lead TSSOP Table 10. Package Dimensions All Dimensions in Millimeters Symbol Minimum Maximum N 24 A 1.20 A1 0.5 0.15 A2 0.80 1.05 b 0.19 0.30 c 0.09 0.20 D 7.70 7.90 E 6.40 Basic E1 4.30 4.50 e 0.65 Basic L 0.45 0.75  0° 8° aaa 0.10 Reference Document: JEDEC Publication 95, MO-153 6.10 mm. Body, 0.65 mm. Pitch TSSOP (240 mil)* Rev B 11/16/15 (25.6mil)* 18 FEMTOCLOCK™ CRYSTAL/LVCMOS-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER 843001I-22 DATA SHEET Ordering Information Table 11. Ordering Information Part/Order Number 843001AGI-22LF 843001AGI-22LFT Marking ICS43001AI22L ICS43001AI22L Package “Lead-Free” 24 Lead TSSOP “Lead-Free” 24 Lead TSSOP Shipping Packaging Tube 2500 Tape & Reel Temperature -40°C to 85°C -40°C to 85°C NOTE: "LF" suffix to the part number are the Pb-Free configuration and are RoHS compliant. FEMTOCLOCK™ CRYSTAL/LVCMOS-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER 19 Rev B 11/16/15 843001I-22 DATA SHEET Revision History Sheet Rev Table Page 1 A A B B B Rev B 11/16/15 3/23/07 16 19 Power Considerations - Changed Ambient Temperature from 70° to 85° Ordering Information - Removed “ICS” from Part/Order Number 2/19/09 1 Corrected block diagram. When updated format on 3/23/07, block diagram was not duplicated correctly. Added Schematic layout. Updated header/footer. 6/25/09 Removed leaded orderable parts from Ordering Information table 11/14/12 Updated data sheet format. 11/16/15 15 T11 Date General Description - corrected crystal frequency from 25.5625MHz crystal to 26.5625MHz crystal. Added LVCMOS to XTAL Interface section. Updated format throughout the datasheet. 12 T11 Description of Change 19 20 FEMTOCLOCK™ CRYSTAL/LVCMOS-TO-3.3V, 2.5V LVPECL FREQUENCY SYNTHESIZER Corporate Headquarters Sales Tech Support 6024 Silver Creek Valley Road San Jose, CA 95138 USA 1-800-345-7015 or 408-284-8200 Fax: 408-284-2775 www.IDT.com email: clocks@idt.com DISCLAIMER Integrated Device Technology, Inc. (IDT) and its subsidiaries reserve the right to modify the products and/or specifications described herein at any time and at IDT’s sole discretion. All information in this document, including descriptions of product features and performance, is subject to change without notice. Performance specifications and the operating parameters of the described products are determined in the independent state and are not guaranteed to perform the same way when installed in customer products. The information contained herein is provided without representation or warranty of any kind, whether express or implied, including, but not limited to, the suitability of IDT’s products for any particular purpose, an implied warranty of merchantability, or non-infringement of the intellectual property rights of others. This document is presented only as a guide and does not convey any license under intellectual property rights of IDT or any third parties. IDT’s products are not intended for use in applications involving extreme environmental conditions or in life support systems or similar devices where the failure or malfunction of an IDT product can be reasonably expected to significantly affect the health or safety of users. Anyone using an IDT product in such a manner does so at their own risk, absent an express, written agreement by IDT. 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