Table of Contents
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User’s Guide
bq34z100EVM Wide Range Impedance Track™ Enabled
Battery Fuel Gauge Solution
Tom Cosby
HVAL - Battery Management Solutions
ABSTRACT
This evaluation module (EVM) is a complete evaluation system for the bq34z100 wide-range fuel gauge for
lithium ion, Nickel metal hydride (NiMH) and Nickel Cadmium (NiCd) chemistries when combined with an
EV2300 USB adapter and Microsoft® Windows® based PC software downloadable from the TI.com website.
The circuit module includes one bq34z100 integrated circuit (IC) and all other components necessary to monitor
and predict capacity in one or more series cell Li-ion, Li-polymer, or LiFePO4 battery packs. The minimum
series cell count for PbA, NiMH, and NiCd chemistries must exceed 3.3-V stack voltage. The circuit module
connects directly across the battery stack. With the EV2300 interface adapter and software, it is possible to
read the bq34z100 data registers, program the chip for different pack configurations, log cycling data for further
evaluation, and evaluate the overall functionality of the bq34z100 solution under different charge and discharge
conditions.
Table of Contents
1 Features...................................................................................................................................................................................3
1.1 Kit Contents........................................................................................................................................................................3
1.2 Ordering Information.......................................................................................................................................................... 3
1.3 Documentation................................................................................................................................................................... 3
1.4 bq34z100 Circuit Module Performance Specification Summary........................................................................................ 3
2 bq34z100 Quick Start Guide.................................................................................................................................................. 4
2.1 Items Needed for EVM Setup and Evaluation....................................................................................................................4
2.2 Software Installation...........................................................................................................................................................4
2.3 EVM Connections.............................................................................................................................................................. 5
3 Battery Management Studio.................................................................................................................................................. 7
3.1 Registers Screen................................................................................................................................................................7
3.2 Setting Programmable bq34z100 Options......................................................................................................................... 8
3.3 Calibration Screen..............................................................................................................................................................9
3.4 Chemistry Screen.............................................................................................................................................................10
3.5 Programming Screen........................................................................................................................................................11
3.6 Golden Image Screen...................................................................................................................................................... 12
3.7 Advanced Comm I2C Screen...........................................................................................................................................13
3.8 Send HDQ Screen........................................................................................................................................................... 15
3.9 Dashboard Panel............................................................................................................................................................. 15
3.10 Commands Panel...........................................................................................................................................................16
4 Circuit Module Physical Layouts.........................................................................................................................................17
4.1 Board Layout....................................................................................................................................................................17
4.2 Schematic........................................................................................................................................................................ 20
4.3 Bill of Materials.................................................................................................................................................................21
5 Related Documentation from Texas Instruments.............................................................................................................. 22
6 Revision History................................................................................................................................................................... 22
List of Figures
Figure 2-1. bq34z100 Circuit Module Connection to Cells and System Load and Charger........................................................ 5
Figure 3-1. Registers Screen.......................................................................................................................................................7
Figure 3-2. Data Memory Screen................................................................................................................................................ 8
Figure 3-3. Calibration Screen.....................................................................................................................................................9
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Trademarks
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Figure 3-4. Chemistry Screen....................................................................................................................................................10
Figure 3-5. Programming Screen...............................................................................................................................................11
Figure 3-6. Golden Image Screen............................................................................................................................................. 12
Figure 3-7. Advanced Comm Screen........................................................................................................................................ 13
Figure 3-8. Send HDQ Screen...................................................................................................................................................15
Figure 4-1. Top Silk Screen....................................................................................................................................................... 17
Figure 4-2. Top Assembly.......................................................................................................................................................... 17
Figure 4-3. Top Layer.................................................................................................................................................................18
Figure 4-4. Internal Layer 1....................................................................................................................................................... 18
Figure 4-5. Internal Layer 2....................................................................................................................................................... 19
Figure 4-6. Bottom Layer........................................................................................................................................................... 19
Figure 4-7. bq34z100EVM-003 Schematic................................................................................................................................20
List of Tables
Table 1-1. Ordering Information................................................................................................................................................... 3
Table 4-1. Bill of Materials..........................................................................................................................................................21
Trademarks
Impedance Track™ is a trademark of Texas Instruments.
Microsoft® and Windows® are registered trademarks of Microsoft Corporation.
All trademarks are the property of their respective owners.
