BQ500211EVM-045

User's Guide SLVU536A – June 2012 – Revised October 2012 bq500211 bqTESLA Wireless Power TX EVM The bqTESLA™ wireless power transmitter evaluation module from Texas Instruments is a highperformance, easy-to-use development module for the design of wireless power solutions. The singlechannel transmitter enables designers to speed the development of their end-applications. The bq500211EVM evaluation module (EVM) provides all basic functions of a Qi-compliant, wireless charger pad. The EVM is intended to be used with bq51013AEVM-764, -765 or any other Qi-compliant receiver. The transmitter EVM is a 5-V input design which powers a standard WPC low-power 5-W receiver. The bq500211EVM-045 will support bq500211 device. 1 2 3 4 5 6 7 8 Contents Applications .................................................................................................................. 2 bq500211EVM-045 Electrical Performance Specifications ............................................................ 2 Modifications ................................................................................................................. 2 Connector and Test Point Descriptions .................................................................................. 3 4.1 Input/Output Connections ......................................................................................... 3 4.2 Test Point Descriptions ............................................................................................ 3 Schematic and Bill of Materials ........................................................................................... 5 Test Setup .................................................................................................................. 10 6.1 Equipment ......................................................................................................... 10 6.2 Equipment Setup ................................................................................................. 10 bq500211EVM-045 Assembly Drawings and Layout ................................................................. 12 Reference ................................................................................................................... 16 List of Figures 1 bq500211EVM-045 Schematic, Page 1 of 3 ............................................................................ 5 2 bq500211EVM-045 Schematic, Page 2 of 3 ............................................................................ 6 3 bq500211EVM-045 Schematic, Page 3 of 3 ............................................................................ 7 4 Equipment Setup .......................................................................................................... 11 5 Efficiency versus Power, bq500211EVM-045 Transmitter and HPA764 Receiver 6 7 8 9 10 11 ............................... Assembly Top .............................................................................................................. Top Silk ..................................................................................................................... Top Layer ................................................................................................................... Layer 2 ...................................................................................................................... Layer 3 ...................................................................................................................... Bottom Layer ............................................................................................................... 12 13 13 14 14 15 15 List of Tables 1 bq500211EVM-045 Electrical Performance Specifications ............................................................ 2 2 Bill of Materials .............................................................................................................. 