16-Channel, 12-Bit
Voltage Output denseDAC
AD5767
Data Sheet
FEATURES
The AD5767 has integrated output buffers that can sink or
source up to 20 mA. In conjunction with these buffers, a low
frequency signal can be superimposed onto each DAC output via
dedicated dither pins. These dedicated dither pins simplify the
system design by reducing the number of external components
required for a similar external implementation, like operational
amplifiers or resistors. The reduction of external components
makes the AD5767 suitable for indium phosphide Mach Zehnder
modulator (InP MZM) biasing applications.
Complete 16-channel, 12-bit digital-to-analog converter
4 mm × 4 mm WLCSP package
Integrated DAC output buffers with ±20 mA output current
capability
Integrated reference buffers
Channel monitoring multiplexer
1.8 V logic compatibility
Temperature range: −40°C to +105°C
APPLICATIONS
The device incorporates a power-on reset (POR) circuit that
ensures that the DAC outputs are clamped to GND on power up
and remain at this level until the output range of the DAC is
configured. The outputs of all DACs are updated through
register configuration, with the added functionality of userselectable DAC channels to be simultaneously updated.
Mach Zehnder modulator bias control
Optical modules
Bias control
Analog output modules
GENERAL DESCRIPTION
The AD5767 utilizes a versatile 4-wire serial interface that
operates at clock rates of up to 50 MHz for write mode and is
compatible with serial peripheral interface (SPI), QSPI™,
MICROWIRE™, and DSP interface standards. The AD5767 also
contains a VLOGIC pin intended for 1.8 V/3 V/5 V logic.
The AD5767 is a 16-channel, 12-bit, voltage output denseDAC®
digital-to-analog converter (DAC).
The DAC generates output voltage ranges from an external
2.5 V reference. Depending on the voltage range selected, the
midpoint of the output span can be adjusted, allowing a minimum
output voltage as low as −20 V or a maximum output voltage of
up to +14 V. Each of the 16 channels can be monitored with an
integrated output multiplexer.
The AD5767 is available in a 4 mm × 4 mm WLCSP package
and a 40-lead LFCSP package. The AD5767 operates at a
temperature range of −40°C to +105°C.
FUNCTIONAL BLOCK DIAGRAM
AVCC
VREF
AVDD
VOUT0
VLOGIC
AD5767
RANGE
SET DAC
n
SDI
SCLK
SYNC
SDO
16-TO-1
MUX
MUX_OUT
VOUT15
INPUT
SHIFT
REGISTER
AND
CONTROL
LOGIC
INPUT
REGISTER 0
n
DAC
REGISTER 0
DAC 0
VOUT0
INPUT
REGISTER 1
n
DAC
REGISTER 1
DAC 1
VOUT1
INPUT
REGISTER 15
DAC
REGISTER 15
DAC 15
VOUT15
DGND
AGND
AVSS
n
N0
AGND
N1
15145-001
RESET
Figure 1.
Rev. A
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Technical Support
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AD5767
Data Sheet
TABLE OF CONTENTS
Features .............................................................................................. 1
Register Details ............................................................................... 25
Applications ....................................................................................... 1
Input Shift Register .................................................................... 25
General Description ......................................................................... 1
Monitor Mux Control ................................................................ 26
Functional Block Diagram .............................................................. 1
No Operation .............................................................................. 27
Revision History ............................................................................... 2
Daisy-Chain Mode ..................................................................... 27
Specifications..................................................................................... 3
Write and Update Commands .................................................. 27
AC Performance Characteristics ................................................ 6
Span Register............................................................................... 28
Timing Characteristics ................................................................ 7
Power Control Register.............................................................. 28
Absolute Maximum Ratings............................................................ 9
Write Input Data to All DAC Registers ................................... 29
Thermal Resistance ...................................................................... 9
Software Full Reset ..................................................................... 29
ESD Caution .................................................................................. 9
Select Register for Readback ..................................................... 29
Pin Configuration and Function Descriptions ........................... 10
Apply N0 or N1 Dither Signal to DACs Register ................... 30
Typical Performance Characteristics ........................................... 14
Dither Scale ................................................................................. 31
Dither ........................................................................................... 18
Invert Dither Register ................................................................ 31
Terminology .................................................................................... 20
Applications Information .............................................................. 32
Theory of Operation ...................................................................... 22
Dither Configuration ................................................................. 32
Digital-to-Analog Converter .................................................... 22
Thermal Considerations............................................................ 32
DAC Architecture ....................................................................... 22
Microprocessor Interfacing ....................................................... 32
Resistor String ............................................................................. 22
AD5767 to SPI Interface ............................................................ 32
Power-On Reset (POR).............................................................. 22
Layout Guidelines....................................................................... 33
Dither ........................................................................................... 23
Outline Dimensions ....................................................................... 34
Power-Down Mode .................................................................... 23
Ordering Guide .......................................................................... 35
Monitor Mux ............................................................................... 23
Serial Interface ............................................................................ 24
REVISION HISTORY
4/2017—Rev. 0 to Rev. A
Added 40-Lead LFCSP Package ........................................ Universal
Changes to Features.......................................................................... 1
Changes to General Description .................................................... 1
Changes to Functional Block Diagram, Figure 1 ......................... 1
Added Figure 6 and Added Table 7, Renumbered
Sequentially ..................................................................................... 12
Changes to Figure 23 and Figure 24............................................. 16
Added Figure 26.............................................................................. 17
Changes to Figure 28 and Figure 29............................................. 17
Changes to Dither DC Shift Section ............................................ 20
Changes to Figure 43, Caption Only............................................ 23
Changes to Input Shift Register Section and Table 9 ................. 25
Changes to Table 18........................................................................ 27
Changes to Thermal Considerations Section ............................. 32
Changes to Layout Guidelines Section and Added Figure 47 .. 33
Updated Outline Dimensions ....................................................... 34
Changes to Ordering Guide .......................................................... 35
1/2017—Revision 0: Initial Version
Rev. A | Page 2 of 35
Data Sheet
AD5767
SPECIFICATIONS
AVCC = 2.97 V to 5.5 V, VLOGIC = 1.7 V to 5.5 V, AVDD = 2.97 V to 16 V, AVSS = −22 V to −7 V, AGND = DGND = 0 V, VREF = 2.5 V, output
range = ±5 V, VOUTx unloaded, all specifications −40°C to +105°C, typical specifications at 25°C, unless otherwise noted.
Table 1.
Parameter
STATIC PERFORMANCE
Resolution
Relative Accuracy (INL)
Differential Nonlinearity
Bipolar Zero Error
Min
12
−1
−1.5
−1
−85
−110
−120
−145
−145
Bipolar Zero Error Temperature
Coefficient (TC) 1
Zero-Scale Error
−80
−80
−110
−110
−130
−130
−140
−140
Zero-Scale Error Temperature
Coefficient (TC)1
Full-Scale Error
−0.9
−0.9
−0.8
−0.8
−0.7
−0.7
−0.6
−0.6
Full-Scale Error Drift
Gain Error
Gain Error Temperature
Coefficient (TC)1
Offset Error
Offset Error Drift1
Typ
−0.4
−80
−80
−110
−110
−130
−130
−140
−140
±12
±13
±15
±16
±16
±2
±25
±25
±35
±35
±35
±35
±45
±45
±2
Max
Unit
+1
+1.5
Bits
LSB
LSB
+1
+85
+110
+120
+145
+145
LSB
mV
mV
mV
mV
mV
ppm FSR/°C
+80
+80
+110
+110
+130
+130
+140
+140
mV
mV
mV
mV
mV
mV
mV
mV
ppm FSR/°C
±0.23
±0.23
±0.2
±0.2
±0.18
±0.18
±0.15
±0.15
±3
±0.07
±2
+0.9
+0.9
+0.8
+0.8
+0.7
+0.7
+0.6
+0.6
±25
±25
±35
±35
±35
±35
±45
±45
±2
+80
+80
+110
+110
+130
+130
+140
+140
+0.4
% FSR
% FSR
% FSR
% FSR
% FSR
% FSR
% FSR
% FSR
ppm FSR/°C
% FSR
ppm FSR/°C
mV
mV
mV
mV
mV
mV
mV
mV
µV/°C
Rev. A | Page 3 of 35
Test Conditions/Comments
−10 V to 0 V range and ±5 V range
−20 V to 0 V, −16 V to 0 V,−10 V to +6 V, ±10 V,
−12 V to +14 V, and −16 V to +10 V ranges
Guaranteed monotonic by design
±5 V range
−10 V to +6 V range
±10 V range
−12 V to +14 V range
−16 V to +10 V range
All 0s loaded to DAC register
−10 V to 0 V range
±5 V range
−16 V to 0 V range
−10 V to +6 V range
−20 V to 0 V range
±10 V range
−12 V to +14 V range
−16 V to +10 V range
All 1s loaded to DAC register.
