DS90UB921-Q1EVM
User's Guide
Literature Number: SNLU205
March 2016
Contents
1
DS90UB921-Q1EVM User's Guide
1.1
1.2
1.3
1.4
1.5
1.6
1.7
1.8
1.9
1.10
1.11
1.12
1.13
1.14
1.15
1.16
.......................................................................................... 5
General Description ......................................................................................................... 5
Features ....................................................................................................................... 5
System Requirements ...................................................................................................... 6
Contents of the Demo Evaluation Kit ..................................................................................... 6
Applications Diagram ........................................................................................................ 6
Typical Configuration ........................................................................................................ 7
Quick Start Guide ............................................................................................................ 8
Default Jumper Settings .................................................................................................... 9
Default Switch Settings ..................................................................................................... 9
Demo Board Connections ................................................................................................. 10
Single-ended (Coax) and Differential (STP) Operation Configuration ............................................... 12
ALP Software Setup ....................................................................................................... 15
1.12.1 System Requirements ........................................................................................... 15
1.12.2 Download Contents .............................................................................................. 15
1.12.3 Installation of the ALP Software ................................................................................ 15
1.12.4 Startup - Software Description.................................................................................. 16
1.12.5 Information Tab ................................................................................................... 19
1.12.6 Pattern Generator Tab........................................................................................... 20
1.12.7 Registers Tab ..................................................................................................... 21
1.12.8 Registers Tab - Address 0x00 selected ....................................................................... 22
1.12.9 Scripting Tab ...................................................................................................... 24
Troubleshooting ALP Software ........................................................................................... 25
1.13.1 ALP Loads the Incorrect Profile ................................................................................ 25
1.13.2 ALP does not detect the EVM .................................................................................. 27
Typical Connection and Test Equipment ................................................................................ 29
Equipment References .................................................................................................... 30
Cable References .......................................................................................................... 30
2
Bill of Materials .................................................................................................................. 31
A
EVM PCB Schematics ......................................................................................................... 38
B
Board Layout ..................................................................................................................... 45
2
Contents
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List of Figures
1-1.
Applications Diagram ........................................................................................................ 6
1-2.
Typical Configuration ........................................................................................................ 7
1-3.
Interfacing to the EVM
1-4.
Single-Ended (Coax) at Top Layer ....................................................................................... 12
1-5.
........................................................................
Differential (STP) at Bottom Layer .......................................................................................
Differential (STP) Configuration Schematic .............................................................................
Launching ALP .............................................................................................................
Initial ALP Screen ..........................................................................................................
Follow-up Screen ...........................................................................................................
ALP Information Tab .......................................................................................................
ALP Pattern Generator Tab ...............................................................................................
ALP Registers Tab .........................................................................................................
ALP Device ID Selected ...................................................................................................
ALP Scripting Tab ..........................................................................................................
USB2ANY Setup ...........................................................................................................
Remove Incorrect Profile ..................................................................................................
Add Correct Profile .........................................................................................................
ALP No Devices Error .....................................................................................................
Windows 7, ALP USB Driver .............................................................................................
ALP in Demo Mode ........................................................................................................
ALP Preferences Menu ....................................................................................................
Typical Test Setup for Video Application ................................................................................
Typical Test Setup for Evaluation ........................................................................................
Top Layer....................................................................................................................
Inner GND Layer ...........................................................................................................
Inner Power Supply Layer.................................................................................................
Inner GND Layer ...........................................................................................................
Inner Power Supply Layer.................................................................................................
Bottom Layer ................................................................................................................
1-6.
1-7.
1-8.
1-9.
1-10.
1-11.
1-12.
1-13.
1-14.
1-15.
1-16.
1-17.
1-18.
1-19.
1-20.
1-21.
1-22.
1-23.
1-24.
B-1.
B-2.
B-3.
B-4.
B-5.
B-6.
......................................................................................................
Single-Ended (Coax) Configuration Schematic
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List of Figures
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8
13
13
14
16
17
18
19
20
21
22
24
25
25
26
27
27
28
28
29
29
45
46
47
48
49
50
3
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List of Tables
Default Board Jumper Settings
1-2.
Default Board Switch Settings
1-3.
1-4.
1-5.
1-6.
1-7.
1-8.
1-9.
2-1.
4
............................................................................................ 9
............................................................................................. 9
Power Supply ............................................................................................................... 10
USB2ANY Connector ...................................................................................................... 10
I2C Interface Header ....................................................................................................... 10
MODE_SEL Settings....................................................................................................... 10
Configuration Select (MODE_SEL) -- SW-DIP8 - S1 .................................................................. 10
Low Frequency (LFMODE) and Intermediate Freuqncy (IFMODE) - SW-DIP2 - S4.............................. 11
IDx SW-DIP8 - S2 ......................................................................................................... 11
Bill of Materials ............................................................................................................. 31
1-1.