8 bqTESLA is a trademark of Texas Instruments. SLVU536A – June 2012 – Revised October 2012 Submit Documentation Feedback bq500211 bqTESLA Wireless Power TX EVM Copyright © 2012, Texas Instruments Incorporated 1 Applications 1 www.ti.com Applications The bq500211EVM-045 evaluation module demonstrates the transmitter portion of the bqTESLA™ wireless power system. This transmitter EVM is a complete transmitter-side solution that powers a bqTESLA™ receiver. The bq500211EVM requires a single 5-V power supply capable of up to 2 A to operate and combines the transmitter electronics, input power socket, LED indicators, and the transmitting coil on the single printed-circuit board (PCB). The open design allows easy access to key points of the electrical schematic. The board has an installed serial interface connector for more advanced operation. This EVM has the following features. • Dynamic Power Limiting™ (DPL) allows operation from a 5-V supply with limited current capability (for example, a USB port). • Transmitter-coil mounting pad providing the correct receiver interface • Input power is really available 5 V • Standard WPC A5-type transmitter coil • LED indicates power transfer or power fault state • Audio indication of start-of-power transfer though a board-mounted buzzer 2 bq500211EVM-045 Electrical Performance Specifications Table 1 provides a summary of the bq500211EVM-045 performance specifications. All specifications are given for an ambient temperature of 25°C. Table 1. bq500211EVM-045 Electrical Performance Specifications Parameter Notes and Conditions Min Typ Max Unit Input Characteristics VIN Input voltage 5.0 5.10 V IIN Input current VIN = Nom, IOUT = Max 4.90 1.50 2.0 A Input no-load current VIN = Nom, IOUT = 0 A 200 mA Input stand-by current VIN = Nom 20 mA Output Characteristics – Receiver bq51013AEVM-764 or 765 VOUT IOUT Output voltage VIN = Nom, IOUT = Nom Output ripple VIN = Nom, IOUT = Max 4.5 5 5.1 V 200 mVPP VIN = Min to Max VIN = Min to Max 0 1 A Output overcurrent VIN = Nom 1 1.1 A 205 kHz Systems Characteristics 3 FS Switching frequency Switching frequency varies with load ηpk Peak efficiency VIN = Nom, P Out RX = 2.5 W 110 72 % η Full-load efficiency VIN = Nom, IOUT = Max 70 % Modifications See the data sheet (SLUSAO2) when changing components. The board is laid out so that a shield can be placed over the active circuit area; Laird Technology BMIS-207 can be used. Use LED Mode – Resistor R23 to change the behavior of the status LED, D4. The standard value is 42.2 kΩ for control option 1, see the data sheet for additional settings. NTC – Connector JP1 provides the option for connecting a negative temperature coefficient (NTC) sensor for thermal protection, see the data sheet for additional settings. EMI Shield – The board is laid out so that a shield can be placed over the active circuit area, Laird Technology BMIS-207 can be used 2 bq500211 bqTESLA Wireless Power TX EVM Copyright © 2012, Texas Instruments Incorporated SLVU536A – June 2012 – Revised October 2012 Submit Documentation Feedback Connector and Test Point Descriptions www.ti.com 4 Connector and Test Point Descriptions 4.1 Input/Output Connections The connection points are described in the following paragraphs. 4.1.1 J1 – VIN Input power 5 V ±100 mV, return at J2. 4.1.2 J2 – GND Return for input power, input at J1. 4.1.3 J3 –JTAG Factory use only 4.1.4 J4 – Serial Interface Factory use only 4.1.5 JP2 – LED Mode External connection for LED MODE reistor, if R23 is removed. 4.1.6 JP4 – Select for Normal or Power Limiting Shorting this header enables the Dynamic Power Limiting feature and the input current is limited to 500 mA. With this connector open, operation is normal, there is no restriction on input power. 4.1.7 JP3 – PMOD Enable (Future Use) Not used for the bq500211 device, should be open. 4.1.8 JP1 – NTC The connection point for the external temperature sensor. See the data sheet for more information. 4.2 Test Point Descriptions The test points are described in the following paragraphs. 4.2.1 TP1 – Coil Drive Q1 / Q2 H-Bridge drive signal. 4.2.2 TP2 – Coil Monitor L / C Coil signal at junction between coil and capacitors. 