End of Life July-2021 - Alternative Device: VSML3710
VSMS3700
www.vishay.com
Vishay Semiconductors
Infrared Emitting Diode, 950 nm, GaAs
FEATURES
• Package type: surface-mount
• Package form: PLCC-2
• Dimensions (L x W x H in mm):
3.5 x 2.8 x 1.75
• Peak wavelength: λp = 950 nm
• High reliability
• Angle of half intensity: ϕ = ± 60°
• Low forward voltage
948553
• Suitable for high pulse current operation
• Good spectral
photodetectors
matching
with
Si
• Package matched with IR emitter series VEMT3700
• Floor life: 168 h, MSL 3, acc. J-STD-020
DESCRIPTION
• Lead (Pb)-free reflow soldering
VSMS3700 is an infrared, 950 nm emitting diode in GaAs
technology, molded in a PLCC-2 package for surface
mounting (SMD).
• AEC-Q101 qualified
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
APPLICATIONS
• Infrared source in tactile keyboards
• IR diode in low space applications
• PCB mounted infrared sensors
• Emitter in miniature photo-interrupters
PRODUCT SUMMARY
COMPONENT
Ie (mW/sr)
ϕ (°)
λP (nm)
tr (ns)
4.5
± 60
950
800
VSMS3700
Note
• Test conditions see table “Basic Characteristics”
ORDERING INFORMATION
ORDERING CODE
PACKAGING
REMARKS
PACKAGE FORM
VSMS3700-GS08
Tape and reel
MOQ: 7500 pcs, 1500 pcs/reel
PLCC-2
VSMS3700-GS18
Tape and reel
MOQ: 8000 pcs, 8000 pcs/reel
PLCC-2
Note
• MOQ: minimum order quantity
Rev. 1.5, 15-Jul-2020
Document Number: 81373
1
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
End of Life July-2021 - Alternative Device: VSML3710
VSMS3700
www.vishay.com
Vishay Semiconductors
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
TEST CONDITION
SYMBOL
VALUE
UNIT
VR
5
V
Reverse voltage
IF
100
mA
Peak forward current
Forward current
tp/T = 0.5, tp = 100 μs
IFM
200
mA
Surge forward current
tp = 100 μs
IFSM
1.5
A
PV
170
mW
°C
Power dissipation
Junction temperature
Tj
100
Operating temperature range
Tamb
-40 to +85
°C
Storage temperature range
Tstg
-40 to +100
°C
According to Fig. 11, J-STD-020
Tsd
260
°C
J-STD-051, soldered on PCB
RthJA
250
K/W
Soldering temperature
Thermal resistance junction-to-ambient
120
160
IF - Forward Current (mA)
PV - Power Dissipation (mW)
180
140
120
100
RthJA = 250 K/W
80
60
40
100
80
60
RthJA = 250 K/W
40
20
20
0
0
0
10
21341
20 30
40
50
60
70 80
90
0
100
Tamb - Ambient Temperature (°C)
10
Fig. 1 - Power Dissipation Limit vs. Ambient Temperature
20 30 40
50 60 70 80
90 100
Tamb - Ambient Temperature (°C)
21342
Fig. 2 - Forward Current Limit vs. Ambient Temperature
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
PARAMETER
Forward voltage
Temperature coefficient of VF
Reverse current
Junction capacitance
Radiant intensity
Radiant power
Temperature coefficient of φe
TEST CONDITION
SYMBOL
MIN.
TYP.
MAX.
