HMC745LC3

13 Gbps, Fast Rise Time XOR/XNOR Gate with Programmable Output Voltage and Positive Supply HMC745 Data Sheet 13 VCC 15 VR VCC VCC GND 1 12 GND 50Ω 50Ω AN 2 11 DP AP 3 10 DN 50Ω 50Ω 50Ω GND 4 50Ω GND 8 BN 7 BP 6 GND 5 RF automatic test equipment (ATE) applications Broadband test and measurement Serial data transmission up to 13 Gbps Digital logic systems up to 13 GHz 9 GND VCC VCC PACKAGE BASE 14819-001 APPLICATIONS 14 GND FUNCTIONAL BLOCK DIAGRAM Inputs terminated internally at 50 Ω Differential and single-ended operation Fast rise and fall times: 21 ps and 19 ps Low power consumption: 240 mW (typical) Programmable differential Output voltage swing: 600 mV to 1200 mV Propagation delay: 95 ps Single supply: 3.3 V 16-terminal, ceramic 3 mm × 3 mm LCC package 16 VCC FEATURES Figure 1. GENERAL DESCRIPTION The HMC745 is a XOR/XNOR gate function designed to support data transmission rates of up to 13 Gbps, and clock frequencies as high as 13 GHz. The HMC745 also features an output level control pin, VR, which permits loss compensation or signal level optimization. Inputs or outputs can be connected directly to a 50 Ω VCC terminated system, while dc blocking capacitors may be used if the terminating system is 50 Ω to ground. The HMC745 operates from a single 3.3 V dc supply, and is available in a ceramic, RoHS compliant, 3 mm × 3 mm LCC package. All input and output signals to the HMC745 are terminated with 50 Ω to VCC on-chip, and can be either ac-coupled or dc-coupled. Rev. D Document Feedback Information furnished by Analog Devices is believed to be accurate and reliable. However, no responsibility is assumed by Analog Devices for its use, nor for any infringements of patents or other rights of third parties that may result from its use. Specifications subject to change without notice. No license is granted by implication or otherwise under any patent or patent rights of Analog Devices. Trademarks and registered trademarks are the property of their respective owners. One Technology Way, P.O. Box 9106, Norwood, MA 02062-9106, U.S.A. Tel: 781.329.4700 ©2018 Analog Devices, Inc. All rights reserved. Technical Support www.analog.com HMC745 Data Sheet TABLE OF CONTENTS Features .............................................................................................. 1 Pin Configuration and Function Descriptions..............................5 Applications ....................................................................................... 1 Interface Schematics .....................................................................5 Functional Block Diagram .............................................................. 1 Typical Performance Characteristics ..............................................6 General Description ......................................................................... 1 Theory of Operation .........................................................................8 Revision History ............................................................................... 2 Applications Information .................................................................9 Specifications..................................................................................... 3 Evaluation Printed Circuit Board (PCB)....................................9 Electrical Specifications ............................................................... 3 Outline Dimensions ....................................................................... 11 Absolute Maximum Ratings ............................................................ 4 Ordering Guide .......................................................................... 11 ESD Caution .................................................................................. 4 REVISION HISTORY 6/2018—Rev. C to Rev. D Changes to Power Supply Voltage Parameter, Table 1 ................. 3 Changes to Input Signals Parameter and Output Signals Parameter, Table 2............................................................................. 4 Changes to Pin 14, Pin No. Column, Table 3................................ 5 Change to Figure 19 ....................................................................... 10 Changes to Ordering Guide .......................................................... 