LTC6226/LTC6227
1nV/√Hz 420MHz GBW, 180V/µs,
Low Distortion Rail-to-Rail Output Op Amps
FEATURES
DESCRIPTION
Ultra Low Voltage Noise: 1nV/√Hz
n Low Distortion: HD2/HD37V)
70
AV = –1
1
RL = 1k, 3rd
1M
FREQUENCY (Hz)
0.1% Settling Time
vs Output Step
SETTLING TIME (ns)
–50
Maxium Undistorted Output
Signal vs Frequency
OUTPUT VOLTAGE SWING (VP–P)
–40
Distortion vs Frequency,
AV = 2, 3V Supply
VS = ±5V
TA = 25°C
AV = 1
0V
1.5V/DIV
SHDN
2.25V
1V/DIV
2µs/DIV
62267 G43
Small Signal Response
Output Overdriven Recovery
VS = ±5V
RL = 1k
AV = 1
TA = 25°C
INPUT
50mV/DIV
62267 G44
100ns/DIV
INPUT
OUTPUT
VS = ±5V
AV=2
RL=1kΩ
TA=25°C
OUTPUT
2V/DIV
INPUT
1V/DIV
OUTPUT
50mV/DIV
5ns/DIV
62267 G45
100ns/DIV
62267 G46
Rev 0
14
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LTC6226/LTC6227
PIN FUNCTIONS
SHDN: Shutdown Pin (Active Low). Referenced to V+.
When taken 2.75V below V+, the amplifier shuts down
and enters low power mode, with the outputs in a high
impedance state. When left floating, the amplifier is on.
FB (SOIC-8 Only): Feedback Pin. Internally connected to
OUT.
+IN: Non-Inverting Input of Amplifier. Valid input range is
from V– to V+ – 1.2V
V+: Positive Supply to Amplifier. Valid range is from 2.8V
to 11.75V when V– is 0V.
–IN: Inverting Input of Amplifier. Valid input range is from
V– to V+ – 1.2V
V–: Negative Supply to Amplifier. Typically 0V. This can
be made a negative voltage as long as 2.8V ≤ (V+ – V–)
≤ 11.75V
OUT: Output of the Amplifier. Swings rail to rail and can
typically source/sink 60mA of current.
APPLICATIONS INFORMATION
Circuit Description
independent of transistor β. The bootstrap arrangement
also enhances gain by improving output impedance. A
pair of complementary common emitter stages, Q15 and
Q14, enables the output to swing to either rail. The SHDN
Interface block translates the SHDN signal into pwr_dn
for powering down the device (by deactivating current
sources I1 - I4) and putting the output in a high impedance
state (by shorting the bases of Q15/Q14 to the supplies
via M2 and M1).
The LTC6226/LTC6227 have an input signal range that
extends from the negative power supply to 1.2V below
the positive power supply. Figure 1 depicts a simplified
schematic of the amplifier. The input stage consists of PNP
transistors Q1 and Q2. Bootstrap transistor Q13 improves
DC accuracy by reducing the offset contribution of the
base currents of Q11 and Q12 since it has twice their collector current thus Q11/Q12 current matching becomes
V+
pwr_dn
V+
V–
ESDD1
pwr_dn
pwr_dn
M2
Q15
+
R3
I1
ESDD2
I3
R4
R5
ESDD5
C2
Q12
Q11
Q13
+IN
V–
pwr_dn
SHDN
SHDN
INTERFACE
BLOCK
D5
D7
Q1
CC
OUT
Q2
V+
+IN
ESDD4
V–
pwr_dn
ESDD3
V+
Q9
Q8
I4
ESDD6
Q10
pwr_dn
R1
BUFFER
AND
OUTPUT BIAS
R2
V–
M1
C1
Q14
R3
62267 F01
Figure 1. LTC6226/LTC6227 Simplified Schematic Diagram
Rev 0
For more information www.analog.com
15
LTC6226/LTC6227
APPLICATIONS INFORMATION
Output
ESD
The LTC6226 family has excellent output drive capability. The amplifiers can typically deliver more than 50mA
of output drive current at a total supply of 10V, and can
typically swing to within 600mV of the rail for load currents
as high as 25mA. As the supply voltage to the amplifier
decreases, the output current capability also decreases.
