APT65GP60B2
600V
®
POWER MOS 7 IGBT
T-MaxTM
The POWER MOS 7® IGBT is a new generation of high voltage power IGBTs.
Using Punch Through Technology this IGBT is ideal for many high frequency,
high voltage switching applications and has been optimized for high frequency
switchmode power supplies.
• Low Conduction Loss
• 100 kHz operation @ 400V, 54A
• Low Gate Charge
• 50 kHz operation @ 400V, 76A
• Ultrafast Tail Current shutoff
• SSOA rated
G
C
E
C
G
E
MAXIMUM RATINGS
Symbol
All Ratings: TC = 25°C unless otherwise specified.
Parameter
APT65GP60B2
VCES
Collector-Emitter Voltage
600
VGE
Gate-Emitter Voltage
±20
Gate-Emitter Voltage Transient
±30
VGEM
7
I C1
Continuous Collector Current
I C2
Continuous Collector Current @ TC = 110°C
I CM
Pulsed Collector Current
SSOA
PD
TJ,TSTG
TL
1
UNIT
Volts
100
@ TC = 25°C
Amps
96
250
@ TC = 25°C
250A@600V
Safe Operating Area @ TJ = 150°C
Watts
833
Total Power Dissipation
-55 to 150
Operating and Storage Junction Temperature Range
Max. Lead Temp. for Soldering: 0.063" from Case for 10 Sec.
°C
300
STATIC ELECTRICAL CHARACTERISTICS
BVCES
Collector-Emitter Breakdown Voltage (VGE = 0V, I C = 1000µA)
600
VGE(TH)
Gate Threshold Voltage
VCE(ON)
I CES
I GES
TYP
MAX
4.5
6
Collector-Emitter On Voltage (VGE = 15V, I C = 65A, Tj = 25°C)
2.2
2.7
Collector-Emitter On Voltage (VGE = 15V, I C = 65A, Tj = 125°C)
2.1
3
(VCE = VGE, I C = 2.5mA, Tj = 25°C)
Collector Cut-off Current (VCE = 600V, VGE = 0V, Tj = 25°C)
Collector Cut-off Current (VCE = 600V, VGE = 0V, Tj = 125°C)
2
1000
2
Gate-Emitter Leakage Current (VGE = ±20V)
Volts
µA
5000
±100
CAUTION: These Devices are Sensitive to Electrostatic Discharge. Proper Handling Procedures Should Be Followed.
APT Website - http://www.advancedpower.com
UNIT
nA
4-2003
MIN
Rev A
Characteristic / Test Conditions
050-7438
Symbol
APT65GP60B2
DYNAMIC CHARACTERISTICS
Symbol
Characteristic
Test Conditions
7400
VGE = 0V, VCE = 25V
580
Reverse Transfer Capacitance
f = 1 MHz
35
Gate-to-Emitter Plateau Voltage
Gate Charge
VGE = 15V
7.5
210
VCE = 300V
50
I C = 65A
65
Input Capacitance
Coes
Output Capacitance
Cres
VGEP
Qge
Qgc
SSOA
TYP
Capacitance
Cies
Qg
MIN
Total Gate Charge
3
Gate-Emitter Charge
Gate-Collector ("Miller ") Charge
Safe Operating Area
TJ = 150°C, R G = 5Ω, VGE =
MAX
UNIT
pF
V
nC
250
A
15V, L = 100µH,VCE = 600V
td(on)
tr
td(off)
tf
Eon1
Eon2
Turn-on Delay Time
Current Rise Time
Turn-on Switching Energy
Turn-on Delay Time
I C = 65A
65
R G = 5Ω
1408
Inductive Switching (125°C)
VCC = 400V
30
VGE = 15V
128
I C = 65A
91
Current Fall Time
Turn-on Switching Energy (Diode)
54
R G = 5Ω
4
Eon2
µJ
896
Turn-off Delay Time
Turn-on Switching Energy
ns
605
TJ = +25°C
5
Current Rise Time
Turn-off Switching Energy
54
6
Eon1
Eoff
91
4
Turn-on Switching Energy (Diode)
td(on)
tf
VGE = 15V
Current Fall Time
Turn-off Switching Energy
td(off)
30
Turn-off Delay Time
Eoff
tr
Inductive Switching (25°C)
VCC = 400V
5
ns
605
TJ = +125°C
1925
6
µJ
1470
THERMAL AND MECHANICAL CHARACTERISTICS
Symbol
Characteristic
MIN
TYP
MAX
RΘJC
Junction to Case (IGBT)
.15
RΘJC
Junction to Case (DIODE)
N/A
Package Weight
6.10
WT
UNIT
°C/W
gm
1 Repetitive Rating: Pulse width limited by maximum junction temperature.
2 For Combi devices, Ices includes both IGBT and FRED leakages
3 See MIL-STD-750 Method 3471.
4 Eon1 is the clamped inductive turn-on-energy of the IGBT only, without the effect of a commutating diode reverse recovery current
adding to the IGBT turn-on loss. (See Figure 24.)
5 Eon2 is the clamped inductive turn-on energy that includes a commutating diode reverse recovery current in the IGBT turn-on switching
loss. A Combi device is used for the clamping diode as shown in the Eon2 test circuit. (See Figures 21, 22.)
6 Eoff is the clamped inductive turn-off energy measured in accordance with JEDEC standard JEDS24-1. (See Figures 21, 23.)
7 Continuous current limited by package lead temperature.
050-7438
Rev A
4-2003
APT Reserves the right to change, without notice, the specifications and information contained herein.
TYPICAL PERFORMANCE CURVES
APT65GP60B2
100
100
VGE = 15V.
250µs PULSE TEST
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