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Features
1 Features
•
•
•
Complete evaluation system for the bq34z100 advanced gas gauge with Impedance Track™ technology.
Populated circuit module for quick setup
Link to software allowing data logging for system analysis
1.1 Kit Contents
•
•
bq34z100 circuit module
Cable to connect the EVM to an EV2300 or EV2400 Communications Interface Adapter.
1.2 Ordering Information
Table 1-1. Ordering Information
EVM Part Number
Chemistry
Configuration
Capacity
bq34z100EVM
Li-Ion, Li-Polymer, LiFePO4, PbA,
NiMH, NiCd
3 V–48 V
Any
1.3 Documentation
See the device data sheet for bq34z100-G1 (SLUSBZ5) on www.ti.com for information on device firmware and
hardware.
1.4 bq34z100 Circuit Module Performance Specification Summary
This section summarizes the performance specifications of the bq34z100 circuit module.
Specification
Min
Typ
Max
Input voltage BAT+ to BAT– in 1S mode
3
4
5
V
Input voltage BAT+ to BAT– in MultiCell
6
28
48
V
Charge and discharge current
0
2
7
A
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bq34z100 Quick Start Guide
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2 bq34z100 Quick Start Guide
This section provides the step-by-step procedures required to take a new EVM and configure it for operation in a
laboratory environment.
2.1 Items Needed for EVM Setup and Evaluation
•
•
•
•
•
•
•
•
bq34z100 circuit module
EV2300 or EV2400 Communications Interface Adapter
Cable to connect the EVM to an EV2300 or EV2400 Communications Interface Adapter
USB cable to the Communications Interface Adapter to the computer
Computer setup with Windows XP, or higher, operating system
Access to the internet to download the Battery Management Studio software setup program
Battery cells or 1-kΩ resistors to configure a cell simulator
A DC power supply that can supply 50 V and 3 A (Constant current/constant voltage capability is desirable)
2.2 Software Installation
Find the latest software version in the bq34z100 tool folder on www.ti.com. Use the following steps to install the
bq34z100-G1 Battery Management Studio software:
1. Download and run the Battery Management Studio setup program from the bqStudio product folder on
www.ti.com. See Section 3 for detailed information on using the tools in the Battery Management Studio.
2. If the Communications Interface Adapter was not previously installed, after the Battery Management Studio
installation, a TI USB driver installer pops up. Click “Yes” for the agreement message and follow the
instructions. Two drivers are associated with the EV2300 and an additional file may be required for the
EV2400. Follow the instructions to install both. Do not reboot the computer, even if asked to do so.
3. Plug the Communications Interface Adapter into a USB port using the USB cable. The Windows system
may show a prompt that new hardware has been found. When asked, "Can Windows connect to Windows
Update to search for software?", select "No, not this time", and click "Next". In the next dialog window, it
indicates "This wizard helps you install software for: TI USB Firmware Updater". Select "Install the software
automatically (Recommended)" and click "Next". It is common for the next screen to be the Confirm File
Replace screen. Click "No" to continue. If this screen does not appear, then go to the next step. After
Windows indicates that the installation was finished, a similar dialog window pops up to install the second
driver. Proceed with the same installation preference as the first one. The second driver is the TI USB
bq80xx Driver.
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2.3 EVM Connections
This section covers the hardware connections for the EVM (see Figure 2-1).
Figure 2-1. bq34z100 Circuit Module Connection to Cells and System Load and Charger
•
Direct connection to the cells: BAT–, BAT+
The bq34z100 monitors the cell stack voltage. Connect the bottom of the stack to BAT– and the top of the
stack to BAT+. The stack voltage can range from 3 V to 48 V (see Figure 2-1).
STACK VOLTAGE
J5 HEADER
J2 HEADER
Less than 5 V
< 5-V jumpers
N/A
Greater than 5 V
> 5-V jumpers
16 V, 32 V or 48 V
WARNING
Applying a voltage greater than 5 V when jumpers are configured to < 5-V operation will damage
the IC. Do not apply power until you have completed the EVM Connections section.
•
To the serial communications port (SCL, SDA)
•
Attach the Communications Interface Adapter cable to the J7 terminal block and to an EV2300 or EV2400
adapter box. Connect the PC USB cable to the EV2300 or EV2400 and the PC USB port (see Figure 2-1).
The charger and system load connection across BAT+ and PACK–
•
Attach the charger or load to the TB3 terminal block. Connect the positive load wire to BAT+ and the ground
wire for the load to PACK– (see Figure 2-1).
