TS4982
2 W stereo audio power amplifier
with ground-referenced headphone driver
Features
■
125 mW into 16 Ω load ground-referenced
stereo headphone driver
■
Four-step gain settings on speaker path
■
3 levels of 3D effect on speaker path
■
PC-beep input system detection
■
±8 kV HBM ESD-protected headphone outputs
■
Pop and click reduction circuitry
BYP
NC
25
HRIN
26
28
3D0
29
VCC
30
17
32
G1
1
2
3D1
16
LHP
15
RHP
14
PVSS
13
CPVSS
12
CP-
3
LRIN
LLIN
4
5
BEEP
PGND
6
10
CP+
9
CPVCC
8
7
LOUT+
CPGND
LOUT- PVCC
Block diagram
1
29
3D0
3D1
30
VCC
PVCCL
PVCCR
ROUT+
3
2
23
LLIN
ROUT-
STEREO
LOUDSPEAKER
AUDIO INPUT
LRIN
SPKREN
4
31
32
LOUT+
BEEP
G0
PGNDR
GAIN
PC BEEP
&
DETECTION
CONTROL
PGNDL
G1
HPVCC
27
26
22
HLIN
STEREO
HEADPHONE
AUDIO INPUT
HRIN
HDEN
LHP
RHP
28
20
19
6
7
21
5
17
16
15
CHARGE
PUMP
BIAS
CPVSS
BYP
CP-
24
8
18
3D
LOUT-
GND
The TS4982 features a PC beep input, three
levels of 3D stereo enhancement and 4-step gain
control using two digital input pins. Minimum
external components make the TS4982 wellsuited for notebook and other hand-held sound
equipment. It also has an internal thermal
shutdown (150° C) and output short circuit
protection mechanism.
HPVCC
18
11
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PVCC
K982
13
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19
31
od
The TS4982 features a stereo loudspeaker driver
and a ground-referenced stereo headphone
driver. An independent standby mode pin allows
the TS4982 to simultaneously drive both output
drivers. Operating on a single 5 V supply, the
TS4982 delivers 2 W (typ.) output power into a
4 Ω load at 1% THD+N.
ROUT-
20
CP+
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O
ROUT+
21
e
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27
HLIN
G0
Pr
PGND
12
Description
23
22
CPGND
)
(s
Laptop/notebook computers
Portable audio devices
u
d
o
10
Thermal shutdown and output short-circuit
protection(a)
Applications
■
HDEN
CPVCC
32-pin 5 x 5 mm QFN package
GND
■
SPKREN
24
9
■
)
s
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ct
Pinout (top view)
11
■
TS4982 - QFN 32
PVSS
2 W output power into 4 Ω load per channel
14
■
a. Patented US#: 2009/0102561, EP#: 1978636
June 2009
Doc ID 14527 Rev 2
1/31
www.st.com
31
Contents
TS4982
Contents
1
Absolute maximum ratings and operating conditions . . . . . . . . . . . . . 3
2
Typical application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
3
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
4
3.1
Electrical characteristics tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
3.2
Electrical characteristic curves . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
)
s
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ct
Application information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
u
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4.1
General description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.2
Loudspeaker BTL configuration principle . . . . . . . . . . . . . . . . . . . . . . . . . 16
4.3
Power dissipation and efficiency . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17
4.4
Loudspeaker 3D effect enhancement . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.5
Low frequency response . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
4.6
Gain settings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
4.7
PC beep . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21
4.8
Decoupling and charge pump capacitors . . . . . . . . . . . . . . . . . . . . . . . . . 22
r
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4.8.1
)
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5
Charge pump capacitors Cp and Cps . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.9
Wake-up time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23
4.10
Standby time . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.11
Pop & click . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.12
Headphone jack detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
4.13
PCB layout recommendations . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25
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Decoupling capacitors Cs and Cb . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22
4.8.2
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Package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26
5.1
QFN32 package information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27
6
Ordering information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29
7
Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 30
2/31
Doc ID 14527 Rev 2
TS4982
1
Absolute maximum ratings and operating conditions
Absolute maximum ratings and operating conditions
Table 1.
Absolute maximum ratings
Symbol
VCC
PVCCL
PVCCR
HPVCC
CPVCC
Parameter
Supply voltage (1)
Vin
Input voltage
Loudspeaker inputs
Headphone inputs
VHDEN= VIH
VHDEN= VIL
V
Storage temperature
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d
o
Maximum junction temperature
Power dissipation
(2)
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HBM: human body model
All pins except headphone outputs(4)
Headphone output pins (LHP, RHP)(5)
-65 to +150
°C
150
°C
80
°C/W
Internally
limited(3)
kV
200
V
1500
V
Latch-up immunity
200
mA
Lead temperature (soldering, 10 sec)
260
°C
)
(s
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CDM: charged device
model(7)
od
Pr
°C
2
8
MM: machine model(6)
Latch-up
-40 to + 85
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Thermal resistance junction to ambient
ESD
V
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Tstg
Pd
6
-3 to 3
-0.3 to VCC + 0.3
Operating free-air temperature range
Rthja
Unit
-0.3 to VCC + 0.3
Toper
Tj
Value
1. All voltage values are measured with respect to the ground pin.
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ol
2. Device is protected in case of over-temperature by a thermal shutdown active at 150° C.
3. Exceeding the power derating curves during a long period can cause abnormal operation.
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4. Human body model: a 100 pF capacitor is charged to the specified voltage, then discharged through a
1.5 kΩ resistor between two pins of the device. This is done for all couples of connected pin combinations
while the other pins are floating.
5. Human body model: a 100 pF capacitor is charged to the specified voltage, then discharged through a
1.5 kΩ resistor between two pins of the device. This is done between headphone output pins, between
headphone output pins and VCC, GND. The other pins are floating.
6. Machine model: a 200 pF capacitor is charged to the specified voltage, then discharged directly between
two pins of the device with no external series resistor (internal resistor < 5 Ω). This is done for all couples of
connected pin combinations while the other pins are floating.
7. Charged device model: all pins and package are charged together to the specified voltage and then
discharged directly to ground through only one pin.
Doc ID 14527 Rev 2
3/31
Absolute maximum ratings and operating conditions
Table 2.