−10 V to 0 V range
±5 V range
−16 V to 0 V range
−10 V to +6 V range
−20 V to 0 V range
±10 V range
−12 V to +14 V range
−16 V to +10 V range
−10 V to 0 V range
±5 V range
−16 V to 0 V range
−10 V to +6 V range
−20 V to 0 V range
±10 V range
−12 V to +14 V range
−16 V to +10 V range
AD5767
Parameter
Total Unadjusted Error
Data Sheet
Min
−0.9
−0.9
−0.8
−0.8
−0.7
−0.7
−0.6
−0.6
DC Crosstalk1
OUTPUT CHARACTERISTICS
Output Voltage Ranges 2
Output Current1
Capacitive Load Stability1
DC Output Impedance1
Short-Circuit Current1
Output Amplifier Bandwidth1
REFERENCE INPUT1
Reference Input Voltage
Reference Range
DC Input Impedance
Input Current
DITHER INPUTS
Typ
±0.18
±0.18
±0.15
±0.15
±0.13
±0.13
±0.12
±0.12
30
35
−20
−16
−10
−10
−12
−16
−5
−10
−20
Input Capacitance
LOGIC OUTPUT1
Output Low Voltage
0
0
0
+6
+14
+10
+5
+10
+20
1
V
V
V
V
V
V
V
V
mA
nF
Ω
mA
kHz
2.5
2.375
2.5
2.625
1
V
V
MΩ
µA
Test Conditions/Comments
−10 V to 0 V range
±5 V range
−16 V to 0 V range
−10 V to +6 V range
−20 V to 0 V range
±10 V range
−12 V to +14 V range
−16 V to +10 V range
Due to output voltage change
Due to load current change (1 LSB)
Refer to the Thermal Considerations section
Single channel only
±1% for specified performance
Functional performance only
nV-sec
nV-sec
dB
dB
For dither input to DAC output attenuation1, see
Figure 36 to Figure 39 for typical performance
Lower −3 dB point
Upper −3 dB point
Peak-to-peak ac voltage
Peak-to-peak ac and dc voltage
See the Terminology section
Dither enabled/disabled, N0 and N1 floating
AVCC = 2.97 V and AVCC = 5.5 V
AVCC =2.97 V and AVCC = 5.5 V
10 kHz dither frequency
100 kHz dither frequency
−2
−6
0.3 × VLOGIC
+2
+6
V
V
µA
µA
Per pin
RESET pin pulled high
−57
+57
µA
RESET pin pulled low
pF
Per pin
V
Sinking 200 µA
10
100
Amplitude1
LOGIC INPUTS1
Input High Voltage, VIH
Input Low Voltage, VIL
Input Current
Unit
%FSR
%FSR
%FSR
%FSR
%FSR
%FSR
%FSR
%FSR
µV
µV/mA
0.2
±60
108
Dither Frequency1
DC Shift
Dither Transient1
Dither Selected Channel
Dither Nonselected Channels
Dither Crosstalk1
Max
+0.9
+0.9
+0.8
+0.8
+0.7
+0.7
+0.6
+0.6
0
−1
±0.063
0.25
AVCC
+1
5
2
−70
−55
0.7 × VLOGIC
2
0.4
kHz
kHz
V p-p
V
LSB
Rev. A | Page 4 of 35
Data Sheet
Parameter
Output High Voltage
High Impedance Leakage
Current
High Impedance Output
Capacitance
VOLTAGE MONITOR PIN
(MUX_OUT)
Impedance1
Three-State Leakage Current
Continuous Current1
Glitch Impulse1
Voltage Settling Time1
POWER SUPPLIES
AVDD
AVSS
AVCC
VLOGIC
Headroom/Footroom1
Normal Mode
AIDD
AISS
AICC
ILOGIC
Power-Down Mode
AIDD
AISS
AICC
ILOGIC
DC Power Supply Rejection
Ratio (PSRR)1
AC Power Supply Rejection
Ratio (PSRR)1
1
2
AD5767
Min
VLOGIC − 0.4
−1
−1
−1
Typ
Max
+1
5
pF
1.3
0.006
kΩ
µA
mA
nV-sec
µs
+1
+1
0.2
12
2.97
−22
2.97
1.7
16
−7
5.5
5.5
2
−11
−0.5
Unit
V
µA
6
−9
8.3
0.02
0.11
−0.16
0.14
0.55
0.02
50
8
10
1
0.3
Test Conditions/Comments
Sourcing 200 µA
Die temperature below 105°C
VOUTx glitch due to mux enable
¼ to ¾ scale settling to ±0.5 LSB, ±5 V range
and −10 V to 0 V range
V
V
V
V
V
AVDD − AVSS must be less than or equal to 30 V
AVDD − AVSS must be less than or equal to 30 V
mA
mA
mA
µA
All output ranges, −40°C to +105°C
All output ranges, −40°C to +105°C
All output ranges, −40°C to +105°C
All output ranges, −40°C to +105°C, VIH =
VLOGIC, VIL = DGND
All channels powered down
Applies to AVDD and AVSS
mA
mA
mA
mA
µA
µV/V
AVDD power supply
50
3
−80
µV/V
mV/V
dB
AVSS power supply
AVCC power supply
AVDD power supply, at 50 Hz
−80
−50
dB
dB
AVSS power supply, at 50 Hz
AVCC power supply, at 50 Hz
0.3
0.8
1
Guaranteed by design and characterization, but not production tested.
Output amplifier headroom requirement is 2 V minimum.
Rev. A | Page 5 of 35
AVCC = 3.3V
See Figure 30
AD5767
Data Sheet
AC PERFORMANCE CHARACTERISTICS
AVCC = 2.97 V to 5.5 V, VLOGIC = 1.7 V to 5.5 V, AVDD = 2.97 V to 15 V, AVSS = −22 V to −7 V, AGND = DGND = 0 V, VREF = 2.5 V, output
range = −10 V to 0 V, VOUTx unloaded, all specifications −40°C to +105°C, typical specifications at 25°C, analog dither signals not applied,
unless otherwise noted.
Table 2.
Parameter
DYNAMIC PERFORMANCE 1
Output Voltage Settling Time 2
Slew Rate2
Digital-to-Analog Glitch Energy2
Glitch Impulse Peak Amplitude2
Digital Feedthrough2
Digital Crosstalk2
Analog Crosstalk2
DAC-to-DAC Crosstalk2
Total Harmonic Distortion2
Output Noise Spectral Density1, 2
Min
Typ
Max
Unit
Test Conditions/Comments
10
4
1
10
8
1
0.2
15
15
−80
−75
375
605
750
835
280
440
470
610
µs
µs
V/µs
nV-sec
mV
nV-sec
nV-sec
nV-sec
nV-sec
dB
dB
nV/√Hz
nV/√Hz
nV/√Hz
nV/√Hz
nV/√Hz
nV/√Hz
nV/√Hz
nV/√Hz
¼ to ¾ scale settling to ±0.5 LSB, ±5 V range and −10 V to 0 V range
32 LSB step to ±0.5 LSB
20
23
33
38
36
45
45
45
μV rms
μV rms
μV rms
μV rms
μV rms
μV rms
μV rms
μV rms
Output Noise2, 3
1 LSB change around major carry for 10 V span
VREF = 2.5 V ± 0.1 V p-p, frequency = 10 kHz, AVCC = 2.97 V and 3.3 V
VREF = 2.5 V ± 0.1 V p-p, frequency = 10 kHz, AVCC = 5.5 V
−10 V to 0 V and ±5 V ranges, frequency = 1 kHz
−16 V to 0 V and −10 V to +6 V ranges, frequency = 1 kHz
−20 V to 0 V and ±10 V ranges, frequency = 1 kHz
−12 V to 14 V and −16 V to +10 V ranges, frequency = 1 kHz
−10 V to 0 V and ±5 V ranges, frequency = 10 kHz
−16 V to 0 V and −10 V to +6 V ranges, frequency = 10 kHz
−20 V to 0 V and ±10 V ranges, frequency = 10 kHz
−12 V to 14 V and −16 V to +10 V ranges, frequency = 10 kHz
Dither disabled
±5 V range
−10 V to 0 V range
−10 V to +6 V range
−16 V to 0 V range
±10 V range
−20 V to 0 V range
−16 V to 10 V range
−12 V to 14 V range
DAC code = midscale. AVDD = VOUT_MAX + 2 V. AVSS = VOUT_MIN − 2 V.
Guaranteed by design and characterization, but not production tested.
3
0.1 Hz to 10 Hz. AVDD = VOUT_MAX + 2 V. AVSS = VOUT_MIN − 2 V.
1
2
Rev. A | Page 6 of 35
Data Sheet
AD5767
TIMING CHARACTERISTICS
All input signals are specified with tR = tF = 1 ns/V (10% to 90% of AVDD) and timed from a voltage level of (VIL + VIH)/2. See Figure 2,
Figure 3, and Figure 4.
AVCC = 2.97 V to 5.5 V, VLOGIC = 1.7 V to 5.5 V, VREF = 2.5 V, all specifications −40°C to +105°C, unless otherwise noted.
Table 3.
Parameter
t1 1
t2
t3
t4
Limit at TMIN, TMAX
20
10
10
15
Unit
ns min
ns min
ns min
ns min
Description
SCLK cycle time
SCLK high time
SCLK low time
SYNC falling edge to SCLK falling edge setup time
t5
15
ns min
SCLK falling edge to SYNC rising edge time
t6
20
ns min
Minimum SYNC high time (write mode)
t7
t8
t9
t10
5
5
4
100
ns min
ns min
µs typ
ns typ
Data setup time
Data hold time
DAC output settling time, 32 code step to ±0.5 LSB at 12-bit resolution (see Table 2)
RESET 2 pulse width low
t11
100
ns typ
RESET2 pulse activation time
t12
10
ns min
SYNC rising edge to SCLK falling edge
t13
t14
40
50
ns max
ns typ
SCLK rising edge to SDO valid (CL_SDO 3 = 15 pF)
Minimum SYNC high time (readback/daisy-chain mode)
t15
20
µs typ
SYNC rising edge to SYNC rising edge (DAC register updates); not shown in Figure 2, Figure 3,
or Figure 4
Maximum SCLK frequency is 50 MHz for write mode and 10 MHz for readback mode.
Minimum time between a reset and the subsequent successful write is typically 25 ns.
3
CL_SDO is the capacitive load on the SDO output.
1
2
Timing Diagrams
t1
SCLK
1
2
24
t3
t6
t2
t4
t5
SYNC
t8
t7
SDI
D23
D0
t9
VOUTx
RESET
t10
t11
15145-002
VOUTx
Figure 2. Serial Interface Timing Diagram
Rev. A | Page 7 of 35
AD5767
Data Sheet
t1
SCLK
24
t3
t14
48
t2
t5
t12
t4
SYNC
t8
t7
D23
D0
INPUT WORD FOR DAC N
D0
INPUT WORD FOR DAC N – 1
t13
D23
SDO
D0
UNDEFINED
15145-003
D23
SDI
INPUT WORD FOR DAC N
Figure 3. Daisy-Chain Timing Diagram
SCLK
1
24
1
24
t14
SYNC
D23
D0
D23
INPUT WORD SPECIFIES
REGISTER TO BE READ
SDO
D23
D0
NOP CONDITION
D0
D23
D0
SELECTED REGISTER DATA
CLOCKED OUT
UNDEFINED
Figure 4. Readback Timing Diagram
Rev. A | Page 8 of 35
15145-004
SDI
Data Sheet
AD5767
ABSOLUTE MAXIMUM RATINGS
TA = 25°C, unless otherwise noted. Transient currents of up to
100 mA do not cause silicon controlled rectifier (SCR) latch-up.
Table 4.
Parameter
AVDD to AGND
AVSS to AGND
AVDD to AVSS
AVCC to AGND
AVCC to AGND
VLOGIC to DGND
Digital Inputs1 to DGND
Digital Output (SDO) to DGND
N0, N1 to AGND
VREF to AGND
VOUTx to AGND
AGND to DGND
Operating Temperature Range,
TA Industrial
Storage Temperature Range
Junction Temperature, TJ MAX
Power Dissipation
Lead Temperature
Soldering Reflow
1
Rating
−0.3 V to +34 V
+0.3 V to −34 V
−0.3 V to +34 V
−0.3 V to +7 V
−0.3 V to AVDD + 0.3 V
−0.3 V to +7 V
−0.3 V to VLOGIC + 0.3 V
−0.3 V to VLOGIC + 0.3 V
−0.3 V to AVCC + 0.3 V
−0.3 V to AVCC + 0.3 V
AVSS − 0.3 V to AVDD + 0.3 V
−0.3 V to +0.3 V
−40°C to +105°C
THERMAL RESISTANCE
Thermal performance is directly linked to printed circuit board
(PCB) design and operating environment. Careful attention to
PCB thermal design is required.