Attention must be paid to keep the junction temperature
of the IC below 150°C (refer to power dissipation section)
when the output is in continuous short-circuit. The output
of the amplifier has reverse-biased diodes connected to
each supply. If the output is forced beyond either supply,
extremely high currents will flow through those diodes
which can result in damage to the device. Forcing the output
to even 1V beyond either supply could result in several
hundred milliamps of current through either diode. Thus
forcing the output beyond the supplies should be avoided.
The LTC6226 family has reverse biased ESD protection
diodes on all inputs as shown in Figure 1. There is an
additional clamp between the positive and negative supplies that further protects the device during ESD strikes.
Input Protection
The LTC6226/LTC6227 has a pair of back to back diodes
(D5 and D7) to prevent the emitter base breakdown of the
input transistors and limit the differential input to ±700mV.
Unlike many other high performance amplifiers, the bases
of the input pair transistors Q1 and Q2 are not connected
to the pins using internal resistors to limit input current,
since that would cause the noise to increase. For instance,
a 100Ω resistor in series with each input would generate
1.8nV/√Hz of noise, and the total amplifier noise voltage
would rise from 1nV/√Hz to 2.06nV/√Hz. Once the input
differential voltage exceeds ±0.7V, current conducted
though the protection diodes should be limited to ±10mA.
This implies 25Ω of protection resistance per quarter volt
(250mV) of overdrive beyond ±0.7V. In addition, the input
and shutdown pins have reverse biased diodes connected
to the supplies. The current in these diodes must be limited
to less than 10mA. The amplifiers should not be used as
comparators or in other open loop applications.
Hot plugging of the device into a powered socket must be
avoided since this can trigger the clamp resulting in larger
currents flowing between the supply pins.
Capacitive Loads
The LTC6226/LTC6227 are optimized for high bandwidth
applications, and have not been designed to directly drive
capacitive loads. Hence any trace capacitance at the
output should be made as small as possible. Increased
capacitance at the output creates an additional pole in
the open loop frequency response, worsening the phase
margin. When driving capacitive loads, a resistor of 10Ω
to 100Ω should be connected between the amplifier
output and the capacitive load to avoid ringing or oscillation. The feedback should be taken directly from the
amplifier output. Higher voltage gain configurations tend
to have better capacitive drive capability than lower gain
configurations due to lower closed loop bandwidth and
hence higher phase margin. The graphs titled Overshoot
vs Capacitive Load demonstrate the transient response of
the amplifier when driving capacitive loads with various
series resistors.
Rev 0
16
For more information www.analog.com
LTC6226/LTC6227
APPLICATIONS INFORMATION
Feedback Components
Power Dissipation
When feedback resistors are used to set up gain, care
must be taken to ensure that the pole formed by the feedback resistors and the parasitic capacitance at the inverting input does not degrade stability. For example if the
amplifier is set up in a gain of +2 configuration with gain
and feedback resistors of 1k, a parasitic capacitance of
7pF (device + PC board) at the amplifier’s inverting input
will cause the part to oscillate, due to a pole formed at
45MHz. An additional capacitor of 7pF across the feedback
resistor as shown in Figure 2 will eliminate any ringing or
oscillation. In general, if the resistive feedback network
results in a pole whose frequency lies within the closed
loop bandwidth of the amplifier, a capacitor can be added
in parallel with the feedback resistor to introduce a zero
whose frequency is close to the frequency of the pole,
improving stability. For high speed designs, minimizing
parasitic inductance is important. The use of capacitors
where the electrodes are terminated on the long side
instead of the short side (for example the use of 0306
instead of 0603 components) can help in this regard.