The ALERT output
The ALERT output is an active low interrupt. The ALERT Configuration register selects the Control Status bits
that will activate the interrupt. The ALERT pin is an open drain output and a pull-up resistor must be attached
to the TB1 to use the feature.
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•
The LED Configuration
•
When configuring the data flash registers, choose one of five LED/Comm configuration codes (refer to Table
21 in the bq34z100-G1 datasheet SLUSBZ5). After reviewing those possibilities, select the jumper pattern
desired for the J6 header on the EVM. For single LED mode, place a jumper on the pair marked A. For four
direct LED mode, place jumpers on A, B, C, and D. (Note: This configuration is only available when using
HDQ communications mode.) For external LEDs using the shift register option, place a single jumper on EXT.
In all cases, where one or more LED’s are used, place a jumper across the J1 header to provide power to the
LED (see Figure 2-1).
Parameter setup
The default data flash settings configure the device for 1-series Li-Ion cell. The user must update the data to
set up the number of series cells to match the physical pack configuration (see Cell Configuration in Section
3.2). This provides basic functionality to the setup. Other data flash parameters should also be updated to
fine tune the gauge to the pack. See the bq34z100 datasheet for help with setting the parameters.
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Battery Management Studio
3 Battery Management Studio
3.1 Registers Screen
Apply power to the EVM after you have completed the EVM Connections section. Run Battery Management
Studio from the Start | Programs | Texas Instruments | Battery Management Studio menu sequence, or the
Battery Management Studio shortcut. The Registers screen (see Figure 3-1) appears. The Registers section
contains parameters used to monitor gauging. The Bit Registers section provides a bit-level picture of status and
fault registers. A green flag indicates that the bit is 0 (low state) and a red flag indicates that the bit is 1 (high
state). Data begins to appear once the Refresh (single-time scan) button is selected, or it scans continuously, if
the Scan button is selected.
Figure 3-1. Registers Screen
The continuous scanning period can be set via the | Window | Preferences | SBS | Scan Interval | menu
selection.
The Battery Management Studio program provides a logging function which logs the values selected by the Log
check boxes located beside each parameter in the Registers section. To enable this function, select the Log
button; this causes the Scan button to be selected. When logging is stopped, the Scan button is still selected and
has to be manually deselected.
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Battery Management Studio
3.2 Setting Programmable bq34z100 Options
The bq34z100 data flash comes configured per the default settings detailed in the bq34z100 datasheet. Ensure
that the settings are correctly changed to match the pack and application for the solution being evaluated.
Note
The correct setting of these options is essential to get the best performance. The settings can be
configured using the Data Memory screen (see Figure 3-2)
Figure 3-2. Data Memory Screen
3.2.1 Cell Configuration
The bq34z100 operates in one of two modes for measuring battery voltage. Place two jumpers on header J5 to
select the mode of operation. Refer to the Section 2.3.
For packs where the stack voltage is less than 5 V:
•
•
•
Set the Number of Series Cells parameter field to the appropriate value
Reset the gauge using the RESET button on the Commands panel
Calibrate the stack voltage. Reference the Calibration Screen section
For packs where the stack voltage is greater than 5 V:
•
•
•
•
8
Set the Number of Series Cells parameter field to the appropriate value
Set the VOLTSEL bit in the Pack Cfg A register
Reset the gauge using the RESET button on the Commands panel
Calibrate the stack voltage. Reference the Calibration Screensection
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Battery Management Studio
3.3 Calibration Screen
Calibrate the voltages, temperatures, and currents to provide good gauging performance. Press the Calibration
button to select the Advanced Calibration window. See Figure 3-3.
Figure 3-3. Calibration Screen
3.3.1 Voltage Calibration
•
•
•
Measure the voltage from BAT+ to BAT– and enter this value in the Applied Voltage field and select the
Calibrate Voltage box.
Press the Calibrate Gas Gauge button to calibrate the voltage measurement system.
Deselect the Calibrate Voltage boxes after voltage calibration has completed.
3.3.2 Temperature Calibration
•
•
•
Enter the room temperature in the Applied Temperature field and select the Calibrate Temperature box and
select the thermistor to be calibrated. The temperature value must be entered in degrees Celsius.
Press the Calibrate Gas Gauge button to calibrate the temperature measurement system.
Deselect the Calibrate Temperature box after temperature calibration has completed.
