ATWINC3400-MR210CA131-T

ATWINC3400-MR210xA IEEE® 802.11 b/g/n Network Controller with Integrated Bluetooth® Low Energy Module Introduction The ATWINC3400-MR210xA is an IEEE 802.11 b/g/n RF/Baseband/Medium Access Control (MAC) network controller with Bluetooth Low Energy module. The ATWINC3400-MR210xA modules are Bluetooth 5.0 certified. This module is optimized for low power and high performance mobile applications. This module features small form factor with integrated Power Amplifier (PA), Low-Noise Amplifier (LNA), Transmit/Receive (T/R) switch (for ® Wi-Fi and Bluetooth) and Power Management Unit (PMU). The ATWINC3400-MR210CA integrates a chip antenna while the ATWINC3400-MR210UA adds a micro co-ax (u.FL) connector for connecting to an external antenna. The ATWINC3400-MR210xA module requires a 32.768 kHz clock for sleep operation. The ATWINC3400-MR210xA module utilizes highly optimized IEEE 802.11 Bluetooth coexistence protocols, and provides Serial Peripheral Interface (SPI) to interface with the host controller. The references to the ATWINC3400-MR210xA module include the following devices: • ATWINC3400-MR210CA – Integrates a chip antenna • ATWINC3400-MR210UA – Adds a micro co-ax (u.FL) connector for connecting to an external antenna Features Wi-Fi features: • • • • • • • • • • • • • • • • • • • IEEE 802.11 b/g/n RF/PHY/MAC IEEE 802.11 b/g/n (1x1) with Single Spatial Stream, up to 72 Mbps PHY Rate in a 2.4 GHz ISM Band Integrated Chip Antenna or Micro Co-ax (U.FL) Connector for an External Antenna Superior Sensitivity and Range via Advanced PHY Signal Processing Advanced Equalization and Channel Estimation Advanced Carrier and Timing Synchronization Supports Soft-AP Supports IEEE 802.11 WEP, WPA and WPA2 Personal and WPA2 Enterprise (firmware version 1.3.1 or later) Superior MAC Throughput through Hardware Accelerated Two-Level A-MSDU/A-MPDU Frame Aggregation and Block Acknowledgment On-Chip Memory Management Engine to Reduce the Host Load Operating Temperature Range from -40°C to +85°C Input/Output voltage ranges from 2.7V to 3.6V Power supply (VBAT) ranges from 3.0V to 4.2V ® Wi-Fi Alliance Certified for Connectivity and Optimizations – ID: WFA62065 Integrated On-Chip Microcontroller SPI Host Interface Integrated Flash Memory for Wi-Fi and Bluetooth System Software Low Leakage On-Chip Memory for State Variables Fast AP Re-Association (150 ms) © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 1 ATWINC3400-MR210xA • • On-Chip Network Stack to Offload MCU Network Features: Firmware version 1.2.0 or later – TCP, UDP, DHCP, ARP, HTTP, TLS, DNS and SNTP Bluetooth features: • • • ATWINC3400-MR210xA Bluetooth Low Energy Certification (end product) QD ID: 112092 Adaptive Frequency Hopping (AFH) Superior Sensitivity and Range © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 2 ATWINC3400-MR210xA Table of Contents Introduction.....................................................................................................................................................1 Features......................................................................................................................................................... 1 1. Ordering Information and Module Marking..............................................................................................5 2. Block Diagram.........................................................................................................................................6 3. Pinout and Package Information............................................................................................................. 7 3.1. 4. Electrical Characteristics....................................................................................................................... 11 4.1. 4.2. 4.3. 4.4. 4.5. 5. Processor................................................................................................................................... 21 Memory Subsystem....................................................................................................................21 Nonvolatile Memory (eFuse)...................................................................................................... 21 WLAN Subsystem................................................................................................................................. 23 8.1. 8.2. 8.3. 9. Low-Power Clock....................................................................................................................... 20 CPU and Memory Subsystem...............................................................................................................21 7.1. 7.2. 7.3. 8. Device States............................................................................................................................. 17 Controlling Device States........................................................................................................... 17 Power-Up/Down Sequence........................................................................................................ 18 Digital I/O Pin Behavior During Power-Up Sequences...............................................................19 Clocking................................................................................................................................................ 20 6.1. 7. Absolute Maximum Ratings........................................................................................................11 Recommended Operating Conditions........................................................................................ 11 DC Characteristics..................................................................................................................... 12 IEEE 802.11 b/g/n Radio Performance...................................................................................... 12 Bluetooth Radio Performance.................................................................................................... 14 Power Management.............................................................................................................................. 17 5.1. 5.2. 5.3. 5.4. 6. Package Description.................................................................................................................. 10 MAC........................................................................................................................................... 23 PHY............................................................................................................................................ 24 Radio.......................................................................................................................................... 24 Bluetooth Low Energy........................................................................................................................... 26 10. External Interfaces................................................................................................................................ 27 10.1. 10.2. 10.3. 10.4. Interfacing with the Host Microcontroller.................................................................................... 27 SPI Client Interface.................................................................................................................... 28 UART Interface...........................................................................................................................30 I2C Client Interface..................................................................................................................... 31 11. Application Reference Design...............................................................................................................33 11.1. Host Interface............................................................................................................................. 33 12. Module Outline Drawings...................................................................................................................... 35 © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 3 ATWINC3400-MR210xA 13. Design Considerations.......................................................................................................................... 39 13.1. 13.2. 13.3. 13.4. 13.5. ATWINC3400-MR210CA............................................................................................................39 ATWINC3400-MR210UA External Antenna Connector............................................................. 42 Reflow Profile Information.......................................................................................................... 44 Module Assembly Considerations.............................................................................................. 44 Conformal Coating..................................................................................................................... 44 14. Appendix A: Regulatory Approval......................................................................................................... 45 14.1. 14.2. 14.3. 14.4. 14.5. 14.6. 14.7. 14.8. United States..............................................................................................................................45 Canada.......................................................................................................................................47 Europe........................................................................................................................................49 Japan..........................................................................................................................................50 Korea..........................................................................................................................................50 Taiwan........................................................................................................................................ 51 China.......................................................................................................................................... 52 Other Regulatory Information..................................................................................................... 52 15. Reference Documentation.................................................................................................................... 53 16. Document Revision History...................................................................................................................54 The Microchip Website.................................................................................................................................56 Product Change Notification Service............................................................................................................56 Customer Support........................................................................................................................................ 56 Microchip Devices Code Protection Feature................................................................................................ 56 Legal Notice................................................................................................................................................. 57 Trademarks.................................................................................................................................................. 57 Quality Management System....................................................................................................................... 58 Worldwide Sales and Service.......................................................................................................................59 © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 4 ATWINC3400-MR210xA Ordering Information and Module Marking 1. Ordering Information and Module Marking The following table provides the ordering details for the ATWINC3400-MR210xA module. Table 1-1. Ordering Details Regulatory Information Model Number Ordering Code Package Description ATWINC3400-MR210CA ATWINC3400-MR210CAxxx(1) 22.43 x 14.73 x 2.0 mm Certified module FCC, IC, CE, with chip MIC, KCC, NCC, antenna SRC ATWINC3400-MR210UA ATWINC3400-MR210UAxxx(1) 22.43 x 14.73 x 2.0 mm Certified module FCC, IC, CE with u.FL connector for an external antenna Note:  1. 