11 10/2017—Rev. 02.0514 to Rev. C This Hittite Microwave Products data sheet has been reformatted to meet the styles and standards of Analog Devices, Inc. Updated Format .................................................................. Universal Change to Features Section, General Description Section, and Figure 1 Caption..................................................................................1 Changes to Table 2.............................................................................4 Changes to Figure 2 Caption............................................................5 Deleted Figure 7; Renumbered Sequentially .................................5 Changes to Theory of Operation Section.......................................8 Changes to Evaluation Printed Circuit Board (PCB) Section .....9 Changes to Figure 18 Caption ...................................................... 10 Changes to Figure 19 Caption ...................................................... 11 Updated Outline Dimensions ....................................................... 12 Changes to Ordering Guide .......................................................... 12 Rev. D | Page 2 of 11 Data Sheet HMC745 SPECIFICATIONS ELECTRICAL SPECIFICATIONS TA = 25°C and VCC = 3.3 V, unless otherwise noted. Table 1. Parameter POWER SUPPLY VOLTAGE Voltage Current MAXIMUM DATA RATE MAXIMUM CLOCK RATE INPUT VOLTAGE High Low INPUT RETURN LOSS OUTPUT AMPLITUDE Single-Ended Differential OUTPUT VOLTAGE High Low OUTPUT Rise Time Fall Time OUTPUT RETURN LOSS SMALL SIGNAL GAIN JITTER Random, JR Deterministic, JD PROPAGATION DELAY, tD 1 Test Conditions/Comments Min Typ Max Unit 3.0 3.3 72 13 13 3.6 V mA Gbps GHz 3.8 3.3 10 V V dB 550 1100 mV p-p mV p-p 3.25 2 V V 21 19 10 27 ps ps dB dB 2.8 2.1 Frequency < 13 GHz Differential, 20 % to 80 % Frequency < 13 GHz 0.2 215 − 1 PRBS input 1 2 95 ps, rms ps p-p ps Deterministic jitter is calculated by simultaneously measuring the jitter of a 300 mV input, 13 GHz input, a 215 − 1 PRBS input, and a single-ended output. Rev. D | Page 3 of 11 HMC745 Data Sheet ABSOLUTE MAXIMUM RATINGS Table 2. Parameter Power Supply Voltage (VCC) Input Signals Output Signals Continuous Power Dissipation, PDISS (TA = 85°C, Derate 17 mW/°C Above 85°C) Thermal Resistance (RTH-JP), Worst Case Junction to Package Pad Maximum Junction Temperature Storage Temperature Range Operating Temperature Range Electrostatic Discharge (ESD) Sensitivity Human Body Model (HBM) Rating VCC − 0.5 V to 3.75 V VCC − 2 V to VCC + 0.5 V VCC − 1.5 V to VCC + 0.5 V 0.68 W Stresses at or above those listed under Absolute Maximum Ratings may cause permanent damage to the product. This is a stress rating only; functional operation of the product at these or any other conditions above those indicated in the operational section of this specification is not implied. Operation beyond the maximum operating conditions for extended periods may affect product reliability. ESD CAUTION 59°C/W 125°C −65°C to +150°C −40°C to +85°C Class 1C Rev. D | Page 4 of 11 Data Sheet HMC745 13 VCC 14 GND 16 VCC 15 VR PIN CONFIGURATION AND FUNCTION DESCRIPTIONS GND 1 12 GND AN 2 HMC745 11 DP AP 3 TOP VIEW (Not to Scale) 10 DN GND 4 NOTES 1. EXPOSED PAD. EXPOSED PAD MUST BE CONNECTED TO GND. 14819-102 BN 7 GND GND 8 BP 6 GND 5 9 Figure 2. Pin Configuration Table 3. Pin Function Descriptions Pin No. 1, 4, 5, 8, 9, 12 2, 3 6, 7 10, 11 13, 16 14 15 Mnemonic GND AN, AP BP, BN DN, DP VCC GND VR EPAD Description Signal Ground. Clock/Data Input A. Clock/Data Input B. Clock/Data Output. Positive Supply. Supply Ground. Output Level Control. Output level can be adjusted by applying a voltage to VR per Figure 10. Exposed Pad. Exposed pad must be connected to GND. INTERFACE SCHEMATICS VCC 14819-002 GND 50Ω Figure 3. GND Interface Schematic VR 14819-003 50Ω Figure 4. AN, AP Interface Schematic Figure 7. VR Interface Schematic 50Ω 14819-004 VCC BP, BN 14819-007 Figure 6. DN, DP Interface Schematic VCC AP, AN 14819-005 DP, DN Figure 5. BP, BN Interface Schematic Rev. D | Page 5 of 11 HMC745 Data Sheet TYPICAL PERFORMANCE CHARACTERISTICS 90 1200 +85°C +25°C –40°C 75 70 65 60 1075 1050 3.3 3.4 3.5 3.6 3.7 1000 2.9 3.2 3.3 3.4 3.5 3.6 3.7 3.4 3.5 3.6 3.7 SUPPLY VOLTAGE (V) 1200 1000 800 600 400 14819-009 17 2 4 6 8 10 12 14 16 18 FREQUENCY (GHz) Figure 9. Rise/Fall Time vs. Supply Voltage, Frequency = 13 GHz Figure 12. Output Voltage (VOUT) Differential vs. Frequency, VR = 3.3 V 1400 25 RISE TIME FALL TIME +85°C +25°C –40°C 1200 RISE/FALL TIME (ps) 23 1000 800 600 21 19 17 2.3 2.5 2.7 2.9 VR (V) 3.1 3.3 3.5 3.7 14819-012 VOUT DIFFERENTIAL (mV p-p) 3.3 Figure 11. Output