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3.3.3 Current Calibration
•
•
•
•
•
•
•
Select the Calibrate CC Offset and Calibrate Board Offset boxes and insure that there is no current flow.
Press the Calibrate Gas Gauge button to calibrate.
Deselect the Calibrate CC Offset and Calibrate Board Offset boxes after current calibration has completed.
Connect and measure a 2-A load from BAT+ and PACK– to calibrate the current gain.
Enter –2000 in the Applied Current field and select the Calibrate Current box.
Press the Calibrate Gas Gauge button to calibrate.
Deselect the Calibrate Current box after current calibration has completed.
3.4 Chemistry Screen
The chemistry file contains parameters that the simulations use to model the cell and its operating profile. It
is critical to program a Chemistry ID that matches the cell into the device. Some of these parameters can be
viewed in the Data Flash section of the Battery Management Studio.
Press the Chemistry button to select the Chemistry window. See Figure 3-4.
Figure 3-4. Chemistry Screen
•
•
•
10
The table can be sorted by clicking the desired column. For example: Click the Chemistry ID column header.
Select the ChemID that matches your cell from the table (Figure 3-4).
Press the Update chemistry in the data flash button to update the chemistry in the device.
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Battery Management Studio
3.5 Programming Screen
Press the Programming button to select the Programming Update window. This window allows the user to
program the device to a new version of firmware.
Figure 3-5. Programming Screen
3.5.1 Programming the Flash Memory
The upper section of the Programming screen is used to initialize the device by loading the default .srec into the
flash memory (see Figure 3-5).
•
•
•
•
Search for the .srec file using the Browse button.
Press the Program button and wait for the download to complete.
Press the Execute FW button after the download has completed.
Select File | Restart to initialize bqStudio to the new firmware.
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3.6 Golden Image Screen
Press the Golden Image button to select the Golden Image window. This window allows the user to export the
device firmware as an .srec, .bq.fs, and .df.fs files.
Figure 3-6. Golden Image Screen
3.6.1 Exporting the Flash Memory
The .srec file contains the full flash memory. The .bq.fs contains the program memory portion for the flash
memory and the .df.fs contains the data flash portion of the flash memory (see Figure 3-6).
•
•
•
•
12
Select the directory location to export the files.
Enter the file name for the files.
Select the files types to export.
Press the Create Image File button to export the memory and create the files.
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3.7 Advanced Comm I2C Screen
Press the Advanced Comm I2C button to select the Advanced I2C Comm window. This tool provides access to
parameters using I2C and Manufacturing Access commands (see Figure 3-7).
Figure 3-7. Advanced Comm Screen
3.7.1 Examples
Reading Standard Data Commands.
•
Read SBData Voltage (0x08)
– Start Register = 0x08
– Number of Bytes to Read = 2
– Press the Read button
– Date returned =8C 3C, which a byte swapped
– 0x3C8C = 15500mV, when converted to decimal
Sending a MAC Gauging() to enable IT via ManufacturerAccess().
•
With Impedance Track™ disabled, send Gauging() (0x0021) to ManufacturerAccess().
– Start Register = 0x00
– Bytes to Write = 21 00
– Press the Write button
– The QEN flag should set in the Control Status register to indicate that Impedance Track is enabled
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Reading Control Subcommands. Chemical ID() (0x0008) via ManufacturerAccess()
•
14
Send Chemical ID() to ManufacturerAccess()
– Start Register = 0x00
– Bytes to Write = 08 00
– Press the Write button
– Start Register = 0x00
– Number of Bytes to Read = 2
– Press the Read button
– Date returned =07 01, which a byte swapped
– That is 0x0107, chem ID 107
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3.8 Send HDQ Screen
When using the HDQ single wire serial communication feature, the mode of the gauge must be changed with
a special command. This screen provides a button for this purpose. Note the warning message. The process is
not reversible. Once in HDQ mode, the HDQ pro screen is available for testing commands and reprogramming
the device. For register scanning and data flash access, use the companion evaluation program for HDQ (see
Figure 3-8).
Figure 3-8. Send HDQ Screen
•
To the HDQ communications port (HDQ, GND)
– Attach the Communications Interface Adapter cable to the J7 terminal block (I2C Interface) to the I2C port
on the EV2300..