'xxx' in the preceding table and following figure denotes the software version. For example, at the time of publish, the software is v1.22, so its equivalent order code is ATWINC3400-MR210CA122. The order code changes with the software version. For more information on the ordering code, refer to the ATWINC3400 product page. The following figure illustrates the ATWINC3400-MR210xA module marking information. Figure 1-1. Marking Information ATWINC3400 MR 2 1 0 C/U A xxx Device name MR: Internal Code 2: OTA with shield 1: Reserved 0: Reserved C: Chip antenna U: External antenna Revision letter Software version Blank: Tray Packing T: Tape and Reel © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 5 ATWINC3400-MR210xA Block Diagram Block Diagram The following figure shows the block diagram of the ATWINC3400-MR210xA module. Figure 2-1. ATWINC3400-MR210xA Module Block Diagram Discrete Balun and Filter SPI_CFG IRQN RESET_N Chip_En RTC (32 kHz) 2.4 GHz Chip Antenna or u.FL Connector for an External Antenna DVDDIO ATWINC3400-MR210xA VBAT 2. UART TXD/RXD RX/TX BT TXD/RXD ATWINC3400 IC BT RTS/CTS SPI I2C 26 MHz Crystal GPIOs GND © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 6 ATWINC3400-MR210xA Pinout and Package Information Pinout and Package Information This package contains an exposed paddle that must be connected to the system board ground. The ATWINC3400MR210xA module pin assignment is shown in the following figure. This package contains an exposed paddle, Pin 37, PADDLE VSS, that must be connected to the system board ground. Figure 3-1. ATWINC3400-MR210xA Module Pin Assignment J32 GPIO20 RESETN J7 J31 GPIO19 BT_TXD J8 J30 GPIO18 BT_RXD J9 J29 GPIO17 I2C_SDA_S J10 J28 GND I2C_SCL_S J11 J27 GPIO7 VDDIO J12 SPI_MOSI GND J13 J26 J25 SPI_SSN SPI_MISO J24 J6 J23 N/C SPI_SCK IRQN J22 J33 GPIO8 J5 J21 N/C GND I2C_SCL_M J20 J34 RTC_CLK J4 J19 N/C CHIP_EN I2C_SDA_M J18 J35 VBAT J3 J17 N/C UART_RXD GND J16 J36 J15 J2 UART_TXD SPI_CFG GPIO4 J1 J14 GND ATWINC3400-MR210xA MODULE GPIO3 3. The following table provides the ATWINC3400-MR210xA module pin description. Table 3-1. ATWINC3400-MR210xA Module Pin Description Pin # Pin Name Pin Type Description 1 GND GND Ground pin 2 SPI_CFG Digital Input Serial Peripheral Interface pin, which must be tied to VDDIO 3 NC — No connection 4 NC — No connection 5 NC — No connection 6 NC — No connection © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 7 ATWINC3400-MR210xA Pinout and Package Information ...........continued Pin # 7 Pin Name RESETN Pin Type Description Digital Input • • • 8 BT_TXD Digital I/O, Programmable pull up • • • 9 BT_RXD Digital I/O, Programmable pull up • • • Active-low hard Reset pin When the Reset pin is asserted low, the module is in the Reset state. When the Reset pin is asserted high, the module functions normally This pin must connect to a host output that is low by default on power-up. If the host output is tri-stated, add a 1 MOhm pull-down resistor to ensure a low level at power-up Bluetooth UART transmit data output pin Used only during debug for DTM interface. SPI is the data and control interface with the host Microcontroller It is recommended to add a test point for this pin Bluetooth UART receive data input pin Used only during debug for the DTM interface. SPI is the data and control interface with the host Microcontroller Adding a test point for this pin is recommended 10 I2C_SDA_S Digital I/O, Programmable pull up • • I2C Client data pin Used only for test purposes. Adding a test point for this pin is recommended 11 I2C_SCL_S Digital I/O, Programmable pull up • • I2C Client clock pin Used only for test purposes. Adding a test point for this pin is recommended 12 VDDIO Power Digital I/O power supply 13 GND GND Ground pin 14 GPIO3 Digital I/O, Programmable pull up General Purpose Input/Output pin(1) 15 GPIO4 Digital I/O, Programmable pull up General Purpose Input/Output pin(1) 16 UART_TXD Digital I/O, Programmable pull up • • Wi-Fi UART TxD output pin Used only for debug development purposes. Adding a test point for this pin is recommended 17 UART_RXD Digital I/O, Programmable pull up • • Wi-Fi UART RxD input pin Used only for debug development purposes. Adding a test point for this pin is recommended 18 VBAT Power © 2021 Microchip Technology Inc. Power supply pin for DC/DC converter and PA Datasheet DS70005350D-page 8 ATWINC3400-MR210xA Pinout and Package Information ...........continued Pin # 19 Pin Name CHIP_EN Pin Type Description Digital Input • • • • • PMU enable pin When the CHIP_EN pin is asserted high, the module is enabled. When the CHIP_EN pin is asserted low, the module is disabled or put into Power-Down mode Connect to a host output that is low by default at power-up. If the host output is tri-stated, add a 1 MOhm pull-down resistor, if necessary, to ensure a low level at power-up 20 RTC_CLK Digital I/O, Programmable pull up 21 GND GND Ground pin 22 GPIO8 Digital I/O, Programmable pull up General Purpose Input/Output pin(1) 23 SPI_SCK Digital I/O, Programmable pull up SPI clock pin 24 SPI_MISO Digital I/O, Programmable pull up SPI MISO (Host In Client Out) pin 25 SPI_SSN Digital I/O, Programmable pull up Active-low SPI SSN (Client Select) pin 26 SPI_MOSI Digital I/O, Programmable pull up SPI MOSI (Host Out Client In) pin 27 GPIO7 Digital I/O, Programmable pull up General Purpose Input/Output pin(1) 28 GND GND Ground pin 29 GPIO17 Digital I/O, Programmable pull up General Purpose Input/Output pin(1) 30 GPIO18 Digital I/O, Programmable pull up General Purpose Input/Output pin(1) 31 GPIO19 Digital I/O, Programmable pull up General Purpose Input/Output pin(1) 32 GPIO20 Digital I/O, Programmable pull up General Purpose Input/Output pin(1) 33 IRQN Digital output, Programmable pull up • • RTC Clock input pin This pin must connect to a 32.768 kHz clock source ATWINC3400-MR210xA module host interrupt request output pin This pin must connect to a host interrupt pin 34 I2C_SCL_M Digital I/O, Programmable pull up I2C Host clock pin 35 I2C_SDA_M Digital I/O, Programmable pull up I2C Host data pin 36 GND GND Ground pin 37 PADDLE VSS GND Connect to the system board ground © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 9 ATWINC3400-MR210xA Pinout and Package Information Note:  1. Usage of the GPIO functionality is not supported by the firmware. The data sheet will be updated once the support for this feature is added. 3.1 Package Description The following table provides the ATWINC3400-MR210xA module package dimensions. Table 3-2. ATWINC3400-MR210xA Module Package Information Parameter Pad count Package size Value Unit 37 — 22.43 x 14.73 Total thickness 2.09 Pad pitch 1.20 Pad width 0.81 Exposed pad size © 2021 Microchip Technology Inc. mm 4.4 x 4.4 Datasheet DS70005350D-page 10 ATWINC3400-MR210xA Electrical Characteristics 4. Electrical Characteristics This chapter provides an overview of the electrical characteristics of the ATWINC3400-MR210xA module. 4.1 Absolute Maximum Ratings The following table provides the absolute maximum ratings for the ATWINC3400-MR210xA module. Table 4-1. ATWINC3400-MR210xA Module Absolute Maximum Ratings Symbol Min. Max. Unit VDDIO I/O supply voltage -0.3 5.0 VBAT Battery supply voltage -0.3 5.0 VIN Digital input voltage -0.3 VDDIO VAIN Analog input voltage -0.3 1.5 VESDHBM Electrostatic discharge Human Body Model (HBM) -1000, -2000 (see notes below) +1000, +2000 (see notes below) TA Storage temperature -65 150 — Junction temperature — 125 — RF input power — 23 1. 2. V ºC dBm VIN corresponds to all the digital pins. For VESDHBM, each pin is classified as Class 1, Class 2 or both: 2.1. The Class 1 pins include all the pins (both analog and digital). 2.2. The Class 2 pins include all digital pins only. 2.3. VESDHBM is ±1 kV for Class 1 pins. VESDHBM is ± 2 kV for Class 2 pins. CAUTION 4.2 Parameter Stresses beyond those listed under “Absolute Maximum Ratings” cause permanent damage to the device. This is a stress rating only. The functional operation of the device at those or any other conditions above those indicated in the operation listings of this specification is not implied. Exposure to maximum rating conditions for extended periods affects the device reliability. Recommended Operating Conditions The following table provides the recommended operating conditions for the ATWINC3400-MR210xA module. Table 4-2. ATWINC3400-MR210xA Module Recommended Operating Conditions Symbol VDDIO Parameter I/O supply voltage (1) voltage(2)(3) VBAT Battery supply — Operating temperature © 2021 Microchip Technology Inc. Min. Typ. Max. Units 2.7 3.3 3.6 V 3.0 3.3 4.2 V -40 — 85 ºC Datasheet DS70005350D-page 11 ATWINC3400-MR210xA Electrical Characteristics Notes:  1. I/O supply voltage is applied to the VDDIO pin. 2. Battery supply voltage is applied to the VBAT pin. 3. The ATWINC3400-MR210xA module is functional across this range of voltages; however, optimal RF performance is ensured for VBAT of 3.3V. 4.3 DC Characteristics The following table provides the DC characteristics for the ATWINC3400-MR210xA module digital pads. Table 4-3. DC Electrical Characteristics Symbol Parameter Min Typ Max VIL Input Low Voltage -0.30 — 0.60 VIH Input High Voltage VDDIO - 0.60 — VDDIO + 0.30 VOL Output Low Voltage — — 0.45 VOH Output High Voltage VDDIO - 0.50 — — — Output Load Capacitance — — 20 — Digital Input Load Capacitance — — 6 4.4 IEEE 802.11 b/g/n Radio Performance 4.4.1 Receiver Performance Unit V pF The receiver performance is tested under the following conditions: • VBAT = 3.3V • VDDIO = 3.3V • Temp = 25°C • Measured after RF matching network The following table provides the receiver performance characteristics for the ATWINC3400-MR210xA module. Table 4-4. IEEE 802.11 Receiver Performance Characteristics Parameter Frequency Sensitivity 802.11b Description Min. Typ. Max. Unit 2,412 — 2,484 MHz 1 Mbps DSSS — -95.0 — 2 Mbps DSSS — -94.0 — 5.5 Mbps DSSS — -90.0 — 11 Mbps DSSS — -86.0 — — © 2021 Microchip Technology Inc. Datasheet dBm DS70005350D-page 12 ATWINC3400-MR210xA Electrical Characteristics ...........continued Parameter Sensitivity 802.11g Sensitivity 802.11n (BW = 20 MHz, 800 ns GI) Maximum receive signal level Adjacent channel rejection 4.4.2 Description Min. Typ. Max. 6 Mbps OFDM — -90.0 — 9 Mbps OFDM — -89.0 — 12 Mbps OFDM — -87.0 — 18 Mbps OFDM — -85.0 — 24 Mbps OFDM — -82.0 — 36 Mbps OFDM — -79.0 — 48 Mbps OFDM — -75.0 — 54 Mbps OFDM — -73.0 — MCS 0 — -89.0 — MCS 1 — -87.0 — MCS 2 — -84.0 — MCS 3 — -82.0 — MCS 4 — -78.0 — MCS 5 — -75.0 — MCS 6 — -73.0 — MCS 7 — -71.0 — 1-11 Mbps DSSS — 0 — 6-54 Mbps OFDM — 0 — MCS 0 – 7 (800 ns GI) — 0 — 1 Mbps DSSS (30 MHz offset) — 50 — 11 Mbps DSSS (25 MHz offset) — 43 — 6 Mbps OFDM (25 MHz offset) — 40 — 54 Mbps OFDM (25 MHz offset) — 25 — MCS 0 – 20 MHz BW (25 MHz offset) — 40 — MCS 7 – 20 MHz BW (25 MHz offset) — 20 — Unit dBm dBm dBm dB Transmitter Performance The transmitter performance is tested under the following conditions: • VBAT = 3.3V • VDDIO = 3.3V • Temp = 25°C The following table provides the transmitter performance characteristics for the ATWINC3400-MR210xA module. Table 4-5. IEEE 802.11 Transmitter Performance Characteristics Parameter Frequency Description Minimum Typical Max. Unit 2,412 — 2,484 MHz — © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 13 ATWINC3400-MR210xA Electrical Characteristics ...........continued Parameter Description Minimum Typical Max. — 16.7(1) — 802.11b 11 Mbps — 17.5(1) — 802.11g OFDM 6 Mbps — 18.3(1) — 802.11g OFDM 54 Mbps — 13.0(1) — 802.11n HT20 MCS 0 (800 ns GI) — 17.5(1) — 802.11n HT20 MCS 7 (800 ns GI) — 12.5 (1)(2) — TX power accuracy — — ±1.5(3) — dB Carrier suppression — — 30.0 — dBc Harmonic output power (Radiated, Regulatory mode) 2nd — — -41 3rd — — -41 802.11b 1 Mbps Output power Unit dBm dBm/MHz Notes:  1. Measured as per IEEE 802.11 specifications. 2. The typical output power is 10 dBm only for channel-10 (2.457 GHz). Values mentioned in the preceding table are applicable for all the other channels. 3. Measured after RF matching network. 4. The operating temperature range is -40°C to +85°C. RF performance is ensured at a room temperature of 25°C with a 2-3 dB change at the boundary conditions. 5. With respect to TX power, different (higher/lower) RF output power settings may be used for specific antennas and/or enclosures, in which case re-certification may be required. 6. The availability of some specific channels and/or operational frequency bands are country-dependent and must be programmed at the host product factory to match the intended destination. Regulatory bodies prohibit exposing the settings to the end user. This requirement needs to be taken care of via the host implementation. 7. The RF parameters for the ATWINC3400-MR210UA are approximately 1 dB less than the values in the table. This insertion loss accounts for PCB trace losses, and the filter network loss to the U.FL connector. 