TS4982
Operating conditions
Symbol
Parameter
Value
Unit
(1)
VCC
PVCCL
PVCCR
Common power supply voltage
Left channel loudspeaker amplifier power supply
Right channel loudspeaker amplifier power supply
4.5 to 5.5
V
HPVCC
CPVCC
Headphone supply voltage(2)
Negative charge pump supply voltage
3 to VCC
V
≥ 4
≥ 16
Ω
-40 to +85
°C
RL
Toper
Load resistor
Speaker output
Headphone output
Operating free-air temperature range
)
s
(
ct
VIH
High-level input voltage
3D0, 3D1, G0, G1, HDEN, SPKREN pin(3)
2.0 ≤ VIH ≤ VCC
V
VIL
Low-level input voltage
3D0, 3D1, G0, G1, HDEN, SPKREN pin(3)
GND ≤ VIL ≤ 0.8
V
Rthja
Thermal resistance junction to ambient(4)
25
°C/W
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1. VCC, PVCCL and PVCCR must be shorted or at the same voltage.
2. HPVCC and CPVCC must be shorted or at the same voltage.
3. Any digital pins (3D0, 3D1, G0, G1, SPKREN, HDEN) must not be left floating.
4. With 4-layer PCB.
Table 3.
SPKREN
HDEN
0
0
0
1
1
1
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)
(s
Operating modes
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VSPKREN
VHDEN
Speaker amplifier
Headphone amplifier
VIL
VIL
ENABLED
DISABLED (standby)
ct
du
VIL
VIH
ENABLED
ENABLED
0
VIH
VIL
DISABLED (standby)
DISABLED (standby)
1
VIH
VIH
DISABLED (standby)
ENABLED
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4/31
Doc ID 14527 Rev 2
Typical application
Typical application
Figure 1.
Typical application schematics
3D EFFECT (LSB) CONTROL
2
Vcc
Cs
3D EFFECT (MSB) CONTROL
TS4982
1uF
Vcc
Cs
Vcc
1uF
Cs
PVCCL
PVCCR
ROUT+
LEFT SPEAKER INPUT
RIGHT SPEAKER INPUT
Cin
1uF
3
Cin
1uF
2
23
SPEAKER STANDBY CONTROL
Cinbeep
47nF
Rin
47k
LLIN
ROUT-
STEREO
LOUDSPEAKER
AUDIO INPUT
LRIN
SPKREN
LOUT+
PC BEEP INPUT
31
GAIN SETTING (LSB) CONTROL
32
GAIN SETTING (MSB) CONTROL
PGNDR
PC BEEP
& GAIN
DETECTION
CONTROL
G0
PGNDL
let
G1
HPVCC
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bs
GND
Cs
1uF
20
LEFT
SPEAKER
19
u
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o
6
7
21
RIGHT
SPEAKER
GND
5
17
HPVcc
Cs
1uF
GND
LHP
RHP
16
HEADPHONE
JACK
15
PVSS
GND
14
9
28
ct
CPVSS
)
(s
GND
GND
Table 4.
b
O
CHARGE
PUMP
BIAS
BYP
1uF
so
CP-
HDEN
13
24
Cb
STEREO
HEADPHONE
AUDIO INPUT
HRIN
CP+
22
12
1uF 26
CPGND
Cin
HEADPHONE STANDBY CONTROL
HLIN
10
1uF 27
CPVCC
LEFT HEADPHONE INPUT
Cin
11
RIGHT HEADPHONE INPUT
18
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BEEP
)
s
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ct
8
3D
LOUT-
4
GND
1
3D1
VCC
TS4982
3D0
30
29
GND
GND
1uF
Cp
GND
1uF
Cps
1uF
GND HPVcc
GND
External component description
Components
Value
Functional description
Cs, Cps
1μF
Supply decoupling capacitor that provides power supply filtering.
Cb
1μF
Bypass decoupling capacitor that provides half-supply filtering.
Cin
1μF
Input coupling capacitors that block the DC voltage at the amplifier
input terminal. The capacitors also form a high-pass filter with Zin.
Cinbeep
47nF
Input coupling capacitors that block the DC voltage at the PCBEEP
input terminal. The capacitors also form a high-pass filter with Rin.
Rin
47kΩ
Inverting input resistor for PCBEEP input. Together with the internal
47 kΩ feedback resistor the PC beep input gain can be adjusted to
change a voltage detection level.
Cp
1μF
Flying capacitor for the negative charge pump.
Doc ID 14527 Rev 2
5/31
Typical application
Table 5.
TS4982
Pin descriptions
Pin number
Pin name
I/O/P(1)
1
3D1
I
3D effect MSB input pin
2
LRIN
I
Right channel loudspeaker amplifier input
3
LLIN
I
Left channel loudspeaker amplifier input
4
BEEP
I
PC BEEP input
5
PGND
P
Loudspeaker amplifier power ground
6
LOUT+
O
Left channel loudspeaker positive output
7
LOUT-
O
Left channel loudspeaker negative output
8
PVCC
P
Loudspeaker amplifier power supply
9
CPVCC
P
Charge pump power supply
10
CP+
I/O
11
CPGND
P
12
CP-
I/O
13
CPVSS
P
Charge pump output, must be shorted to PVSS
14
PVSS
P
Headphone amplifier negative power supply, must be shorted to CPVSS, no
external supply allowed
15
RHP
O
Right channel headphone output
16
LHP
O
Left channel headphone output
17
HPVCC
P
Headphone amplifier positive power supply
18
PVCC
P
Loudspeaker amplifier power supply
19
ROUT-
O
20
ROUT+
O
21
PGND
22
HDEN
24
o
s
b
25
O
Charge pump flying capacitor positive pin
r
P
e
Charge pump flying capacitor negative pin
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P
)
(s
s
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O
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Right channel loudspeaker negative output
Left channel loudspeaker positive output
Loudspeaker amplifier power ground
I
Headphone standby input pin
SPKREN
I
Loudspeaker standby input pin,
BYP
I
Common mode bias voltage
NC
Not internally connected
26
HRIN
I
Right channel headphone amplifier input
27
HLIN
I
Left channel headphone amplifier input
GND
P
Device ground
29
3D0
I
3D effect LSB input pin
30
VCC
P
Common power supply
31
G0
I
Gain control LSB input pin
32
G1
I
Gain control MSB input pin
P
Thermal pad to be soldered to the ground plane of the PCB
28
(2)
EXPAD
1. I - input, O - output, P - passive or power.
2. All GNDs are internally-connected together.
6/31
Doc ID 14527 Rev 2
)
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Charge pump ground
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let
23
Pin description
TS4982
Electrical characteristics
3
Electrical characteristics
3.1
Electrical characteristics tables
Table 6.