θJA is the natural convection junction to ambient thermal
resistance measured in a one cubic foot sealed enclosure.
Table 5. Thermal Resistance
Package Type
CB-49-41
CP-40-71
1
θJA
53
31.71
Unit
°C/W
°C/W
Thermal impedance simulated values are based on JEDEC 2S2P thermal test
board with 16 thermal vias. See JEDEC JESD51.
ESD CAUTION
−65°C to +150°C
150°C
(TJ MAX − TA)/θJA
260°C, as per JEDEC J-STD-020
The digital inputs include RESET, SCLK, SYNC, and SDI.
Stresses at or above those listed under Absolute Maximum
Ratings may cause permanent damage to the product. This is a
stress rating only; functional operation of the product at these
or any other conditions above those indicated in the operational
section of this specification is not implied. Operation beyond
the maximum operating conditions for extended periods may
affect product reliability.
Rev. A | Page 9 of 35
AD5767
Data Sheet
PIN CONFIGURATION AND FUNCTION DESCRIPTIONS
AD5767
2
1
A
DNC
B
AVCC
3
4
5
6
VOUT1 VOUT2 VOUT4 VOUT5 VOUT6
AGND
C MUX_OUT NIC
7
DNC
VOUT0 VOUT3 VOUT7 DGND RESET
NIC
NIC
DNC
VLOGIC
SDI
D
AVDD
NIC
NIC
NIC
NIC
NIC
AVSS
E
N1
NIC
NIC
NIC
NIC
SDO
SCLK
F
N0
G
VREF VOUT15 VOUT12 VOUT8 AGND
SYNC
DNC VOUT14 VOUT13 VOUT11 VOUT10 VOUT9
DNC
NOTES
1. DNC = DO NOT CONNECT. DO NOT CONNECT TO THESE PINS.
2. NIC = NO INTERNAL CONNECTION. THESE PINS SHOULD BE
ROUTED TO THERMAL VIAS ON THE PCB TO AID WITH HEAT
DISSIPATION. THESE SHOULD BE CONNECTED TO GROUND.
15145-005
TOP VIEW
(BALL SIDE DOWN)
Not to Scale
Figure 5. WLCSP Package Pin Configuration
Table 6. 49-Ball WLCSP Pin Function Descriptions
Pin No.
Dither
F1
E1
Logic Inputs and Outputs
E7
Mnemonic
Description
N0
Dither Signal Input Pin 0. A signal connected to this pin can be added to the DAC outputs via
register commands. If unused, connect this pin to ground. Refer to the Dither section for more
information.
Dither Signal Input Pin 1. A signal connected to this pin can be added to the DAC outputs via
register commands. If unused, connect this pin to ground. Refer to the Dither section for more
information.
N1
SCLK
F7
SYNC
C7
SDI
E6
SDO
B7
RESET
Analog Outputs
B3
A2
A3
B4
A4
A5
A6
VOUT0
VOUT1
VOUT2
VOUT3
VOUT4
VOUT5
VOUT6
Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial
clock input. Data can be transferred at rates of up to 50 MHz for write mode and 10 MHz for
readback and daisy-chain mode.
Active Low Control Input. SYNC is the frame synchronization signal for the input data. When
SYNC goes low, it powers on the SCLK and SDI buffers and enables the input shift register. Data
is transferred in on the falling edges of the next 24 clocks. If SYNC is taken high before the 24th
falling edge, the rising edge of SYNC acts as an interrupt, and the write sequence is ignored by
the device.
Serial Data Input. This device has a 24-bit shift register. Data is clocked into the register on the
falling edge of the serial clock input.
Serial Data Output. This pin clocks data from the serial register in daisy-chain or readback mode.
Data is clocked out on the rising edge of SCLK and is valid on the falling edge of SCLK.
Active Low Reset Input. Asserting this pin logic low returns the AD5767 to its default power-on
state. After this pin returns to logic high, the device comes out of the reset mode and is ready to
accept a new SPI command. This pin can be left floating, because there is a weak internal pull-up
resistor.
Analog Output Voltage from DAC 0.
Analog Output Voltage from DAC 1.
Analog Output Voltage from DAC 2.
Analog Output Voltage from DAC 3.
Analog Output Voltage from DAC 4.
Analog Output Voltage from DAC 5.
Analog Output Voltage from DAC 6.
Rev. A | Page 10 of 35
Data Sheet
AD5767
Pin No.
B5
F5
G6
G5
G4
F4
G3
G2
F3
Power Supplies and
Reference Input
F2
C6
B1
Mnemonic
VOUT7
VOUT8
VOUT9
VOUT10
VOUT11
VOUT12
VOUT13
VOUT14
VOUT15
Description
Analog Output Voltage from DAC 7.
Analog Output Voltage from DAC 8.
Analog Output Voltage from DAC 9.
Analog Output Voltage from DAC 10.
Analog Output Voltage from DAC 11.
Analog Output Voltage from DAC 12.
Analog Output Voltage from DAC 13.
Analog Output Voltage from DAC 14.
Analog Output Voltage from DAC 15.
VREF
VLOGIC
AVCC
D1
D7
B2, F6
B6
Channel Monitoring
C1
AVDD
AVSS
AGND
DGND
Reference Input Voltage. For specified performance, VREFIN = 2.5 V.
Digital Power Supply.
Power Supply Input. The AD5767 operates from 2.97 V to 5.5 V. Decouple AVCC with a 10 µF
capacitor in parallel with a 0.1 µF capacitor to analog ground.
Output Amplifier Positive Analog Supply.
Output Amplifier Negative Analog Supply.
Analog Ground.
Digital Ground Pin.
Do Not Connect
A1, A7, C5, G1, G7
No Internal Connection
C2 to C4, D2 to D6,
E2 to E5
MUX_OUT
Monitor Output. This pin acts as the output of a 16-to-1 channel multiplexer that can be
programmed to multiplex one of 16 channels, Channel 0 to Channel 15, to the MUX_OUT pin.
DNC
Do Not Connect. Do not connect to these pins.
NIC
No Internal Connection. Route these pins to thermal vias on the PCB to aid with heat
dissipation. Connect these pins to ground.
Rev. A | Page 11 of 35
Data Sheet
40
39
38
37
36
35
34
33
32
31
DNC
VOUT7
VOUT6
VOUT5
VOUT4
VOUT3
VOUT2
VOUT1
VOUT0
NIC
AD5767
AD5767
TOP VIEW
(Not to Scale)
30
29
28
27
26
25
24
23
22
21
DNC
AGND
AVCC
MUX_OUT
AVDD
NIC
N1
N0
VREF
DNC
NOTES
1. DNC = DO NOT CONNECT. DO NOT CONNECT TO THESE PINS.
2. NIC = NO INTERNAL CONNECTION. THESE PINS SHOULD BE
ROUTED TO THERMAL VIAS ON THE PCB TO AID WITH HEAT
DISSIPATION. THESE SHOULD BE CONNECTED TO GROUND.
3. EXPOSED PAD (LFCSP PACKAGE ONLY). CONNECT THIS
EXPOSED PAD TO THE POTENTIAL OF THE AVSS PIN, OR,
ALTERNATIVELY, LEAVE IT ELECTRICALLY UNCONNECTED.
IT IS RECOMMENDED THAT THE PAD BE THERMALLY
CONNECTED TO A COPPER PLANE FOR ENHANCED
THERMAL PERFORMANCE.
15145-006
DNC
VOUT8
VOUT9
VOUT10
VOUT11
VOUT12
VOUT13
VOUT14
VOUT15
NIC
11
12
13
14
15
16
17
18
19
20
DNC 1
DGND 2
RESET 3
VLOGIC 4
SDI 5
AVSS 6
SLCK 7
SYNC 8
SDO 9
AGND 10
Figure 6. LFCSP Package Pin Configuration
Table 7. 40-Lead LFCSP Pin Function Descriptions
Pin No.
Dither
23
Mnemonic
Description
N0
24
N1
Dither Signal Input Pin 0. A signal connected to this pin can be added to the DAC outputs via
register commands. If unused, connect this pin to ground. Refer to the Dither section for more
information.
Dither Signal Input Pin 1. A signal connected to this pin can be added to the DAC outputs via
register commands. If unused, connect this pin to ground. Refer to the Dither section for more
information.
Logic Inputs and Outputs
7
SCLK
8
SYNC
5
SDI
9
SDO
3
RESET
Analog Outputs
32
33
34
35
36
37
VOUT0
VOUT1
VOUT2
VOUT3
VOUT4
VOUT5
Serial Clock Input. Data is clocked into the input shift register on the falling edge of the serial
clock input. Data can be transferred at rates of up to 50 MHz for write mode and 10 MHz for
readback and daisy-chain mode.
Active Low Control Input. SYNC is the frame synchronization signal for the input data. When
SYNC goes low, it powers on the SCLK and SDI buffers and enables the input shift register. Data
is transferred in on the falling edges of the next 24 clocks. If SYNC is taken high before the 24th
falling edge, the rising edge of SYNC acts as an interrupt, and the write sequence is ignored by
the device.
Serial Data Input. This device has a 24-bit shift register. Data is clocked into the register on the
falling edge of the serial clock input.
Serial Data Output. This pin clocks data from the serial register in daisy-chain or readback mode.
Data is clocked out on the rising edge of SCLK and is valid on the falling edge of SCLK.
Active Low Reset Input. Asserting this pin logic low returns the AD5767 to its default power-on
state. After this pin returns to logic high, the device comes out of the reset mode and is ready to
accept a new SPI command. This pin can be left floating, because there is a weak internal pull-up
resistor.
Analog Output Voltage from DAC 0.
Analog Output Voltage from DAC 1.
Analog Output Voltage from DAC 2.
Analog Output Voltage from DAC 3.
Analog Output Voltage from DAC 4.
Analog Output Voltage from DAC 5.
Rev. A | Page 12 of 35
Data Sheet
AD5767
Pin No.
38
39
12
13
14
15
16
17
18
19
Power Supplies and
Reference Input
22
4
28
Mnemonic
VOUT6
VOUT7
VOUT8
VOUT9
VOUT10
VOUT11
VOUT12
VOUT13
VOUT14
VOUT15
Description
Analog Output Voltage from DAC 6.
Analog Output Voltage from DAC 7.
Analog Output Voltage from DAC 8.
Analog Output Voltage from DAC 9.
Analog Output Voltage from DAC 10.
Analog Output Voltage from DAC 11.
Analog Output Voltage from DAC 12.
Analog Output Voltage from DAC 13.
Analog Output Voltage from DAC 14.
Analog Output Voltage from DAC 15.