UNIT
IF = 100 mA, tp = 20 ms
VF
-
1.3
1.7
V
IF = 1 A, tp = 100 μs
VF
-
1.8
-
V
IF = 100 mA
TKVF
-
-1.3
-
mV/K
μA
VR = 5 V
IR
-
-
100
VR = 0 V, f = 1 MHz, E = 0
Cj
-
30
-
pF
IF = 100 mA, tp = 20 ms
Ie
1.6
4.5
8
mW/sr
IF = 1.5 A, tp = 100 μs
Ie
-
35
-
mW/sr
IF = 100 mA, tp = 20 ms
φe
-
15
-
mW
IF = 100 mA
TKφe
-
-0.8
-
%/K
ϕ
-
± 60
-
°
λp
-
950
-
nm
Angle of half intensity
Peak wavelength
IF = 100 mA
Spectral bandwidth
IF = 100 mA
Δλ
-
50
-
nm
Temperature coefficient of λp
IF = 100 mA
TKλp
-
0.2
-
nm/K
IF = 20 mA
tr
-
800
-
ns
IF = 1 A
tr
-
400
-
ns
IF = 20 mA
tf
-
800
-
ns
Rise time
Fall time
Virtual source diameter
Rev. 1.5, 15-Jul-2020
IF = 1 A
tf
-
400
-
ns
EN 60825-1
d
-
0.5
-
mm
Document Number: 81373
2
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
End of Life July-2021 - Alternative Device: VSML3710
VSMS3700
www.vishay.com
Vishay Semiconductors
BASIC CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
100
10 000
IF - Forward Current (mA)
tp/T = 0.005
Ie - Radiant Intensity (mW/sr)
Tamb < 60 °C
0.01
1000
0.02
0.05
100
0.2
0.5
DC
0.1
10
1
0.01
0.1
1
100
103
104
1000
Φe - Radiant Power (mW)
I F - Forward Current (mA)
102
Fig. 6 - Radiant Intensity vs. Forward Current
10 4
10 3
10 2
10 1
10 0
0
1
2
3
100
10
1
0.1
100
4
V F - Forward Voltage (V)
94 7996
101
102
103
104
IF - Forward Current (mA)
94 8012
Fig. 4 - Forward Current vs. Forward Voltage
Fig. 7 - Radiant Power vs. Forward Current
1.2
1.6
1.1
1.2
IF = 10 mA
Ie rel; e rel
VF rel - Relative Forward Voltage (V)
101
IF - Forward Current (mA)
94 7956
Fig. 3 - Pulse Forward Current vs. Pulse Duration
10 -1
1
0.1
100
10
tp - Pulse Length (ms)
95 9985
10
1.0
0.9
IF = 20 mA
0.8
0.4
0.8
0.7
0
94 7990
20
40
60
80
100
Tamb - Ambient Temperature (°C)
Fig. 5 - Relative Forward Voltage vs. Ambient Temperature
Rev. 1.5, 15-Jul-2020
0
-10 0 10
947993-1
50
100
140
T amb - Ambient Temperature (°C)
Fig. 8 - Relative Radiant Intensity/Power vs. Ambient Temperature
Document Number: 81373
3
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
End of Life July-2021 - Alternative Device: VSML3710
VSMS3700
www.vishay.com
Vishay Semiconductors
Φe rel - Relative Radiant Power
1.25
1.0
0.75
0.5
0.25
IF = 100 mA
0
900
1000
950
λ - Wavelength (nm)
94 7994
Fig. 9 - Relative Radiant Power vs. Wavelength
0°
10°
20°
40°
1.0
0.9
50°
0.8
60°
70°
0.7
- Angular Displacement
Ie, rel - Relative Radiant Intensity
30°
80°
0.6
0.4
0.2
0
948013-4
Fig. 10 - Relative Radiant Intensity vs. Angular Displacement
Rev. 1.5, 15-Jul-2020
Document Number: 81373
4
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
End of Life July-2021 - Alternative Device: VSML3710
VSMS3700
www.vishay.com
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
0.9
1.75 ± 0.1
3.5 ± 0.2
0.8
technical drawings
according to DIN
specifications
C
A
2.2
2.8 ± 0.15
Pin identification
Drawing-No.: 6.541-5067.01-4
Issue: 7; 12.03.14
Ø 2.4
3 + 0.15
Mounting Pad Layout
Area covered
with solderresist
4
2.6 (2.8)
1.2
1.6 (1.9)
4
Dimensions: reflow and vapor phase (wave soldering)
Rev. 1.5, 15-Jul-2020
Document Number: 81373
5
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
End of Life July-2021 - Alternative Device: VSML3710
VSMS3700
www.vishay.com
Vishay Semiconductors
SOLDER PROFILE
TAPE AND REEL
PLCC-2 components are packed in antistatic blister tape
(DIN IEC (CO) 564) for automatic component insertion.