General electrical characteristics, VCC = PVCC = HPVcc = CPVcc = 5V,
Tamb = 25° C (unless otherwise specified)
Symbol
Parameter
Min.
Max.
Unit
12
10
mA
ICC
Current consumption, no load
Speaker mode, VSPKREN = VHDEN = GND
Headphone mode, VSPKREN = VHDEN = VCC
8
6
ISTBY
Standby current consumption, no input signal
VHDEN = GND, VSPKREN = VCC,
1
Iin
Level input current
G0, G1, 3D0, 3D1, SPKREN, HDEN pins
Zin
Input impedance
Table 7.
PO
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Parameter
Min.
Output power
THD+N = 1%, RL = 4 Ω, f = 1 kHz
)-
s
(
t
c
u
d
o
Differential output offset voltage, no load, inputs AC
grounded, gain = 13.5 dB, V3D0 = V3D1 = VCC
r
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e
Gain
Gain
G0 = G1 = VIL
G0 = VIH, G1 = VIL
G0 = VIL, G1 = VIH
G0 = G1 = VIH
Gerr
Gain error
t
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30
µA
1
µA
36
kΩ
Typ.
-35
Unit
W
0.08
-62
%
dB
35
9
10.5
12
13.5
ratio(1)
Max.
2
Total harmonic distortion plus noise,
THD + N PO = 1.5 W, RL = 4 Ω, 20 Hz ≤F ≤20 kHz, BW = 22 Hz
to 22 kHz
Voo
u
d
o
Pr
24
)
s
(
ct
5
Loudspeaker amplifier, VCC = PVCCL,R = 5 V, VHDEN = VSPKREN = GND,
Cb = Cin = Cs = 1 μF, V3D0 = V3D1 = GND, gain = 9 dB, Tamb = 25° C
(unless otherwise specified)
Symbol
s
b
O
Typ.
mV
dB
0.5
dB
PSRR
Speaker power supply rejection
RL = 4 Ω, Vripple = 200 mVpp, F = 1 kHz
-75
dB
XT
Channel crosstalk
Po = 1.5 W, RL = 4 Ω, 20 Hz ≤F ≤20 kHz
-85
dB
Vn
Output noise voltage, A-weighted filter, RL = 4 Ω
Gain = 9 dB, V3D0 = V3D1 = GND
Gain = 13.5 dB, V3D0 = V3D1 = VCC
17
87
µVrms
SNR
Signal to noise ratio, A-weighted filter, RL = 4 Ω
Po = 2 W, THD+N = 1%, F = 1 kHz
103
dB
Doc ID 14527 Rev 2
7/31
Electrical characteristics
Table 7.
TS4982
Loudspeaker amplifier, VCC = PVCCL,R = 5 V, VHDEN = VSPKREN = GND,
Cb = Cin = Cs = 1 μF, V3D0 = V3D1 = GND, gain = 9 dB, Tamb = 25° C
(unless otherwise specified) (continued)
Symbol
Parameter
CL
Capacitive load
RL = 4 Ω to 100 Ω
RL > 100 Ω
tWU
Wake up time
tSTBY
Standby time
Min.
Typ.
Max.
Unit
400
100
pF
10
ms
200
μs
6
1. Dynamic selective measurements - 20*log(rms(Vout)/rms(Vripple)). Vripple is an added sinus signal to VCC
and PVCCL,R.
Table 8.
)
s
(
ct
Headphone amplifier, VCC = PVCCL,R = HPVCC = CPVCC= 5 V ,
VHDEN = VSPKREN = VCC, Cb = Cin = Cs = Cp = Cps = 1 μF,
V3D0 = V3D1 = GND, AV = 3.5 dB, Tamb = 25° C
(unless otherwise specified)
Symbol
PO
THD+N
Voo
Parameter
Min.
Output power, THD+N = 1%, RL = 16 Ω, F = 1 kHz,
HPVCC = CPVCC = 5 V
HPVCC = CPVCC = 3 V
O
)
Output offset voltage, inputs AC grounded, no load
Gain
GERR
Gain error
s
(
t
c
-10
Max.
125
65
mW
0.05
-66
%
dB
0
10
mV
0.5
dB
Power supply rejection ratio
RL = 16 Ω, Vripple = 200 mVpp, F = 1 kHz
-75
dB
XT
Channel crosstalk
PO = 100 mW, RL = 16 Ω, 20 Hz ≤F ≤20 kHz
-75
dB
Vn
Output noise voltage, A-weighted filter, RL = 16 Ω
HPVCC = CPVCC = 5 V
HPVCC = CPVCC = 3 V
10
10
µVrms
102
dB
u
d
o
(1)
SNR
Signal-to-noise ratio
PO = 125 mW, RL = 16 Ω, A-weighted filter
CL
Capacitive load
RL = 16 Ω to 100 Ω
RL > 100 Ω
tWU
Wake-up time
tSTBY
Standby time
6
400
100
pF
10
ms
200
μs
1. Dynamic selective measurements - 20*log(rms(Vout)/rms(Vripple)). Vripple is an added sinus signal to
HPVCC and CPVCC.
8/31
Unit
dB
r
P
e
s
b
O
100
35
Typ.
3.5
PSRR
t
e
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o
e
t
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s
b
Total harmonic distortion plus noise
PO = 100 mW, RL = 16 Ω, 20 Hz ≤F ≤20 kHz,
BW = 22 Hz to 22 kHz
Gain
Pr
u
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Doc ID 14527 Rev 2
TS4982
Electrical characteristics
Table 9.
Internal charge pump stage
Symbol
Parameter
Internal frequency of charge pump across temperature
range
fosc
Table 10.
Typ.
Max.
Unit
400
550
800
kHz
Min.
Typ.
Max.
Unit
PC beep input stage, RIN = 47 kΩ, CIN = 47 nF
Symbol
3.2
Min.
Parameter
Vbeep
Beep signal minimum amplitude
0.8
Vpp
fbeep
Beep signal minimum frequency
400
Hz
)
s
(
ct
Electrical characteristic curves
Table 11.
u
d
o
Index of graphics
Description
r
P
e
Current consumption vs. power supply voltage
let
Current consumption vs. standby voltage
Power derating curves
o
s
b
Speaker output power vs. power supply
O
)
Headphone output power vs. power supply
Speaker output power vs. load resistance
t(s
Headphone output power vs. load resistance
uc
THD+N vs. output power
od
2
3, 4
5
6, 7
8, 9
10
11
12 - 19
THD+N vs. frequency
20 - 23
Pr
24, 25
PSRR vs. frequency
Wake-up and standby time
26 - 29
Crosstalk vs. frequency
30 - 33
e
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s
b
Figure
Channel isolation vs frequency
34
Total power dissipation vs. output power
35 - 37
O
Doc ID 14527 Rev 2
9/31
Electrical characteristics
Figure 2.
