STPS3170
Datasheet
170 V, 3 A power Schottky rectifier
Features
•
•
•
•
•
•
Negligible switching losses
High junction temperature capability
Very small conduction losses
Low leakage current
Avalanche rated
ECOPACK2 component
Applications
•
•
•
•
Switching diode
SMPS
DC / DC converter
Telecom power
Description
The STPS3170 is a 170 V Schottky rectifier suited for switch mode power supplies
and high frequency DC to DC converters.
Packaged in SMA Flat, SMA Flat Notch and SMB Flat, the STPS3170 is ideal for use
in low voltage, high frequency inverters, freewheeling and polarity protection. Also
ideal for all LED lighting applications where efficiency and space constraint are
required.
Product status
STPS3170
Product summary
Symbol
Value
IF(AV)
3A
VRRM
170 V
T j(max.)
175 °C
VF(typ.)
0.63 V
DS10645 - Rev 2 - October 2019
For further information contact your local STMicroelectronics sales office.
www.st.com
STPS3170
Characteristics
1
Characteristics
Table 1. Absolute ratings (limiting values at 25 °C, unless otherwise specified)
Symbol Parameter
Value
Unit
VRRM
Repetitive peak reverse voltage
170
V
VRRM
Repetitive peak reverse voltage, Tj = -40 °C
160
V
IF(RMS)
Forward rms current
15
A
3
A
IF(AV)
Average forward current, δ = 0.5, square
wave
IFSM
Surge non repetitive forward current
PARM
Repetitive peak avalanche power
Tstg
Tj
SMA Flat, SMA Flat Notch TL = 130 °C
TL = 140 °C
SMB Flat
SMA Flat, SMA Flat Notch
SMB Flat
A
80
tp = 10 µs, Tj = 125 °C
Storage temperature range
Maximum operating junction
75
tp = 10 ms sinusoidal
210
W
-65 to +175
°C
+175
°C
temperature(1)
1. (dPtot/dTj) < (1/Rth(j-a)) condition to avoid thermal runaway for a diode on its own heatsink.
Table 2. Thermal resistance parameter
Symbol
Rth(j-l)
Parameter
Junction to lead
Max. value
SMA Flat, SMA Flat Notch
20
SMB Flat
15
Unit
°C/W
For more information, please refer to the following application note :
•
AN5088 : Rectifiers thermal management, handling and mounting recommendations
Table 3. Static electrical characteristics
Symbol
IR (1)
Parameter
Reverse leakage current
Test conditions
Tj = 25 °C
Tj = 125 °C
Tj = 25 °C
VF(2)
Forward voltage drop
Tj = 125 °C
Tj = 25 °C
Tj = 125 °C
VR = VRRM
IF = 3 A
IF = 6 A
Min.
Typ.
-
0.73
-
Unit
4.0
µA
4.0
mA
0.82
0.63
-
Max.
0.67
0.89
0.70
V
0.75
1. Pulse test: tp = 5 ms, δ < 2%
2. Pulse test: tp = 380 µs, δ < 2%
To evaluate the conduction losses, use the following equation: P = 0.59 x IF(AV) + 0.027 x IF2(RMS)
For more information, please refer to the following application notes related to the power losses :
•
AN604: Calculation of conduction losses in a power rectifier
•
AN4021: Calculation of reverse losses on a power diode
DS10645 - Rev 2
page 2/13
STPS3170
Characteristics (curves)
1.1
Characteristics (curves)
Figure 1. Average forward power dissipation versus
average forward current
2.5
PF(AV) (W)
δ = 0.05
δ = 0.1
δ = 0.2
δ=1
δ = 0.5
Figure 2. Average forward current versus ambient
temperature (δ = 0.5)
IF(AV) (A)
12
R
10
2.0
th(j-a)
=R
th(j-l)
SMB Flat
8
1.5
SMA Flat
SMA Fat Notch
6
1.0
4
T
0.5
T
2
δ= tp/T
0.0
0.0
0.5
1.0
1.5
I
tp
2.0
2.5
F(AV)
3.0
(A)
3.5
δ= tp/T
Tamb(°C)
tp
0
0
25
50
75
100
125
150
175
Figure 3. Relative variation of thermal impedance junction Figure 4. Relative variation of thermal impedance junction
to lead versus pulse duration
to lead versus pulse duration
1.0
Z
0.9
0.8
/R
th(j-l) th(j-l)
th(j-l)
/R
th(j-l)
SMBflat
0.9
SMA Flat
SMA Flat Notch
0.8
0.7
0.7
0.6
0.6
0.5
0.5
0.4
0.4
0.3
0.3
Single pulse
0.2
Single pulse
0.2
0.1
0.1
tP(s)
0.0
1.E-04
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
Figure 5. Reverse leakage current versus reverse voltage
applied (typical values)
1.E+04
Z
1.0
IR(µA)
0.0
1.E-04
tP(s)
1.E-03
1.E-02
1.E-01
1.E+00
1.E+01
Figure 6. Junction capacitance versus reverse voltage
applied (typical values)
C(pF)
1000
T = 150 °C
j
F = 1 MHz
VOSC = 30 mVRMS
1.E+03
T = 125 °C
j
1.E+02
T = 25 °C
j
T = 100 °C
j
T = 75 °C
j
1.E+01
100
T = 50 °C
j
1.E+00
T = 25 °C
j
1.E-01
VR(V)
1.E-02
0
DS10645 - Rev 2
20
40
60
80
100
120
140
160
180
VR(V)
10
1
10
100
1000
page 3/13
STPS3170
Characteristics (curves)
Figure 8. Forward voltage drop versus forward current
(maximum values)
Figure 7. Forward voltage drop versus forward current
(typical values)
I (A)
10.00 F
I (A)
10.00 F
T = 125 °C
1.00
j
T = 125 °C
j
1.00
T = 25 °C
T = 25 °C
j
j
0.10
0.01
0.0
0.10
V (V)
F
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Figure 9. Thermal resistance junction to ambient versus
copper surface under each lead (SMB Flat)
200
0.01
0.0
V (V)
F
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
Figure 10. Thermal resistance junction to ambient versus
copper surface under each lead (SMA Flat, SMA Flat
Notch)
Rth(j-a) (°C/W)
Rth(j-a) (°C/W)
200
SMB flat
Epoxy printed circuit board FR4, eCu = 35 µm
150
Epoxy printed circuit board FR4, copper thickness: 35 µm
SMA Flat
SMA Flat Notch
150
100
100
50
50
S(Cu)(cm²)
SCu (cm²)
0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
0
5.0
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
4.5
5.0
Figure 11. Normalized avalanche power derating versus pulse duration (Tj = 125 °C)
PARM (t p )
PARM (10 µs)
1
0.1
0.01
0.001
DS10645 - Rev 2
t p(µs)
1
10
100
1000
page 4/13
STPS3170
Package information
2
Package information
In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK packages,
depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product
status are available at: www.st.com. ECOPACK is an ST trademark.
