MSC2X101SDA070J

MSC2X101/100SDA070J Dual Silicon Carbide Schottky Barrier Diodes Product Overview The Silicon Carbide (SiC) power Schottky barrier diode (SBD) product line from Microsemi increases the performance over silicon diode solutions while lowering the total cost of ownership for high-voltage applications. MSC2X101/100SDA070J are dual 700 V, 100 A SiC SBD devices in a SOT-227 package. Figure 1 • Parallel MSC2X101SDA070J Figure 2 • Anti-parallel MSC2X100SDA070J Features The following are key features of the MSC2X101SDA070J and MSC2X100SDA070J devices: • No reverse recovery • Low forward voltage • Low leakage current • Avalanche-energy rated • RoHS compliant • Isolated voltage to 2500 V Benefits The following are benefits of the MSC2X101SDA070J and MSC2X100SDA070J devices: • High switching frequency • Low switching losses • Low noise (EMI) switching • Higher reliability systems • Increased system power density • Direct mounting to the heat sink (isolated package) 053-4108 MSC2X101/100SDA070J Datasheet Revision A 1 Product Overview Applications The MSC2X101SDA070J and MSC2X100SDA070J devices are designed for the following applications: • Power factor correction (PFC) • Anti-parallel diode ◦ Switch-mode power supply ◦ Inverters/converters ◦ Motor controllers • Freewheeling diode ◦ Switch-mode power supply ◦ Inverters/converters • Snubber/clamp diode 053-4108 MSC2X101/100SDA070J Datasheet Revision A 2 Device Specifications Device Specifications This section shows the specifications for the MSC2X101SDA070J and MSC2X100SDA070J devices. Absolute Maximum Ratings The following table shows the absolute maximum ratings per diode for the MSC2X101SDA070J and MSC2X100SDA070J devices. TC = 25 °C, unless otherwise specified. Table 1 • Absolute Maximum Ratings Symbol Parameter Maximum Ratings Unit VR Maximum DC reverse voltage 700 V IF Maximum DC forward current 100 A TC = 70 °C The following table shows the thermal and mechanical characteristics of the MSC2X101SDA070J and MSC2X100SDA070J devices. Table 2 • Thermal and Mechanical Characteristics Symbol Characteristics RΘJC Junction-to-case thermal resistance VISOLATION RMS voltage Min Typ Max Unit 0.56 °C/W 2500 V (50 Hz–60 Hz sinusoidal waveform from terminals to mounting base for 1 minute) TJ, TSTG Operating junction and storage temperature range Wt Package weight –55 Mounting torque, M4 screw 053-4108 MSC2X101/100SDA070J Datasheet Revision A 175 °C 1.03 oz 29.2 g 10 lbf-in 1.1 N.m 3 Device Specifications Electrical Performance The following table shows the static characteristics per diode of the MSC2X101SDA070J and MSC2X100SDA070J devices. Table 3 • Static Characteristics Per Diode Symbol Characteristics Test Conditions VF Diode forward voltage IF = 100 A IRM Reverse leakage current VR = 700 V Min Typ Max Unit TJ = 25 °C 1.5 1.8 V TJ = 175 °C 1.9 TJ = 25 °C 30 400 μA TJ = 175 °C 500 QC Total capacitive charge VR = 400 V 266 nC CJ Junction capacitance f = 1 MHz, VR = 200 V 496 pF f = 1 MHz, VR = 400 V 432 053-4108 MSC2X101/100SDA070J Datasheet Revision A 4 Device Specifications Typical Performance Curves This section shows the typical performance curves for the MSC2X101SDA070J and MSC2X100SDA070J devices. Figure 3 • Maximum Transient Thermal Impedance Figure 4 • Forward Current vs. Forward Voltage Figure 5 • Capacitance vs. Reverse Voltage 053-4108 MSC2X101/100SDA070J Datasheet Revision A 5 Package Specification Package Specification This section shows the package specification of the MSC2X101SDA070J and MSC2X100SDA070J devices. Package Outline Drawing The following figure illustrates the SOT-227 package outline of the MSC2X101SDA070J and MSC2X100SDA070J devices. The dimensions in the figure below are in millimeters and (inches). Figure 6 • Package Outline Drawing 053-4108 MSC2X101/100SDA070J Datasheet Revision A 6 Legal Microsemi 2355 W. Chandler Blvd. Chandler, AZ 85224 USA Within the USA: +1 (480) 792-7200 Fax: +1 (480) 792-7277 www.microsemi.com © 2020 Microsemi and its corporate affiliates. All rights reserved. Microsemi and the Microsemi logo are trademarks of Microsemi Corporation and its corporate affiliates. All other trademarks and service marks are the property of their respective owners. Microsemi's product warranty is set forth in Microsemi's Sales Order Terms and Conditions. Information contained in this publication is provided for the sole purpose of designing with and using Microsemi products. Information regarding device applications and the like is provided only for your convenience and may be superseded by updates. Buyer shall not rely on any data and performance specifications or parameters provided by Microsemi. It is your responsibility to ensure that your application meets with your specifications. THIS INFORMATION IS PROVIDED "AS IS." MICROSEMI MAKES NO REPRESENTATIONS OR WARRANTIES OF ANY KIND WHETHER EXPRESS OR IMPLIED, WRITTEN OR ORAL, STATUTORY OR OTHERWISE, RELATED TO THE INFORMATION, INCLUDING BUT NOT LIMITED TO ITS CONDITION, QUALITY, PERFORMANCE, NON-INFRINGEMENT, MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. IN NO EVENT WILL MICROSEMI BE LIABLE FOR ANY INDIRECT, SPECIAL, PUNITIVE, INCIDENTAL OR CONSEQUENTIAL LOSS, DAMAGE, COST OR EXPENSE WHATSOEVER RELATED TO THIS INFORMATION OR ITS USE, HOWEVER CAUSED, EVEN IF MICROSEMI HAS BEEN ADVISED OF THE POSSIBILITY OR THE DAMAGES ARE FORESEEABLE. TO THE FULLEST EXTENT ALLOWED BY LAW, MICROSEMI’S TOTAL LIABILITY ON ALL CLAIMS IN RELATED TO THIS INFORMATION OR ITS USE WILL NOT EXCEED THE AMOUNT OF FEES, IF ANY, YOU PAID DIRECTLY TO MICROSEMI FOR THIS INFORMATION. Use of Microsemi devices in life support, mission-critical equipment or applications, and/or safety applications is entirely at the buyer’s risk, and the buyer agrees to defend and indemnify Microsemi from any and all damages, claims, suits, or expenses resulting from such use. No licenses are conveyed, implicitly or otherwise, under any Microsemi intellectual property rights unless otherwise stated. Microsemi Corporation, a subsidiary of Microchip Technology Inc. (Nasdaq: MCHP), and its corporate affiliates are leading providers of smart, connected and secure embedded control solutions. Their easy-to-use development tools and comprehensive product portfolio enable customers to create optimal designs which reduce risk while lowering total system cost and time to market. These solutions serve more than 120,000 customers across the industrial, automotive, consumer, aerospace and defense, communications and computing markets. Headquartered in Chandler, Arizona, the company offers outstanding technical support along with dependable delivery and quality. Learn more at www.microsemi.com. 053-4106 | May 2020 | Released 053-4108 MSC2X101/100SDA070J Datasheet Revision A 7