VREF
VLOGIC
AVCC
26
6
10, 29
2
Channel Monitoring
27
AVDD
AVSS
AGND
DGND
Reference Input Voltage. For specified performance, VREFIN = 2.5 V.
Digital Power Supply.
Power Supply Input. The AD5767 operates from 2.97 V to 5.5 V. Decouple AVCC with a 10 µF
capacitor in parallel with a 0.1 µF capacitor to analog ground.
Output Amplifier Positive Analog Supply.
Output Amplifier Negative Analog Supply.
Analog Ground.
Digital Ground Pin.
MUX_OUT
Monitor Output. This pin acts as the output of a 16-to-1 channel multiplexer that can be
programmed to multiplex one of 16 channels, Channel 0 to Channel 15, to the MUX_OUT pin.
Do Not Connect
1, 11, 21, 30, 40
No Internal Connection
20, 25, 31
DNC
Do Not Connect. Do not connect to these pins.
NIC
Not Applicable
EPAD
No Internal Connection. Route these pins to thermal vias on the PCB to aid with heat
dissipation. Connect these pins to ground.
Exposed Pad. Connect this exposed pad to the potential of the AVSS pin, or, alternatively, leave it
electrically unconnected. It is recommended that the exposed pad be thermally connected to a
copper plane for enhanced thermal performance.
Rev. A | Page 13 of 35
AD5767
Data Sheet
TYPICAL PERFORMANCE CHARACTERISTICS
0.6
0.05
–20V TO 0V RANGE
–16V TO 0V RANGE
–10V TO 0V RANGE
0.5
0.03
DNL ERROR (LSB)
0.4
0.3
0.2
0.1
0
–0.1
0.02
0.01
0
–0.01
–0.02
–0.03
AVDD/AVSS = RANGE ± 2V
AVCC = 3.3V
TA = 25°C
–0.3
0
500
1000
1500
–20V TO 0V RANGE
–16V TO 0V RANGE
–10V TO 0V RANGE
–0.04
2000
2500
3000
3500
4000
CODE
–0.05
15145-107
–0.2
0
500
1000
1500
2000
2500
3000
3500
4000
CODE
Figure 7. INL Error vs. DAC Code (Unipolar Output)
15145-110
INL ERROR (LSB)
AVDD/AVSS = RANGE ± 2V
AVCC = 3.3V
TA = 25°C
0.04
Figure 10. DNL Error vs. DAC Code (Unipolar Outputs)
0.8
0.6
AVDD/AVSS = RANGE ± 2V
AVCC = 3.3V
TA = 25°C
0.5
0.6
0.4
INL ERROR (LSB)
0.2
0.1
0
500
1000
1500
2000
0
–0.4
–0.3
0
2500
3000
3500
4000
CODE
–0.6
–40
20
40
60
80
100
0.06
0.04
0.03
DNL ERROR (LSB)
0.02
0.01
0
–0.01
–0.02
–0.03
0.02
AVDD/AVSS = RANGE ± 2V
AVCC = 3.3V
±5V RANGE
MIN INL
MAX INL
0
–0.02
–0.05
0
500
1000
1500
2000
–10V TO +6V RANGE
–12V TO +14V RANGE
2500
3000
3500
CODE
4000
Figure 9. DNL Error vs. DAC Code (Bipolar Outputs)
–0.06
–40
–20
0
20
40
60
TEMPERATURE (°C)
Figure 12. DNL Error vs. Temperature
Rev. A | Page 14 of 35
80
100
15145-112
–0.04
±5V RANGE
±10V RANGE
–16V TO +10V RANGE
–0.04
15145-109
DNL ERROR (LSB)
0
Figure 11. INL Error vs. Temperature
AVDD/AVSS = RANGE ± 2V
AVCC = 3.3V
TA = 25°C
0.04
–20
TEMPERATURE (°C)
Figure 8. INL Error vs. DAC Code (Bipolar Outputs)
0.05
AVDD/AVSS = RANGE ± 2V
AVCC = 3.3V
±5V RANGE
MIN INL
MAX INL
15145-111
–0.2
0.2
–0.2
±5V RANGE
–16V TO +10V RANGE
–12V TO +14V RANGE
–10V TO +10V RANGE
–10V TO +6V RANGE
–0.1
15145-108
INL ERROR (LSB)
0.4
0.3
Data Sheet
AD5767
0.10
–19.0
–19.5
AVDD/AVSS = RANGE ± 2V
AVCC = 3.3V
±5V RANGE
AVDD/AVSS = RANGE ± 2V
AVCC = 3.3V
0.09
–20.5
–21.0
–21.5
0.07
0.06
0.05
0.04
0.03
0.02
–20V TO 0V RANGE
–16V TO 0V RANGE
–10V TO +6V RANGE
–10V TO 0V RANGE
±5V RANGE
±10V RANGE
–12V TO +14V AND –16V TO +10V RANGE
–22.0
0.01
–20
0
20
40
60
80
100
TEMPERATURE (°C)
0
–40
15145-115
–22.5
–40
Figure 13. Zero-Scale Error vs. Temperature
–20
0
20
40
60
TEMPERATURE (°C)
80
100
15145-118
–20.0
GAIN ERROR (% FSR)
ZERO-SCALE ERROR (mV)
0.08
Figure 16. Gain Error vs. Temperature
0.020
15
5
0.015
OFFSET ERROR (mV)
0.010
AVDD/AVSS = RANGE ± 2V
AVCC = 3.3V
0
20
40
60
–15
AVDD/AVSS = RANGE ± 2V
AVCC = 3.3V
–25
80
100
TEMPERATURE (°C)
–30
–40
15145-116
–20
–10
–20
–10V TO +6V RANGE
±5V RANGE
±10V RANGE
–12V TO +14V AND –16V TO +10V RANGE
0
–40
–20V TO 0V RANGE
–16V TO 0V RANGE
–10V TO +6V RANGE
–10V TO 0V RANGE
±5V RANGE
±10V RANGE
–12V TO +14V AND –16V TO +10V RANGE
–5
TOTAL UNADJUSTED ERROR (% FSR)
0.16
0.14
0.12
0.10
0.08
0.06
–20V TO 0V RANGE
–10V TO 0V RANGE
±5V RANGE
–12V TO +14V AND –16V TO
–20
0
20
–16V TO 0V RANGE
–10V TO +6V RANGE
±10V RANGE
+10V RANGE
40
60
80
TEMPERATURE (°C)
100
15145-117
FULL-SCALE ERROR (% FSR)
40
60
80
100
0.25
AVDD/AVSS = RANGE ± 2V
AVCC = 3.3V
0.18
0
–40
20
Figure 17. Offset Error vs. Temperature
0.20
0.02
0
TEMPERATURE (°C)
Figure 14. Bipolar Zero Error vs. Temperature
0.04
–20
15145-119
0.005
0
AVDD/AVSS = RANGE ± 2V
AVCC = 3.3V
0.20
0.15
0.10
0.05
–20V TO 0V RANGE
–16V TO 0V RANGE
–10V TO +6V RANGE
–10V TO 0V RANGE
±5V RANGE
±10V RANGE
–12V TO 14V AND –16V TO +10V RANGE
0
–0.05
–0.10
–40
–20
0
20
40
60
TEMPERATURE (°C)
80
Figure 18. Total Unadjusted Error vs. Temperature
Figure 15. Full-Scale Error vs. Temperature
Rev. A | Page 15 of 35
100
15145-120
BIPOLAR ZERO ERROR (V)
10
AD5767
Data Sheet
0.05
6
±5V RANGE
AVDD/AVSS = RANGE ± 2V
AVCC = 3.3V
TA = 25°C
4
±5V RANGE
AVDD/AVSS = RANGE ± 2V
AVCC = 3.3V
0.04
0.03
0.02
0.01
0
VOUT (V)
VOUT (V)
2
0
–2
–0.01
–0.02
–0.03
–0.04
–0.05
–0.06
–0.07
–4
–0.08
0
10
20
30
40
50
TIME (µs)
15145-124
–10
–0.10
–20
Figure 19. Full-Scale Settling Time (Rising Voltage Step)
–10
0
10
20
30
40
50
60
TIME (µs)
15145-130
10nF
1nF
–0.09
–6
–20
Figure 22. Output Voltage vs. Settling Time at Various Capacitive Loads
6
0.00008
±5V RANGE
AVDD/AVSS = RANGE ± 2V
AVCC = 3.3V
TA = 25°C
4
±5V RANGE
MIDSCALE CODE
0.00006
0.00004
0.00002
VOUT (V)
VOUT (V)
2
0
0
–2
–0.00002
–4
–10
0
10
20
30
40
50
TIME (µs)
Figure 20. Full-Scale Settling Time (Falling Voltage Step)
–0.00006
0
2
3
4
5
6
7
8
9
10
TIME (µs)
Figure 23. Peak to Peak Noise (0.1 Hz to 10 Hz Bandwidth) with Dither Disabled
20
15
1
15145-131
–6
–20
15145-125
–0.00004
3000
AVDD/AVSS = RANGE ± 2V
AVCC = 3.3V
TA = 25°C
±5V RANGE
MIDSCALE CODE
2500
10
NSD (nV/√Hz)
0
1500
1000
–5
–12V TO +14V
–20V TO 0V
–15
–0.06
–0.04
–0.02
0
0.02
0.04
0.06
VOUT CURRENT OUTPUT (A)
500
0
10
100
1k
10k
FREQUENCY (Hz)
Figure 24. Noise Spectral Density (NSD) vs. Frequency
Figure 21. Source and Sink Capability of Output Amplifier
Rev. A | Page 16 of 35
100k
15145-132
–10
15145-126
VOUT (V)
2000
5
Data Sheet
AD5767
14
5
AVDD/AVSS = RANGE ± 2V
AVCC = 3.3V
TA = 25°C
4
12
3
10
0
–1
8
6
–2
±5V RANGE
–10 V TO 0 V RANGE
–10 V TO +6 V RANGE
–16 V TO 0V RANGE
±10 V RANGE
–20 V TO 0V RANGE
–12V TO +14V RANGE
–16V TO +10V RANGE
4
–3
2
–4
5
10
20
30
40
50
60
TIME (µs)
0
1.7 1.9 2.1 2.3 2.5 2.7 2.9 3.1 3.3 3.5 3.7 3.9 4.1 4.3 4.5 4.7 4.9 5.1 5.3 5.5
15145-134
–5
VLOGIC (V)
Figure 25. Digital Feedthrough for WLCSP Package
Figure 28. Logic Current (ILOGIC) vs. Logic Input Voltage (VLOGIC)
–9.3
–9.5
–9.7
8
AVDD/AVSS = RANGE ± 2V
AVCC = 3.3V
TA = 25°C
6
4
–9.9
2
–101
AICC (mA)
VOUTx (mV)
15145-138
1
ILOGIC (nA)
VOUTx (mV)
2
–10.3
–10.5
0
AIDD
AISS
AICC
–2
–10.7
–4
–10.9
–6
–11.1
27
28
29
30
31
32
33
34
TIME (µs)
15145-026
–11.5
26
–10
–40
Figure 26. Digital Feedthrough for LFCSP Package
0
–20
60
20
40
TEMPERATURE (°C)
80
100
15145-139
–8
–11.3
Figure 29. Supply Current in Normal Mode (AICC) vs. Temperature
4.1
550
500
4.0
450
±5V RANGE
–16 TO 0V RANGE
–12V TO +14V RANGE
–10V TO 0V RANGE
±10V RANGE
–16 TO +10V RANGE
–10V TO +6V RANGE
–20V TO 0V RANGE
400
350
AICC (µA)
AICC (mA)
3.9
3.8
300
250
200
3.7
150
100
3.6
4.0
4.5
AVCC (V)
5.0
5.5
0
3.0
15145-136
3.5
Figure 27. Supply Current in Normal Mode (AICC) vs. Supply Voltage (AVCC)
3.5
4.0
4.5
AVCC (V)
5.0
5.5
15145-143
50
3.5
3.0
Figure 30. Supply Current in Power-Down Mode (AICC) v s. Supply Voltage
(AVCC)
Rev. A | Page 17 of 35
AD5767
Data Sheet
DITHER
150
700
±5V RANGE
±5V RANGE
600
100
500
50
VOUT (µV)
VOUT (µV)
400
300
200
0
–50
100
–100
0
0
5
10
15
20
25
TIME (µs)
–200
15145-151
–200
Figure 31. Transient on Dither Selected Channel (Dither Enabled)
0
5
10
15
20
25
TIME (µs)
15145-154
–150
–100
Figure 34. Transient on Nondither Selected Channel (Dither Disabled)
150
650
±5V RANGE
±5V RANGE
550
100
450
50
VOUT (µV)
VOUT (µV)
350
0
250
150
–50
50
–100
0
5
10
15
20
25
TIME (µs)
–150
–0.3
15145-152
–150
0
0.3
0.6
0.9
1.2
1.5
TIME (µs)
Figure 32. Transient on Nondither Selected Channel (Dither Enabled)
15145-155
–50
Figure 35. Dither DC Shift
0
200
±5V RANGE
–0.5
150
50
0
–1.5
–2.0
–2.5
–3.0
–3.5
–4.0
–50
–4.5
–100
0
5
10
15
20
25