4.5 Bluetooth Radio Performance 4.5.1 Receiver Performance The receiver performance is tested under the following conditions: • VBAT = 3.3V • VDDIO = 3.3V • Temp: 25°C • Measured after RF matching network The following table provides the Bluetooth receiver performance characteristics for the ATWINC3400-MR210xA module. Table 4-6. Bluetooth Receiver Performance Characteristics Parameter Description Min. Typ. Max. 2,402 — 2,480 Frequency — Sensitivity (ideal Tx) Bluetooth Low Energy (GFSK) — -92.5 — Maximum receive signal level Bluetooth Low Energy (GFSK) — -2 — © 2021 Microchip Technology Inc. Datasheet Unit MHz dBm DS70005350D-page 14 ATWINC3400-MR210xA Electrical Characteristics ...........continued Parameter Interference performance (Bluetooth Low Energy) 4.5.2 Description Min. Typ. Max. Co-channel — 9 — adjacent + 1 MHz — -4 — adjacent - 1 MHz — -2 — adjacent + 2 MHz (image frequency) — -24 — adjacent - 2 MHz — -25 — adjacent + 3 MHz (adjacent to image) — -27 — adjacent - 3 MHz — -27 — adjacent + 4 MHz — -28 — adjacent - 4 MHz — -27 — adjacent + 5 MHz — -27 — adjacent - 5 MHz — -27 — Unit dB Transmitter Performance The transmitter performance is tested under the following conditions: • VBAT = 3.3V • VDDIO = 3.3V • Temp: 25°C • Measured after RF matching network The following table provides the Bluetooth transmitter performance characteristics for the ATWINC3400-MR210xA module. Table 4-7. Bluetooth Transmitter Performance Characteristics Parameter Description Frequency — Output power In-band spurious emission (Bluetooth Low Energy) © 2021 Microchip Technology Inc. Min. Typ. Max. Unit 2,402 — 2,480 Bluetooth Low Energy (GFSK) — 3.3 3.8 N + 2 (Image frequency) — -33 — N + 3 (Adjacent to image frequency) — -32 — N-2 — -48 — N-3 — -47 — Datasheet MHz dBm DS70005350D-page 15 ATWINC3400-MR210xA Electrical Characteristics Notes:  1. Measured after RF matching network. 2. The operating temperature range is -40°C to +85°C. RF performance is ensured at a room temperature of 25°C with a 2-3 dB change at the boundary conditions. 3. With respect to TX power, different (higher/lower) RF output power settings may be used for specific antennas and/or enclosures, in which case re-certification may be required. 4. The availability of some specific channels and/or operational frequency bands are country-dependent and must be programmed at the host product factory to match the intended destination. Regulatory bodies prohibit exposing the settings to the end user. This requirement needs to be taken care of via the host implementation. 5. The RF parameters for the ATWINC3400-MR210UA are approximately 1 dB less than the values in the table. This insertion loss accounts for PCB trace losses and the filter network loss to the u.FL connector. © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 16 ATWINC3400-MR210xA Power Management 5. Power Management 5.1 Device States The ATWINC3400-MR210xA module has multiple device states, based on the state of the IEEE 802.11 and Bluetooth subsystems. It is possible for both subsystems to be active at the same time. To simplify the device power consumption breakdown, the following basic states are defined. One subsystem can be active at a time: • • • • • • 5.2 WiFi_ON_Transmit – Device actively transmits IEEE 802.11 signal WiFi_ON_Receive – Device actively receives IEEE 802.11 signal BT_ON_Transmit – Device actively transmits Bluetooth signal BT_ON_Receive – Device actively receives Bluetooth signal Doze – Device is powered on but it does not actively transmit or receive data Power_Down – Device core supply is powered off Controlling Device States The following table shows different device states and their power consumption for the ATWINC3400-MR210xA . The device states can be switched using the following: • • CHIP_EN – Module pin (pin 19) enables or disables the DC/DC converter VDDIO – I/O supply voltage from external supply In the ON states, VDDIO is ON and CHIP_EN is high (at VDDIO voltage level). To change from the ON states to Power_Down state, connect the RESETN and CHIP_EN pin to logic low (GND) by following the power-down sequence mentioned in Figure 5-1. When VDDIO is OFF and CHIP_EN is low, the chip is powered off with no leakage. Table 5-1. Device States Current Consumption Device State ON_WiFi_Transmit Code Rate Output Power (dBm) Current Consumption(1) IVBAT IVDDIO 802.11b 1 Mbps 16.7 271 mA 24 mA 802.11b 11 Mbps 17.5 265 mA 24 mA 802.11g 6 Mbps 18.3 275 mA 24 mA 802.11g 54 Mbps 13.0 235 mA 24 mA 802.11n MCS 0 17.5 272 mA 24 mA 802.11n MCS 7 12.5 232 mA 24 mA 802.11b 1 Mbps N/A 63.9 mA 23.7 mA 802.11b 11 Mbps N/A 63.9 mA 23.7 mA 802.11g 6 Mbps N/A 63.9 mA 23.7 mA 802.11g 54 Mbps N/A 63.9 mA 23.7 mA 802.11n MCS 0 N/A 63.9 mA 23.7 mA 802.11n MCS 7 N/A 63.9 mA 23.7 mA ON_BT_Transmit BLE 1 Mbps 3.3 79.37 mA 23.68 mA ON_BT_Receive BLE 1 Mbps N/A 51.36 mA 23.68 mA ON_WiFi_Receive © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 17 ATWINC3400-MR210xA Power Management ...........continued Device State Code Rate Output Power (dBm) Current Consumption(1) IVBAT IVDDIO (2) Doze (Bluetooth Low Energy Idle) N/A N/A 53 mA Doze (Bluetooth Low Energy Low Power) N/A N/A 1 mA (2) Power_Down N/A N/A 10.5 uA(2) Notes:  1. Conditions: VBAT = 3.3V, VDDIO = 3.3V, at 25°C. 2. Current consumption mentioned for these states is the sum of current consumed in VDDIO and VBAT voltage rails. When power is not supplied to the device (DC/DC converter output and VDDIO are OFF, at ground potential), voltage cannot be applied to the ATWINC3400-MR210xA module pins because each pin contains an ESD diode from the pin to supply. This diode turns on when voltage higher than one diode-drop is supplied to the pin. If voltage must be applied to the signal pads when the chip is in a low-power state, the VDDIO supply must be ON, so the Power_Down state must be used. Similarly, to prevent the pin-to-ground diode from turning ON, do not apply voltage that is more than one diode-drop below the ground to any pin. 5.3 Power-Up/Down Sequence The following figure illustrates the power-up/down sequence for the ATWINC3400-MR210xA. Figure 5-1.  Power-Up/Down Sequence VBATT tA VDDIO tA' tB tB' CHIP_EN tC tC' RESETN XO Clock The following table provides power-up/down sequence timing parameters. Table 5-2.  Power-Up/Down Sequence Timing Paramet er Min. Max. Units Description tA 0 — ms VBAT rise to VDDIO rise VBAT and VDDIO can rise simultaneously or connected together. VDDIO must not rise before VBAT. tB 0 — ms VDDIO rise to CHIP_EN rise CHIP_EN must not rise before VDDIO. CHIP_EN must be driven high or low and must not be left floating. © 2021 Microchip Technology Inc. Notes Datasheet DS70005350D-page 18 ATWINC3400-MR210xA Power Management ...........continued Paramet er 5.4 Min. Max. Units Description Notes tC 5 — ms CHIP_EN rise to RESETN rise This delay is required to stabilize the XO clock before RESETN removal. RESETN must be driven high or low and must not be left floating. tA’ 0 — ms VDDIO fall to VBAT fall VBAT and VDDIO must fall simultaneously or be connected together. VBAT must not fall before VDDIO. tB’ 0 — ms CHIP_EN fall to VDDIO fall VDDIO must not fall before CHIP_EN. CHIP_EN and RESETN must fall simultaneously. tC’ 0 — ms RESETN fall to VDDIO fall VDDIO must not fall before RESETN. RESETN and CHIP_EN fall simultaneously. Digital I/O Pin Behavior During Power-Up Sequences The following table represents the digital I/O pin states corresponding to the device power modes. Table 5-3. Digital I/O Pin Behavior in Different Device States Device State VDDIO CHIP_EN RESETN Output Driver Input Driver Pull Up/Down Resistor (96 kOhm) Power_Down: core supply OFF High Low Low Disabled (Hi-Z) Disabled Disabled Power-On Reset: core supply and hard reset ON High High Low Disabled (Hi-Z) Disabled Enabled Power-On Default: core supply High ON, device out of reset and not programmed High High Disabled (Hi-Z) Enabled Enabled On_Doze/ On_Transmit/ On_Receive: core supply ON, device programmed by firmware High High Programmed by firmware for each pin: enabled or disabled Opposite of Output Driver state Programmed by firmware for each pin: enabled or disabled © 2021 Microchip Technology Inc. High Datasheet DS70005350D-page 19 ATWINC3400-MR210xA Clocking 6. Clocking 6.1 Low-Power Clock The ATWINC3400-MR210xA module requires an external 32.768 kHz clock to be supplied at the module pin 20. This clock is used during the sleep operation. The frequency accuracy of this external clock must be within ±200 ppm. © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 20 ATWINC3400-MR210xA CPU and Memory Subsystem 7. CPU and Memory Subsystem 7.1 Processor The ATWINC3400-MR210xA module has two Cortus APS3 32-bit processors, one is used for Wi-Fi and the other is used for Bluetooth. In IEEE 802.11 mode, the processor performs many of the MAC functions, including but not limited to: association, authentication, power management, security key management and MSDU aggregation/deaggregation. In addition, the processor provides flexibility for various modes of operation, such as Station (STA) and Access Point (AP) modes. In Bluetooth mode, the processor handles multiple tasks of the Bluetooth protocol stack. 7.2 Memory Subsystem The APS3 core uses a 256 KB instruction/boot ROM (160 KB for IEEE 802.11 and 96 KB for Bluetooth) along with a 420 KB instruction RAM (128 KB for IEEE 802.11 and 292 KB for Bluetooth), and a 128 KB data RAM (64 KB for IEEE 802.11 and 64 KB for Bluetooth). In addition, the device uses a 160 KB shared/exchange RAM (128 KB for IEEE 802.11 and 32 KB for Bluetooth), accessible by the processor and MAC, which allows the processor to perform various data management tasks on the Tx and Rx data packets. 7.3 Nonvolatile Memory (eFuse) The ATWINC3400-MR210xA modules have 768 bits of nonvolatile eFuse memory that can be read by the CPU after a device reset. The eFuse is partitioned into six 128-bit banks (Bank 0 – Bank 5). Each bank has the same bit map (see the following figure). The purpose of the first 108 bits in each bank is fixed, and the remaining 20 bits are general-purpose software dependent bits, or reserved for future use. Currently, the Bluetooth address is derived from the Wi-Fi MAC address such that the Bluetooth address = Wi-Fi MAC address + 1. Note:  If IQ Amp Used, IQ Amp Correction, IQ Pha Used, and IQ Pha Correction bit fields are programmed, Bank 0 and Bank 1 must not be programmed with any values, and only the Bank Invalid bit must be programmed. This nonvolatile one-time-programmable (OTP) memory can be used for storing the following customer-specific parameters: • MAC address • Calibration information (crystal frequency offset (XO offset) and so on) • Other software-specific configuration parameters Each bank can be programmed independently, which allows for several updates of the device parameters following the initial programming. For example, if the MAC address is currently programmed in Bank 3, and to update the new MAC address, perform the following steps: 1. Invalidate the contents of Bank 3 by programming the Bank Invalid bit field of Bank 3. 2. Program Bank 4 with the new MAC address along with the values of ADC Calib (if used in Bank 3), Frequency Offset (from Bank 3), IQ Amp Correction (from Bank 3) and IQ Pha Correction (from Bank 3). The Used bit field for each corresponding value bit field must also be programmed. 3. Validate the contents of Bank 4 by programming the Bank Used bit field of Bank 4. Each bit field (i.e., MAC Address, ADC Calibration, Frequency Offset, IQ Amp Correction, and IQ Pha Correction) has its corresponding Used bit field. Each Used bit field indicates to the firmware that the value in the related bit field is valid. A value of '0' in the Used bit field indicates that the following bit field is invalid and a value of '1' programmed to the Used bit field indicates that the corresponding bit field is valid and can be used by firmware. By default, all the ATWINC3400-MR210xA modules are programmed with the MAC address, Frequency Offset bits, IQ Amp and IQ Phase fields of Bank 3. © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 21 ATWINC3400-MR210xA CPU and Memory Subsystem Word Word 0 7 6:0 31 30:16 15 14:2 1 Word 1 13 Word 2 1 13 20 Reserved IQ Pha Used 1 IQ Pha Correction IQ Amp Correction 31:8 1 IQ Amp Used 23:0 15 Freq Offset 24 1 Freq Offset Used 26:25 7 ADC Calib 29:27 48 ADC Calib Used 3 Mac Addr 30 1 Mac Addr Used 31 2 Reserved 1 Version Bit 1 Bank Invalid Width Bank Used Figure 7-1. Bitmap for ATWINC3400-MR210xA eFuse Bank 0 - 31:20 19 0 Word 3 Note:  The bit map has been updated with the IQ Amp Correction and IQ Pha Correction fields from firmware version 1.4 onwards. Earlier, these bit fields were reserved for future use. For customers using firmware older than 1.4, the IQ Amp Correction and IQ Pha Correction bit fields will not be used by the firmware. The matrix table below provides details on how different versions of the firmware would handle the IQ Amp Used, IQ Amp Correction, IQ Pha Used and IQ Pha Correction bit fields during Initialization. Firmware Version Used by Customer IQ Amp Used and IQ Pha Used Bit Status Device with IQ Amp Used and IQ Pha Used Bits with Value ‘1’ Device with IQ Amp Used and IQ Pha Used Bits with Value ‘0’ 1.4 or later The firmware loads the IQ calibration values from the IQ Amp Correction and IQ Pha Correction bit fields of the corresponding eFuse bank and proceeds with Initialization. The firmware ignores the values in the IQ Amp Correction and IQ Pha Correction bit fields and proceeds with Initialization. Prior to 1.4 The firmware does not check for the IQ Amp Used and IQ Pha Used bit fields and proceeds with Initialization. © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 22 ATWINC3400-MR210xA WLAN Subsystem 8. WLAN Subsystem The WLAN subsystem is composed of the Media Access Controller (MAC), Physical Layer (PHY) and the radio. 