CSD88539ND
SLPS456 – FEBRUARY 2014
CSD88539ND, Dual 60 V N-Channel NexFET™ Power MOSFETs
1 Features
•
•
•
•
•
1
Product Summary
Ultra-Low Qg and Qgd
Avalanche Rated
Pb Free
RoHS Compliant
Halogen Free
TA = 25°C
2 Applications
•
•
TYPICAL VALUE
Drain-to-Source Voltage
60
V
Qg
Gate Charge Total (10 V)
7.2
nC
Qgd
Gate Charge Gate to Drain
RDS(on)
Drain-to-Source On Resistance
VGS(th)
Threshold Voltage
Half Bridge for Motor Control
Synchronous Buck Converter
1.1
This dual SO-8, 60 V, 23 mΩ NexFET™ power
MOSFET is designed to serve as a half bridge in lowcurrent motor control applications.
27
mΩ
VGS = 10 V
23
mΩ
3.0
Top View
8
2
G1
7
3
S2
6
4
G2
V
Device
Qty
Media
Package
Ship
CSD88539ND
2500
13-Inch Reel
CSD88539NDT
250
7-Inch Reel
SO-8 Plastic
Package
Tape and
Reel
Absolute Maximum Ratings
TA = 25°C
1
nC
VGS = 6 V
Ordering Information
3 Description
S1
UNIT
VDS
5
D1
VALUE
UNIT
VDS
Drain-to-Source Voltage
60
V
VGS
Gate-to-Source Voltage
±20
V
Continuous Drain Current (Package limited)
15
ID
Continuous Drain Current (Silicon limited),
TC = 25°C
11.7
(1)
Continuous Drain Current
D1
D2
D2
A
6.3
IDM
Pulsed Drain Current (2)
46
A
PD
Power Dissipation(1)
2.1
W
TJ,
TSTG
Operating Junction and Storage
Temperature Range
–55 to 150
°C
EAS
Avalanche Energy, single pulse
ID = 22 A, L = 0.1 mH, RG = 25 Ω
24
mJ
(1) Typical RθJA = 60°C/W on a 1-inch2, 2-oz. Cu pad on a 0.06inch thick FR4 PCB
(2) Pulse duration ≤ 300 μs, duty cycle ≤ 2%
RDS(on) vs VGS
Gate Charge
10
TC = 25°C, I D = 5A
TC = 125°C, I D = 5A
54
VGS - Gate-to-Source Voltage (V)
RDS(on) - On-State Resistance (mΩ)
60
48
42
36
30
24
18
12
6
0
0
2
4
6
8
10
12
14
16
VGS - Gate-to- Source Voltage (V)
18
20
G001
ID = 5A
VDS = 30V
9
8
7
6
5
4
3
2
1
0
0
1
2
3
4
5
Qg - Gate Charge (nC)
6
7
8
G001
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
CSD88539ND
SLPS456 – FEBRUARY 2014
www.ti.com
4 Specifications
4.1
Electrical Characteristics
(TA = 25°C unless otherwise stated)
PARAMETER
TEST CONDITIONS
MIN
TYP
MAX
UNIT
Static Characteristics
BVDSS
Drain-to-Source Voltage
VGS = 0 V, ID = 250 μA
IDSS
Drain-to-Source Leakage Current
VGS = 0 V, VDS = 48 V
1
μA
IGSS
Gate-to-Source Leakage Current
VDS = 0 V, VGS = 20 V
100
nA
VGS(th)
Gate-to-Source Threshold Voltage
VDS = VGS, ID = 250 μA
RDS(on)
Drain-to-Source On Resistance
gfs
Transconductance
60
2.6
V
3.0
3.6
V
VGS = 6 V, ID = 5 A
27
34
mΩ
VGS = 10 V, ID = 5 A
23
28
mΩ
VDS = 30 V, ID = 5 A
19
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
RG
Series Gate Resistance
Qg
Gate Charge Total (10 V)
Qgd
Gate Charge Gate to Drain
Qgs
Gate Charge Gate to Source
Qg(th)
Gate Charge at Vth
Qoss
Output Charge
td(on)
Turn On Delay Time
tr
Rise Time
td(off)
Turn Off Delay Time
tf
Fall Time
VGS = 0 V, VDS = 30 V, f = 1 MHz
VDS = 30 V, ID = 5 A
VDS = 30 V, VGS = 0 V
VDS = 30 V, VGS = 10 V, IDS = 5 A, RG = 0 Ω
570
741
pF
70
91
pF
2.0
2.6
pF
6.6
13.2
Ω
7.2
9.4
nC
1.1
nC
2.7
nC
1.8
nC
9.6
nC
5
ns
9
ns
14
ns
4
ns
Diode Characteristics
VSD
Diode Forward Voltage
Qrr
Reverse Recovery Charge
trr
Reverse Recovery Time
ISD = 5 A, VGS = 0 V
0.8
VDS= 30 V, IF = 5A, di/dt = 300A/μs
1
V
37
nC
21
ns
4.2 Thermal Characteristics
(TA = 25°C unless otherwise stated)
MAX
UNIT
RθJL
Junction-to-Lead Thermal Resistance (1)
PARAMETER
20
°C/W
RθJA
Junction-to-Ambient Thermal Resistance (1) (2)
75
°C/W
(1)
(2)
2
MIN
TYP
RθJC is determined with the device mounted on a 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu pad on a 1.5-inch × 1.5-inch (3.81-cm ×
3.81-cm), 0.06-inch (1.52-mm) thick FR4 PCB. RθJC is specified by design, whereas RθJA is determined by the user’s board design.