Care must be taken to ensure that the junction temperature of the die does not exceed 150°C.
7pF
1k
CPAR
VIN
VOUT
+
TJ = TA + (PD • θJA).
The power dissipation in the IC is a function of the supply
voltage, output voltage and load resistance. For symmetric supply voltages with output load connected to ground,
the worst-case power dissipation PD(MAX) occurs when
the supply current is maximum and the output voltage at
half of either supply voltage for a given load resistance.
PD(MAX) is approximately (since IS actually changes with
output load current) given by:
PD(MAX) = (2 • VS • IS(MAX)) + (VS/2)2/RL
Example: For an LTC6227 in a 8-lead MS package operating on ±5V supplies and driving a 250Ω load to ground,
the worst-case power dissipation is approximately given
by PD(MAX)/Amp = (10 • 7.4mA) + (5/2)2/250 = 99mW.
If both channels are loaded identically, the total power
dissipation is 198mW.
At the Absolute Maximum ambient operating temperature,
the junction temperature under these conditions will be:
–
1k
The junction temperature, TJ, is calculated from the ambient temperature, TA, power dissipation, PD, and thermal
resistance, θJA:
TJ = TA + (PD • θJA) = 125 + 0.198 • 35 = 132°C
62267 F02
Figure 2. 7pF Feedback Cancels Parasitic Pole
Shutdown
The LTC6226 and LTC6227DD have SHDN pins that can
shut down the amplifier to 350µA typical supply current.
The SHDN pin needs to be taken 2.75V below the positive supply to shut down. When left floating, the SHDN
pin is internally pulled up to 1.2V below the positive supply and the amplifier remains on. During shutdown, the
output transistors Q15 and Q14 in Figure 1 are in a high
impedance state.
which is less than the absolute maximum junction temperature for the LTC6227.
Refer to the Pin Configuration section for thermal resistances of various packages
Board Layout and Bypass Capacitors
High speed and RF board layout techniques should
be applied due to the very high speeds of the signals
involved. For the LTC6226 SOIC-8 package option, the
feedback should be taken from the FB pin rather than from
the output pin, to reduce signal trace length.
Stray capacitances at the –IN and +IN pins should be
made as low as possible to reduce stability degradation.
Rev 0
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17
LTC6226/LTC6227
APPLICATIONS INFORMATION
For single supply applications, it is recommended that high
quality 0.1µF||1000pF ceramic bypass capacitors be placed
directly between each V+ pin and its closest V– pin with
short connections. The V– pins (including the Exposed Pad)
should be tied directly to a low impedance ground plane
with minimal routing. For dual (split) power supplies, it is
recommended that additional high quality 0.1µF||1000pF
ceramic capacitors be used to bypass V+ pins to ground
and V– pins to ground, again with minimal routing.
Noise Considerations
The ultralow input referred voltage noise of of 1nV/√Hz
is equivalent to that of an 60Ω resistor. As with all BJT
input amplifiers, lowering input referred noise is achieved
by increasing the collector current of the input differential
pair, which increases the input referred current noise.
Figure 3 shows the LTC6226 in a typical gain configuration.
RS1
RF
–
in
RS2
LTC6226
en
+
in
62267 F03
Figure 3.
As can be seen, the input referred noise spectral density
of the gain stage (eT) can be calculated by the following
equations:
eT2 = en2 + in2REQ2 + 4kTREQ
Where
REQ = RS2 + RS1||RF, k is the Boltzmann constant and
T is the temperature (in Kelvin).
Resistor noise dominated the input referred noise of the
gain stage when
REQ >> en2/4kT and REQ > 4kT/in2
With an input referred voltage noise spectral density of
1nV/Hz and an input referred current noise of 2.4pA/Hz,
it is easy to see that the gain stage’s input referred noise
is dominated by op amp voltage noise when REQ