8.1 MAC The ATWINC3400-MR210xA module is designed to operate at low power, while providing high data throughput. The IEEE 802.11 MAC functions are implemented with a combination of dedicated datapath engines, hardwired control logic and a low power, high-efficiency microprocessor. The combination of dedicated logic with a programmable processor provides optimal power efficiency and real-time response while providing the flexibility to accommodate evolving standards and future feature enhancements. The dedicated datapath engines are used to implement datapath functions with heavy computational requirements. For example, a Frame Check Sequence (FCS) engine checks the Cyclic Redundancy Check (CRC) of the transmitting and receiving packets, and a cipher engine performs all the required encryption and decryption operations for the WEP, WPA-TKIP and WPA2 CCMP-AES security requirements. Control functions, which have real-time requirements, are implemented using hardwired control logic modules. These logic modules offer real-time response while maintaining configurability through the processor. Examples of hardwired control logic modules are the channel access control module (implements EDCA/HCCA, Beacon TX control, interframe spacing and so on), protocol timer module (responsible for the Network Access vector, back-off timing, timing synchronization function and slot management), MAC Protocol Data Unit (MPDU) handling module, aggregation/deaggregation module, block ACK controller (implements the protocol requirements for burst block communication) and TX/RX control Finite State Machine (FSM) (coordinates data movement between PHY and MAC interface, cipher engine and the Direct Memory Access (DMA) interface to the TX/RX FIFOs). The following are the characteristics of the MAC functions implemented solely in the software on the microprocessor: • • • Functions with high memory requirements or complex data structures. Examples include association table management and power save queuing. Functions with low computational load or without critical real-time requirements. Examples include authentication and association. Functions that require flexibility and upgradeability. Examples include beacon frame processing and QoS scheduling. Features The ATWINC3400-MR210xA MAC supports the following functions: • • • • • • • IEEE 802.11b/g/n IEEE 802.11e WMM QoS EDCA/HCCA/PCF multiple access categories traffic scheduling Advanced IEEE 802.11n features: – Transmission and reception of aggregated MPDUs (A-MPDU) – Transmission and reception of aggregated MSDUs (A-MSDU) – Immediate block acknowledgment – Reduced Interframe Spacing (RIFS) IEEE 802.11i and WFA security with key management: – WEP 64/128 – WPA-TKIP – 128-bit WPA2 CCMP (AES) Advanced power management: – Standard IEEE 802.11 power save mode RTS-CTS and CTS-self support Either STA or AP mode in the infrastructure basic service set mode © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 23 ATWINC3400-MR210xA WLAN Subsystem 8.2 PHY The ATWINC3400-MR210xA module WLAN PHY is designed to achieve the reliable and power-efficient physical layer communication specified by the IEEE 802.11 b/g/n in single stream mode with 20 MHz bandwidth. The advanced algorithms are used to achieve maximum throughput in a real-world communication environment with impairments and interference. The PHY implements all the required functions such as Fast Fourier Transform (FFT), filtering, Forward Error Correction (FEC) that is a Viterbi decoder, frequency, timing acquisition and tracking, channel estimation and equalization, carrier sensing, clear channel assessment and automatic gain control. Features The IEEE 802.11 PHY supports the following functions: • • • • • • • Single antenna 1x1 stream in 20 MHz channels Supports IEEE 802.11b DSSS-CCK modulation: 1, 2, 5.5 and 11 Mbps Supports IEEE 802.11g OFDM modulation: 6, 9, 12,18, 24, 36, 48 and 54 Mbps Supports IEEE 802.11n HT modulations MCS0-7, 20 MHz, 800 and 400 ns guard interval: 6.5, 7.2, 13.0, 14.4, 19.5, 21.7, 26.0, 28.9, 39.0, 43.3, 52.0, 57.8, 58.5, 65.0 and 72.2 Mbps(1) IEEE 802.11n mixed mode operation Per packet TX power control Advanced channel estimation/equalization, automatic gain control, CCA, carrier/symbol recovery and frame detection Note:  1. Short GI is currently not supported by the firmware. The data sheet will be updated when the feature is supported. 8.3 Radio This section presents information describing the properties and characteristics of the ATWINC3400-MR210xA and Wi-Fi radio transmit and receive performance capabilities of the device. The performance measurements are taken at the RF pin assuming 50Ω impedance; the RF performance is ensured for a room temperature of 25oC with a derating of 2-3 dB at the boundary conditions. The measurements were taken under typical conditions: VBATT = 3.3V; VDDIO = 3.3V; temperature: +25ºC Table 8-1. Features and Properties Feature Description Part Number ATWINC3400-MR210xA WLAN Standard IEEE 802.11 b/g/n, Wi-Fi Compliant Host Interface SPI Dimension 22.4 x 14.7 x 2.0 mm Frequency Range 2.412 GHz ~ 2.472 GHz (2.4 GHz ISM Band) Number of Channels 11 for North America and 13 for Europe and Japan Modulation 802.11b: DQPSK, DBPSK, CCK 802.11g/n: OFDM /64-QAM,16-QAM, QPSK, BPSK Data Rate 802.11b: 1, 2, 5.5, 11 Mbps 802.11g: 6, 9, 12, 18, 24, 36, 48, 54 Mbps Data Rate (20 MHz, normal GI, 800 ns) © 2021 Microchip Technology Inc. 802.11n: 6.5, 13, 19.5, 26, 39, 52, 58.5, 65 Mbps Datasheet DS70005350D-page 24 ATWINC3400-MR210xA WLAN Subsystem ...........continued Feature Description Data Rate (20 MHz, short GI, 400 ns)(1) 802.11n: 7.2, 14.4, 21.7, 28.9, 43.3, 57.8, 65,72.2 Mbps Operating Temperature -40 to +85oC Note:  1. Currently, short GI is not supported by the firmware. The data sheet will be updated when the feature is supported. © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 25 ATWINC3400-MR210xA Bluetooth Low Energy 9. Bluetooth Low Energy The Bluetooth subsystem implements all the mission critical real-time functions. It encodes/decodes HCI packets, constructs baseband data packages; and manages and monitors the connection status, slot use, data flow, routing, segmentation and buffer control. The Bluetooth subsystem supports Bluetooth Low Energy modes of operation. The following advanced low energy applications are supported: • • • • • • • • Smart energy Consumer wellness Home automation Security Proximity detection Entertainment Sports and fitness Automotive Coexistence Mechanism The ATWINC3400-MR210xA supports simultaneous use of both Bluetooth Low Energy and Wi-Fi via a coexistence mechanism that allows the protocols to share the same radio. The radio defaults to Wi-Fi use until a Bluetooth Low Energy event occurs (such as connection or advertising), in which case the radio is gracefully switched over for Bluetooth Low Energy use. For the duration of the Bluetooth Low Energy event, the radio is switched back and forth between Wi-Fi and Bluetooth Low Energy, as demanded by the Bluetooth Low Energy activity, before returning to Wi-Fi until the next Bluetooth Low Energy event. © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 26 ATWINC3400-MR210xA External Interfaces 10. External Interfaces The ATWINC3400-MR210CA external interfaces include: • I2C for debugging • SPI for control and data transfer • UART for debugging • General Purpose Input/Output pins(1) Note:  1. Usage of the GPIO functionality is not supported by the ATWINC3400 firmware. The data sheet will be updated once the support for this feature is added. 10.1 Interfacing with the Host Microcontroller This section describes interfacing the ATWINC3400-MR210xA module with the host microcontroller. The interface is comprised of a client SPI and additional control signals, as shown in the following figure. For more information on SPI interface specification and timing, refer to the SPI Interface. Additional control signals are connected to the GPIO/IRQ interface of the microcontroller. Figure 10-1. Interfacing with Host Microcontroller CHIP_EN RESET Host Microcontroller Wi-Fi Controller Module SPI IRQN Table 10-1. Host Microcontroller Interface Pins Pin Number Pin Name 7 RESETN 33 IRQN 19 CHIP_EN 25 SPI_SSN 26 SPI_MOSI 24 SPI_MISO © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 27 ATWINC3400-MR210xA External Interfaces ...........continued Pin Number Pin Name 23 SPI_SCK 10.2 SPI Client Interface 10.2.1 Overview The ATWINC3400-MR210xA has a Serial Peripheral Interface (SPI) that operates as an SPI client. The SPI interface can be used for control and for serial I/O of 802.11 and Bluetooth Low Energy data. The SPI pins are mapped as shown in the following table. The SPI is a full-duplex, client-synchronous serial interface that is available immediately following a Reset when pin 2 (SPI_CFG) is tied to VDDIO. Table 10-2. SPI Interface Pin Mapping Pin # SPI function 2 CFG: Must be tied to VDDIO 25 SSN: Active-Low Client Select 26 MOSI(RXD): Serial Data Receive 23 SCK: Serial Clock 24 MISO(TXD): Serial Data Transmit When the SPI is not selected, that is, when the SSN is high, the SPI interface will not interfere with data transfers between the serial-host and other serial-client devices. When the serial-client is not selected, its transmitted data output is buffered, resulting in a high impedance drive onto the MISO line. The SPI interface responds to a protocol that allows an external host to read or write any register in the chip, as well as, initiate DMA transfers. The SPI SSN, MOSI, MISO and SCK pins of the ATWINC3400-MR210xA have internal programmable pull-up resistors. These resistors must be programmed to be disabled; otherwise, if any of the SPI pins are driven to a low level while the ATWINC3400-MR210xA is in the low-power sleep state, the current will flow from the VDDIO supply through the pull-up resistors, increasing the current consumption of the module. 10.2.2 SPI Timing The SPI Client interface supports four standard modes as determined by the Clock Polarity (CPOL) and Clock Phase (CPHA) settings. These modes are illustrated in the following table and figure. Table 10-3. SPI Client Modes Mode CPOL CPHA 0 0 0 1 0 1 2 1 0 3 1 1 Note:  The ATWINC3400-MR210xA firmware uses “SPI MODE 0” to communicate with the host. The red lines in the following figure correspond to Clock Phase = 0 and the blue lines correspond to Clock Phase = 1. © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 28 ATWINC3400-MR210xA External Interfaces Figure 10-2. SPI Client Clock Polarity and Clock Phase Timing CPOL = 0 SCK CPOL = 1 SSN RXD/TXD (MOSI/MISO) CPHA = 0 CPHA = 1 z 1 z 2 1 3 2 4 3 5 4 6 5 7 6 8 7 z 8 z The SPI timing is provided in the following figure and table. Figure 10-3. SPI Timing Diagram (SPI Mode CPOL = 0, CPHA = 0) f SCK t LH t WH SCK t WL t HL TXD t ODLY RXD t ISU t IHD SSN t SUSSN t HDSSN Table 10-4. SPI Client Timing Parameters( Parameter Clock Input Symbol Frequency(2) © 2021 Microchip Technology Inc. fSCK Min. Max. — Datasheet Units 48 MHz DS70005350D-page 29 ATWINC3400-MR210xA External Interfaces ...........continued Parameter Symbol Clock Low Pulse Width tWL 4 — Clock High Pulse Width tWH 5 — Clock Rise Time tLH 0 7 Clock Fall Time tHL 0 7 tODLY 4 RXD Input Setup Time tISU 1 — RXD Input Hold Time tIHD 5 — SSN Input Setup Time tSUSSN 3 — SSN Input Hold Time tHDSSN 5.5 — TXD Output Delay(3) Min. Max. Units 9 from SCK fall ns Notes:  1. The timing is applicable to all SPI modes. 2. The maximum clock frequency specified is limited by the SPI Client interface internal design; the actual maximum clock frequency can be lower and depends on the specific PCB layout. 