TS4982
Current consumption vs. power
supply voltage
Figure 3.
10
12
no load
SPEAKER
V SPKREN = V HDEN = GND
Current Consumption (mA)
T AMB = 25°C
Current Consumption (mA)
Current consumption vs. standby
voltage
8
6
4
HEADPHONE
V SPKREN = V HDEN = V CC
2
V CC= PV CCL,R = 5V
0
3.0
3.5
4.0
4.5
5.0
SPEAKER
V CC = PV CCL,R = 5V, V HDEN = GND
10
no load, T AMB = 25°C
8
6
4
2
0
5.5
0
1
2
SPKREN pin Voltage (V)
Current consumption vs. standby
voltage
Figure 5.
8
7
no load, T AMB = 25°C
6
5
)
s
(
ct
4
CPV CC = HPV CC = 3V
du
1
0
-O
CPV CC = HPV CC = 5V
3
2
0
1
2
P
e
ro
3
4
t
e
l
o
bs
3.5
2
1
0
25
Output power vs. power supply
Figure 7.
2.0
Output Power (W)
2.0
1.5
1.0
THD+N = 1%
0.0
4.5
10/31
75
100
125
150
Output power vs. power supply
2.5
THD+N = 10%
2.5
0.5
50
Ambient Temperature (° C)
3.0
Output Power (W)
O
No Heat sink
3
0
5
With 4-layer PCB
4
HDEN pin Voltage (V)
Figure 6.
r
P
e
bs
5
5
Power derating curves
t
e
l
o
6
Package Power Dissipation (W)
Current Consumption (mA)
9
HEADPHONE
V CC = PV CCL,R = 5V, V SPKREN = V CC
4
u
d
o
Power Supply Voltage (V)
Figure 4.
)
s
(
ct
3
SPEAKER
R L = 4 Ω , F = 1kHz
THD+N = 10%
BW = 22Hz to 22kHz
T AMB = 25 ° C
1.5
1.0
THD+N = 1%
0.5
BW = 22Hz to 22kHz
T AMB = 25° C
5.0
Power Supply Voltage V CC= PV CCL,R (V)
SPEAKER
R L = 8 Ω , F = 1kHz
5.5
0.0
4.5
Doc ID 14527 Rev 2
5.0
Power Supply Voltage V CC = PV CCL,R (V)
5.5
TS4982
Electrical characteristics
Figure 8.
Output power vs. power supply
Figure 9.
200
Output power vs. power supply
120
THD+N = 10%
THD+N = 10%
100
Output Power (mW)
Output Power (mW)
150
100
HEADPHONE
V CC = PV CCL,R = 5V
50
R L= 16 Ω , F = 1kHz
THD+N = 1%
80
60
THD+N = 1%
3.5
4.0
4.5
5.0
Power Supply Voltage HPV CC= CPV CC (V)
120
F = 1kHz, BW = 22Hz to 22kHz
T AMB = 25° C
100
1.5
)-
s
(
t
c
0
du
10
20
30
40
Load Resistance (Ω )
50
o
r
P
e
t
e
ol
s
b
O
e
t
e
ol
o
r
P
s
b
O
80
HEADPHONE
V CC = PV CCL,R= 5V, THD+N = 1%
F = 1kHz, BW = 22Hz to 22kHz
T AMB = 25° C
40
20
0
0
40
80
120
Load Resistance (Ω )
200
10
SPEAKER
R L= 4Ω , V CC= PV CCL,R= 5V
Gain = 9dB, T AMB= 25 ° C
Gain = 13.5dB, T AMB= 25° C
BW = 22Hz to 22kHz
BW = 22Hz to 22kHz
F = 1kHz
THD + N (%)
1
F = 6kHz
0.1
0.01
1E-3
160
Figure 13. THD+N vs. output power
SPEAKER
R L= 4 Ω , V CC= PV CCL,R = 5V
F = 60Hz
HPV CC= CPV CC = 5V
HPV CC = CPV CC= 3V
60
60
Figure 12. THD+N vs. output power
10
Output Power (mW)
Output Power (W)
SPEAKER
V CC = PV CCL,R = 5V, THD+N = 1%
1.0
5.5
c
u
d
140
0.5
THD + N (%)
)
s
(
t
3.5
4.0
4.5
5.0
Power Supply Voltage HPV CC = CPV CC (V)
Figure 11. Output power vs. load resistance
2.5
0.0
BW = 22Hz to 22kHz
TAMB = 25 ° C
0
3.0
5.5
Figure 10. Output power vs. load resistance
2.0
R L= 32 Ω , F = 1kHz
20
BW = 22Hz to 22kHz
TAMB = 25 ° C
0
3.0
HEADPHONE
V CC = PV CCL,R = 5V
40
1
F = 60Hz
F = 1kHz
F = 6kHz
0.1
0.01
0.1
Output Power (W)
1
3
0.01
1E-3
Doc ID 14527 Rev 2
0.01
0.1
Output Power (W)
1
3
11/31
Electrical characteristics
TS4982
Figure 14. THD+N vs. output power
Figure 15. THD+N vs. output power
10
10
SPEAKER
R L= 8 Ω , V CC = PV CCL,R = 5V
SPEAKER
R L= 8Ω , V CC= PV CCL,R= 5V
Gain = 9dB, T AMB= 25 ° C
Gain = 13.5dB, T AMB= 25° C
BW = 22Hz to 22kHz
BW = 22Hz to 22kHz
F = 6kHz
F = 1kHz
F = 60Hz
THD + N (%)
THD + N (%)
1
0.1
1
F = 6kHz
F = 60Hz
0.1
0.01
1E-3
0.01
0.1
Output Power (W)
1
3
Figure 16. THD+N vs. output power
0.01
1E-3
F = 60Hz
)
(s
0.01
ct
F = 1kHz
du
10
Output Power (mW)
100
200
o
r
P
F = 60Hz
0.01
F = 6kHz
F = 1kHz
1E-3
1
10
Output Power (mW)
100
200
10
HEADPHONE
HPV CC = CPV CC= 5V, R L= 32Ω
V CC = PV CCL,R = 5V, T AMB= 25 ° C
V CC = PV CCL,R = 5V, T AMB= 25° C
1
BW = 22Hz to 22kHz