List of Tables
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Chapter 1
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DS90UB921-Q1EVM User's Guide
1.1
General Description
The DS90UB921-Q1EVM (Evaluation Module) is 24-bit Color FPD-Link III Serializer with Bidirectional
Control Channel. This kit will demonstrate the functionality and operation of the DS90UB921-Q1. The
DS90UB921-Q1 is in conjunction with the DS90UB922-Q1, DS90UB926Q-Q1, DS90UB928Q-Q1,
DS90UB940-Q1, and DS90UB948-Q1 Deserializers, provides a complete digital interface for concurrent
transmission of high-speed video, audio, and control data for automotive display and image sensing
applications. The DS90UB921-Q1 supports Extended High Definition (1920 x 720p / 60Hz) Digital Video
Format with 24-bit color depth.
The DS90UB921-Q1 incorporates an embedded bidirectional control channel and low latency GPIO
controls. The device translates a parallel interface into a single pair high-speed serialized interface. The
serial bus scheme, FPD-Link III, supports full duplex of high-speed video data transmission and
bidirectional control communication over a single link.
The DS90UB921-Q1 supports clocks in the range of 5 MHz to 96 MHz.
WARNING
The demo board is not intended for EMI testing. The demo board was
designed for easy accessibility to device pins with tap points for
monitoring or applying signals, additional pads for termination, and
multiple connector options.
1.2
Features
•
•
•
•
•
•
•
•
•
•
•
•
Supports Extended High Definition (1920x720p/60Hz) Digital Video Format with 24-bit Color Depth
RGB888 + VS, HS, and DE
Parallel LVCMOS Video Inputs
Bidirectional Control Interface Channel Interface with I2C Compatible Serial Control Bus
Up to 10 meters over Differential Shielded Twisted-Pair (STP) cable or Single-Ended Coaxial (Coax)
– STP mode: 5 - 96 MHz Pixel Clock
– Coax mode: 15 - 96 MHz Pixel Clock
Backwards Compatible to DS90UB922-Q1, DS90UB926Q-Q1, DS90UB928-Q1, DS90UB940-Q1, and
DS90UB948-Q1 FPD-Link III Deserializers
4 Optional Bidirectional GPIO Channels
Spread Spectrum Tolerant Input
Single 3.3 V Operation with 1.8 V or 3.3 V Compatible LVCMOS I/O Interface
DC-Balanced and Scrambled Data with Embedded Clock
Internal pattern Generation
Automotive grade product: AEC-Q100 Grade 2 qualified
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System Requirements
1.3
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System Requirements
In order to demonstrate, the following is required:
1. FPD-Link III compatible Deserializer
(a) DS90UB922-Q1, DS90UB940-Q1 and DS90UB948-Q1 up to 96MHz
(b) DS90UB926Q-Q1, and DS90UB928-Q1 up to 85MHz
2. Optional I2C controller
3. Power supply for 3.3V or 12V @ 1A
1.4
Contents of the Demo Evaluation Kit
1. One EVM board with the DS90UB921-Q1
1.5
Applications Diagram
VDDIO
VDD33
(3.3V) (1.8V or 3.3V)
HOST
Graphics
Processor
RGB Digital Display Interface
VDDIO
VDD33
(1.8V or 3.3V) (3.3V)
R[7:0]
G[7:0]
B[7:0]
HS
VS
DE
PCLK
DOUT+
RIN+
DOUT-
RIN-
DS90UB921-Q1
Serializer
PDB
I2S AUDIO
(STEREO)
R[7:0]
G[7:0]
B[7:0]
HS
VS
DE
PCLK
FPD-Link III
1 Coax / AC Coupled
3
SCL
SDA
IDx
MODE_SEL
INTB
DAP
PDB
OSS_SEL
OEN
MODE_SEL
DS90UB922-Q1
Deserializer
SCL
SDA
IDx
LOCK
PASS
3
INTB_IN
RGB Display
720p
24-bit color depth
I2S AUDIO
(STEREO)
MCLK
DAP
Figure 1-1. Applications Diagram
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Typical Configuration
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1.6
Typical Configuration
Video Processor Board
(Video Data+Ctrl+PCLK)
DS90UB921
Video
Processor
(I2C)
Dual FPD-LINK III
Cluster, Head Unit
FPD-Link III
Deserializer
(OpenLDI)
Display
(I2C)
Figure 1-2. Typical Configuration
Figure 1-1 and Figure 1-2 illustrate the use of the chipset in a display application.