Cavities of blister tape are covered with adhesive tape.
Axis Title
10000
300
Max. 260 °C
255 °C
240 °C
217 °C
2nd line
Temperature (°C)
250
245 °C
1000
200
1st line
2nd line
Max. 30 s
150
Max. 120 s
100
Max. 100 s
Max. ramp down 6 °C/s
Adhesive tape
100
Blister tape
Max. ramp up 3 °C/s
50
10
0
0
50
19841-1
100
150
200
250
300
Time (s)
Fig. 11 - Lead (Pb)-free Reflow Solder Profile acc. J-STD-020
Component cavity
Fig. 12 - Blister Tape
DRYPACK
Devices are packed in moisture barrier bags (MBB) to
prevent the products from moisture absorption during
transportation and storage. Each bag contains a desiccant.
3.5
3.1
2.2
2.0
FLOOR LIFE
5.75
5.25
Floor life (time between soldering and removing from MBB)
must not exceed the time indicated on MBB label:
3.6
3.4
Floor life: 168 h
Conditions: Tamb < 30 °C, RH < 60 %
Moisture sensitivity level 3, acc. to J-STD-020
DRYING
In case of moisture absorption devices should be baked
before soldering. Conditions see J-STD-020 or label.
Devices taped on reel dry using recommended conditions
192 h at 40 °C (+ 5 °C), RH < 5 %.
94 8670
4.0
3.6
8.3
7.7
1.85
1.65
1.6
1.4
4.1
3.9
4.1
3.9
0.25
2.05
1.95
94 8668
Fig. 13 - Tape Dimensions in mm for PLCC-2
MISSING DEVICES
A maximum of 0.5 % of the total number of components per
reel may be missing, exclusively missing components at the
beginning and at the end of the reel. A maximum of three
consecutive components may be missing, provided this gap
is followed by six consecutive components.
De-reeling direction
94 8158
> 160 mm
Tape leader
40 empty
compartments
min. 75 empty
compartments
Carrier leader
Carrier trailer
Fig. 14 - Beginning and End of Reel
Rev. 1.5, 15-Jul-2020
Document Number: 81373
6
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
End of Life July-2021 - Alternative Device: VSML3710
VSMS3700
www.vishay.com
Vishay Semiconductors
The tape leader is at least 160 mm and is followed by a
carrier tape leader with at least 40 empty compartments.
The tape leader may include the carrier tape as long as the
cover tape is not connected to the carrier tape. The least
component is followed by a carrier tape trailer with a least
75 empty compartments and sealed with cover tape.
2.5
1.5
The removal force lies between 0.1 N and 1.0 N at a removal
speed of 5 mm/s. In order to prevent components from
popping out of the blisters, the cover tape must be pulled off
at an angle of 180° with regard to the feed direction.
10.0
9.0
120°
4.5
3.5
COVER TAPE REMOVAL FORCE
13.00
12.75
63.5
60.5
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
14.4 max.
180
178
94 8665
Fig. 15 - Dimensions of Reel-GS08
10.4
8.4
120°
4.5
3.5
2.5
1.5
13.00
12.75
62.5
60.0
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
321
329
14.4 max.
18857
Fig. 16 - Dimensions of Reel-GS18
Rev. 1.5, 15-Jul-2020
Document Number: 81373
7
For technical questions, contact: emittertechsupport@vishay.com
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
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www.vishay.com
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Revision: 01-Jan-2022
1
Document Number: 91000