3. The timing is based on 15 pF output loading. Under all conditions, tLH + tWH + tHL + tWL must be less than or equal to 1/ fSCK. 10.3 UART Interface The ATWINC3400-MR210xA supports the Universal Asynchronous Receiver/Transmitter (UART) interface. Wi-Fi and Bluetooth Low Energy interfaces must be used for debug purposes only. Wi-Fi UART pins are available on pins 16 (TXD) and 17 (RXD). Bluetooth Low Energy UART pins are available on pins 8 (TXD) and 9 (RXD). The UART is compatible with the RS-232 standard. The default configuration for accessing the Wi-Fi UART interface of the ATWINC3400-MR210xA is mentioned below: • Baud rate: 460800 • Data: 8-bit • Parity: None • Stop bit: 1-bit • Flow control: None It also has RX and TX FIFOs, which ensure reliable high-speed reception and low software overhead transmission. FIFO size is 4 x 8 for both RX and TX direction. The UART also has status registers showing the number of received characters available in the FIFO and various error conditions, as well as, the ability to generate interrupts based on these status bits. An example of the UART receiving or transmitting a single packet is shown in the following figure. This example shows 7-bit data (0x45), odd parity and two stop bits. Figure 10-4. Example of UART RX of TX Packet Previous Packets or Leading Idle Bits © 2021 Microchip Technology Inc. Current Packet Next Packet Data Parity Bit Start Bit Datasheet Stop Bits DS70005350D-page 30 ATWINC3400-MR210xA External Interfaces 10.4 I2C Client Interface The I2C client interface is a two-wire serial interface consisting of a serial data line (SDA) on module Pin 10 and a serial clock line (SCL) on module Pin 11. This interface is used for debugging of ATWINC3400-MR210xA modules. The I2C client responds to the seven bit address value 0x60. The ATWINC3400-MR210xA I2C supports I2C bus version 2.1 - 2000 and can operate in Standard mode (with data rates up to 100 Kb/s) and Fast mode (with data rates up to 400 Kb/s). Note:  For specific information on I2C bus, refer to Philips Specification entitled “The I2C-Bus Specification, Version 2.1”. The I2C client is a synchronous serial interface. The SDA line is a bidirectional signal and changes only while the SCL line is low, except for STOP, START, and RESTART conditions. The output drivers are open-drain to perform wire-AND functions on the bus. The maximum number of devices on the bus is limited by only the maximum capacitance specification of 400 pF. Data is transmitted in byte packages. 10.4.1 I2C Client Timing The I2C Client timing diagram for the ATWINC3400-MR210xA module is shown in the following figure. Figure 10-5. I2C Client Timing Diagram The following table provides the I2C Client timing parameters for the ATWINC3400-MR210xA module. Table 10-5. I2C Client Timing Parameters Parameter Symbol Min. Max. Units Remarks kHz — SCL Clock Frequency fSCL 0 400 SCL Low Pulse Width tWL 1.3 — SCL High Pulse Width tWH 0.6 — SCL, SDA Fall Time tHL — 300 SCL, SDA Rise Time tLH — 300 START Setup Time tSUSTA 0.6 — START Hold Time tHDSTA 0.6 — SDA Setup Time tSUDAT 100 — ns SDA Hold Time tHDDAT 0 — ns Client and Host Default 40 — µs Host Programming Option © 2021 Microchip Technology Inc. Datasheet µs — — — ns µs This is dictated by external components — — — DS70005350D-page 31 ATWINC3400-MR210xA External Interfaces ...........continued Parameter STOP Setup Time Symbol tSUSTO Min. Max. 0.6 — Bus Free Time Between STOP and START tBUF 1.3 — Glitch Pulse Reject tPR 0 50 © 2021 Microchip Technology Inc. Datasheet Units Remarks — µs ns — — DS70005350D-page 32 ATWINC3400-MR210xA Application Reference Design 11. Application Reference Design The ATWINC3400-MR210xA module application schematics for different supported host interfaces are shown in this section. 11.1 Host Interface Figure 11-1. ATWINC3400-MR210xA Reference Schematic Note:  It is recommended to add test points for module pins J8, J9, J10, J11, J16 and J17 in the design. The following table provides the reference Bill of Material (BoM) details for the ATWINC3400-MR210xA module with SPI as host interface. Table 11-1. ATWINC3400-MR210xA Reference Bill of Materials for SPI Operation Item Quantity Referenc e Value Description Manufacturer Part Number Footprint 1 1 U1 ATWINC3400MR210xA Wi-Fi/ Bluetooth/BLE Combo Module Microchip Technology Inc.® ATWINC3400 Custom -MR210xA 2 1 U2 ASH7KW-32.76 Oscillator, 8kHZ-L-T 32.768 kHz, +0/-175 ppm, 1.2V - 5.5V, -40°C - +85°C Abracon® Corporation ASH7KW-32. 768kHZ-L-T © 2021 Microchip Technology Inc. Datasheet OSCCC320 X150X100-4 N DS70005350D-page 33 ATWINC3400-MR210xA Application Reference Design ...........continued Item Quantity Referenc e Value Description Manufacturer Part Number Footprint 3 1 R1 1M RESISTOR, Thick Film, 1 MOhm, 0201 Panasonic® ERJ-1GEJ10 5C 4 13 R2-R14 0 RESISTOR, Thick Film, 0 Ohm, 0201 Panasonic® ERJ-1GN0R0 RS0201 0C © 2021 Microchip Technology Inc. Datasheet RS0201 DS70005350D-page 34 ATWINC3400-MR210xA Module Outline Drawings 12. Module Outline Drawings The ATWINC3400-MR210xA module package details are outlined in the following figure. Figure 12-1. ATWINC3400-MR210CA Footprint and Module Package Drawings - Top, Bottom and Side View 22.428 1.981 METAL SHIELD 13 1.30 1 14 1.346 14.732 1.204 PITCH 24 25 36 1.341 1.204 PITCH ANTENNA 0.787 TOP VIEW 2.09 SIDE VIEW THIS PAD MUST BE SOLDERED TO GROUND 25 26 27 28 29 30 31 32 33 34 35 36 24 5.21 23 22 21 20 4.40 19 18 17 16 0.94 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 4.40 6.13 BOTTOM VIEW © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 35 ATWINC3400-MR210xA Module Outline Drawings Figure 12-2. ATWINC3400-MR210CA Module Package Drawings - 3D View and Recommended Land Pattern RECOMMENDED LAND PATTERN 1.204 PITCH 6.128 SILK SCREEN 4.400 13 1 1.880 14 5.118 4.400 12.045 5.214 14.732 EDGE OF PC BOARD 24 25 36 1.985 0.813 13.244 22.428 © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 36 ATWINC3400-MR210xA Module Outline Drawings Figure 12-3. ATWINC3400-MR210UA Footprint and Module Package Drawings - Top, Bottom and Side View 22.428 1.981 RF CONNECTOR 3.64 13 1.30 1 14 2.72 1.346 14.732 1.204 PITCH 24 25 36 METAL SHIELD 1.341 1.204 PITCH 0.787 TOP VIEW 2.09 SIDE VIEW THIS PAD MUST BE SOLDERED TO GROUND 25 26 27 28 29 30 31 32 33 34 35 36 24 5.21 23 22 21 20 4.40 19 18 17 16 0.94 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 4.40 6.13 BOTTOM VIEW © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 37 ATWINC3400-MR210xA Module Outline Drawings Figure 12-4. ATWINC3400-MR210UA Module Package Drawings - 3D View and Recommended Land Pattern RECOMMENDED LAND PATTERN 1.204 PITCH 6.128 SILK SCREEN 4.400 13 1 1.880 14 5.118 4.400 12.045 5.214 14.732 EDGE OF PC BOARD 24 25 36 1.985 0.813 13.244 22.428 Notes:  1. Dimensions are in mm. 2. Having a 5x5 grid of GND vias solidly connecting the exposed GND paddle of the module to the ground plane on the inner/other layers of the host board is recommended. This will provide a good ground and thermal transfer for the ATWINC3400-MR210xA module. © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 38 ATWINC3400-MR210xA Design Considerations 13. Design Considerations This chapter provides the guidelines on module placement and routing to achieve the best performance. 13.1 ATWINC3400-MR210CA 13.1.1 ATWINC3400-MR210CA Module Placement and Routing Guidelines It is critical to follow the recommendations listed below to achieve the best RF performance: • The module must be placed on the host board and the chip antenna area must not overlap with the host board. The following figure on placement reference shows the best, poor and worst case module placements in the host board. Figure 13-1. ATWINC3400-MR210CA Placement Example CAUTION • Do not place the module in the middle of the host board or far away from the host board edge. Follow the host board mechanical recommendation, ground plane and keepout recommendations, as shown in the following figure. Module chip antenna is specifically tuned for this host board mechanical recommendation, as shown in the following figure. The host PCB must have a thickness of 1.5 mm. – Follow the module placement and keepout recommendation, as shown in the following figure. • Avoid routing any traces on the top layer of the host board, which is directly below the module area. • In the keepout region, there must be no copper traces in all signal layers. • Avoid placing any components (like mechanical spacers, bumpon and so on) on the host board close to the chip antenna region. • Place the GND polygon pour below the module on the top layer of the host board. Avoid breaks in this GND plane and ensure continuous GND plane for better RF performance. © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 39 ATWINC3400-MR210xA Design Considerations • • • • The GND polygon pour in the top layer of the host board must have a minimum area of 20 x 40 mm. Place sufficient GND vias on the host board edge and below the module for better RF performance. Having a 5 x 5 grid of GND vias solidly connecting the exposed GND paddle of the module to the ground plane of the host board is recommended. This will act as a good ground and thermal conduction path for the ATWINC3400-MR210CA module. The GND vias must have a minimum via hole size of 0.2 mm. The antenna on the module must not be placed in direct contact or close proximity to plastic casing/ objects. Keep a minimum clearance of > 7 mm in all directions around the chip antenna. Figure 13-2. ATWINC3400-MR210CA Best Case Placement Reference Example 13.1.2 ATWINC3400-MR210CA Antenna Performance The ATWINC3400-MR210CA uses a chip antenna, which is fed via matching network. The table below lists the technical specification of the chip antenna. Table 13-1. Chip antenna specification Parameter Value Peak gain 0.5 dBi Operating frequency 2400 – 2500 MHz Antenna P/N 2450AT18A100 Antenna vendor Johanson Technology Inc. 13.1.2.1 Radiation Pattern Following figures illustrate the antenna radiation pattern measured for the ATWINC3400-MR210CA module mounted in the ATWINC3400-Xpro evaluation kit. During the measurement, the module is placed in the XZ plane with Y axis being perpendicular to the module and pointing to the front of the module. © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 40 ATWINC3400-MR210xA Design Considerations Figure 13-3. Antenna Radiation Pattern - XY Plane Figure 13-4. Antenna Radiation Pattern - ZY Plane Figure 13-5. Antenna Radiation Pattern - ZX Plane © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 41 ATWINC3400-MR210xA Design Considerations 13.2 ATWINC3400-MR210UA External Antenna Connector 13.2.1 ATWINC3400-MR210UA Module Placement and Routing Guidelines The ATWINC3400-MR210UA module has an Ultra Small Miniature RF Connector (u.FL) for the external antenna. The choice of antenna is limited to the antenna types for which the module was tested and approved. For a list of tested and approved antennas that may be used with the module, refer to the respective country in the Regulatory Approval section. An approved list of external antennas tested and certified with the ATWINC3400-MR210UA module is shown in 13.2.2 ATWINC3400-MR210UA Approved External Antennas. It is critical to follow the recommendations listed below to achieve the best RF performance: • • • • • • Avoid routing any traces on the top layer of the host board, which is directly below the module area. Place the GND polygon pour below the complete module area. Do not have any breaks in this GND plane. Place sufficient GND vias in the GND polygon pour below the module area for better RF performance. Having a 3 x 3 grid of GND vias solidly connecting the exposed GND paddle of the module to the inner layer ground plane of the host board is recommended. This will act as a good ground and thermal conduction path for the ATWINC3400-MR210UB module. The GND vias must have a minimum via hole size of 0.3 mm. Keep large metal objects away from the external antenna to avoid electromagnetic field blocking. Make sure the width of the traces routed to GND, VDDIO and VBAT rails are sufficiently larger for handling the peak TX current consumption. 13.2.1.1 Antenna Placement Recommendations for ATWINC3400-MR210UA The following recommendations must be applied for the placement of antenna and its cable: • • • • • • The antenna cable must not be routed over circuits generating electrical noise on the host board or alongside or underneath the module. It is preferable that the cable be routed straight out of the module. The antenna must not be placed in direct contact or in close proximity of the plastic casing/objects. – Do not enclose the antenna within a metal shield. Keep any components that may radiate noise, signals or harmonics within the 2.4 GHz to 2.5 GHz frequency band away from the antenna and, if possible, shield those components. Any noise radiated from the host board in this frequency band degrades the sensitivity of the module. It is recommended that the antenna be placed at a distance greater than 5 cm away from the module. The following figure shows the antenna keepout area; the antenna must not be placed in this area. This recommendation is based on an open-air measurement and does not take into account any metal shielding of the customer end product. When a metal enclosure is used, the antenna can be located closer to the ATWINC3400-MR210UA module. The drawing provides an option for routing the antenna cable depending on the location of the antenna with respect to the ATWINC3400-MR210UA PCB. There are two possible options for the optimum routing of the cable. © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 42 ATWINC3400-MR210xA Design Considerations Figure 13-6. Antenna Placement Guideline Note:  These guidelines are generic and it is recommended that customers check and fine-tune the antenna positioning in the final host product based on RF performance. 