4.2.3 TP3 – PWR GND Ground for switch circuits. 4.2.4 TP4 – Analog GND Low-noise GND SLVU536A – June 2012 – Revised October 2012 Submit Documentation Feedback bq500211 bqTESLA Wireless Power TX EVM Copyright © 2012, Texas Instruments Incorporated 3 Connector and Test Point Descriptions 4.2.5 www.ti.com TP5 – Analog GND Low-noise GND 4.2.6 TP6 – Analog GND Low-noise GND 4.2.7 TP7 – Analog GND Low-noise GND 4.2.8 TP8 – DC Buzzer Output The connection point for an external DC buzzer; logic high for 500 ms at the start of power transfer to receiver unit. 4.2.9 TP9 – 3.3-VDC Voltage for low-power circuits, 3.3-V output from U5, TPS62237, U5. 4.2.10 TP10 - Filtered 3.3 V 3.3-V output with additional filtering for A-to-D converters. 4.2.11 TP11 – Input voltage Input voltage from J1. 4.2.12 TP12 – MSP430 3.3 V Filtered 3.3 V for MSP430, U4. 4.2.13 TP13 – Demodulation Comm 1 Output Primary communications channel, input to bq500211, U1 from demodulation circuit. 4.2.14 TP14 – Sleep Output from bq500211, U1 to sleep timer circuit. 4.2.15 TP15 – Coil Drive Q3 and Q4 Side H-Bridge drive signal Q3 and Q4. 4.2.16 TP16 – DPWM Signal Digital output signal from bq500211 to H-Bridge drive for Q1 and Q2. 4.2.17 TP17 – DPWM Signal Digital output signal from bq500211 to H-Bridge drive for Q3 and Q4. 4.2.18 TP18 – Spare Pin Unused output from bq500211. 4.2.19 TP19 – I_Sense Input current-sense voltage, scale 1 V = 1 A. 4 bq500211 bqTESLA Wireless Power TX EVM Copyright © 2012, Texas Instruments Incorporated SLVU536A – June 2012 – Revised October 2012 Submit Documentation Feedback Schematic and Bill of Materials www.ti.com 5 Schematic and Bill of Materials Buck Regulator VIN J1 TP11 1 D C IN 5 Vin 2 C26 4.7uF R4 D3 C2 1 4.7uF TP9 1 SW 2 FB 6 3 VIN 5 EN 1 M ODE 365 L1 1.0 uH U5 TPS62237D RY GND 4 2 3V3_VCC C25 4.7uF J5 D C IN 1 GND 2 D1 R25 1 Pow er Train 523k LTST-C190G KT TP4 TP5 TP6 TP7 VIN GND 2 J2 R37 200 U7 LM V931ID CK VIN TP14 SLEEP Q4 BSS138 R36 200 .020 O hm C22 4.7uF Q6 BC857C R32 C7 22uF C21 TP19 I_SEN SE 0.1uF C16 0.01uF R46 10.0k R18 10.0k U2 TPS28225D VIN D PW M -1A 6 VD D 3 PW M U G ATE 1 BO O T 2 7 EN /PG 4 GND PH SE 8 LG ATE 5 Q1 CSD 17308Q 3 Q3 CSD 17308Q 3 C23 22uF R3 10.0 TP1 L2 IN D _TXL05001 TP2 TP15 C6 0.22uF C27 Q2 CSD 17308Q 3 C9 0.1uF R34 0 C18 4700pF C15 0.22uF 100nF C28 100nF C29 100nF 3V3_VCC C30 100nF Q5 R6 100k TP13 R29 10 R14 23.2k U6 TPS28225D 1 U G ATE VD D 6 2 BO O T PW M 3 8 PH SE 5 LG ATE VIN EN /PG 7 GND 4 C13 0.1uF CSD 17308Q 3 TP3 R1 10.0 R13 0 D2 CO M M + BAT54SW R26 10 R5 10.0k C14 33pF CO M M - Figure 1. bq500211EVM-045 Schematic, Page 1 of 3 SLVU536A – June 2012 – Revised October 2012 Submit Documentation Feedback bq500211 bqTESLA Wireless Power TX EVM Copyright © 2012, Texas Instruments Incorporated 5 Schematic and Bill of Materials www.ti.com U3 TLV70033D CK VIN 1 IN 2 GND C17 0.1uF Low Pow er Supervisor R24 10 O UT 5 3V3_VCC 3 EN NC 4 - C11 4.7uF R16 C8 1.0uF C10 0.01uF R12 10.0k Q7 BSS138 10.0k M SP_RST U4 M SP430G 2001 TP12 Tem p Sensor TP10 3V3_AD C 3V3_VCC R19 10.0k R7 22 JP1 C24 4.7nF M SP_CLK M SP_M ISO C19 4.7uF C1 1.0uF 3V3_VCC R10 15.4k VIN 2.00k I_SEN SE 4700pF SLEEP M SP_RST M SP_M ISO M SP_TEST TP18 M SP_CLK 3V3_VCC CO M M + CO M M - 1.0uF M SP_SYN C 3 P1.1 4 P1.2 XO U T 12 TEST 11 M SP_TEST 5 P1.3 6 P1.4 RST 10 P1.7 9 C12 1000pF 7 P1.5 P1.6 8 M SP_M O SI M SP_RD Y R33 10.0k R15 V33D 33 41 V33FB 48 REFIN BPCAP35 JTAG _TRSTN31 JTAG _TM S30 JTAG _TD I29 5 RESET U1 JTAG _TD O28 BQ 500211RG ZJTAG _TCK27 4 AIN 8 PM B_CTRL20 3 AIN 3 PM B_ALRT19 2 T_SEN SE AIN 5 PM B_D ATA11 1 PM B_CLK10 46 V_IN 45 AIN 7 D PW M _A12 42 I_IN D PM B_B13 M SP_SYN C14 D O U T_2B15 SLEEP 6 D O U T_4A16 7 M SP_RST/LED _A D O U T_4B17 8 M SP_M ISO /LED _B 9 M SP_TEST 18 M SP_TCK/CLK M SP_TD O /PRO G26 21 D O U T_TX M SP_M O SI/LPW R_EN 25 22 D RV_CFG BU Z_D C24 BU Z_AC23 37 CO M M _A+ R45 38 CO M M _A10.0k 39 CO M M _B+ LED _M O D E44 40 CO M M _BPM O D _TH R43 BQ 500211 1 C3 47 AG N D 36 AG N D 32 D G N D 49 EPAD 10K R9 JP4 R11 4.7uF 