HMC598
v01.0809
FREQUency MULTIPLIERS - Active - CHIP
2
Typical Applications
Features
The HMC598 is ideal for:
High Output Power: +15 dBm
• Clock Generation Applications:
OC-768 & SDM STM-256
Low Input Power Drive: 0 to +6 dBm
• Point-to-Point & VSAT Radios
Fo Isolation: 25 dBc @ Fout = 30 GHz
Die Size: 2.07 x 1.86 x 0.1 mm
• Test Instrumentation
• Military & Space
Functional Diagram
General Description
The HMC598 is a x2 active broadband frequency
multiplier chip utilizing GaAs PHEMT technology.
When driven by a +5 dBm signal, the multiplier
provides +15 dBm typical output power from 22 to
46 GHz and the Fo and 3Fo isolations are 25 dBc
and 15 dBc respectively at 30 GHz. The HMC598 is
ideal for use in LO multiplier chains for Point to Point
and VSAT radios yielding reduced parts count versus
traditional design approaches.
Electrical Specifications
TA = +25°C, Vdd1, 2, 3 = +5V, Vgg1 = -1.25V, Vgg2 = -0.8V, 5 dBm Drive Level
Parameter
Min.
Typ.
Max.
Units
Frequency Range, Input
11 - 23
GHz
Frequency Range, Output
22 - 46
GHz
15
dBm
Fo Isolation (with respect to output level)
20
dBc
3Fo Isolation (with respect to output level)
10
dBc
4Fo Isolation (with respect to output level)
5
dBc
Input Return Loss
10
dB
Output Power
2-1
GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 22 - 46 GHz OUTPUT
10
Output Return Loss
13
dB
Supply Current (Idd Total)
175
mA
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
For price, 20
delivery,
andRoad,
to place
orders: Analog
Devices,
For price,
delivery
and
to place
Microwave
Corporation,
Alpha
Chelmsford,
MA
01824Inc.,
responsibility
is assumed
by Analog
Devices
for its use,orders:
nor for any Hittite
infringements
of patents or other
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
rights of third parties that may result from its use. Specifications subject to change without notice. No
Phone: 978-250-3343
Fax: 978-250-3373
Order
On-line at www.hittite.com
Phone: 781-329-4700
• Order online at www.analog.com
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Application
Support: Phone: 1-800-ANALOG-D
Trademarks and registered trademarks are
the property of their
respective owners.
Application
Support:
Phone: 978-250-3343
or apps@hittite.com
HMC598
v01.0809
GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 22 - 46 GHz OUTPUT
Output Power vs.
Temperature @ 5 dBm Drive Level
Output Power vs. Drive Level
20
15
10
+25 C
+85 C
-55 C
5
0
2
15
10
0 dBm
+3 dBm
+5 dBm
+8 dBm
+10 dBm
5
0
14
18
22
26
30
34
38
42
46
14
18
22
26
FREQUENCY (GHz)
Output Power vs.
Supply Voltage @ 5 dBm Drive Level
34
38
42
46
Isolation @ 5 dBm Drive Level
20
OUTPUT POWER (dBm)
20
OUTPUT POWER (dBm)
30
FREQUENCY (GHz)
15
10
+4.5V
+5V
+5.5V
5
10
F0
2F0
3F0
4F0
0
-10
-20
-30
0
14
18
22
26
30
34
38
42
14
46
18
22
26
30
34
38
42
46
FREQUENCY (GHz)
FREQUENCY (GHz)
Output Power vs. Input Power
OUTPUT POWER (dBm)
20
FREQUency MULTIPLIERS - Active - CHIP
OUTPUT POWER (dBm)
OUTPUT POWER (dBm)
20
15
10
22GHz
26GHz
40GHz
5
0
0
2
4
6
8
10
INPUT POWER (dBm)
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
For price, 20
delivery,
and
to place
orders: Analog
For price,
delivery
and
to place
orders:
Microwave
Corporation,
Alpha
Road,
Chelmsford,
MADevices,
01824 Inc.,
responsibility
is assumed
by Analog
Devices
for its use,
nor for anyHittite
infringements
of patents or other
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
rights of third parties that may result from its use. Specifications subject to change without notice. No
Phone: 978-250-3343
Fax: 978-250-3373
Order
at www.hittite.com
Phone: On-line
781-329-4700
• Order online at www.analog.com
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Application
Support: Phone: 1-800-ANALOG-D
Trademarks and registered trademarks are
the property of their
respective owners.
Application
Support:
Phone: 978-250-3343
or apps@hittite.com
2-2
HMC598
v01.0809
GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 22 - 46 GHz OUTPUT
Input Return Loss vs. Temperature
2-3
0
+25 C
+85 C
-55 C
+25 C
+85 C
-55 C
-5
RETURN LOSS (dB)
-5
RETURN LOSS (dB)
-10
-15
-20
-25
-10
-15
-20
-25
-30
-30
6
8
10
12
14
16
18
20
22
24
14
18
22
FREQUENCY (GHz)
26
30
34
38
42
46
FREQUENCY (GHz)
Supply Current vs. Input Power
200
190
180
Idd (mA)
FREQUency MULTIPLIERS - Active - CHIP
2
Output Return Loss vs. Temperature
0
170
160
150
140
0
2
4
6
8
10
INPUT POWER (dBm)
Absolute Maximum Ratings
RF Input (Vdd1, 2, 3 = +5V)
+10 dBm
Supply Voltage (Vdd1,2, 3)
+6 Vdc
Channel Temperature
175 °C
Continuous Pdiss (T= 85 °C)
(derate 12.7 mW/°C above 85 °C)
1.14 W
Thermal Resistance
(channel to die bottom)
79 °C/W
Storage Temperature
-65 to +150 °C
Operating Temperature
-55 to +85 °C
Typical Supply Current vs.