Voltage (VOUT) Differential vs. Supply Voltage, VR = 3.3 V, Frequency = 13 GHz VOUT DIFFERENTIAL (mV p-p) 19 400 2.1 3.2 1400 21 3.1 3.1 SUPPLY VOLTAGE (V) RISE TIME FALL TIME 3.0 3.0 14819-010 3.2 23 RISE/FALL TIME (ps) 1100 14819-011 3.1 14819-008 3.0 Figure 8. DC Current vs. Supply Voltage, VR = 3.3 V, Frequency = 13 GHz 15 2.9 1125 1025 SUPPLY VOLTAGE (V) 25 1150 Figure 10. Output Voltage (VOUT) Differential vs. VR, Frequency = 13 GHz Rev. D | Page 6 of 11 15 2.1 2.3 2.5 2.7 2.9 3.1 3.3 3.5 VR (V) Figure 13. Rise/Fall Time vs. VR, Frequency = 13 GHz 3.7 14819-014 DC CURRENT (mA) 80 55 2.9 +85°C +25°C –40°C 1175 VOUT DIFFERENTIAL (mV p-p) 85 Data Sheet HMC745 0 0 –5 RETURN LOSS (dB) RETURN LOSS (dB) –5 –10 –15 –20 –10 –15 –20 –25 –25 0 2 4 6 8 10 12 FREQUENCY (GHz) 14 0 2 4 6 8 10 12 FREQUENCY (GHz) Figure 16. Output Return Loss vs. Frequency 14819-016 Figure 14. Input Return Loss vs. Frequency –35 Figure 15. Eye Diagram, Waveform Generated with an Agilent N4903A J-Bert, Rate = 13 Gbps, Eye Diagram Data Presented on a Tektronix CSA 8000, Device is AC-Coupled to Scope Rev. D | Page 7 of 11 14 14819-015 –30 14819-013 –30 HMC745 THEORY OF OPERATION The HMC745 consists of an XOR/XNOR stage followed by an output driver stage. The XOR/XNOR stage accepts two differential input pairs; AN/AP and BN/BP, and gives one differential output. The following output driving stage drives Data Sheet the line with a 50 Ω single-ended or 100 Ω differential. The output stage has a tunable voltage swing feature that allows the tune to swing between 600 mV p-p to 1200 mV p–p. All input and output interfaces are referenced to 3.3 V with a 50 Ω resistor. Rev. D | Page 8 of 11 Data Sheet HMC745 APPLICATIONS INFORMATION Table 4 is the truth table, and Figure 17 is the timing diagram. Table 4. Truth Table A L L H H 1 Input 1 B L H L H Outputs1 D L H H L A = AP – AN, B = BP – BN, D = DP – DN, H is the positive voltage level, and L is the negative voltage level. AP BP td td 80% DP tf 80% 20% tr 14819-017 20% Figure 17. Timing Diagram EVALUATION PRINTED CIRCUIT BOARD (PCB) The circuit board used in the application must use RF circuit design techniques. Signal lines must have 50 Ω impedance while the package ground leads must be connected directly to the ground plane. The exposed package base must be connected to GND. A sufficient number of via holes must be used to connect the top and bottom ground planes. The evaluation circuit board shown is available from Analog Devices, Inc., upon request. Table 5. Connector Description Item J1 J2 J3 J4 J5 J6 J7 J8 J9 Description AN AP BP BN DN DP GND VR VCC Table 6. List of Materials for Evaluation PCB 1225171 Item J1 to J6 J7 to J9 JP1 C1, C2 C3 to C5 R2 U1 PCB2 1 2 Description PCB mount SMA RF connectors DC pin Shorting jumper 4.7 µF capacitor, tantalum 100 pF capacitor, 0402 package 10 Ω resistor, 0603 package HMC745LC3, high speed logic, XOR/XNOR 122515 evaluation board Reference this number when ordering complete evaluation PCB. The circuit board material is Arlon 25FR. Rev. D | Page 9 of 11 Data Sheet 14819-019 HMC745 Figure 18. Evaluation Board J9 + + JP1 C3 100pF C5 100pF 13 16 J2 1, 4, 5, 8 9, 12, 14 GND DP 11 VR 2 AN 3 AP DN 10 BP 6 C2 4.7µF C4 100pF 15 VCC VCC J1 R2 10Ω J7 J6 J5 BN 7 J3 J4 Figure 19. Evaluation Board Schematic Rev. D | Page 10 of 11 14819-018 C1 4.7µF J8 Data Sheet HMC745 OUTLINE DIMENSIONS 3.05 2.90 SQ 2.75 0.36 0.30 0.24 0.08 BSC 13 PIN 1 16 1 12 0.50 BSC 1.60 1.50 SQ 1.40 EXPOSED PAD 9 4 5 8 TOP VIEW PKG-004838 0.90 0.80 0.70 0.32 BSC BOTTOM VIEW 1.50 REF 2.10 BSC SIDE VIEW FOR PROPER CONNECTION OF THE EXPOSED PAD, REFER TO THE PIN CONFIGURATION AND FUNCTION DESCRIPTIONS SECTION OF THIS DATA SHEET. SEATING PLANE 02-24-2017-C PIN 1 INDICATOR Figure 20. 16-Terminal Ceramic Leadless Chip Carrier [LCC] (E-16-1) Dimensions shown in millimeters ORDERING GUIDE Model1 HMC745LC3 HMC745LC3TR HMC745LC3TR-R5 122517-HMC745LC3 1 2 MSL Rating2 MSL3 MSL3 MSL3 Temperature Range −40°C to +85°C −40°C to +85°C −40°C to +85°C Package Description 16-Terminal Ceramic Leadless Chip Carrier [LCC] 16-Terminal Ceramic Leadless Chip Carrier [LCC] 16-Terminal Ceramic Leadless Chip Carrier [LCC] Evaluation Board All models are RoHS compliant. Maximum peak reflow temperature of 260°C. ©2018 Analog Devices, Inc. All rights reserved. Trademarks and registered trademarks are the property of their respective owners. D14819-0-6/18(D) Rev. D | Page 11 of 11 Package Option E-16-1 E-16-1 E-16-1