10.0k R30 G N D 14 XIN 13 AG N D 100k R20 C4 C5 V33A34 3V3_VCC 1 VCC 2 P1.0 R28 470 1.0uF C20 R27 470 1 R8 10.0k /TRST TM S TD I TD O TCK STATU S PM _D ATA PM _CLK R47 10.0 D4 H SM F-C165 R2 10.0 TP17 TP16 D PW M -1A M SP_SYN C D PW M -1B R48 10.0k M SP_RD Y M SP_M O SI TP8 R17 10.0k AG N D BU Z R44 475 R22 JP3 R23 42.2k JP2 D5 LTST-C190G KT Parts w ith no values are not installed Figure 2. bq500211EVM-045 Schematic, Page 2 of 3 6 bq500211 bqTESLA Wireless Power TX EVM SLVU536A – June 2012 – Revised October 2012 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Schematic and Bill of Materials www.ti.com J4 14 13 12 11 10 9 8 7 6 5 4 3 2 1 TCK TD O TD I /TRST TM S 1 2 3 4 5 6 7 8 9 10 PM _CLK PM _D ATA J3 R40 R41 10.0k 10.0k 3V3_VCC R43 10.0k R21 R31 R35 R38 R49 R39 R42 3V3_VCC SH D 1 Figure 3. bq500211EVM-045 Schematic, Page 3 of 3 SLVU536A – June 2012 – Revised October 2012 Submit Documentation Feedback bq500211 bqTESLA Wireless Power TX EVM Copyright © 2012, Texas Instruments Incorporated 7 Schematic and Bill of Materials www.ti.com Table 2. Bill of Materials Count RefDes Value Description Size Part Number MFR 1 BUZ Buzzer Piezoelectronic, 12 mm 12 mm PS1240P02CT3 TDK 1 C14 33pF Capacitor, Ceramic, 50V, C0G, 5% 0603 Std Std 1 C12 1000pF Capacitor, Ceramic, 10V, COG, 5% 0603 Std Std 2 C4, C18, C24 4700pF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std 2 C16, C10 0.01uF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std 4 C13, C21, C17, C9 0.1uF Capacitor, Ceramic, 50V, X7R, 10% 0603 Std Std 4 C27, C28, C29, C30 100nF Capacitor, Ceramic, COG, 50V, 5% 1812 C4532COG1H104J TDK 2 C15, C6 0.22uF Capacitor, Ceramic, 50V, X7R, 20% 0603 Std Std 4 C1, C3, C8, C20 1.0uF Capacitor, Ceramic, 16V, X7R, 20% 0603 Std Std 7 C22, C25, C5, C11, C19, C26, 4.7uF C2 Capacitor, Ceramic, 10V, X5R, 20% 0603 Std Std 2 C23, C7 22uF Capacitor, Ceramic, 25V, X5R, 20% 1210 Std Std 2 D1, D5 LTST-C190GKT Diode, LED, Green, 2.1-V, 20-mA, 6-mcd 0603 LTST-C190GKT Lite On 1 D2 BAT54SW Diode, Dual Schottky, 200mA, 30V SOT523 BAT54SWT1G On Semi 0 D3 Open Diode, Schottky, 0.5A, 30V SOD-123 MMSZ5251BT1G On Semi 1 D4 HSMF-C165 Diode, Bi-Color LED, [GRN/RED] 20mA, 52 mW Max. 0603 HSMF-C165 Avago 1 L1 1.0 uH Inductor, SMT, 800 mA, ±20% 0805 LQM21PN1R0MC0 Murata Alternate L1 1.0 uH Inductor, SMT, 800 mA, ±20% 0805 74479775210 Wurth L2 6.3 uH Inductor, WPC TX Coil 53 × 53 mm TXL05001A (or B) Mingstar 1 Alternate L2 6.3 uH Inductor, WPC TX Coil 52 X 53 mm 760-308-105 Wurth 4 Q1, Q2, Q3, Q5 CSD17308Q3 MOSFET, NChan, 30V, 13A, 9.4 milliOhm QFN3.3x3.3 mm CSD17308Q3 TI 2 Q4, Q7 BSS138 MOSFET, Nch, 50V, 0.22A, 3.5 Ohm SOT23 BSS138 Fairchild 1 Q6 BC857C Trans, P-Chan GP, 65V, 100mA, SOT-23 BC857 Philips 1 R10 15.4k Resistor, Chip, 1/16W, 1% 0603 Std Std 1 R11 2.00k Resistor, Chip, 1/16W, 1% 0603 Std Std 2 R13, R34 0 Resistor, Chip, 1/16W, 1% 0603 Std Std 1 R32 0.020 Ohm Resistor, Chip, 1/4W, 1%, 200ppm 0805 ERJ-6BWFR020V Panasonic 6 R1-3, R24, R26, R29 10 Resistor, Chip, 1/16W, 1% 0603 Std Std 1 R7 22 Resistor, Chip, 1/10W, 1% 0805 Std Std 2 R36, R37 200 Resistor, Chip, 1/16W, 1% 0603 Std Std 1 R4 365 Resistor, Chip, 1/16W, 1% 0603 Std Std 2 R27, R28 470 Resistor, Chip, 1/16W, 1% 0603 Std Std 1 R38 475 Resistor, Chip, 1/16W, 1% 0603 Std Std 8 bq500211 bqTESLA Wireless Power TX EVM SLVU536A – June 2012 – Revised October 2012 Submit Documentation Feedback Copyright © 2012, Texas Instruments Incorporated Schematic and Bill of Materials www.ti.com Table 2. Bill of Materials (continued) Count RefDes Value Description Size Part Number MFR 15 R5, R8, R9, R12, R16-19, R30, R31, R33, R35, R39, R40, R43 10.0k Resistor, Chip, 1/16W, 1% 0603 Std Std 1 R14 23.2k Resistor, Chip, 1/16W, 1% 0603 Std Std 1 R23 42.2k Resistor, Chip, 1/16W, 1% 0603 Std Std 2 R6, R20 100k Resistor, Chip, 1/16W, 1% 0603 Std Std 1 R20 100k Resistor, Chip, 1/16W, 1% 0402 Std Std 1 R25 523k Resistor, Chip, 1/16W, 1% 0603 Std Std 0 R15, R22, R21, R31, R35, R49, R39, R42 Open Resistor, Chip, 1/16W, 1% 0603 Std Std 1 U1 BQ500211RGZ IC, Qi