Vdd1, Vdd2, Vdd3
Vdd1, 2, 3 (Vdc)
Idd1 + Idd2 + Idd3(mA)
4.5
170
5.0
175
5.5
180
Note:
Multiplier will operate over full voltage range shown above.
ELECTROSTATIC SENSITIVE DEVICE
OBSERVE HANDLING PRECAUTIONS
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
For price, 20
delivery,
andRoad,
to place
orders: Analog
Devices,
For price,
delivery
and
to place
Microwave
Corporation,
Alpha
Chelmsford,
MA
01824Inc.,
responsibility
is assumed
by Analog
Devices
for its use,orders:
nor for any Hittite
infringements
of patents or other
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
rights of third parties that may result from its use. Specifications subject to change without notice. No
Phone: 978-250-3343
Fax: 978-250-3373
Order
On-line at www.hittite.com
Phone: 781-329-4700
• Order online at www.analog.com
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Application
Support: Phone: 1-800-ANALOG-D
Trademarks and registered trademarks are
the property of their
respective owners.
Application
Support:
Phone: 978-250-3343
or apps@hittite.com
HMC598
v01.0809
GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 22 - 46 GHz OUTPUT
Outline Drawing
Die Packaging Information
FREQUency MULTIPLIERS - Active - CHIP
2
[1]
Standard
Alternate [2]
GP-1 (Gel Pack)
—
[1] Refer to the “Packaging Information” section for die
packaging dimensions.
[2] Reference this suffix only when ordering alternate die
packaging.
Pin Description
Pin Number
Function
Description
1
RFIN
Pin is AC coupled and matched to 50 Ohms.
2-4
Vdd1, Vdd2, Vdd3
Power supply voltage. See Assembly
Diagram for external components.
5
RFOUT
Pin is AC coupled and matched to 50 Ohms.
6, 7
Vgg2, Vgg1
Gate control for multiplier. Please follow “MMIC
Amplifier Biasing Procedure” Application note. See
Assembly Diagram for required external components.
Interface Schematic
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
For price, 20
delivery,
and
to place
orders: Analog
For price,
delivery
and
to place
orders:
Microwave
Corporation,
Alpha
Road,
Chelmsford,
MADevices,
01824 Inc.,
responsibility
is assumed
by Analog
Devices
for its use,
nor for anyHittite
infringements
of patents or other
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
rights of third parties that may result from its use. Specifications subject to change without notice. No
Phone: 978-250-3343
Fax: 978-250-3373
Order
at www.hittite.com
Phone: On-line
781-329-4700
• Order online at www.analog.com
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Application
Support: Phone: 1-800-ANALOG-D
Trademarks and registered trademarks are
the property of their
respective owners.
Application
Support:
Phone: 978-250-3343
or apps@hittite.com
2-4
HMC598
v01.0809
GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 22 - 46 GHz OUTPUT
Assembly Diagram
FREQUency MULTIPLIERS - Active - CHIP
2
2-5
Information furnished by Analog Devices is believed to be accurate and reliable. However, no
For price, 20
delivery,
andRoad,
to place
orders: Analog
Devices,
For price,
delivery
and
to place
Microwave
Corporation,
Alpha
Chelmsford,
MA
01824Inc.,
responsibility
is assumed
by Analog
Devices
for its use,orders:
nor for any Hittite
infringements
of patents or other
One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106
rights of third parties that may result from its use. Specifications subject to change without notice. No
Phone: 978-250-3343
Fax: 978-250-3373
Order
On-line at www.hittite.com
Phone: 781-329-4700
• Order online at www.analog.com
license is granted by implication or otherwise under any patent or patent rights of Analog Devices.
Application
Support: Phone: 1-800-ANALOG-D
Trademarks and registered trademarks are
the property of their
respective owners.
Application
Support:
Phone: 978-250-3343
or apps@hittite.com
HMC598
v01.0809
GaAs MMIC x2 ACTIVE FREQUENCY
MULTIPLIER, 22 - 46 GHz OUTPUT
Mounting & Bonding Techniques for Millimeterwave GaAs MMICs
50 Ohm Microstrip transmission lines on 0.127mm (5 mil) thick alumina thin film
substrates are recommended for bringing RF to and from the chip (Figure 1). If
0.254mm (10 mil) thick alumina thin film substrates must be used, the die should
be raised 0.150mm (6 mils) so that the surface of the die is coplanar with the
surface of the substrate. One way to accomplish this is to attach the 0.102mm
(4 mil) thick die to a 0.150mm (6 mil) thick molybdenum heat spreader (moly-tab)
which is then attached to the ground plane (Figure 2).
0.102mm (0.004”) Thick GaAs MMIC
Wire 3 mil Ribbon Bond
0.076mm
(0.003”)
RF Ground Plane
Microstrip substrates should be brought as close to the die as possible in order
to minimize ribbon bond length. Typical die-to-substrate spacing is 0.076mm (3
mils). Gold ribbon of 0.075 mm (3 mil) width and minimal length