13.2.2 ATWINC3400-MR210UA Approved External Antennas The ATWINC3400-MR210UA module is approved for use with the antennas listed in the following table. It is permissible to use a different antenna, provided the antenna is of the same type, gain (equal or less than), and has similar in-band and out-of-band characteristics are present (refer to specification sheet for cutoff frequencies). If other antenna types are used, the OEM installer must conduct the necessary assessments and authorize the antenna with respective regulatory agencies and ensure compliance. For more details on the corresponding regulatory approval sections, 14. Appendix A: Regulatory Approval. Table 13-2. List of Approved External Antennas List Items Part Number Manufacturer Antenna Gain at 2.4 GHz band Antenna type 1 RFA-02-P33 Aristotle 2 PCB 2 RFA-02-D3 Aristotle 2 Dipole © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 43 ATWINC3400-MR210xA Design Considerations ...........continued List Items Part Number Manufacturer Antenna Gain at 2.4 GHz band Antenna type 3 RFA-02-L2H1 Aristotle 2 Dipole 4 RFA-02-P05 Aristotle 2 PCB 5 RFA-02-C2M2 Aristotle 2 Dipole 6 W3525B039 Pulse Electronics 2 PCB 7 RFDPA870920IMLB3 WALSIN 01 1.84 Dipole 8 RN-SMA-S 0.56 Dipole Microchip Notes:  1. If the end-product using the module is designed to have an antenna port that is accessible to the end user, then the unique antenna connector (permissible by FCC) must be used (for example, Reverse Polarity (RP)SMA). 2. If an RF coaxial cable is used between the module RF output and the enclosure, then the unique antenna connector must be used in the enclosure wall to interface with an antenna. 3. Contact the antenna vendor for detailed antenna specifications to review suitability to end-product operating environment and to identify alternatives. 13.3 Reflow Profile Information For information on the reflow process guidelines, refer to the “Solder Reflow Recommendation” Application Note (AN233). 13.4 Module Assembly Considerations The ATWINC3400-MR210xA module is assembled with an EMI shield to ensure compliance with EMI emission and immunity rules. The EMI shield is made of a tin-plated steel (SPTE) and is not hermetically sealed. Solutions such as IPA and similar solvents can be used to clean this module. Cleaning solutions containing acid must never be used on the module. 13.5 Conformal Coating The modules are not intended for use with a conformal coating and the customer assumes all risks (such as the module reliability, performance degradation and so on) if a conformal coating is applied to the modules. © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 44 ATWINC3400-MR210xA Appendix A: Regulatory Approval 14. Appendix A: Regulatory Approval The ATWINC3400-MR210CA and ATWINC3400-MR210UA modules have received regulatory approval for the following countries: • ATWINC3400-MR210CA – United States/FCC ID: 2ADHKWINC3400 – Canada/ISED: • IC: 20266-ATWINC3400 • HVIN: ATWINC3400-MR210CA • PMN: Wi-Fi and Bluetooth Module – Europe/CE – Japan/MIC: 005-101794 – Korea/KCC: R-CRM-mcp-WINC3400MR210C – Taiwan/NCC: CCAN18LP0450T0 – China/SRRC: CMIIT ID: 2018DJ2733 • ATWINC3400-MR210UA – United States/FCC ID: 2ADHKWINC3400U – Canada/ISED: • IC: 20266-WINC3400UA • HVIN: ATWINC3400-MR210UA • PMN: ATWINC3400-MR210UA – Europe/CE Gain Table for Individual Regulatory Region The ATWINC3400-MR210CA module has received regulatory approvals for many regions in the world, namely United States/FCC, Canada/ISED, Europe/CE, Japan/MIC, Korea/KCC, Taiwan/NCC, and China/SRRC. The ATWINC3400-MR210UA module has received regulatory approvals for United States/FCC, Canada/ISED and Europe/CE. The default firmware uses a common gain table that meets IEEE 802.11 specifications, and regulatory region limits for both ATWINC3400-MR210CA and ATWINC3400-MR210UA as noted above. In some cases, the output power is reduced by limits of regulatory region with stringent transmit power limits. To optimize performance, and if end products’ destination is known, the specific gain table for that region can be optionally embedded into the firmware. The regulatory region certified gain table for individual regulatory region is available on ATWINC3400-MR210CA and ATWINC3400-MR210UA product page. Customers can update the gain table in firmware by following the instructions in section 6. Updating Application Gain Table into WINC3400 of ATWINC3400 – Deriving Application Gain Table Application Note 14.1 United States The ATWINC3400-MR210CA and ATWINC3400-MR210UA modules have received Federal Communications Commission (FCC) CFR47 Telecommunications, Part 15 Subpart C “Intentional Radiators” single-modular approval in accordance with Part 15.212 Modular Transmitter approval. Single-modular transmitter approval is defined as a complete RF transmission sub-assembly, designed to be incorporated into another device, that must demonstrate compliance with FCC rules and policies independent of any host. A transmitter with a modular grant can be installed in different end-use products (referred to as a host, host product or host device) by the grantee or other equipment manufacturer, then the host product may not require additional testing or equipment authorization for the transmitter function provided by that specific module or limited module device. The user must comply with all of the instructions provided by the Grantee, which indicate installation and/or operating conditions necessary for compliance. A host product itself is required to comply with all other applicable FCC equipment authorization regulations, requirements, and equipment functions that are not associated with the transmitter module portion. For example, © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 45 ATWINC3400-MR210xA Appendix A: Regulatory Approval compliance must be demonstrated: to regulations for other transmitter components within a host product; to requirements for unintentional radiators (Part 15 Subpart B), such as digital devices, computer peripherals, radio receivers, etc.; and to additional authorization requirements for the non-transmitter functions on the transmitter module (i.e., Suppliers Declaration of Conformity (SDoC) or certification) as appropriate (e.g., Bluetooth and Wi-Fi transmitter modules may also contain digital logic functions). 14.1.1 Labeling and User Information Requirements The ATWINC3400-MR210CA and ATWINC3400-MR210UA modules have been labeled with its own FCC ID number, and if the FCC ID is not visible when the module is installed inside another device, then the outside of the finished product into which the module is installed must display a label referring to the enclosed module. This exterior label must use the following wording: • For ATWINC3400-MR210CA Contains Transmitter Module FCC ID: 2ADHKWINC3400 or Contains FCC ID: 2ADHKWINC3400 This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. • For ATWINC3400-MR210UA Contains Transmitter Module FCC ID: 2ADHKWINC3400U or Contains FCC ID: 2ADHKWINC3400U This device complies with Part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) this device may not cause harmful interference, and (2) this device must accept any interference received, including interference that may cause undesired operation. The user's manual for the finished product must include the following statement: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy, and if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures: • • • • Reorient or relocate the receiving antenna Increase the separation between the equipment and receiver Connect the equipment into an outlet on a circuit different from that to which the receiver is connected Consult the dealer or an experienced radio/TV technician for help Additional information on labeling and user information requirements for Part 15 devices can be found in KDB Publication 784748, which is available at the FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB) apps.fcc.gov/oetcf/kdb/index.cfm. © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 46 ATWINC3400-MR210xA Appendix A: Regulatory Approval 14.1.2 RF Exposure All transmitters regulated by FCC must comply with RF exposure requirements. KDB 447498 General RF Exposure Guidance provides guidance in determining whether proposed or existing transmitting facilities, operations or devices comply with limits for human exposure to Radio Frequency (RF) fields adopted by the Federal Communications Commission (FCC). From the FCC Grant: Output power listed is conducted. This transmitter is restricted for use with the specific antenna(s) tested in this application for Certification. The antenna(s) used with this transmitter must be installed to provide a separation distance of at least 6.5 cm from all persons and must not be co-located or operating in conjunction with any other antenna or transmitter. Users and installers must be provided with antenna installation instructions and transmitter operating conditions for satisfying RF exposure compliance. 14.1.3 Approved External Antennas To maintain modular approval in the United States, only the antenna types that have been tested shall be used. It is permissible to use different antenna, provided the same antenna type, antenna gain (equal to or less than), with similar in-band and out-of band characteristics (refer to specification sheet for cutoff frequencies). For ATWINC3400-MR210CA, the approval is received using the integral chip antenna. For ATWINC3400-MR210UA, approved antennas are listed in the table 13.2.2 ATWINC3400-MR210UA Approved External Antennas. 14.1.4 Helpful Web Sites • • 14.2 Federal Communications Commission (FCC): www.fcc.gov. FCC Office of Engineering and Technology (OET) Laboratory Division Knowledge Database (KDB) apps.fcc.gov/ oetcf/kdb/index.cfm. Canada The ATWINC3400-MR210CA and ATWINC3400-MR210UA modules have been certified for use in Canada under Innovation, Science and Economic Development Canada (ISED, formerly Industry Canada) Radio Standards Procedure (RSP) RSP-100, Radio Standards Specification (RSS) RSS-Gen and RSS-247. Modular approval permits the installation of a module in a host device without the need to recertify the device. 14.2.1 Labeling and User Information Requirements Labeling Requirements (from RSP-100 - Issue 12, Section 5): The host product shall be properly labeled to identify the module within the host device. The Innovation, Science and Economic Development Canada certification label of a module shall be clearly visible at all times when installed in the host device; otherwise, the host product must be labeled to display the Innovation, Science and Economic Development Canada certification number of the module, preceded by the word “Contains” or similar wording expressing the same meaning, as follows: • For ATWINC3400-MR210CA Contains IC: 20266-ATWINC3400 • For ATWINC3400-MR210UA Contains IC: 20266-WINC3400UA User Manual Notice for License-Exempt Radio Apparatus (from Section 8.4 RSS-Gen, Issue 5, March 2019): User manuals for license-exempt radio apparatus shall contain the following or equivalent notice in a conspicuous location in the user manual or alternatively on the device or both: © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 47 ATWINC3400-MR210xA Appendix A: Regulatory Approval This device contains license-exempt transmitter(s)/receiver(s) that comply with Innovation, Science and Economic Development Canada’s license-exempt RSS(s). Operation is subject to the following two conditions: (1) This device may not cause interference; (2) This device must accept any interference, including interference that may cause undesired operation of the device. L’émetteur/récepteur exempt de licence contenu dans le présent appareil est conforme aux CNR d’Innovation, Sciences et Développement économique Canada applicables aux appareils radio exempts de licence. L’exploitation est autorisée aux deux conditions suivantes: 1. L’appareil ne doit pas produire de brouillage; 2. L’appareil doit accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d’en compromettre le fonctionnement. Transmitter Antenna (From Section 6.8 RSS-GEN, Issue 5, March 2019): User manuals, for transmitters shall display the following notice in a conspicuous location: This radio transmitter [IC: 20266-ATWINC3400 and IC: 20266-WINC3400UA] has been approved by Innovation, Science and Economic Development Canada to operate with the antenna types listed below, with the maximum permissible gain indicated. Antenna types not included in this list that have a gain greater than the maximum gain indicated for any type listed are strictly prohibited for use with this device. Le présent émetteur radio [IC: 20266-ATWINC3400 and IC: 20266-WINC3400UA] a été approuvé par Innovation, Sciences et Développement économique Canada pour fonctionner avec les types d'antenne énumérés cidessous et ayant un gain admissible maximal. Les types d'antenne non inclus dans cette liste, et dont le gain est supérieur au gain maximal indiqué pour tout type figurant sur la liste, sont strictement interdits pour l'exploitation de l'émetteur. Immediately following the above notice, the manufacturer shall provide a list of all antenna types approved for use with the transmitter, indicating the maximum permissible antenna gain (in dBi) and required impedance for each. 14.2.2 RF Exposure All transmitters regulated by Innovation, Science and Economic Development Canada (ISED) must comply with RF exposure requirements listed in RSS-102 - Radio Frequency (RF) Exposure Compliance of Radio communication Apparatus (All Frequency Bands). This transmitter is restricted for use with a specific antenna tested in this application for certification, and must not be co-located or operating in conjunction with any other antenna or transmitters within a host device, except in accordance with Canada multi-transmitter product procedures. The installation of the transmitter must ensure that the antenna has a separation distance of at least 6.5 cm from all persons or compliance must be demonstrated according to the ISED SAR procedures. 