THD + N (%)
THD + N (%)
0.1
HEADPHONE
HPV CC = CPV CC= 3V, R L= 32Ω
F = 60Hz
0.01
BW = 22Hz to 22kHz
0.1
F = 60Hz
0.01
F = 1kHz
12/31
s
b
O
Figure 19. THD+N vs. output power
0.1
1E-3
BW = 22Hz to 22kHz
F = 6kHz
Figure 18. THD+N vs. output power
s
b
O
THD + N (%)
THD + N (%)
0.1
e
t
e
ol
t
e
l
o
V CC = PV CCL,R = 5V, T AMB= 25° C
1
BW = 22Hz to 22kHz
10
3
HEADPHONE
HPV CC = CPV CC= 5V, R L= 16Ω
V CC= PV CCL,R= 5V, T AMB= 25° C
1
1
r
P
e
10
1
)
s
(
ct
0.1
Output Power (W)
u
d
o
HEADPHONE
HPV CC= CPV CC = 3V, R L= 16 Ω
1
0.01
Figure 17. THD+N vs. output power
10
1E-3
F = 1kHz
1
10
Output Power (mW)
F = 6kHz
F = 6kHz
100
F = 1kHz
200
1E-3
1
Doc ID 14527 Rev 2
10
Output Power (mW)
100
200
TS4982
Electrical characteristics
Figure 20. THD+N vs. frequency
Figure 21. THD+N vs. frequency
10
10
SPEAKER
P O = 1.5W, R L= 4Ω
SPEAKER
P O = 1W, R L= 8Ω
V CC = PV CCL,R = 5V, T AMB = 25° C
Gain = 13.5dB
Gain = 9dB
0.1
0.01
20
100
BW = 22Hz to 22kHz
1
THD + N (%)
THD + N (%)
V CC = PV CCL,R = 5V, T AMB = 25° C
BW = 22Hz to 22kHz
1
0.01
10000 20k
1000
Frequency (Hz)
Figure 22. THD+N vs. frequency
0.1
Gain = 9dB
20
HEADPHONE
R L= 32 Ω
t
e
l
o
V CC = PV CCL,R= 5V, TAMB = 25° C
V CC = PV CCL,R= 5V, T AMB = 25° C
BW = 22Hz to 22kHz
)-
P O = 50mW
s
(
t
c
du
1000
Frequency (Hz)
o
r
P
R L ≥ 4Ω , Cin = Cb = 1 μ F, T AMB= 25° C
1000
Frequency (Hz)
10000 20k
R L≥ 16 Ω , Cin = 1 μ F, T AMB= 25 ° C
Inputs AC grounded
-40
100
HEADPHONE
V CC = PV CCL,R = 5V, Vripple = 200mV PP
-20
Inputs AC grounded
Gain = 13.5dB
PSRR (dB)
PSRR (dB)
O
P O= 60mW
P O= 40mW
0
SPEAKER
V CC = PV CCL,R = 5V, Vripple = 200mV PP
-20
20
HPV CC = CPV CC= 5V
HPV CC = CPV CC= 3V
Figure 25. Power supply rejection ratio vs.
frequency
0
bs
0.1
0.01
10000 20k
Figure 24. Power supply rejection ratio vs.
frequency
e
t
e
ol
s
b
O
THD + N (%)
THD + N (%)
P O=100mW
HPV CC= CPV CC= 3V
100
BW = 22Hz to 22kHz
1
HPV CC= CPV CC = 5V
20
10000 20k
r
P
e
10
0.1
)
s
(
ct
1000
Frequency (Hz)
u
d
o
HEADPHONE
R L= 16 Ω
0.01
100
Figure 23. THD+N vs. frequency
10
1
Gain = 13.5dB
-60
-80
-40
HPV CC = CPV CC= 5V
-60
-80
Gain = 9dB
-100
-100
HPV CC = CPV CC = 3V
-120
20
100
1k
10k
20k
-120
20
Frequency (Hz)
100
1k
10k
20k
Frequency (Hz)
Doc ID 14527 Rev 2
13/31
Electrical characteristics
TS4982
Figure 26. Wake-up time,
VCC=PVCCL,R=CPVCC=HPVCC=5V,
VSPKREN=VIH
Figure 27. Standby time,
VCC=PVCCL,R=CPVCC=HPVCC=5V,
VSPKREN=VIH
)
s
(
ct
Figure 28. Wake-up time,
VCC=PVCCL,R=CPVCC=HPVCC=5V,
VHDEN=VIL
)
(s
u
d
o
r
P
e
Figure 29. Standby time,
VCC=PVCCL,R=CPVCC=HPVCC=5V,
VHDEN=VIL
t
e
l
o
s
b
O
t
c
u
d
o
r
P
e
t
e
l
o
Figure 30. Crosstalk vs. frequency
0
SPEAKER
V CC = PV CCL,R = 5V, P O = 1.5W
-20
Crosstalk (dB)
O
0
R L= 4 Ω , Gain = 13.5dB, T AMB= 25 ° C
R L= 4 Ω , Gain = 9dB, T AMB= 25 ° C
-40
-60
Left to Right channel
Right to Left channel
-80
-100
-120
14/31
SPEAKER
V CC = PV CCL,R = 5V, P O = 1.5W
-20
Crosstalk (dB)
bs
Figure 31. Crosstalk vs. frequency
-40
-60
Left to Right channel
Right to Left channel
-80
-100
20
100
1000
Frequency (Hz)
10000 20k
-120
20
Doc ID 14527 Rev 2
100
1000
Frequency (Hz)
10000 20k
TS4982
Electrical characteristics
Figure 32. Crosstalk vs. frequency
Figure 33. Crosstalk vs. frequency
0
0
HEADPHONE
V CC= PV CCL,R = 5V, HPV CC= CPV CC= 3V
-20
P O = 50mW, R L= 16Ω , T AMB= 25° C
Crosstalk (dB)
Crosstalk (dB)
-20
-40
Right to Left channel
-60
Left to Right channel
-80
-100
P O = 100mW, R L= 16 Ω , T AMB= 25 ° C
-40
Left to Right channel
-60
Right to Left channel
-80
20
100
-100
10000 20k
1000
Frequency (Hz)
20
100
)
s
(
ct
1000
Frequency (Hz)
10000 20k
u
d
o
Figure 34. Inter-channel isolation vs.