Device mounted on FR4 material with 1-inch2 (6.45-cm2), 2-oz. (0.071-mm thick) Cu.
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SLPS456 – FEBRUARY 2014
4.3 Typical MOSFET Characteristics
(TA = 25°C unless otherwise stated)
50
40
45
36
IDS - Drain-to-Source Current (A)
IDS - Drain-to-Source Current (A)
Figure 1. Transient Thermal Impedance
40
35
30
25
20
15
VGS =10V
VGS =8V
VGS =6V
10
5
0
0
0.2
0.4 0.6 0.8
1
1.2 1.4 1.6
VDS - Drain-to-Source Voltage (V)
1.8
2
VDS = 5V
32
28
24
20
16
12
TC = 125°C
TC = 25°C
TC = −55°C
8
4
0
0
G001
Figure 2. Saturation Characteristics
1
2
3
4
VGS - Gate-to-Source Voltage (V)
5
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G001
Figure 3. Transfer Characteristics
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6
3
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SLPS456 – FEBRUARY 2014
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Typical MOSFET Characteristics (continued)
(TA = 25°C unless otherwise stated)
10000
Ciss = Cgd + Cgs
Coss = Cds + Cgd
Crss = Cgd
ID = 5A
VDS = 30V
9
8
C − Capacitance (pF)
VGS - Gate-to-Source Voltage (V)
10
7
6
5
4
3
1000
100
10
2
1
0
0
1
2
3
4
5
Qg - Gate Charge (nC)
6
7
1
8
0
6
12
G001
Figure 4. Gate Charge
RDS(on) - On-State Resistance (mΩ)
VGS(th) - Threshold Voltage (V)
60
G001
60
ID = 250uA
3.4
3.2
3
2.8
2.6
2.4
2.2
2
−75
−25
25
75
125
TC - Case Temperature (ºC)
42
36
30
24
18
12
6
0
2
4
6
8
10
12
14
16
VGS - Gate-to- Source Voltage (V)
18
20
G001
Figure 7. On-State Resistance vs Gate-to-Source Voltage
100
ISD − Source-to-Drain Current (A)
VGS = 6V
VGS = 10V
1.8
1.6
1.4
1.2
1
0.8
0.6
0.4
−75
48
G001
Figure 6. Threshold Voltage vs Temperature
2
TC = 25°C, I D = 5A
TC = 125°C, I D = 5A
54
0
175
2.2
Normalized On-State Resistance
54
Figure 5. Capacitance
3.6
TC = 25°C
TC = 125°C
10
1
0.1
0.01
0.001
ID = 5A
−25
25
75
125
TC - Case Temperature (ºC)
175
0.0001
0
0.2
0.4
0.6
0.8
VSD − Source-to-Drain Voltage (V)
G001
Figure 8. Normalized On-State Resistance vs Temperature
4
18
24
30
36
42
48
VDS - Drain-to-Source Voltage (V)
1
G001
Figure 9. Typical Diode Forward Voltage
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SLPS456 – FEBRUARY 2014
Typical MOSFET Characteristics (continued)
(TA = 25°C unless otherwise stated)
100
10us
100us
1ms
10ms
DC
IAV - Peak Avalanche Current (A)
IDS - Drain-to-Source Current (A)
1000
100
10
1
Single Pulse
Max RthetaJL = 20ºC/W
0.1
0.1
1
10
VDS - Drain-to-Source Voltage (V)
100
TC = 25ºC
TC = 125ºC
10
1
0.01
0.1
TAV - Time in Avalanche (mS)
G001
Figure 10. Maximum Safe Operating Area
1
G001
Figure 11. Single Pulse Unclamped Inductive Switching
IDS - Drain- to- Source Current (A)
18
15
12
9
6
3
0
−50
−25
0
25
50
75
100 125
TC - Case Temperature (ºC)
150
175
G001
Figure 12. Maximum Drain Current vs Temperature
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CSD88539ND
SLPS456 – FEBRUARY 2014
www.ti.com
5 Mechanical Data
5.1 SO-8 Package Dimensions
1. All linear dimensions are in inches (millimeters).
2. This drawing is subject to change without notice.
3. Body length does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs
shall not exceed 0.006 (0,15) each side.
4. Body width does not include interlead flash. Interlead flas shall not exceed 0.017 (0,43) each side.
5. Reference JEDEC MS-012 variation AA.
6
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SLPS456 – FEBRUARY 2014
5.2 Recommended PCB Pattern and Stencil Opening
1.
2.
3.
4.
All linear dimensions are in millimeters.
This drawing is subject to change without notice.
Publication IPC-7351 is recommended for alternate designs.
Laser cutting apertures with trapezoidal walls and also rounding corners will offer better paste release.
Customers should contact their board assembly site for stencil design recommendations. Refer to IPC-7525
for other stencil recommendations.
5. Customers should contact their board fabrication site for solder mask tolerances between and around signal
pads.
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CSD88539ND
SLPS456 – FEBRUARY 2014
www.ti.com
6 Device and Documentation Support
6.1 Trademarks
NexFET is a trademark of Texas Instruments.
6.2 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
8
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PACKAGE OPTION ADDENDUM
www.ti.com
10-Dec-2020
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
(2)
Lead finish/
Ball material
MSL Peak Temp
Op Temp (°C)
Device Marking
(3)
(4/5)
(6)
CSD88539ND
ACTIVE
SOIC
D
8
2500
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 150
88539N
CSD88539NDT
ACTIVE
SOIC
D
8
250
RoHS & Green
NIPDAU
Level-1-260C-UNLIM
-55 to 150
88539N
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of