14.2.3 Approved Antenna Types For the ATWINC3400-MR210CA, the approval is received using the integral chip antenna. For the ATWINC3400-MR210UA, approved antennas are listed in the table 13.2.2 ATWINC3400-MR210UA Approved External Antennas. 14.2.4 Helpful Web Sites Innovation, Science and Economic Development Canada (ISED): www.ic.gc.ca/. © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 48 ATWINC3400-MR210xA Appendix A: Regulatory Approval 14.3 Europe The ATWINC3400-MR210CA and ATWINC3400-MR210UA modules is/are a Radio Equipment Directive (RED) assessed radio module that is CE marked and has been manufactured and tested with the intention of being integrated into a final product. The ATWINC3400-MR210CA and ATWINC3400-MR210UA modules has/have been tested to RED 2014/53/EU Essential Requirements mentioned in the following European Compliance table. Table 14-1. European Compliance Certification Standards Article Safety EN 62368 3.1a Health EN 62311 EMC EN 301 489-1 3.1b EN 301 489-17 Radio EN 300 328 3.2 The ETSI provides guidance on modular devices in the “Guide to the application of harmonised standards covering articles 3.1b and 3.2 of the RED 2014/53/EU (RED) to multi-radio and combined radio and nonradio equipment” document available at http://www.etsi.org/deliver/etsi_eg/203300_203399/20 3367/01.01.01_60/ eg_203367v010101p.pdf. Note:  To maintain conformance to the standards listed in the preceding European Compliance table, the module shall be installed in accordance with the installation instructions in this data sheet and shall not be modified. When integrating a radio module into a completed product, the integrator becomes the manufacturer of the final product and is therefore responsible for demonstrating compliance of the final product with the essential requirements against the RED. 14.3.1 Labeling and User Information Requirements The label on the final product that contains the ATWINC3400-MR210CA and ATWINC3400-MR210UA modules must follow CE marking requirements. 14.3.2 Conformity Assessment From ETSI Guidance Note EG 203367, section 6.1, when non-radio products are combined with a radio product: If the manufacturer of the combined equipment installs the radio product in a host non-radio product in equivalent assessment conditions (i.e. host equivalent to the one used for the assessment of the radio product) and according to the installation instructions for the radio product, then no additional assessment of the combined equipment against article 3.2 of the RED is required. 14.3.2.1 Simplified EU Declaration of Conformity Hereby, Microchip Technology Inc. declares that the radio equipment type ATWINC3400-MR210xA is in compliance with Directive 2014/53/EU. The full text of the EU declaration of conformity for this product is available at www.microchip.com/ATWINC3400 (available under Documents > Certifications). 14.3.3 Approved Antenna Types For the ATWINC3400-MR210CA, the approval is received using the integral chip antenna. For the ATWINC3400-MR210UA, approved antennas are listed in the table 13.2.2 ATWINC3400-MR210UA Approved External Antennas. 14.3.4 Helpful Websites A document that can be used as a starting point in understanding the use of Short Range Devices (SRD) in Europe is the European Radio Communications Committee (ERC) Recommendation 70-03 E, which can be downloaded from the European Communications Committee (ECC) at: http://www.ecodocdb.dk/. © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 49 ATWINC3400-MR210xA Appendix A: Regulatory Approval Additional helpful web sites are: • • • • 14.4 Radio Equipment Directive (2014/53/EU): https://ec.europa.eu/growth/single-market/european-standards/harmonised-standards/red_en European Conference of Postal and Telecommunications Administrations (CEPT): http://www.cept.org European Telecommunications Standards Institute (ETSI): http://www.etsi.org The Radio Equipment Directive Compliance Association (REDCA): http://www.redca.eu/ Japan The ATWINC3400-MR210CA module has/have received type certification and is required to be labeled with its own technical conformity mark and certification number as required to conform to the technical standards regulated by the Ministry of Internal Affairs and Communications (MIC) of Japan pursuant to the Radio Act of Japan. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. Additional testing may be required: • If the host product is subject to electrical appliance safety (for example, powered from an AC mains), the host product may require Product Safety Electrical Appliance and Material (PSE) testing. The integrator should contact their conformance laboratory to determine if this testing is required • There is an voluntary Electromagnetic Compatibility (EMC) test for the host product administered by VCCI: www.vcci.jp/vcci_e/index.html 14.4.1 Labeling and User Information Requirements The label on the final product which contains the ATWINC3400-MR210CA module must follow Japan marking requirements. The integrator of the module should refer to the labeling requirements for Japan available at the Ministry of Internal Affairs and Communications (MIC) website. For the ATWINC3400-MR210CA module, due to a limited module size, the technical conformity logo and ID is displayed in the data sheet and/or packaging and cannot be displayed on the module label. The final product in which this module is being used must have a label referring to the type certified module inside: 005-101794 14.4.2 Helpful Web Sites • • 14.5 Ministry of Internal Affairs and Communications (MIC): www.tele.soumu.go.jp/e/index.htm. Association of Radio Industries and Businesses (ARIB): www.arib.or.jp/english/. Korea The ATWINC3400-MR210CA module has/have received certification of conformity in accordance with the Radio Waves Act. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. 14.5.1 Labeling and User Information Requirements The label on the final product which contains the ATWINC3400-MR210CA module must follow KC marking requirements. The integrator of the module should refer to the labeling requirements for Korea available on the Korea Communications Commission (KCC) website. © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 50 ATWINC3400-MR210xA Appendix A: Regulatory Approval For ATWINC3400-MR210CA, due to a limited module size, the KC mark and ID are displayed in the data sheet and/or packaging and cannot be displayed on the module label. The final product requires the KC mark and certificate number of the module: R-CRM-mcp-WINC3400MR210C 14.5.2 Helpful Websites • • 14.6 Korea Communications Commission (KCC): www.kcc.go.kr. National Radio Research Agency (RRA): rra.go.kr. Taiwan The ATWINC3400-MR210CA module has/have received compliance approval in accordance with the Telecommunications Act. Customers seeking to use the compliance approval in their product should contact Microchip Technology sales or distribution partners to obtain a Letter of Authority. Integration of this module into a final product does not require additional radio certification provided installation instructions are followed and no modifications of the module are allowed. 14.6.1 Labeling and User Information Requirements For the ATWINC3400-MR210CA module, due to the limited module size, the NCC mark and ID are displayed in the data sheet only and cannot be displayed on the module label: CCAN18LP0450T0 The user's manual should contain following warning (for RF device) in traditional Chinese: 注意 ! 依據 低功率電波輻射性電機管理辦法 第十二條 經型式認證合格之低功率射頻電機，非經許 可， 公司、商號或使用者均不得擅自變更頻率、加大功率或 變更原設計 之特性及功能。 第十四條 低功率射頻電機之使用不得影響飛航安全及 干擾合法通信； 經發現有干擾現象時，應立即停用，並改善至無干擾時 方得繼續使用。 前項合法通信，指依電信規定作業之無線電信。 低功率射頻電機須忍受合法通信或工業、科學及醫療用 電波輻射性 電機設備之干擾。 14.6.2 Helpful Web Sites National Communications Commission (NCC): www.ncc.gov.tw © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 51 ATWINC3400-MR210xA Appendix A: Regulatory Approval 14.7 China The ATWINC3400-MR210CA modules has/have received certification of conformity in accordance with the China MIIT Notice 2014-01 of State Radio Regulation Committee (SRRC) certification scheme. Integration of this module into a final product does not require additional radio certification, provided installation instructions are followed and no modifications of the module are allowed. Refer to SRRC certificate available in ATWINC3400-MR210xA product page for expiry date. 14.7.1 Labeling and User Information Requirements The ATWINC3400-MR210CA module is labeled with its own CMIIT ID as follows: CMIIT ID: 2018DJ2733 When Host system is using an approved Full Modular Approval (FMA) radio: The host must bear a label containing the statement “This device contains SRRC approved Radio module CMIIT ID: 2018DJ2733”. 14.8 Other Regulatory Information • • For information about other countries' jurisdictions, refer to www.microchip.com/wwwproducts/en/ATWINC3400 (available under Documents > Certifications). Should other regulatory jurisdiction certification be required by the customer, or the customer needs to recertify the module for other reasons, contact Microchip for the required utilities and documentation © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 52 ATWINC3400-MR210xA Reference Documentation 15. Reference Documentation For further details, refer to the following documents: • • • • • • • • • ATWINC3400A-MU Datasheet Wi-Fi Network Controller Software Design Guide Application Note Integrated Serial Flash Memory Download Procedure Application Note Wi-Fi Network Controller Software Programming Guide Application Note ATWINC3400 XPro User Guide BLE Profiles Application User Guide Solder Reflow Recommendation Application Note ATWINC3400A/ATWINC3400-MR110xA Errata ATWINC3400 – Deriving Application Gain Table Application Note Note:  For a complete listing of development-support tools and documentation, visit http://www.microchip.com/ wwwproducts/en/ATWINC3400 or refer to the customer support section for details on the nearest Microchip field representative. © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 53 ATWINC3400-MR210xA Document Revision History 16. Document Revision History Revision Date D C Section 04/2021 Document Replaced Master/Slave with the new terminologies. For more details, see the following note. 1. Ordering Information and Module Marking Updated Figure 1-1 with tape and reel information. 14.3 Europe Updated EN 301 489 in EMC to EN 301 489-1 and EN 301 489-17. 