Compliant Wireless Power Transmitter Manager 7X7 QFN BQ500211RGZ (R/T) TI 2 U2 U6 TPS28225D IC, High Frequency 4-Amp Sink Synchronous Buck MOSFET SO8 Driver TPS28225D TI 1 U4 MSP430G2001 IC, Mixed Signal Microcontroller TSSOP MSP430G2001IPW14 TI 1 U5 TPS62237DRY IC, 3MHz Ultra Small Step Down Converter, 3.3 V USON TPS62237DRY TI 1 U7 LMV931IDCK IC, Single Op-Amp R-R In/Out put SC-70 LMV931IDCK TI 1 U8 TLV70033DCK IC, 150mA, Low IQ, LDO Regulator SOT TLV70033DCK TI 0 SHD1 Open Shield, Copper 44.4x44.4 mm BMI-S-207-F Laird Tech SLVU536A – June 2012 – Revised October 2012 Submit Documentation Feedback bq500211 bqTESLA Wireless Power TX EVM Copyright © 2012, Texas Instruments Incorporated 9 Test Setup www.ti.com 6 Test Setup 6.1 Equipment 6.1.1 bqTESLA™ Receiver Use the bq51013AEVM-764 or a Qi-compliant receiver to work with this EVM. 6.1.2 Voltage Source The input voltage source must provide a regulated DC voltage of 5 V and deliver at least 2-A continuous load current; current limit must be set to 3 A. CAUTION To help assure safety integrity of the system and minimize risk of electrical shock hazard, always use a power supply providing suitable isolation and supplemental insulation (double insulated). Compliance to IEC 61010-1, Safety Requirements for Electrical Equipment for Measurement, Control and Laboratory Use, Part 1, General Requirements, or its equivalent is strongly suggested, including any required regional regulatory compliance certification approvals. Always select a power source that is suitably rated for use with this EVM as referenced in this user manual. 6.1.3 Meters Monitor the output voltage at the bq51013AEVM-764 test point TP7 with a voltmeter. Monitor the input current into the load with an appropriate ammeter. You can also monitor the transmitter input current and voltage, but the meter must use the averaging function for reducing error, due to communications packets. 6.1.4 Loads A single load is required at 5 V with a maximum current of 1 A. The load can be resistive or electronic. 6.1.5 Oscilloscope Use a dual-channel oscilloscope with appropriate probes to observe the COMM_DRV signal at bq51013AEVM-764 TP3 and other signals. 6.1.6 Recommended Wire Gauge For proper operation, use 22-AWG wire when connecting the bq500211EVM-045 to the input supply and the bq51013AEVM-764 to the load. 6.2 Equipment Setup • • • 6.2.1 With the power supply OFF, connect the supply to the bqTESLA™ transmitter. Connect the VIN positive power source to J1, and connect the negative terminal of the VIN source to J2. Do not place the bqTESLA™ receiver on the transmitter. Connect a load to J3 with a return to J4, monitor current through the load with the ammeter, and monitor the current to the load at TP7. All voltmeters must be Kelvin connected (at the pin) to the point of interest. Equipment Setup Diagram The diagram in Figure 4 shows the test setup. 10 bq500211 bqTESLA Wireless Power TX EVM Copyright © 2012, Texas Instruments Incorporated SLVU536A – June 2012 – Revised October 2012 Submit Documentation Feedback Test Setup www.ti.com Wireless Transmitter bq500211EVM-045 Wireless Receiver bq51013EVM-725 A OUT_J2 J1 POS A VIN + - TP1 AC1 LP V J2 RTN V AC1 Voltmeter TP2 AC2 OUT_TP7 VRECT_TP12 LS V RL AC2 GND_J4 A Ammeter + - Power Supply Oscilloscope Figure 4. Equipment Setup 6.2.2 EVM Procedures This section guides the user through a few general test procedures to exercise the functionality of the presented hardware. Some key notes follow. 