2.1
SMB Flat package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 12. SMB Flat package outline
A
c
D
L 2x
L1 2 x
E
E1
L2 2 x
b
Table 4. SMB Flat mechanical data
Dimensions
Ref.
Millimeters
Min.
DS10645 - Rev 2
Typ.
Inches
Max.
Min.
Typ.
Max.
A
0.90
1.10
0.035
0.044
b
1.95
2.20
0.076
0.087
c
0.15
0.40
0.005
0.016
D
3.30
3.95
0.129
0.156
E
5.10
5.60
0.200
0.221
E1
4.05
4.60
0.159
0.182
L
0.75
1.50
0.029
0.060
L1
0.40
0.016
L2
0.60
0.024
page 5/13
STPS3170
SMB Flat package information
Figure 13. Footprint recommendations, dimensions in mm (inches)
1.20
(0.047)
3.44
(0.136)
1.20
(0.047)
2.07
(0.082)
5.84
(0.230)
millimeters
(inches)
DS10645 - Rev 2
page 6/13
STPS3170
SMA Flat package information
2.2
SMA Flat package information
•
•
Epoxy meets UL94, V0
Lead-free package
Figure 14. SMA Flat package outline
A
c
D
L 2x
L1 2 x
E
E1
L
L2 2 x
b
2x
Table 5. SMA Flat package mechanical data
Dimensions
Ref.
Millimeters
Min.
DS10645 - Rev 2
Typ.
Inches (for reference only)
Max.
Min.
Typ.
Max.
A
0.90
1.10
0.035
0.044
b
1.25
1.65
0.049
0.065
c
0.15
0.40
0.005
0.016
D
2.25
2.95
0.088
0.117
E
4.80
5.60
0.188
0.221
E1
3.95
4.60
0.155
0.182
L
0.75
1.50
0.029
0.060
L1
0.50
0.020
L2
0.50
0.020
page 7/13
STPS3170
SMA Flat package information
Figure 15. SMA Flat recommended footprint in mm (inches)
5.52
(0.217)
1.52
(0.060)
1.20
(0.047)
3.12
(0.123)
1.20
(0.047)
millimeter s
(inches)
DS10645 - Rev 2
page 8/13
STPS3170
SMA Flat Notch package information
2.3
SMA Flat Notch package information
•
•
•
Epoxy meets UL94, V0
Cooling method: by conduction (C)
Band indicates cathode
Figure 16. SMA Flat Notch package outline
Table 6. SMA Flat Notch package mechanical data
Dimensions
Ref.
Millimeters
Min.
A1
0.90
A1
Max.
Min.
1.10
0.035
0.05
Typ.
Max.
0.044
0.002
b
1.25
1.65
0.049
0.065
C
0.15
0.40
0.005
0.016
D
2.25
2.90
0.088
0.115
E
5.00
5.35
0.196
0.211
E1
3.95
4.60
0.155
0.182
G
2.00
0.079
G1
0.85
0.033
L
DS10645 - Rev 2
Typ.
Inches (for reference only)
0.75
1.20
0.029
L1
0.45
0.018
L2
0.45
0.018
L3
0.05
0.002
V
8°
8°
V1
8°
8°
page 9/13
STPS3170
SMA Flat Notch package information
Figure 17. SMA Flat Notch recommended footprint in mm (inches)
1.20
(0.047)
3.12
1.20
(0.123)
(0.047)
1.52
(0.060)
5.52
(0.217)
DS10645 - Rev 2
page 10/13
STPS3170
Ordering Information
3
Ordering information
Table 7. Ordering information
DS10645 - Rev 2
Order code
Marking
Package
Weight
Base qty.
Delivery mode
STPS3170AF
F317
SMA Flat
0.035 g
10 000
Tape and reel
STPS3170AFN
A3170
SMA Flat Notch
0.039 g
10 000
Tape and reel
STPS3170UF
FG317
SMB Flat
0.050 g
5000
Tape and reel
page 11/13
STPS3170
Revision history
Table 8. Document revision history
DS10645 - Rev 2
Date
Version
Changes
17-Oct-2014
1
First release.
08-Oct-2019
2
Added Section 2.3 SMA Flat Notch package information.
page 12/13
STPS3170
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© 2019 STMicroelectronics – All rights reserved
DS10645 - Rev 2
page 13/13
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