frequency
Figure 35. Power dissipation vs. output power
per one channel
r
P
e
2.0
120
t
e
l
o
SPEAKER
V CC= PV CCL,R = 5V, F = 1kHz, THD+N < 1%
80
Speaker (Pout = 1.5W) to Headphone
Headphone (Pout = 100mW) to Speaker
60
40
)-
s
(
t
c
V CC= PV CC = HPV CC= CPV CC = 5V
T AMB= 25 ° C
20
Power Dissipation (W)
100
Interchannel Isolation (dB)
HEADPHONE
V CC= PV CCL,R= CPV CC= HPV CC= 5V
1.6
s
b
O
1.2
R L= 4Ω
R L= 8Ω
0.8
0.4
Headphone: R L= 16 Ω
u
d
o
Speaker: R L= 4Ω
0
20
100
0.0
0.0
10000 20k
1000
Frequency (Hz)
r
P
e
t
e
l
o
0.5
1.0
1.5
Output Power (W)
2.0
Figure 36. Power dissipation vs. output power Figure 37. Power dissipation vs. output power
per one channel
per one channel
bs
320
100
Power Dissipation (mW)
O
Power Dissipation (mW)
120
80
R L= 16Ω
60
40
R L= 32Ω
20
HEADPHONE
V CC = PV CCL,R = 5V
240
R L= 16Ω
160
80
R L= 32Ω
HPV CC= CPV CC = 5V
HPV CC= CPV CC = 3V
F = 1kHz, THD+N < 1%
F = 1kHz, THD+N < 1%
0
0
10
20
30
40
50
60
Output Power (mW)
70
HEADPHONE
V CC = PV CCL,R = 5V
80
0
0
Doc ID 14527 Rev 2
40
80
120
Output Power (mW)
160
15/31
Application information
TS4982
4
Application information
4.1
General description
The TS4982 is a stereo loudspeaker power amplifier and ground-referenced headphone
driver with dedicated separated single-ended inputs in a QFN32 package, which is the best
solution in space-saving applications. Each of the audio paths, loudspeaker or headphone,
can be independently set to standby mode to save battery life.
The loudspeaker amplifier with BTL output configuration (see Section 4.2: Loudspeaker BTL
configuration principle on page 16) can deliver 2 W output power into a 4 Ω load with both
channels enabled at 1% THD+N with a nominal power supply of 5 V. The gain (see
Section 4.2) of the loudspeaker amplifier can be set to four discrete levels thanks to two
digital inputs. The stereo sound perception which could seem poor in an application
(notebook) can be enhanced by a 3D effect internal block in three levels (see Section 4.3:
Power dissipation and efficiency on page 17).
)
s
(
ct
u
d
o
In the audio path which is not in standby mode, a PC beep signal is mixed if it is detected
(see Section 4.7: PC beep on page 21) on the PC beep input.
r
P
e
The outputs are protected against over-current consumption which can appear when the
outputs are short-circuited between them or to GND or Vcc. There is also an internal
thermal shutdown activated at 150° C (typical) and deactivated at 120° C (typical).
t
e
l
o
4.2
s
b
O
Loudspeaker BTL configuration principle
)
(s
Figure 38. Simplified schematic of the loudspeaker amplifier
od
t
c
u
INPUT
r
P
e
t
e
l
o
s
b
O
16/31
BIAS
Av=1
+
Vout1
Av=-1
+
Doc ID 14527 Rev 2
Vout2
TS4982
Application information
Bridge tied load (BTL) means that each end of the load is connected to two single-ended
output amplifiers. Therefore, we have:
Single-ended output 1 = Vout1 = Vout
Single-ended output 2 = Vout2 = -Vout
BTL output = Vout1 - Vout2 = 2Vout
The output power is:
2
( 2V outRMS )
P out = -----------------------------------RL
For the same power supply voltage, the output power in a BTL configuration is four times
higher than the output power in a single-ended configuration.
4.3
)
s
(
ct
Power dissipation and efficiency
Hypotheses:
r
P
e
The voltage and current in the load are sinusoidal (Vout and Iout).
The supply voltage is a pure DC source (Vcc).
t
e
l
o
Regarding the load we have:
V out = V PEAK sin ωt
and
)-
s
(
t
c
and
du
o
r
P
u
d
o
s
b
O
V out
I out = ------------RL
V PEAK 2
P out = -----------------------2R L
(V)
(A)
(W)
Therefore, the average current delivered by the supply voltage is:
e
t
e
l
O
o
s
b
I CC
AVG
V PEAK
= 2 -----------------πRL
(A)
Figure 39. Current delivered by power supply voltage
Icc (t)
Vpeak/RL
IccAVG
0
T/2
T
Doc ID 14527 Rev 2
3T/2
2T Time
17/31
Application information
TS4982
The power delivered by the supply voltage is:
P supply = V CC ⋅ I CC
AVG
(W)
Then, the power dissipated by each amplifier is:
(W)
P diss = P supply – P out
2 2V CC
P diss = ------------------------ ⋅
π RL
(W)
P out – P out
and the maximum value is obtained when:
)
s
(
ct
∂ P diss
--------------------- = 0
∂ P out
u
d
o
and its value is:
2
2V cc
P dissmax = -----------π2 R L
r
P
e
(W)
t
e
l
o
This maximum value only depends on the power supply voltage and load values.
The efficiency, η, is the ratio between the output power and the power supply:
bs
P
πV
out
PEAK
η = -------------------- = ------------------------
P supply
O
)
4V CC
The maximum theoretical value is reached when:
– VPEAK = VCC for the loudspeaker part, so that:
s
(
t
c
u
d
o
r
P
e
π
η= --- = 78.5%
4
t
e
l
o
s
b
O
18/31
– VPEAK = VCC /2 for the headphone part, so that:
π
η= --- = 39.3%
8
Doc ID 14527 Rev 2
TS4982
4.4
Application information
Loudspeaker 3D effect enhancement
The TS4982 features a 3D audio effect which can be programmed at three discrete levels
(LOW, MEDIUM, HIGH) through input pins 3D1 and 3D0 which provide a digital interface.
The correspondence between the logic levels of this interface and 3D effect levels are
shown in the Table 12 on page 19.