TIME (µs)
15145-153
VOUT (µV)
100
Figure 33. Transient on Dither Selected Channel (Dither Disabled)
–5.0
1k
±5V RANGE
–10V TO 0V RANGE
AVDD/AVSS = RANGE ± 2V
AVCC = 5V
DITHER SIGNAL: 0.25mV p-p
10k
100k
1M
FREQUENCY (Hz)
Figure 36. Dither Input to DAC Output Attenuation vs. Frequency
(±5 V Range and −10 V to 0 V Range)
Rev. A | Page 18 of 35
15145-158
ATTENUATION (dB)
–1.0
AD5767
0
–0.5
–0.5
–1.0
–1.0
–1.5
–1.5
–2.0
–2.5
–3.0
–4.0
–4.5
–5.0
1k
±10V RANGE
–20V TO 0V RANGE
100k
1M
–1.5
THD (dB)
–2.0
–2.5
–3.0
–10V TO +6V RANGE
–16V TO 0V RANGE
AVDD/AVSS = RANGE ± 2V
AVCC = 5V
DITHER SIGNAL: 0.25mV p-p
100k
1M
FREQUENCY (Hz)
15145-160
ATTENUATION (dB)
–1.0
10k
100k
1M
Figure 39. Dither Input to DAC Output Attenuation vs. Frequency
(−12 V to +14 V Range and −16 V to +10 V Range)
–0.5
–5.0
1k
10k
FREQUENCY (Hz)
0
–4.5
AVDD/AVSS = RANGE ± 2V
AVCC = 5V
DITHER SIGNAL: 0.25mV p-p
–5.0
1k
Figure 37. Dither Input to DAC Output Attenuation vs. Frequency
(±10 V Range and −20 V to 0 V Range)
–4.0
–12V TO +14V RANGE
–16V TO +10V RANGE
–3.5
–4.5
FREQUENCY (Hz)
–3.5
–3.0
–4.0
AVDD/AVSS = RANGE ± 2V
AVCC = 5V
DITHER SIGNAL: 0.25mV p-p
10k
–2.5
Figure 38. Dither Input to DAC Output Attenuation vs. Frequency
(−10 V to +6 V Range and −16 V to 0 V Range)
0
±5V RANGE
–10
AVCC = 5V
–20
–30
–40
–50
–60
–70
–80
–90
–100
–110
–120
–130
–140
–150
–160
–170
–180
–190
100
1k
10k
100k
FREQUENCY (Hz)
Figure 40. Total Harmonic Distortion (THD) vs. Frequency
Rev. A | Page 19 of 35
15145-166
–3.5
–2.0
15145-161
ATTENUATION (dB)
0
15145-159
ATTENUATION (dB)
Data Sheet
AD5767
Data Sheet
TERMINOLOGY
Total Unadjusted Error (TUE)
Total unadjusted error is a measure of the output error taking
all the various errors into account, namely INL error, offset
error, gain error, and output drift over supplies, temperature,
and time. TUE is expressed in % FSR.
Relative Accuracy or Integral Nonlinearity (INL)
Relative accuracy or integral nonlinearity is a measurement of
the maximum deviation, in LSBs, from a straight line passing
through the endpoints of the DAC transfer function. Typical
INL error vs. DAC code plots are shown in Figure 7 and Figure 8.
Differential Nonlinearity (DNL)
Differential nonlinearity is the difference between the measured
change and the ideal 1 LSB change between any two adjacent
codes. A specified differential nonlinearity of ±1 LSB maximum
ensures monotonicity. This DAC is guaranteed monotonic by
design. Typical DNL error vs. DAC code plots are shown in
Figure 9 and Figure 10.
Zero-Scale Error
Zero-scale error is a measurement of the output error when
zero code (0x0000) is loaded to the DAC register. Zero code
error is expressed in mV.
Zero-Scale Error Temperature Coefficient
Zero code error drift is a measure of the change in zero code
error with a change in temperature. It is expressed in µV/°C.
Bipolar Zero Error
Bipolar zero error is the deviation of the analog output from the
ideal half-scale output of 0 V when the DAC register is loaded
with 0x2000.
Bipolar Zero Error Temperature Coefficient
Bipolar zero drift is a measure of the change in the bipolar zero
error with a change in temperature. It is expressed in µV/°C.
Gain Error
Gain error is a measure of the span error of the DAC. It is the
deviation in slope of the DAC transfer characteristic from the
ideal expressed as % FSR.
Gain Error Temperature Coefficient
Gain temperature coefficient is a measurement of the change in
gain error with changes in temperature. It is expressed in ppm
of FSR/°C.
Offset Error
Offset error is a measurement of the difference between VOUTx
(actual) and VOUTx (ideal), expressed in mV, in the linear region
of the transfer function. Offset error can be negative or positive.
Offset Error Drift
Offset error drift is a measurement of the change in offset error
with a change in temperature. It is expressed in µV/°C.
Dither DC Shift
Dither dc shift is a measurement of the dc voltage difference
between VOUTx (actual) and VOUTx (ideal) due to the coupling of
a dither tone to the analog output. It is expressed in LSB.
Dither Transient
Dither transient is the amplitude of the impulse injected into
the analog outputs due to the enabling or disabling of the dither
functionality on an output channel. The transients are measured
the selected output channel and the other nonselected channels.
It is specified in nV-sec.
DC Power Supply Rejection Ratio (PSRR)
PSRR indicates how the output of the DAC is affected by
changes in the supply voltage. PSRR is the ratio of the change in
VOUTx to a change in AVDD for a full-scale output of the DAC. It
is measured in V/V.
Output Voltage Settling Time
Output voltage settling time is the amount of time it takes for
the output of a DAC to settle to a specified level for a ¼ to ¾
full-scale input change and is measured from the rising edge
of SYNC.
Digital-to-Analog Glitch Impulse
Digital-to-analog glitch impulse is the impulse injected into the
analog output when the input code in the DAC register changes
state. It is normally specified as the area of the glitch in nV-sec,
and is measured when the digital input code is changed by 1 LSB at
the major carry transition (0x7FF to 0x800 for the AD5767).
Digital Feedthrough
Digital feedthrough is a measure of the impulse injected into
the analog output of the DAC from the digital inputs of the
DAC, but is measured when the DAC output is not updated. It
is specified in nV-sec, and measured with a full-scale code change
on the data bus, that is, from all 0s to all 1s and vice versa.
DC Crosstalk
DC crosstalk is the dc change in the output level of one DAC in
response to a change in the output of another DAC. It is
measured with a full-scale output change on one DAC (or
power-down and power-up) while monitoring another DAC
maintained at midscale. It is expressed in μV.
DC crosstalk due to load current change is a measure of the
impact that a change in load current on one DAC has to
another DAC kept at midscale. It is expressed in μV/mA.
Digital Crosstalk
Digital crosstalk is the glitch impulse transferred to the output
of one DAC at midscale in response to a full-scale code change
(all 0s to all 1s and vice versa) in the input register of another
DAC. It is measured in standalone mode and is expressed in
nV-sec.
Rev. A | Page 20 of 35
Data Sheet
AD5767
Analog Crosstalk
Analog crosstalk is the glitch impulse transferred to the output
of one DAC due to a change in the output of another DAC. It is
measured by loading one of the input registers with a full-scale
code change (all 0s to all 1s and vice versa), then executing a
software LDAC command (see Table 18), and monitoring the
output of the DAC whose digital code was not changed. The
area of the glitch is expressed in nV-sec.
DAC-to-DAC Crosstalk
DAC-to-DAC crosstalk is the glitch impulse transferred to the
output of one DAC due to a digital code change and subsequent
analog output change of another DAC. It is measured by
loading the attack channel with a full-scale code change (all 0s
to all 1s and vice versa), using the write to and update commands
while monitoring the output of the victim channel that is at
midscale. The energy of the glitch is expressed in nV-sec.
Output Noise Spectral Density
Output noise spectral density is a measurement of the internally
generated random noise. Random noise is characterized as a
spectral density (nV/√Hz). It is measured by loading the DAC
to midscale and measuring noise at the output. It is measured
in nV/√Hz.
Rev. A | Page 21 of 35
AD5767
Data Sheet
THEORY OF OPERATION
DIGITAL-TO-ANALOG CONVERTER
The AD5767 is a 16-channel, 12-bit, serial input, voltage output
DAC capable of providing multiple output ranges with ±20 mA
output current capability. The available ranges are as follows:
•
•
•
•
•
•
•
•
The input coding to the DAC is straight binary, the ideal output
voltage is given by
D
VOUT = Span × + V MIN
N
where:
Span is the full extent of the DAC output voltage range from the
minimum to the maximum limit.