– Press the Convert From I2C to HDQ button
– Power cycle the voltage to the device
– Attach the Communications Interface Adapter cable to the J4 terminal block (HDQ Interface) to the HDQ
port on the EV2300
– Select File | Restart to reload the bqStudio program
WARNING
The conversion to HDQ mode is permanent. TI recommends using the I2C interface to setup,
calibrate, and run the optimization cycle.
3.9 Dashboard Panel
The Dashboard panel displays the device type and firmware version. It also provides updates to the Voltage,
SOC, Current and Temperature in one location. The Dashboard uses automatic polling, which can cause
problems when sending some MAC commands. Dashboard polling can be disabled by clicking the auto refresh
field at the top of the panel (see Figure 3-1).
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3.10 Commands Panel
The Commands panel provides a quick and easy access to frequently used I2C and MAC commands. They are
mapped to buttons that can be pressed to execute the function. The I2C transaction is logged in the Log Panel
(see Figure 3-1).
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Circuit Module Physical Layouts
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4 Circuit Module Physical Layouts
This section contains the printed-circuit board (PCB) layout, assembly drawings, and schematic for the
bq34z100 circuit module.
4.1 Board Layout
This section shows the dimensions, PCB layers (Figure 4-1 through Figure 4-6), and assembly drawing for the
bq34z100 module.
TP4
TP5
J7
TP3
TP8
TP7
TP6
U1
U3
J6
J3
J1
J4
J5
RT1
J2
U2
TB3
SW1
TB1
Figure 4-1. Top Silk Screen
D15
D14
D9
R9
R10
R11
C3
R35
R36
1
R37
J7
D1
Q6
C1
R7
J6
R34
J3
J1
R33
R16 Q2
D3
1
D10
TP5
TP4
R29
R31
R15
D8
R32
Q1
1
D11
1
U3
U1
D4
R17
TP3
R12
R18
R20
R22
R23
R24
R19
D5
TP8
TP7
TP6
C4
1
D12
D13
R8
D16
D17
D6
J4
R13
R14
J5
1
D2
R21
R28
C8
J2
TP2
C2
C9
U2
C5
C6
C7
R30
TB3
R5
R6
Q7
RT1
R2
R4
R1
R26
R27
1
R3
R25
TP1
Q5
Q4
Q3
D7
SW1
TB1
Figure 4-2. Top Assembly
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Circuit Module Physical Layouts
Figure 4-3. Top Layer
Figure 4-4. Internal Layer 1
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Figure 4-5. Internal Layer 2
Figure 4-6. Bottom Layer
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Circuit Module Physical Layouts
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4.2 Schematic
Figure 4-7 shows the schematic for this EVM.
R2
100K
R4
165K
1
Q4
BSS138
1
GND
REGIN
R35
100
R36
100
R37
100
R34
100
4
J2
1
2
3
4
5
6
Q5
BSS84
R1
R26
300K .1%
R27
300K .1%
16V
R3
2
3300 pF
AGND
Vscale Hi Vscale Lo
D7 BZT52C5V6S-7
27K
P1
GND
R41 27K
Q3
2N7002
R39
47
Q8
2N7002
4
C2
J5
5V
8
A
C1
100
R5
C5
B
C
D
1uF
0.1uF
C7
0.1uF
C6
1
SN74HC164PW
1
P1
A
VCC
14
B
QH
13
LED9
D9 QTLP610C-7 RED
R8
1.5K
3
QA
QG
12
LED8
D10 QTLP610C-7 RED
R9
1.5K
4
QB
QF
11
LED7
D11 QTLP610C-7 RED
R10
1.5K
5
QC
QE
10
LED6
D12 QTLP610C-3 YEL
R11
1.5K
6
QD
~CLR 9
7
GND
2
J1
REGIN
U3
AGND
GND
CLK
C3
GND
0.1uF
R15
0.1uF
R16
1.5K
1.5K
GND
Open for I2C
LED A
Q1
2SK3019
8
D8
LED B
R17
1.5K
D3
LED C
R19
1.5K
D4
LED D
QTLP610C-4 GRN
100
QTLP610C-4 GRN
R6
QTLP610C-4 GRN
SH1
GND
D2
AGND
TB3
HDQ
1
AZ23C5V6-7
QTLP610C-4 GRN
3
3
2
GND
2
2
4
RT1
10K
R7
2M
R30
.010 75ppm
1
BAT -
R13
100
REG25
>5V
SH2
BAT +
PACK -
16.5K .1%
GND
R21
220K
R38
1k
7
R28
GND
AZ23C5V6-7
R14
100
5
6
GND
J7