The 3D audio effect applied to the stereo audio signals evokes perception of spatial hearing
and improves this effect in cases where the stereo speakers are too close to each other,
such as in small handheld devices or mobile equipment.
The perceived amount of 3D effect also depends on many factors such as speaker position,
distance between speakers and listener, frequency spectrum of the audio signal, or the
difference of signal between the left and right channels. In some cases, the volume can
increase when the 3D effect is switched on. This factor depends on the composition of the
stereo audio signal and its frequency spectrum.
Table 12.
)
s
(
ct
3D1
3D0
V3D1
V3D0
0
0
VIL
VIL
0
1
VIL
1
0
VIH
1
1
VIH
)
Low frequency response
s
(
t
c
u
d
o
r
P
e
t
e
ol
4.5
u
d
o
3D effect settings
r
P
e
t
e
l
o
s
b
O
3D effect level
OFF
VIH
LOW
VIL
MEDIUM
VIH
HIGH
Figure 40. Simplified schematic of input stage
External
s
b
O
Internal (TS4982)
Rfeed
Cin
Rin
INPUT
BIAS
In the low-frequency region, the input coupling capacitor Cin starts to have an effect. Cin
forms, with the Rin, a first order high-pass filter with a -3 dB cut-off frequency:
1
F CL = ---------------------------------------2π ⋅ Rin ⋅ Cin
Doc ID 14527 Rev 2
19/31
Application information
TS4982
In this case we can consider that Rin equals Zin. So, for a desired cut-off frequency FCL, Cin
is calculated as follows:
1
Cin = --------------------------------------2π ⋅ Zin ⋅ F CL
The input impedance Zin is for the whole power supply voltage range, typically 30 kΩ . There
is also a tolerance around the typical value (see Table 6 on page 7) and it must be taken into
account.
In the typical application, Cin =1 μ F, then FCL = 5.3 Hz. If FCL is required higher to limit low
frequencies, it must be taken account that the speaker’s PSRR performance for the low
frequency region is decreased. The headphone PSRR remains the same.
)
s
(
ct
Figure 41. PSRR vs. frequency
0
-20
R L ≥ 4 Ω , Cb = 1 μ F, T AMB= 25 ° C, Gain = 9dB
r
P
e
Inputs AC grounded
-40
PSRR (dB)
u
d
o
SPEAKER
V CC = PV CCL,R = 5V, Vripple = 200mV PP
Cb = 100nF
t
e
l
o
Cb = 220nF
-60
-80
-100
s
b
O
Cb = 1μ F
)-
-120
100
20
s
(
t
c
Cb = 470nF
1k
10k
20k
Frequency (Hz)
u
d
o
4.6
Gain settings
r
P
e
In the flat region of the frequency-response curve (no input coupling capacitor or internal
feedback loop + load effect) the gain of the loudspeaker amplifier can be set in four discrete
levels thanks to the two digital inputs G1 and G0.
t
e
l
o
s
b
O
20/31
The headphone amplifier gain does not depend on the loudspeaker gain setting and is kept
equal to 3.5 dB.
Table 13.
Gain settings
G1
G0
VG1
VG0
Loudspeaker
amplifier gain
(dB)
Headphone
amplifier gain
(dB)
0
0
VIL
VIL
9
3.5
0
1
VIL
VIH
10.5
3.5
1
0
VIH
VIL
12
3.5
1
1
VIH
VIH
13.5
3.5
Doc ID 14527 Rev 2
TS4982
4.7
Application information
PC beep
The PC beep input allows to send a system beep (for instance power-on self-test error
code) through the amplifiers to the loudspeaker or (and) headphone output. In the typical
application (see Figure 1) the input is passed through when eight sequential rising edges in
the signal appear on the detector input with the minimum amplitude VinMIN = 0.8 VP-P and
minimum frequency FMIN = 400 Hz. The PC beep signal is mixed with gain = -1 V/V into a
loudspeaker (SPKREN = 0) or headphone (HDEN = 1) path. The signal from the
loudspeaker or headphone inputs are not muted. The beep signal pass-through is switched
off when there is no signal with sufficient amplitude VinMIN present during a 1/FMIN (1/400 s)
time period.
The overall gain in the typical application (Rin = Rfeed = 47 kΩ) is equal to the loudspeaker
or headphone gain setting.
)
s
(
ct
Figure 42. PC beep input stage
External
u
d
o
Internal (TS4982)
Rfeed
e
t
e
ol
47k
Cinbeep
Rin
PC BEEP INPUT
PC BEEP
Avbeep
47k
47nF
Vin
GND
)
(s
t
c
u
Pr
LOUDSPEAKER
AUDIO INPUT
VOLT. & FREQ.
DETECTOR
s
b
O
GND
HEADPHONE
AUDIO INPUT
The input capacitor Cinbeep with input resistor Rin forms a high-pass filter with a -3 dB low
frequency cut-off FCL which must be lower than FMIN.
d
o
r
P
e
1
Cinbeep ≥ -------------------------------------------2π ⋅ Rin ⋅ F MIN
t
e
l
o
For a typical application (Rin = 47 kΩ, FMIN = 400 Hz) a good choice is Cinbeep = 47 nF.
s
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If it is necessary to change the minimum amplitude VinMIN = 0.8 VP-P the gain of the PC
BEEP input amplifier has to be changed. For a typical application (Rin = Rfeed = 47 kΩ) the
gain is -1 V/V.
Rfeed
47000
Av = – ----------------- = – ---------------- = – 1
Rin
47000
If VinMIN2 is a new requested minimum amplitude then a new input resistor Rin is:
Rfeed ⋅ Vin MIN2
Rin [ Ω] = ---------------------------------------------- = 5875 ⋅ Vin MIN2 [ V PP ]
Vin MIN
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Application information
4.8
TS4982
Decoupling and charge pump capacitors
Only a power supply decoupling capacitor Cs and a bias voltage decoupling capacitor Cb
are needed to correctly decouple the TS4982.
4.8.1
Decoupling capacitors Cs and Cb
Cs has a particular influence on the THD+N in the high frequency region (above 7 kHz) and
an indirect influence on the power supply disturbances. With a value for Cs of 1 µF, you can
expect similar THD+N performances to those outlined in this document (see Figure 12 to
Figure 23). For example:
●
In the high frequency region, if Cs is lower than 1 µF, it increases THD+N and
disturbances on the power supply rail are less filtered.
●
On the other hand, if Cs is higher than 1 µF, those disturbances on the power supply
rail are more filtered.
