STPS2200UF

STPS2200 Power Schottky diode Datasheet  production data Features K A  Low forward voltage drop  Very small conduction losses A  Negligible switching losses  Extremely fast switching  Low thermal resistance K  -40°C minimum operating Tj SMB STPS2200U  ECOPACK®2 compliant component A Description This device is a 200 V Schottky rectifier suited for switch mode power supplies and high frequency DC to DC converters. K SMBflat STPS2200UF Table 1. Device summary Symbol Value IF(AV) 2A VRRM 200 V Tj(max) 175 °C VF(typ) 0.58 V April 2013 This is information on a product in full production. Packaged in SMB, SMBflat, this device is especially intended for use in low voltage, high frequency inverters, freewheeling and polarity protection. Also ideal for all LED lighting applications. DocID024381 Rev 1 1/9 www.st.com 9 Characteristics 1 STPS2200 Characteristics Table 2. Absolute ratings (limiting values, at 25 °C unless otherwise stated) Symbol Parameter Value Unit VRRM Repetitive peak reverse voltage 200 V IF(RMS) Forward rms current 10 A 2 A 100 A SMB Tl = 145 °C SMBflat Tl = 150 °C IF(AV) Average forward current  = 0.5, square wave IFSM Surge non repetitive forward current Tstg Storage temperature range -65 to +175 °C Operating junction temperature range -40 to +175 °C Tj tp = 10 ms sinusoidal, Tl = 25 °C Table 3. Thermal parameters Symbol Rth(j-l) Parameter Value SMB 20 SMBflat 15 Unit Junction to lead °C/W Table 4. Static electrical characteristics Symbol Test conditions IR(1) Reverse leakage current VF(1) Forward voltage drop Tj = 25 °C Tj = 125 °C Tj = 25 °C Tj = 125 °C Min. VR = VRRM IF = 2 A Typ. Max. Unit 5 µA 0.7 2.5 mA 0.73 0.80 V 0.58 0.64 V 1. Pulse test: tp = 380 µs,  < 2% To evaluate the maximum conduction losses use the following equation: P = 0.58 x IF(AV) + 0.03 IF2(RMS) Note: More information is available in the application notes: AN604 Calculation of conduction losses in a power rectifier AN4021 Calculation of reverse losses in a power diode 2/9 DocID024381 Rev 1 STPS2200 Characteristics Figure 1. Average forward power dissipation versus average forward current Figure 2. Forward voltage drop versus forward current PF(AV)(W) 1.6 IF(A) 1.E+01 δ = 0.05 1.4 δ = 0.1 δ = 0.2 δ=1 δ = 0.5 T j = 125 °C (Maximum values) 1.2 1.E+00 1.0 Tj=125°C (Typical values) 0.8 Tj=25°C (Maximum values) 0.6 1.E-01 0.4 Tj=25°C (Typical values) T 0.2 IF(AV)(A) 0.0 0.0 0.2 0.4 0.6 0.8 1.0 1.2 δ =tp/T 1.4 1.6 1.8 2.0 VF(V) tp 1.E-02 2.2 Figure 3. Reverse leakage current versus reverse voltage applied (typical values) 1.E+01 0.0 2.4 IR(mA) 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.9 1.0 1.1 Figure 4. Junction capacitance versus reverse voltage applied (typical values) C(pF) 1000 F = 1 MHz VOSC = 30 mVRMS Tj = 25 °C Tj = 150 °C 1.E+00 0.8 Tj = 125 °C 1.E-01 Tj = 100 °C Tj = 75 °C 1.E-02 100 Tj = 50 °C 1.E-03 Tj = 25 °C 1.E-04 VR(V) VR(V) 1.E-05 10 0 20 40 60 80 100 120 140 160 180 200 1 Figure 5. Relative variation of thermal impedance junction to lead versus pulse duration (SMB) 1.0 0.9 Zth(j-l)/Rth(j-l) 0.9 0.8 0.8 0.7 0.7 0.6 0.6 0.5 0.5 0.4 0.4 0.3 0.3 0.2 0.1 100 1000 Figure 6. Relative variation of thermal impedance junction to lead versus pulse duration (SMBflat) 1.0 SMB 10 Zth(j-l)/Rth(j-l) SMBflat 0.2 Single pulse 0.0 1.E-04 tp(s) 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 0.1 Single pulse 0.0 1.E-04 DocID024381 Rev 1 tp(s) 1.E-03 1.E-02 1.E-01 1.E+00 1.E+01 3/9 Characteristics STPS2200 Figure 7. Thermal resistance junction to Figure 8. Thermal resistance junction to ambient versus copper surface under each lead ambient versus copper surface under each lead (SMB) (SMBflat) Rth(j-a) (°C/W) 200 200 Rth(j-a) (°C/W) SMB Epoxy printed circuit board FR4 copper thickness = 35 µm SMBflat Epoxy printed circuit board FR4 copper thickness = 35 µm 150 150 100 100 50 50 SCu(cm²) SCu(cm²) 0 0 0.0 4/9 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 0.0 DocID024381 Rev 1 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 STPS2200 2 Package information Package information  Epoxy meets UL94, V0  Lead-free package  Cooling method: by conduction (C)  Recommended torque value: 0.4 to 0.6 N·m In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK® packages, depending on their level of environmental compliance. ECOPACK® specifications, grade definitions and product status are available at: www.st.com. ECOPACK® is an ST trademark. Figure 9. SMB dimension definitions E1 D E A1 A2 C L b Table 5. SMB dimension values Dimensions Ref. Millimeters Min. Typ. Inches Max. Min. Typ. Max. A1 1.90 2.45 0.075 0.096 A2 0.05 0.20 0.002 0.008 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 0.130 0.156 E 5.10 5.60 0.201 0.220 E1 4.05 4.60 0.159 0.181 L 0.75 1.50 0.030 0.059 DocID024381 Rev 1 5/9 Package information STPS2200 Figure 10. SMB footprint, dimensions in mm (inches) 1.62 (0.064) 2.60 1.62 (0.102) (0.064) 2.18 (0.086) 5.84 (0.23) Figure 11. SMBflat (non exposed pad) dimension definitions A c D L 2x L2 2x E E1 L L1 2x b Table 6. SMBflat (non exposed pad) dimension values Dimensions Ref. Millimeters Min. 6/9 Typ. Inches Max. Min. Typ. Max. A 0.90 1.10 0.035 0.043 b 1.95 2.20 0.077 0.087 c 0.15 0.40 0.006 0.016 D 3.30 3.95 1.30 0.156 E 5.10 5.60 0.200 0.220 E1 4.05 4.60 0.189 0.181 L 0.75 1.50 0.029 0.059 L1 0.40 0.016 L2 0.60 0.024 DocID024381 Rev 1 STPS2200 Package information Figure 12. SMBflat (non exposed pad) footprint dimensions 5.84 (0.230) 2.07 (0.082) 1.20 (0.047) 3.44 (0.136) 1.20 (0.047) millimeters (inches) DocID024381 Rev 1 7/9 Ordering information 3 STPS2200 Ordering information Table 7. Ordering information 4 Ordering type Marking Package Weight Base qty Delivery mode STPS2200U G22 SMB g 2500 Tape and reel STPS2200UF FG22 SMBflat g 5000 Tape and reel Revision history Table 8. Document revision history 8/9 Date Revision 11-Apr-2013 1 Changes First issue DocID024381 Rev 1 STPS2200 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. 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