12/2020 Document 2. Block Diagram 3. Pinout and Package Information • Updated ATWINC3400-MR210CA to ATWINC3400-MR210xA • Added ATWINC3400-MR210UA module information • Minor edits Updated Figure 2-1 • Updated Figure 3-1 • Updated pin descriptions of Pin 8, 9, 14, 15, 22,27, 28,29, 30, 31, 32 and 37 • Added Note 4. Electrical Characteristics Updated VBAT specification in 4.2 Recommended Operating Conditions 8. WLAN Subsystem Added footnotes for Short GI feature 10.2.2 SPI Timing • Updated Note • Added description in 10.4 I2C Client Interface 13.1.1 ATWINC3400-MR210CA Module Placement and Routing Guidelines • Added ATWINC3400-MR210CA for the section name • Updated Figure 13-2 13.2.1 ATWINC3400-MR210UA Module Placement and Routing Guidelines Added 13.2.2 ATWINC3400-MR210UA Approved External Antennas Added 1. Ordering Information and Module Marking • Updated Table 1-1 • Updated Figure 1-1 10.3 UART Interface Updated with Wi-Fi and Bluetooth Low Energy data information 11.1 Host Interface Updated Figure 11-1 14. Appendix A: Regulatory Approval B Changes 08/2018 Document Features © 2021 Microchip Technology Inc. • Updated Japan, Korea, Taiwan and China regulatory IDs for ATWINC3400MR210CA • Updated USA, Canada and Europe regulatory IDs for ATWINC3400MR210UA • Added 14. Gain Table for Individual Regulatory Region • Updated 14.1 United States, 14.2 Canada and 14.3 Europe with the details of antennas used for approval • Revamped 14.3 Europe • Updated module label information in 14.5 Korea • Updated expiry date information in 14.7 China • Updated contents of 14.8 Other Regulatory Information Updated from Bluetooth 4.0 to Bluetooth 5.0 throughout the document • Removed Bluetooth Host and Controller QD ID • Added QD ID for an end product Datasheet DS70005350D-page 54 ATWINC3400-MR210xA Document Revision History ...........continued Revision Date Section Changes 1. Ordering Information and Module Marking Updated product web page link Table 10-1 and Table 10-2 Updated pin numbers Reflow profile information 14. Appendix A: Regulatory Approval 15. Reference Documentation Radiation Pattern A 11/2017 Document • Removed Reflow Profile information sections • Added link to Solder Reflow Recommendation Application Note Added PMN details under Canada/ISED • Updated web links • Added Solder Reflow Recommendation Newly added Initial Release Note:  Microchip is aware that some terminologies used in the technical documents and existing software codes of this product are outdated and unsuitable. This document may use these new terminologies, which may or may not reflect on the source codes, software GUIs, and the documents referenced within this document. The following table shows the relevant terminology changes made in this document. Table 16-1. Terminology Related Changes Old Terminology New Terminology Description Master Host Slave Client The following sections are updated with new terminology: • 3. Pinout and Package Information • 10.1 Interfacing with the Host Microcontroller • 10.2 SPI Client Interface • 10.2.1 Overview • 10.2.2 SPI Timing • 10.4 I2C Client Interface © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 55 ATWINC3400-MR210xA The Microchip Website Microchip provides online support via our website at www.microchip.com/. This website is used to make files and information easily available to customers. Some of the content available includes: • • • Product Support – Data sheets and errata, application notes and sample programs, design resources, user’s guides and hardware support documents, latest software releases and archived software General Technical Support – Frequently Asked Questions (FAQs), technical support requests, online discussion groups, Microchip design partner program member listing Business of Microchip – Product selector and ordering guides, latest Microchip press releases, listing of seminars and events, listings of Microchip sales offices, distributors and factory representatives Product Change Notification Service Microchip’s product change notification service helps keep customers current on Microchip products. Subscribers will receive email notification whenever there are changes, updates, revisions or errata related to a specified product family or development tool of interest. To register, go to www.microchip.com/pcn and follow the registration instructions. Customer Support Users of Microchip products can receive assistance through several channels: • • • • Distributor or Representative Local Sales Office Embedded Solutions Engineer (ESE) Technical Support Customers should contact their distributor, representative or ESE for support. Local sales offices are also available to help customers. A listing of sales offices and locations is included in this document. Technical support is available through the website at: www.microchip.com/support Microchip Devices Code Protection Feature Note the following details of the code protection feature on Microchip devices: • • • • • Microchip products meet the specifications contained in their particular Microchip Data Sheet. Microchip believes that its family of products is secure when used in the intended manner and under normal conditions. There are dishonest and possibly illegal methods being used in attempts to breach the code protection features of the Microchip devices. We believe that these methods require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data Sheets. Attempts to breach these code protection features, most likely, cannot be accomplished without violating Microchip’s intellectual property rights. Microchip is willing to work with any customer who is concerned about the integrity of its code. Neither Microchip nor any other semiconductor manufacturer can guarantee the security of its code. Code protection does not mean that we are guaranteeing the product is “unbreakable.” Code protection is constantly evolving. We at Microchip are committed to continuously improving the code protection features of our products. Attempts to break Microchip’s code protection feature may be a violation of the Digital Millennium Copyright Act. If such acts allow unauthorized access to your software or other copyrighted work, you may have a right to sue for relief under that Act. © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 56 ATWINC3400-MR210xA Legal Notice Information contained in this publication is provided for the sole purpose of designing with and using Microchip products. Information regarding device applications and the like is provided only for your convenience and may be superseded by updates. It is your responsibility to ensure that your application meets with your specifications. THIS INFORMATION IS PROVIDED BY MICROCHIP “AS IS”. MICROCHIP MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF NON-INFRINGEMENT, MERCHANTABILITY, AND FITNESS FOR A PARTICULAR PURPOSE OR WARRANTIES RELATED TO ITS CONDITION, QUALITY, OR PERFORMANCE. IN NO EVENT WILL MICROCHIP BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL OR CONSEQUENTIAL LOSS, DAMAGE, COST OR EXPENSE OF ANY KIND WHATSOEVER RELATED TO THE INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROCHIP HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROCHIP'S TOTAL LIABILITY ON ALL CLAIMS IN ANY WAY RELATED TO THE INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY, THAT YOU HAVE PAID DIRECTLY TO MICROCHIP FOR THE INFORMATION. Use of Microchip devices in life support and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend, indemnify and hold harmless Microchip from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microchip intellectual property rights unless otherwise stated. Trademarks The Microchip name and logo, the Microchip logo, Adaptec, AnyRate, AVR, AVR logo, AVR Freaks, BesTime, BitCloud, chipKIT, chipKIT logo, CryptoMemory, CryptoRF, dsPIC, FlashFlex, flexPWR, HELDO, IGLOO, JukeBlox, KeeLoq, Kleer, LANCheck, LinkMD, maXStylus, maXTouch, MediaLB, megaAVR, Microsemi, Microsemi logo, MOST, MOST logo, MPLAB, OptoLyzer, PackeTime, PIC, picoPower, PICSTART, PIC32 logo, PolarFire, Prochip Designer, QTouch, SAM-BA, SenGenuity, SpyNIC, SST, SST Logo, SuperFlash, Symmetricom, SyncServer, Tachyon, TimeSource, tinyAVR, UNI/O, Vectron, and XMEGA are registered trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. AgileSwitch, APT, ClockWorks, The Embedded Control Solutions Company, EtherSynch, FlashTec, Hyper Speed Control, HyperLight Load, IntelliMOS, Libero, motorBench, mTouch, Powermite 3, Precision Edge, ProASIC, ProASIC Plus, ProASIC Plus logo, Quiet-Wire, SmartFusion, SyncWorld, Temux, TimeCesium, TimeHub, TimePictra, TimeProvider, WinPath, and ZL are registered trademarks of Microchip Technology Incorporated in the U.S.A. Adjacent Key Suppression, AKS, Analog-for-the-Digital Age, Any Capacitor, AnyIn, AnyOut, Augmented Switching, BlueSky, BodyCom, CodeGuard, CryptoAuthentication, CryptoAutomotive, CryptoCompanion, CryptoController, dsPICDEM, dsPICDEM.net, Dynamic Average Matching, DAM, ECAN, Espresso T1S, EtherGREEN, IdealBridge, In-Circuit Serial Programming, ICSP, INICnet, Intelligent Paralleling, Inter-Chip Connectivity, JitterBlocker, maxCrypto, maxView, memBrain, Mindi, MiWi, MPASM, MPF, MPLAB Certified logo, MPLIB, MPLINK, MultiTRAK, NetDetach, Omniscient Code Generation, PICDEM, PICDEM.net, PICkit, PICtail, PowerSmart, PureSilicon, QMatrix, REAL ICE, Ripple Blocker, RTAX, RTG4, SAM-ICE, Serial Quad I/O, simpleMAP, SimpliPHY, SmartBuffer, SMART-I.S., storClad, SQI, SuperSwitcher, SuperSwitcher II, Switchtec, SynchroPHY, Total Endurance, TSHARC, USBCheck, VariSense, VectorBlox, VeriPHY, ViewSpan, WiperLock, XpressConnect, and ZENA are trademarks of Microchip Technology Incorporated in the U.S.A. and other countries. SQTP is a service mark of Microchip Technology Incorporated in the U.S.A. The Adaptec logo, Frequency on Demand, Silicon Storage Technology, and Symmcom are registered trademarks of Microchip Technology Inc. in other countries. GestIC is a registered trademark of Microchip Technology Germany II GmbH & Co. KG, a subsidiary of Microchip Technology Inc., in other countries. All other trademarks mentioned herein are property of their respective companies. © 2021, Microchip Technology Incorporated, Printed in the U.S.A., All Rights Reserved. ISBN: 978-1-5224-8269-7 © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 57 ATWINC3400-MR210xA Quality Management System For information regarding Microchip’s Quality Management Systems, please visit www.microchip.com/quality. © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 58 Worldwide Sales and Service AMERICAS ASIA/PACIFIC ASIA/PACIFIC EUROPE Corporate Office 2355 West Chandler Blvd. Chandler, AZ 85224-6199 Tel: 480-792-7200 Fax: 480-792-7277 Technical Support: www.microchip.com/support Web Address: www.microchip.com Atlanta Duluth, GA Tel: 678-957-9614 Fax: 678-957-1455 Austin, TX Tel: 512-257-3370 Boston Westborough, MA Tel: 774-760-0087 Fax: 774-760-0088 Chicago Itasca, IL Tel: 630-285-0071 Fax: 630-285-0075 Dallas Addison, TX Tel: 972-818-7423 Fax: 972-818-2924 Detroit Novi, MI Tel: 248-848-4000 Houston, TX Tel: 281-894-5983 Indianapolis Noblesville, IN Tel: 317-773-8323 Fax: 317-773-5453 Tel: 317-536-2380 Los Angeles Mission Viejo, CA Tel: 949-462-9523 Fax: 949-462-9608 Tel: 951-273-7800 Raleigh, NC Tel: 919-844-7510 New York, NY Tel: 631-435-6000 San Jose, CA Tel: 408-735-9110 Tel: 408-436-4270 Canada - Toronto Tel: 905-695-1980 Fax: 905-695-2078 Australia - Sydney Tel: 61-2-9868-6733 China - Beijing Tel: 86-10-8569-7000 China - Chengdu Tel: 86-28-8665-5511 China - Chongqing Tel: 86-23-8980-9588 China - Dongguan Tel: 86-769-8702-9880 China - Guangzhou Tel: 86-20-8755-8029 China - Hangzhou Tel: 86-571-8792-8115 China - Hong Kong SAR Tel: 852-2943-5100 China - Nanjing Tel: 86-25-8473-2460 China - Qingdao Tel: 86-532-8502-7355 China - Shanghai Tel: 86-21-3326-8000 China - Shenyang Tel: 86-24-2334-2829 China - Shenzhen Tel: 86-755-8864-2200 China - Suzhou Tel: 86-186-6233-1526 China - Wuhan Tel: 86-27-5980-5300 China - Xian Tel: 86-29-8833-7252 China - Xiamen Tel: 86-592-2388138 China - Zhuhai Tel: 86-756-3210040 India - Bangalore Tel: 91-80-3090-4444 India - New Delhi Tel: 91-11-4160-8631 India - Pune Tel: 91-20-4121-0141 Japan - Osaka Tel: 81-6-6152-7160 Japan - Tokyo Tel: 81-3-6880- 3770 Korea - Daegu Tel: 82-53-744-4301 Korea - Seoul Tel: 82-2-554-7200 Malaysia - Kuala Lumpur Tel: 60-3-7651-7906 Malaysia - Penang Tel: 60-4-227-8870 Philippines - Manila Tel: 63-2-634-9065 Singapore Tel: 65-6334-8870 Taiwan - Hsin Chu Tel: 886-3-577-8366 Taiwan - Kaohsiung Tel: 886-7-213-7830 Taiwan - Taipei Tel: 886-2-2508-8600 Thailand - Bangkok Tel: 66-2-694-1351 Vietnam - Ho Chi Minh Tel: 84-28-5448-2100 Austria - Wels Tel: 43-7242-2244-39 Fax: 43-7242-2244-393 Denmark - Copenhagen Tel: 45-4485-5910 Fax: 45-4485-2829 Finland - Espoo Tel: 358-9-4520-820 France - Paris Tel: 33-1-69-53-63-20 Fax: 33-1-69-30-90-79 Germany - Garching Tel: 49-8931-9700 Germany - Haan Tel: 49-2129-3766400 Germany - Heilbronn Tel: 49-7131-72400 Germany - Karlsruhe Tel: 49-721-625370 Germany - Munich Tel: 49-89-627-144-0 Fax: 49-89-627-144-44 Germany - Rosenheim Tel: 49-8031-354-560 Israel - Ra’anana Tel: 972-9-744-7705 Italy - Milan Tel: 39-0331-742611 Fax: 39-0331-466781 Italy - Padova Tel: 39-049-7625286 Netherlands - Drunen Tel: 31-416-690399 Fax: 31-416-690340 Norway - Trondheim Tel: 47-72884388 Poland - Warsaw Tel: 48-22-3325737 Romania - Bucharest Tel: 40-21-407-87-50 Spain - Madrid Tel: 34-91-708-08-90 Fax: 34-91-708-08-91 Sweden - Gothenberg Tel: 46-31-704-60-40 Sweden - Stockholm Tel: 46-8-5090-4654 UK - Wokingham Tel: 44-118-921-5800 Fax: 44-118-921-5820 © 2021 Microchip Technology Inc. Datasheet DS70005350D-page 59