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Cb has a critical influence on the final result of the PSRR with input grounded and in the
lower frequency region in the following manner:
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●
If Cb is lower than 1 µF the PSRR performance worsens at lower frequencies.
●
If Cb is higher than 1 µF, the benefit to PSRR is decreased significantly.
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Figure 43. PSRR vs. frequency
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SPEAKER
V CC = PV CCL,R = 5V, Vripple = 200mV PP
-20
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PSRR (dB)
Inputs AC grounded
-40
-60
Cb = 470nF
-80
-100
Cb = 1μ F
-120
20
Cb = 2.2μ F
100
1k
Frequency (Hz)
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10k
20k
TS4982
4.8.2
Application information
Charge pump capacitors Cp and Cps
A proper selection of the charge pump capacitors Cp and Cps is necessary to generate an
efficient negative voltage by the internal charge pump without a negative impact on the
audio performance.
The following are some recommendations for the decoupling and charge pump capacitors.
4.9
●
Low ESR capacitors are needed to minimize the output resistance of the charge pump.
●
An X7R dielectric type for large temperature ranges should be used.
●
Placement of the component as close to the package pins as possible. Small packages
(for instance SMD 0603, 0402) make it easier.
●
Use of a 10 V DC rating voltage for 5 V operation or 6.3 V DC rating operation for 3 V
operation with regard to the ΔC/ΔV variation of this type of dielectric.
●
For a typical application a 1 μF ceramic capacitor is recommended (see Figure 1 on
page 5).
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Wake-up time
When the standby is released to turn the device ON, the bypass capacitor Cb is charged
immediately. As Cb is directly linked to the bias of the loudspeaker amplifier, the bias will not
work properly until the Cb voltage is correct. The time to reach this voltage plus a time delay
of 1 ms (pop precaution) is called the wake-up time or tWU. It is specified in the electrical
characteristics with Cb = 1 µF in Table 7 on page 7.
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If Cb has a value other than 1 µF, you can calculate the typical tWU by using the following
formula, or read it directly from the graph (Figure 44).
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t WU [ s ] = 5199 ⋅ Cb + 0.001[F]
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Figure 44. Typical wake-up time vs. bypass capacitor
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Wake-up Time (ms)
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30
28
26
24
22
20
18
16
14
12
10
8
6
4
2
0
T AMB =25°C
0
1
2
3
4
5
Cb (μ F)
If the headphone (speaker) is already out of the standby mode and the speaker
(headphone) is enabled there is no need to charge Cb. Therefore, the wake-up time is only
the pop precaution delay of 1 ms (typical).
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Application information
4.10
TS4982
Standby time
The time to disable the dedicated part into the standby mode since the level of the dedicated
standby pins are changed (HDEN from "1" to "0", SPKREN from "0" to "1") is called the
standby time. It is specified in the electrical characteristics in Table 7 on page 7.
4.11
Pop & click
Older generations of headphone drivers with single-ended outputs have a load connected in
series with a bulky capacitor (for instance 220 μF) to ground. With this type of configuration,
when the amplifier is turned on by a standby control pin, a time transient phenomena on the
load is present. This has been the main contribution to the unpleasant audible sound
currently called "pop effect".
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Thanks to the negative charge pump the headphone outputs are referred to ground without
the need for bulky in-series capacitors. Therefore, the pop created by these bulky capacitors
is internally eliminated. In addition, the TS4982 include a pop & click circuitry which
suppresses any residual pop on the headphone and speaker outputs, thus enabling the
outputs to be virtually pop & click-free.
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Headphone jack detection
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The device incorporates a simple circuitry that can be used to enable the headphone
amplifier and disable the speaker amplifier by a headphone jack insertion.
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Figure 45. Headphone jack detection schematics
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Vcc
100K
HDEN
SPKREN
HEADPHONE JACK
LHP
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10K GND
GND
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TS4982
4.13
Application information
PCB layout recommendations
The TS4982 can delivery 2 W into a 4 Ω load at 1% THD+N. To reach this output power
value, you should follow these few recommendations during the design phase of the PCB.
●
Use large and short traces for power supply (PVCCL,R) and outputs - load tracks to
minimize losses due to track parasitic resistance.
●
Connect all VCC tracks (PVCCL,R, HPVCC, CPVCC, VCC) to one point on the board.
●
Connect all grounding planes or tracks (GND, PGNDL, PGNDR, CPGND) to one point
on the board.
●
Keep the grounding of the charge pump CPGND away from other GNDs.
●
Connect the exposed pad to the grounding plane or a large bottom copper area using
vias for good heatsink.
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Package information
5
TS4982
Package information
In order to meet environmental requirements, ST offers these devices in different grades of
ECOPACK® packages, depending on their level of environmental compliance. ECOPACK®
specifications, grade definitions and product status are available at: www.st.com.
ECOPACK® is an ST trademark.
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TS4982
5.1
Package information
QFN32 package information
Figure 46. QFN32 package mechanical drawing
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Table 14.
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QFN32 package mechanical data
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Ref.
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Dimensions
Millimeters
Inches
Min.
Typ.
Max.
Min.
Typ.
Max.
0.80
0.90
1.00
0.031
0.035
0.039
0.02
0.05
0.0008
0.002
A2
0.65
1.00
0.026
0.039
A3
0.20
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Pr
0.008
b
0.18
0.25
0.30
0.007
0.010
0.012
D
4.85
5.00
5.15
0.191
0.20
0.203
D1
4.75
0.19
D2
3.15
3.30
3.45
0.124
0.130
0.136
E
4.85
5.00
5.15
0.191
0.20
0.203
3.45
0.124
0.130
E1
E2
4.75
3.15
e
L
3.30
0.19
0.50
0.30
0.40
0.136
0.020
0.50
0.012
0.016
0.020
P
0.60
0.024
K
14
0.55
ddd
0.08
0.003
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Package information
TS4982
Figure 47. Footprint recommendation
0.45 mm
5.4 mm
3.2 mm
0.5 mm
0.3 mm
0.65 mm
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5.4 mm
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6
Ordering information
Ordering information
Table 15.
Order code
Order code
Temperature range
Package
Packaging
Marking
-40°C to +85°C
QFN32
Tape & reel
K982
TS4982IQT
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Revision history
7
TS4982
Revision history
Table 16.
Document revision history
Date
Revision
Changes
18-Mar-2008
1
Initial release.
16-Jun-2009
2
Document status promoted from target specification to full datasheet.
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Revision history
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