6.2.2.1 Start-Up No Receiver Turn on VIN, and observe that the green power LED, D1, illuminates. Status LED D5 is off until the power transfer starts. Apply the scope probe to the test point, TP1, and observe single-pulse bursts approximately every 400 ms. This is an analog ping probing environment for the presence of a receiver placed on the TX coil. 6.2.2.2 Apply Receivers Place the bq51013AEVM-764 EVM on the top of the transmitting coil. Align the centers of the receiving and transmitting coils across each other. In the next few seconds, observe that the status LED, D5, flashes green, indicating that communication between the transmitter and the receiver is established and that power transfer has started. • The buzzer sounds at the start of power transfer. The status LED, D4, flashes a green light during power transfer. • Typical output voltage is 5 V, and the output current range is 0 mA to 1 A. • Observe a continuous sine-wave on the test point TP1 when power transfer is active; the frequency is between 110 kHz and 205 kHz. • Make tests and measurements applicable to a normal 5-V power supply. 6.2.2.3 Efficiency To measure system efficiency, measure the output voltage, the output current, input voltage, and input current and calculate efficiency as the ratio of the output power to the input power. Connect voltage meters at the input and output of TX and RX (see Figure 4). Average the input current; the comm pulses modulate the input current, distorting the reading. See Figure 5 for efficiency. SLVU536A – June 2012 – Revised October 2012 Submit Documentation Feedback bq500211 bqTESLA Wireless Power TX EVM Copyright © 2012, Texas Instruments Incorporated 11 bq500211EVM-045 Assembly Drawings and Layout www.ti.com 80 70 Efficiency (%) 60 50 40 30 20 10 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 Power (W) 4.5 5.0 C001 Figure 5. Efficiency versus Power, bq500211EVM-045 Transmitter and HPA764 Receiver 6.2.2.4 Dynamic Power Limiting™ Dynamic Power Limiting™ (DPL) allows operation from a 5-V supply with limited current capability. DPL is controlled by JP4, which pulls U1 pin 4 high or low. With the jumper open (pin 4 High) the IC monitors input voltage and when that voltage is observed drooping, the output power is limited to reduce the load and provide some operating margin relative to the supply’s capability. With a shorting jumper installed (pin 4 Low), the IC restricts output power such that the input current remains below 500 mA, compatible with a USB port. See the data sheet for additional information on the DPL function 6.2.2.5 Thermal Protection, NTC Thermal protection is provided by an NTC resistor connected to JP1. At 1 V on the sense side (U1-2), the thermal fault is set, and the unit is shut down, The status LED, D5, illuminates red. The typical resistor value for fault is 850 Ω. The system tries to restart in 5 minutes. 7 bq500211EVM-045 Assembly Drawings and Layout Figure 6 through Figure 11 show the design of the bq500211EVM PCB. The EVM has been designed using a 4-layer, 2-oz, copper-clad circuit board 13.2 cm × 7.24 cm with all components in a 4.5-cm x 4.5cm active area on the top side and all active traces to the top and bottom layers to allow the user to easily view, probe, and evaluate the bq500211 control IC in a practical application. Moving components to both sides of the PCB or using additional internal layers offers additional size reduction for space-constrained systems. Gerber files are available for download from the EVM product folder. A 4-layer PCB design is recommended to provide a good low-noise ground plane for all circuits. A 2-layer PCB presents a high risk of poor performance. Grounding between the bq500211 GND pin 47, 36 and 32 and filter capacitor returns C19, C1, C5 and C3 should be a good low-impedance path. Coil Grounding – A ground plane area under the coil is recommended to reduce noise coupling into the receiver. The ground plane for the EVM is slightly larger than the coil footprint and grounded at one point back to the circuit area. Note: The clear plastic cover thickness is 0.93 in, or 2.4 mm is the z-gap thickness for the transmitter. 