D is the decimal equivalent of the binary code that is loaded to
the DAC register.
N is 4096 for the 12-bit version.
VMIN is the lowest voltage of the span.
−20 V to 0 V
−16 V to 0 V
−10 V to 0 V
−10 V to +6 V
−12 V to +14 V
−16 V to +10 V
±5 V
±10 V
RESISTOR STRING
The devices operate from four supply voltages: AVCC, AVDD,
AVSS, and VLOGIC. AVCC is the power supply input voltage for the
DACs and other low voltage circuitry, whereas AVDD and AVSS
are the positive and negative analog supplies for the output
amplifiers. The output amplifiers require +2 V of headroom and
−2 V of footroom. Table 8 shows the power supply requirements
for the selected output range. VLOGIC defines the logic levels for
the digital input and output signals.
The resistor string section is shown in Figure 42. It is a
simplified resistor string structure, each of Value R. The digital
code loaded to the DAC register determines at which node on
the string the voltage is connected to be fed into the output
amplifier. The voltage is tapped off by closing one of the
switches connecting the string to the amplifier. Because a string
of resistors is used, the DAC is guaranteed to be monotonic.
R
Table 8. Power Supply Requirements for the Selected Output
Range
AVSS Maximum (V)
−22
−18
−12
−12
−14
−18
−7
−12
R
AVDD Minimum (V)
2.97
2.97
2.97
8
16
12
7
12
R
R
DAC ARCHITECTURE
The architecture of one DAC channel consists of a resistor
string DAC followed by an output buffer amplifier. The voltage
at the VREF pin provides the reference voltage for the all DAC
channels. Figure 41 shows a block diagram of the DAC
architecture.
VREF
REFERENCE
BUFFER
DAC
REGISTER
RESISTOR
STRING
VOUTX
OUTPUT
BUFFER AMPLIFIER
Figure 42. Resistor String
POWER-ON RESET (POR)
The AD5767 contains a POR circuit that controls the output
voltage during power-up. The AD5767 outputs are clamped to
GND at power-up and remain powered up at this level until a
valid write sequence is made to the span register to configure
the output range of the DAC. A software executable reset
function resets the DAC to the power-up state. Command 0111
is reserved for this reset function (see Table 27). A minimum
time is required between a reset and a successful write (see the
timing characteristics in Table 3).
15145-068
INPUT
REGISTER
TO OUTPUT
AMPLIFIER
R
15145-069
Range (V)
−20 to 0
−16 to 0
−10 to 0
−10 to +6
−12 to +14
−16 to +10
−5 to +5
−10 to +10
Figure 41. DAC Architecture
Rev. A | Page 22 of 35
Data Sheet
AD5767
DITHER
D19 to D16 must be set to 0000, whereas a dither block powerdown per channel function requires D19 to D16 to be set to
0001 (see Table 23). Table 25 shows how the state of the Bit D16
corresponds to the mode of operation of the device. Any or all
DACs can be powered down to the selected mode by setting the
corresponding 16 bits (D15 to D0) to 1.
External dither signals can be coupled onto any DAC output by
writing the appropriate value to the dither registers. The dither
signals are applied to the N0 and N1 input pins (see Figure 43).
If dither is not required, connect these pins to AGND. The
dither signals amplitude have a maximum peak-to-peak voltage
(ac voltage) of 0.25 V p-p, and the absolute input voltage (ac
and dc voltage) must not exceed the range of 0 V to AVCC. The
dither signals can be attenuated and/or inverted internally on a
per channel basis if required. Dither signals in the range of 10
kHz to 100 kHz can be applied to the dither input pins. Due to
the nature of the internal dither circuitry, the dc value of the
output can shift (see Table 1). For the recommended configuration
of the dither functionality, see the Applications Information
section.
To save on power consumption, it is recommended to place all
unused DAC channels in power-down mode after all channels
are enabled via the span register.
Ensure that all channels are powered up before writing to the
span register.
MONITOR MUX
The AD5767 contains a channel monitor function that consists
of an analog multiplexer addressed via the serial interface,
allowing any channel output to be routed to the common
MUX_OUT pin for external monitoring.
POWER-DOWN MODE
The AD5767 contains two separate power-down modes of
operation, a channel output power-down mode and a dither
block power-down mode per channel. Command 0101 is
reserved for the power-down function (see Table 9). These two
power-down modes are software-programmable by setting four
bits, Bit D19 to Bit D16, in the power control register. To
address the power-down operation for DAC channel output,
Because the MUX_OUT pin is not buffered, the amount of
current drawn from this pin creates a voltage drop across the
switches, which in turn leads to an error in the voltage being
monitored. Therefore, the MUX_OUT pin must be connected
to only high impedance inputs or externally buffered.
VDAC0
V
DAC 0
SELECT N0/N1/NO
DITHER SIGNAL
DITHER SCALE
V
100%
N0
BAND-PASS
FILTER
INVERT DITHER
VDAC0
VAC p-p
t
INVERTED SIGNAL
75%
50%
NOT INVERTED SIGNAL
25%
VN0p-p
t
DITHER SCALE
V
100%
INVERT DITHER
INVERTED SIGNAL
75%
N1
BAND-PASS
FILTER
50%
NOT INVERTED SIGNAL
15145-071
25%
VN1p-p
t
Figure 43. Dither Signal Generation
Rev. A | Page 23 of 35
AD5767
Data Sheet
SERIAL INTERFACE
Daisy-Chain Operation
The AD5767 4-wire (SYNC, SCLK, SDI, and SDO) interface is
compatible with SPI, QSPI, and MICROWIRE interface
standards as well as most digital signal processors (DSPs). The
write sequence begins after bringing the SYNC line low,
maintaining this line low until the complete data-word is loaded
from the SDI pin. Data is loaded into the AD5767 at the SCLK
falling edge transition (see Figure 2). When a rising edge is
detected on SYNC, the serial data-word is decoded according to
the instructions in Table 9. The command must be a multiple of
24; otherwise, the device ignores the command. The AD5767
contains an SDO pin to allow the user to daisy-chain multiple
devices together or to read back the contents of the status
register.
Daisy chaining minimizes the number of port pins required
from the controlling IC. As shown in Figure 44, the SDO pin of
one package must be tied to the SDI pin of the next package. To
enable daisy-chain mode, the DC_EN bit in Table 14 must be
high. When two AD5767 devices are daisy-chained, 48 bits of
data are required. The first 24 bits are assigned to U2, and the
second 24 bits are assigned to U1, as shown in Figure 44. Keep the
SYNC pin low until all 48 bits are clocked into their respective
serial registers.
The SYNC pin is then pulled high to complete the operation.
To prevent data from mislocking (for example, due to noise) the
device includes an internal counter; if the SCLK falling edges
count is not a multiple of 24, the device ignores the command.
A valid clock count is 24, 48, 72, and so on. The counter resets
when SYNC returns high.
Readback Operation
The contents of the status registers can be read back via the
SDO pin. Figure 4 shows how the registers are decoded. After a
register has been addressed for a read, the next 24 clock cycles
clock the data out on the SDO pin. The clocks must be applied
while SYNC is low. For a read of a single register, the no
operation (NOP) function clocks out the data. Alternatively, if
more than one register is to be read, the data of the first register
to be addressed clocks out at the same time that the second
register to be read is being addressed.
Daisy-chain mode is disabled by default and is enabled using
the daisy-chain control register (see Table 14).
AD5767
MOSI
SDI
U1 SDO
AD5767
SDI
U2 SDO
MICROCONTROLLER
SS
SYNC
SCLK
SYNC
SCLK
15145-070
MISO SCLK
Figure 44. Daisy-Chain Block Diagram
Rev. A | Page 24 of 35
Data Sheet
AD5767
REGISTER DETAILS
INPUT SHIFT REGISTER
The input shift register of the AD5767 is 24 bits wide. Data is loaded MSB first (D23). The first four bits are the command bits, C3 to C0
(see Figure 45), followed by the 4-bit DAC address bits (see Table 10), and finally the data bits. The 24-bit data-word is transferred to the
input register on the 24 falling edges of SCLK and are updated on the rising edge of SYNC.
D23 (MSB)
C3
D0 (LSB)
C2
C1
C0
A3
A2
A1
A0
D15
D14
D13
D12
D11
D10
D9
D8
D7
D6
D5
D4
D3
D2
D1
D0
COMMAND BITS
15145-072
DATA BITS
ADDRESS BITS
Figure 45. Input Shift Register Content
Table 9. Command Definitions 1
C3
0
C2
0
C1
0
C0
0
A3
0
A2
0
A1
0
A0
0
Name
NOP/monitor mux control
0
0
0
0
0
0
0
1
Daisy-chain mode
0
0
0
1
A3 2
A22
A12
A02
Write to DACx input register
0
0
1
0
A32
A22
A12
A02
0
0
1
1
X
X
X
X
Write to input register and
DAC register
Software load DAC (LDAC)
0
0
1
1
0
0
0
1
X
0
X
0
X
0
X
0
0
1
0
1
0
0
0
1
0
1
1
0
X
X
X
X
0
1
1
0
1
0
1
0
0
A32
0
A22
0
A12
0
A02
1
0
0
1
X
X
X
X
1
0
1
0
X
X
X
X
1
1
0
0
X
X
X
X
1
1
0
1
X
X
X
X
1
0
1
1
X
X
X
X
Apply N0 or N1 dither signal
to DACs (DAC 7 to DAC 0)
Apply N0 or N1 dither signal
to DACs (DAC 15 to DAC 8)
Dither scale (DAC 7 to
DAC 0)
Dither scale (DAC 15 to
DAC 8)
Invert dither
1
1
1
1
1
1
0
1
X
X
X
X
X
X
X
X
Reserved
Reserved
1
2
Span
Power control (DAC
channel)
Power control (dither)
Write input data to all DAC
registers
Software full reset
Select register for readback
X means don’t care.
See Table 10 for the address bit setting.
Rev. A | Page 25 of 35
Description
No operation (all zeros register). Monitor mux control
register (D4 = 1) determines whether a DAC output or no
output is switched out on the MUX_OUT pin.
Enables/disables the SDO output buffer for daisy-chain
mode.
Writes data to the input register for the selected DAC
channel.
Writes data to the input register and DAC register for the
selected DAC channel.
Updates the selected DAC register with data from the
corresponding input register.
Selects the output span of the AD5767.
Powers up/down selected DAC outputs of individual DAC
channels.
Powers up/down dither functionality of individual DAC
channels.
Writes data to input registers and DAC registers for all DAC
channels.