12 bq500211 bqTESLA Wireless Power TX EVM Copyright © 2012, Texas Instruments Incorporated SLVU536A – June 2012 – Revised October 2012 Submit Documentation Feedback bq500211EVM-045 Assembly Drawings and Layout www.ti.com Figure 6. Assembly Top Figure 7. Top Silk SLVU536A – June 2012 – Revised October 2012 Submit Documentation Feedback bq500211 bqTESLA Wireless Power TX EVM Copyright © 2012, Texas Instruments Incorporated 13 bq500211EVM-045 Assembly Drawings and Layout www.ti.com Figure 8. Top Layer Figure 9. Layer 2 14 bq500211 bqTESLA Wireless Power TX EVM Copyright © 2012, Texas Instruments Incorporated SLVU536A – June 2012 – Revised October 2012 Submit Documentation Feedback bq500211EVM-045 Assembly Drawings and Layout www.ti.com Figure 10. Layer 3 Figure 11. Bottom Layer SLVU536A – June 2012 – Revised October 2012 Submit Documentation Feedback bq500211 bqTESLA Wireless Power TX EVM Copyright © 2012, Texas Instruments Incorporated 15 Reference 8 www.ti.com Reference For additional information about the bq500211EVM-045 low-power, wireless, power evaluation kit from Texas Instruments, visit the product folder on the TI Web site at http://focus.ti.com/docs/toolsw/folders/print/bq500211.html. 16 bq500211 bqTESLA Wireless Power TX EVM Copyright © 2012, Texas Instruments Incorporated SLVU536A – June 2012 – Revised October 2012 Submit Documentation Feedback EVALUATION BOARD/KIT/MODULE (EVM) ADDITIONAL TERMS Texas Instruments (TI) provides the enclosed Evaluation Board/Kit/Module (EVM) under the following conditions: The user assumes all responsibility and liability for proper and safe handling of the goods. Further, the user indemnifies TI from all claims arising from the handling or use of the goods. Should this evaluation board/kit not meet the specifications indicated in the User’s Guide, the board/kit may be returned within 30 days from the date of delivery for a full refund. THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES, EXPRESSED, IMPLIED, OR STATUTORY, INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE. EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE, NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT, SPECIAL, INCIDENTAL, OR CONSEQUENTIAL DAMAGES. Please read the User's Guide and, specifically, the Warnings and Restrictions notice in the User's Guide prior to handling the product. This notice contains important safety information about temperatures and voltages. For additional information on TI's environmental and/or safety programs, please visit www.ti.com/esh or contact TI. No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine, process, or combination in which such TI products or services might be or are used. TI currently deals with a variety of customers for products, and therefore our arrangement with the user is not exclusive. TI assumes no liability for applications assistance, customer product design, software performance, or infringement of patents or services described herein. REGULATORY COMPLIANCE INFORMATION As noted in the EVM User’s Guide and/or EVM itself, this EVM is subject to the Federal Communications Commission (FCC), Industry Canada (IC) and European Union CE Mark rules. FCC – FEDERAL COMMUNICATIONS COMMISSION Part 18 Compliant Note: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 18 of the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more of the following measures:—Reorient or relocate the receiving antenna. • Increase the separation between the equipment and receiver. • Connect the equipment into an outlet on a circuit different from that to which the receiver is connected. • Consult the dealer or an experienced radio/TV technician for help. Note: There is no required maintenance of this device from a FCC compliance perspective. IC – INDUSTRY CANADA ICES-001 Compliant This ISM device complies with Canadian ICES-001. Cet appareil ISM est conforme à la norme NMB-001 du Canada. European Union CE Mark This ISM device complies with Directive 2004/108/EC of the European Parliament and of the Council of 15 December 2004 on the approximation of the laws of the Member States relating to electromagnetic compatibility and repealing Directive 89/336/EEC – the EMC Directive, tested to EN55011: 2007, Industrial Scientific and Medical (ISM) radio-frequency equipment. SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER SPACER EVALUATION BOARD/KIT/MODULE (EVM) WARNINGS, RESTRICTIONS AND DISCLAIMERS For Feasibility Evaluation Only, in Laboratory/Development Environments. Unless otherwise indicated, this EVM is not a finished electrical equipment and not intended for consumer use. It is intended solely for use for preliminary feasibility evaluation in laboratory/development environments by technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components, systems and subsystems. It should not be used as all or part of a finished end product. Your Sole Responsibility and Risk. You acknowledge, represent and agree that: 1. 2. 3. 4. You have unique knowledge concerning Federal, State and local regulatory requirements (including but not limited to Food and Drug Administration regulations, if applicable) which relate to your products and which relate to your use (and/or that of your employees, affiliates, contractors or designees) of the EVM for evaluation, testing and other purposes. You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable regulatory requirements, and also to assure the safety of any activities to be conducted by you and/or your employees, affiliates, contractors or designees, using the EVM. Further, you are responsible to assure that any interfaces (electronic and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard. You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage, injury or death, even if the EVM should fail to perform as described or expected. You will take care of proper disposal and recycling of the EVM’s electronic components and packing materials. Certain Instructions. It is important to operate this EVM within TI’s recommended specifications and environmental considerations per the user guidelines. Exceeding the specified EVM ratings (including but not limited to input and output voltage, current, power, and environmental ranges) may cause property damage, personal injury or death. If there are questions concerning these ratings please contact a TI field representative prior to connecting interface electronics including input power and intended loads. Any loads applied outside of the specified output range may result in unintended and/or inaccurate operation and/or possible permanent damage to the EVM and/or interface electronics. Please consult the EVM User's Guide prior to connecting any load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative. During normal operation, some circuit components may have case temperatures greater than 60°C as long as the input and output are maintained at a normal ambient operating temperature. These components include but are not limited to linear regulators, switching transistors, pass transistors, and current sense resistors which can be identified using the EVM schematic located in the EVM User's Guide. When placing measurement probes near these devices during normal operation, please be aware that these devices may be very warm to the touch. As with all electronic evaluation tools, only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in development environments should use these EVMs. Agreement to Defend, Indemnify and Hold Harmless. You agree to defend, indemnify and hold TI, its licensors and their representatives harmless from and against any and all claims, damages, losses, expenses, costs and liabilities (collectively, "Claims") arising out of or in connection with any use of the EVM that is not in accordance with the terms of the agreement. This obligation shall apply whether Claims arise under law of tort or contract or any other legal theory, and even if the EVM fails to perform as described or expected. Safety-Critical or Life-Critical Applications. If you intend to evaluate the components for possible use in safety critical applications (such as life support) where a failure of the TI product would reasonably be expected to cause severe personal injury or death, such as devices which are classified as FDA Class III or similar classification, then you must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement. 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