Writing 0x1234 to this register resets the AD5767.
Selects the register to read back for a selected DAC
channel.
Selects whether dither on N0, dither on N1, or no dither is
applied to each DAC output.
Selects whether dither on N0, dither on N1, or no dither is
applied to each DAC output.
Scales the dither signal applied to the selected DAC
outputs.
Scales the dither signal applied to the selected DAC
outputs.
Inverts the dither signal applied to the selected DAC
outputs.
Not applicable.
Not applicable.
AD5767
Data Sheet
Table 10 shows the DAC x address commands. For applications using the WLCSP package that do not require all 16 channels, do not use
Channel 8 because it is more sensitive to crosstalk and digital feedthrough.
Table 10. DAC x Address Commands
Address
A3
0
0
0
0
0
0
0
0
1
1
1
1
1
1
1
1
A2
0
0
0
0
1
1
1
1
0
0
0
0
1
1
1
1
A1
0
0
1
1
0
0
1
1
0
0
1
1
0
0
1
1
A0
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Selected DAC
DAC 0
DAC 1
DAC 2
DAC 3
DAC 4
DAC 5
DAC 6
DAC 7
DAC 8
DAC 9
DAC 10
DAC 11
DAC 12
DAC 13
DAC 14
DAC 15
MONITOR MUX CONTROL
The monitor mux control command determines whether one of the DAC outputs or none is switched out on the MUX_OUT pin
depending on the desired D[4:0] value. To assert the no operation command, write all zeros to the D15 to D0 bits.
Table 11. Monitor Mux Control Register
D23
0
D22
0
D21
0
D20
0
D19
0
D18
0
D17
0
D16
0
D15 to D5
Don’t care
Table 12. Output Voltage Selection from Mux
0
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
1
VOUT_SEL, Bits[4:0] 1
X
X
X
0
0
0
0
0
0
0
0
1
0
0
1
0
1
0
0
1
0
0
1
1
0
1
1
1
0
0
1
0
0
1
0
1
1
0
1
1
1
0
1
1
0
1
1
1
1
1
1
X
0
1
0
1
0
1
0
1
0
1
0
1
0
1
0
1
Mux Output
No output is switched out
VOUT0
VOUT1
VOUT2
VOUT3
VOUT4
VOUT5
VOUT6
VOUT7
VOUT8
VOUT9
VOUT10
VOUT11
VOUT12
VOUT13
VOUT14
VOUT15
X means don’t care.
Rev. A | Page 26 of 35
D4 to D0
VOUT_SEL
Data Sheet
AD5767
NO OPERATION
Writing all zeros does not vary the state of the device.
Table 13. No Operation Register
D23
0
D22
0
D21
0
D20
0
D19
0
D18
0
D17
0
D16
0
D15 to D0
0000 0000 0000 0000
DAISY-CHAIN MODE
To use the daisy-chain mode, enable the DC_EN bit in the daisy-chain control register. This bit is linked to the internal SDO buffer. If the
functionality is not required, set the DC_EN bit to 0 to save the power consumed by the SDO buffer.
Table 14. Daisy-Chain Control Register
D23
0
D22
0
D21
0
D20
0
D19
0
D18
0
D17
0
D16
1
D15 to D1
Don’t care
D0
DC_EN
Table 15. Daisy-Chain Enable/Disable Bit description
DC_EN
0
1
Description
Daisy chain disabled (default)
Daisy chain enabled
WRITE AND UPDATE COMMANDS
Write to DAC x Input Register
This command allows the user to write to the dedicated input register of each DAC individually. The output of the DAC does not change
its value until a write to the software LDAC register occurs with the appropriate bit set to include the addressed channel in the update.
Table 16. Write to DAC x Input Register
D23
0
D22
0
D21
0
D20
1
D19 to D16
DAC x address (see Table 10)
D15 to D4
Input register data
D3 to D0
Do not care
Write to Input Register and DAC Register
This command writes directly to the selected DAC register and updates the output accordingly.
Table 17. Write to DACx Input and DAC Register
D23
0
D22
0
D21
1
D20
0
D19 to D16
DAC x address (see Table 10)
D15 to D4
Input register data
D3 to D0
Do not care
Software LDAC Register
This command copies data from the selected input registers to the corresponding DAC registers and the outputs update accordingly.
Table 18. Software LDAC Register
D23
0
D22
0
D21
1
D20
1
D19 to D16
Do not care
D15 to D0
LDAC (bit for each channel)
Table 19. LDAC Bit Description
LDAC
0
1
Description
Do not update channel
Update channel
Rev. A | Page 27 of 35
AD5767
Data Sheet
SPAN REGISTER
This register selects the output span of the AD5767. See Table 21 and Table 22. Always issue a software reset before writing to the span
register.
Table 20. Span Register
D23
0
D22
1
D21
0
D20
0
D19 to D5
Do not care
D4 to D3
P[1:0] (power-up condition)
D2 to D0
S[2:0] (span)
Table 21. Span Selection
S2
0
0
0
0
1
1
1
1
S1
0
0
1
1
0
0
1
1
S0
0
1
0
1
0
1
0
1
Output Voltage Range
−20 V to 0 V
−16 V to 0 V
−10 V to 0 V
−12 V to +14 V
−16 V to +10 V
−10 V to +6 V
−5 V to +5 V
−10 V to +10 V
Table 22. Power-Up Condition Selection
P1
0
0
1
P0
0
1
Don’t care
Power-Up Condition
Zero scale
Midscale
Full scale
POWER CONTROL REGISTER
The power control register powers up or powers down individual DACs and their associated amplifiers. It is recommended to power
down any unused channels during the first write to the AD5767.
The power control register with D[19:16] = 0001 powers up or powers down the dither functionality of the individual DACs.
Table 23. Power Control Register (DAC Control)
D23
0
D22
1
D21
0
D20
1
D19
0
D18
0
D17
0
D16
0
D15 to D0
Power-down bit for each channel output (for example, D15 = DAC 15, D8 = DAC 8,
and D0 = DAC 0)
D16
1
D15 to D0
Power-down bit for each channel dither block (for example, D15 = DAC 15, D8 =
DAC 8, and D0 = DAC 0)
Table 24. Power Control Register (Dither)
D23
0
D22
1
D21
0
D20
1
D19
0
D18
0
D17
0
Table 25. Power Control
D16
0
1
Operating Mode
Normal operation (default)
Powered down
Rev. A | Page 28 of 35
Data Sheet
AD5767
WRITE INPUT DATA TO ALL DAC REGISTERS
This command writes the data in D[15:0] to the DAC register of all DACs and sets all DAC outputs to the same value. For the AD5767 12bit resolution DAC, the data is written in D[15:4].
Table 26. Write Input Data to All DAC Registers
D23
0
D22
1
D21
1
D20
0
D19 to D16
Don’t care
D15 to D4
DAC register data
D3 to D0
Do not care
SOFTWARE FULL RESET
Writing 0x1234 initiates a reset routine, which returns the AD5767 to its power-on state.
Table 27. Software Full Reset Register
D23
0
D22
1
D21
1
D20
1
D19 to D16
0000
D15 to D12
0001
D11 to D8
0010
D7 to D4
0011
D3 to D0
0100
SELECT REGISTER FOR READBACK
This command selects which registers to read back (see Table 28). After issuing this command, the contents of the selected registers are
clocked out on the SDO on the next 24-bit frame (see Table 29).
Table 28. Initiate Readback Register
D23
1
D22
0
D21
0
D20
0
D19 to D16
DAC x address (see Table 10)
D15 to D0
Do not care
Table 29. Readback Data Register
D23
1
D22
0
D21
0
D20
0
D19 to D16
DAC x address
(see Table 10)
D15 to D10
000000
D9
Invert
dither
D8 to D7
Dither scale
Table 30. Readback Register Data Functions
Bit Name
Span S[2:0]
Description
Span register
D2
0
0
0
0
1
1
1
1
Reserved
D1
D0
Output Voltage Range
0
0
−20 V to 0 V
0
1
−16 V to 0 V
1
0
−10 V to 0 V
1
1
−12 V to +14 V
0
0
−16 V to +10 V
0
1
−10 V to +6 V
1
0
−5 V to +5 V
1
1
−10 V to +10 V
This is a reserved bit; ignore its contents
Power Down
D3
Power-down register
Dither Signal
D4
Operating Mode
0
Channel normal operation
1
Channel not powered down
Apply N0 or N1 dither signal to DACs register
D6
0
0
1
1
D5
0
1
0
1
Dither Setting
No dither applied
N0 dither applied
N1 dither applied
No dither applied
Rev. A | Page 29 of 35
D6 to D5
Dither
signal
D4
Power
down
D3
Reserved
D2 to D0
Span S[2:0]
AD5767
Data Sheet
Bit Name
Dither Scale
Description
Dither scale register
Invert Dither
D8
D7
Scaling Factor
0
0
No scaling
0
1
75% scaling
1
0
50% scaling
1
1
25% scaling
Invert dither register
D9
0
1
Dither Mode
Dither signal is not inverted
Dither signal is inverted
APPLY N0 OR N1 DITHER SIGNAL TO DACs REGISTER
These commands determine which dither signal, N0 or N1, is applied to the selected DACs. Couple the dither signals to the AD5767
outputs after the dither signals are configured and the clamp to ground is removed by writing to the span register. Refer to the
Applications Information section for a more information.
Table 31. Apply N0 or N1 Dither Signal to DACs Register (DAC 7 to DAC 0)
D23 to
D20
1001
D19 to D16
Do not care
D15 to D14
DAC 7
D13 to D12
DAC 6
D11 to D10
DAC 5
D9 to D8
DAC 4
D7 to D6
DAC 3
D5 to D4
DAC 2
D3 to D2
DAC 1
D1 to D0
DAC 0
D7 to D6
DAC 11
D5 to D4
DAC 10
D3 to D2
DAC 9
D1 to D0
DAC 8
Table 32. Apply N0 or N1 Dither Signal to DACs Register (DAC 15 to DAC 8)
D23 to
D20
1010
D19 to D16
Do not care
D15 to D14
DAC 15
D13 to D12
DAC 14
D11 to D10
DAC 13
D9 to D8
DAC 12
Table 33 shows the dither scaling setting using Bits[D15:D14] as an example. To apply the N0 dither to DAC 7 (see Table 31), set D15 to 0
and D14 to 1. The same dither selection settings apply to the other bits, Bits[D13:D12], Bits[D11:D10], Bits[D9:D8], Bits[D7:D6],
Bits[D5:D4], Bits[D3:D2], and Bits[D1:D0] in Table 31 and Table 32 .
Table 33. Dither Selection for DAC x (DAC 0 to DAC 15)
D15
0
0
1
1
D14
0
1
0
1
Dither Setting
No dither applied
N0 dither signal applied
N1 dither signal applied
No dither applied
Rev. A | Page 30 of 35
Data Sheet
AD5767
DITHER SCALE
This command scales the dither before it is applied to the selected channel.
Table 34. Dither Scaling Register (DAC 7 to DAC 0)
D23 to
D20
1100
D19 to D16
Do not care
D15 to D14
DAC 7
D13 to D12
DAC 6
D11 to D10
DAC 5
D9 to D8
DAC 4
D7 to D6
DAC 3
D5 to D4
DAC 2
D3 to D2
DAC 1
D1 to D0
DAC 0
D11 to D10
DAC 13
D9 to D8
DAC 12
D7 to D6
DAC 11
D5 to D4
DAC 10
D3 to D2
DAC 9
D1 to D0
DAC 8
Table 35. Dither Scaling Register (DAC 15 to DAC 8)
D23 to
D20
1101
D19 to D16
Do not care
D15 to D14
DAC 15
D13 to D12
DAC 14
Table 36 shows the dither scaling setting using Bits[D15:D14] as an example. To apply 25% scaling to DAC 7 (see Table 34), set D15 to 1
and D14 to 1. The same dither scaling settings apply to the other bits, Bits[D13:D12], Bits[D11:D10], Bits[D9:D8], Bits[D7:D6],
Bits[D5:D4], Bits[D3:D2], and Bits[D1:D0] in Table 31 and Table 32 .
Table 36. Apply Dither Signal to DAC x (DAC 0 to DAC 15)
D15
0
0
1
1
D14
0
1
0
1
Scaling Factor
No scaling
75% scaling
50% scaling
25% scaling
INVERT DITHER REGISTER
This command inverts the dither applied to the selected DACs when the appropriate bit is set to 0.
Table 37. Invert Dither Register
D23
1
D22
0
D21
1
D20
1
D19 to D16
Do not care
D15 to D0
Dx (invert dither bit for each channel)
Table 38. Invert Dither
Dx
0
1
Dither Mode
Dither signal is not inverted (default)
Dither signal is inverted
Rev. A | Page 31 of 35
AD5767
Data Sheet
APPLICATIONS INFORMATION
The current required to supply 16 channels (output power) is
DITHER CONFIGURATION
The AD5767 contains two dither input pins to allow dither tone
signals to be coupled to any of the 16 DAC output channels.
Operate the AD5767 using the dither functionality to minimize
the transient amplitude seen on the DAC outputs when the
dither functionality is enabled or disabled. The recommended
configuration of the dither functionality is as follows:
1.
2.
3.
After the AD5767 powers up, the input dither signals must
be configured by writing to the dither scale register and the
invert dither register.
Configure the AD5767 in normal operating mode before
applying dither by programming the span register, allowing
the output clamp on the AD5767 to be removed.
Write to the apply N0 or N1 dither signal to DACs register
to couple the N0/N1 input dither signals to any DAC
output, VOUTx.
2 mA × 16 = 32 mA
The power required on the AVDD rail for the AD5767 to supply
the 16 channels and 6 mA typical supply current is
12 V × (32 mA + 6 mA) = 0.456 W
Next, add power dissipated by the AVSS, AVCC, and VLOGIC rails
(input power) as follows:
0.456 W + (−12 V × −9 mA) + (3.3 V × 8.3 mA) + (3.3 V ×
0.02 μA) = 0.59 W
To calculate the power dissipated by the AD5767, use the
following equation:
PDISS = Input Power − Output Power
For example,
0.59 W − (32 mA × 1 V) = 0.558 W
Enabling the dither feature on a channel can increase its
sensitivity to digital feedthrough.
Then, calculate the die temperature,
THERMAL CONSIDERATIONS
Using the following equation to calculate the maximum
permitted ambient temperature:
0.558 W × 53°C/W = 29.57°C
Up to ±20 mA can be sourced from each channel on the AD5767;
thus, it is important to understand the effects of power dissipation
on the package and its effects on junction temperature. The
internal junction temperature must not exceed 150°C. The
AD5767 is packaged in a 49-ball, 4 mm × 4mm WLCSP and a
40-lead 6mm x 6mm LFCSP package. The thermal impedance,
θJA, is specified in the Absolute Maximum Ratings section. It is
important that the device is not operated under conditions that
cause the junction temperature to exceed the maximum
temperature specified in the Absolute Maximum Ratings
section.
The Thermal Calculation Example (WLCSP) section details
how to calculate the die temperature and maximum permitted
ambient temperature. The quiescent current of the AVDD, AVSS,
AVCC, and VLOGIC pins must also be included in the calculation
of the junction temperature. These calculations use the typical
supply currents specified in Table 1.
Thermal Calculation Example (WLCSP)
For this thermal calculation example, all 16 channels are
enabled with the ±10 V output voltage range used. Each channel
is drawing 2 mA for a +1V output voltage.
TA MAX = TJ MAX − Die Temperature
For example,
150°C − 29.57° = 120°C
The θJA specification assumes that proper layout and grounding
techniques are followed to minimize power dissipation, as
outlined in the Layout Guidelines section
MICROPROCESSOR INTERFACING
Microprocessor interfacing to the AD5767 is via a serial bus that
uses a standard protocol compatible with DSPs and microcontrollers. The communications channel requires a 4-wire serial interface
consisting of a clock signal, a data input signal, a data output
signal, and a synchronization signal. The device requires a
24-bit data-word with data valid on the falling edge of SCLK.
AD5767 TO SPI INTERFACE
The SPI interface of the AD5767 is designed to be easily connected
to industry-standard DSPs and microcontrollers. Figure 46 shows
the AD5767 connected to the Analog Devices, Inc., ADSP-BF531
Blackfin® DSP. The Blackfin has an integrated SPI port that can
be connected directly to the SPI pins of the AD5767.
AVDD = Span + 2 V = 12 V
AVSS = Span – 2 V = −12 V
AVCC = VLOGIC = 3.3 V
where Span is the output voltage range, ±10 V.
Rev. A | Page 32 of 35
Data Sheet
AD5767
the supply line. Shield clocks and other fast switching digital
signals from other parts of the board by using a digital ground.
Avoid crossover of digital and analog signals if possible. When
traces cross on opposite sides of the board, ensure that they run
at right angles to each other to reduce feedthrough effects
through the board. The best board layout technique is the
microstrip technique, where the component side of the board is
dedicated to the ground plane only, and the signal traces are
placed on the solder side. However, this technique is not always
possible with a 2-layer board.
AD5767
SPISELx
SYNC
SCK
SCLK
MOSI
DIN
MISO
SDO
PF8
RESET
15145-073
ADSP-BF531
Figure 46. ADSP-BF531 SPI Interface
It is often useful to provide some heat sinking capability to
allow the power to dissipate easily.
LAYOUT GUIDELINES
In any circuit where accuracy is important, careful consideration
of the power supply and ground return layout helps to ensure
the rated performance. The PCB on which the AD5767 is
mounted must be designed so that the AD5767 lies on the
analog plane. Ensure that the board has separate analog and
digital sections. If the AD5767 is in a system where other
devices require an AGND to DGND connection, make the
connection at one point only. Keep this ground point as close as
possible to the AD5767.
For the WLCSP package, heat is transferred through the solder
balls to the PCB board. θJA thermal impedance is dependent on
board construction. More copper layers enable heat to be
removed more effectively.
The LFCSP package of the AD5767 has an exposed pad beneath
the device. Connect this pad to the AVSS supply of the device.
For optimum performance, use special consideration when
designing the motherboard and mounting the package. For
enhanced thermal, electrical, and board level performance,
solder the exposed pad on the bottom of the package to the
corresponding thermal land pad on the PCB. Design thermal
vias into the PCB land pad area to improve heat dissipation
further.
The AD5767 must have ample supply bypassing of 10 μF in
parallel with 0.1 μF on each supply, located as close to the
package as possible, ideally right up against the device. The
10 μF capacitors are the tantalum bead type. The 0.1 μF capacitor
must have low effective series resistance (ESR) and low effective
series inductance (ESI). Ceramic capacitors, for example, provide
a low impedance path to ground at high frequencies to handle
transient currents due to internal logic switching.
The AVSS plane on the device can be increased (as shown in
Figure 47) to provide a natural heat sinking effect.
Ensure that the power supply line has as large a trace as possible
to provide a low impedance path and reduce glitch effects on
BOARD
Figure 47. Exposed Pad Connection to Board
Rev. A | Page 33 of 35
15145-074
AVSS
PLANE
AD5767
Data Sheet
OUTLINE DIMENSIONS
4.000
3.960 SQ
3.920
7
5
6
3
4
2
1
A
BALL A1
IDENTIFIER
B
C
3.00 REF
SQ
D
E
F
G
0.50
BSC
BOTTOM VIEW
(BALL SIDE UP)
END VIEW
0.380
0.355
0.330
COPLANARITY
0.05
0.270
0.240
0.210
01-20-2017-B
0.340
0.320
0.300
SEATING
PLANE
Figure 48. 49-Ball Wafer Level Chip Scale Package [WLCSP]
(CB-49-4)
Dimensions shown in millimeters
DETAIL A
(JEDEC 95)
6.10
6.00 SQ
5.90
0.30
0.25
0.18
31
30
PIN 1
INDIC ATOR AREA OPTIONS
(SEE DETAIL A)
40
1
0.50
BSC
4.70
4.60 SQ
4.50
EXPOSED
PAD
TOP VIEW
0.80
0.75
0.70
SEATING
PLANE
END VIEW
0.45
0.40
0.35
10
11
21
20
0.05 MAX
0.02 NOM
COPLANARITY
0.08
0.203 REF
BOTTOM VIEW
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
COMPLIANT TO JEDEC STANDARDS MO-220-WJJD-5
Figure 49. 40-Lead Lead Frame Chip Scale Package [LFCSP]
(CP-40-7)
Dimensions shown in millimeters
Rev. A | Page 34 of 35
0.20 MIN
10-12-2016-A
PIN 1
INDICATOR
PKG-005131/005253
PKG-005027
0.650
0.595
0.540
TOP VIEW
(BALL SIDE DOWN)
Data Sheet
AD5767
ORDERING GUIDE
Model 1
AD5767BCBZ-RL7
AD5767BCPZ-RL7
EVAL-AD5767SD2Z
1
Resolution (Bits)
12
12
Temperature Range
−40°C to +105°C
−40°C to +105°C
Package Description
49-Ball Wafer Level Chip Scale Package [WLCSP]
40-Lead Lead Frame Chip Scale Package [LFCSP]
Evaluation Board
Z = RoHS Compliant Part.
©2017 Analog Devices, Inc. All rights reserved. Trademarks and
registered trademarks are the property of their respective owners.
D15145-0-4/17(A)
Rev. A | Page 35 of 35
Package Option
CB-49-4
CP-40-7