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Quick Start Guide
1.7
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Quick Start Guide
1. The DS90UB921-Q1EVM is configured for the single-ended operation by using Coax cable. (default)
2. Connect J28 and J29 (DOUT_P, DOUT_N) to compatible Deserializer e.g. DS90UB922-Q1,
DS90UB926Q-Q1, DS90UB928-Q1, DS90UB940-Q1, and DS90UB948-Q1.
3. Configure switches S1 and S2 to set device’s operating modes
• S1: MODE_SEL = 1 (default factory setting)
• S2: IDx = 0x18 (default factory setting)
4. Connect J23, J24, and J25 to 3.3V.
(a) Optional power options available, J13, 12V (see Table 1-3)
5. Connect J7 with miniUSB (5-pin_ to USB A (4-pin) cable to PC USB port
For details of pin-names and pin-functions, please refer to the DS90UB921-Q1 datasheet.
Figure 1-3. Interfacing to the EVM
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Default Jumper Settings
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1.8
Default Jumper Settings
Ensure that the board has the default board jumper settings:
Table 1-1. Default Board Jumper Settings
1.9
JUMPER
JUMPER SETTINGS
J17
Shorted 3V3 EXT
J21
Shorted VDD33
J22
Shorted
Default Switch Settings
Ensure that the board has the default board switch settings:
Table 1-2. Default Board Switch Settings
SWITCH
SWITCH SETTINGS
S1
8 ON, 1 to 7 OFF
S2
8 ON, 1 to 7 OFF
S4
1 and 2 OFF
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Demo Board Connections
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1.10 Demo Board Connections
Table 1-3. Power Supply
DESIGNATOR
SIGNAL
DESCRIPTION
J12
+12V
12V ±5% Main Power, Single +12V power connector that supplies
power to the entire board.
J17.2
+3.3V
3V3 EXT, 3.3V ±5%, Alternative to Main Power.
J21.3
+3.3V
VDD33, 3.3V ±5%, Alternative to Main Power.
Table 1-4. USB2ANY Connector
DESIGNATOR
DESCRIPTION
J7
mini USB 5 pin
Table 1-5. I2C Interface Header
DESIGNATOR
SIGNAL
J30.1
VDDI2C
J30.2
SCL
J30.3
SDA
J30.4
GND
Configuration of the device may be done via the MODE_SEL[1:0]. These modes are latched into register
location during power-up:
Table 1-6. MODE_SEL Settings
MODE
SETTING
FUNCTION
0
ALTERNATE FREQUENCY
1
REPEATER
18-BIT MODE
See Table 1-7 and Table 1-8
0
Repeater OFF (Default)
1
Repeater ON
0
Normal 24-bit RGB Mode (Default)
1
18-bit RGB Mode. Note: use of GPIO(s) on unused inputs must be enabled
by Register.
Table 1-7. Configuration Select (MODE_SEL) -- SW-DIP8 - S1 (1)
(1)
10
MODE #
ALTERNATE FREQUENCY
REPEATER
18- BIT MODE
1
0
0
0
2
0
1
0
3
0
1
1
4
1
0
0
5
1
0
1
6
1
1
0
7
1
1
1
Only set one high.
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Demo Board Connections
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Table 1-8. Low Frequency (LFMODE) and Intermediate Freuqncy (IFMODE) - SW-DIP2 - S4
FSEL (pin 15 or
Register 0x35[7:6]
ALTERNATE FREQUENCY
(set by MODE_SEL pin or
Register 0x04[1:0])
MODE
PCLK RANGE for COAX
PCLK RANGE for
STP
L
L
HFMODE
N/A
15 - 96 MHz
H
L
HFMODE (default)
48 - 96 MHz
N/A
H
H
IFMODE
24 - 48 MHz
N/A
L
H
LFMODE
15 - 24 MHz
5 - 15 MHz
Table 1-9. IDx SW-DIP8 - S2 (1)
(1)
DESIGNATOR
7-Bit ADDRESS
8-Bit ADDRESS
S2.1 (Default)
0x0C
0x18
S2.2
0x0E
0x1C
S2.3
0x10
0x20
S2.4
0x12
0x24
S2.5
0x14
0x28
S2.6
0x16
0x2C
S2.7
0x18
0x30
S2.8
0x1A
0x34
Only set one high.
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Single-ended (Coax) and Differential (STP) Operation Configuration
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1.11 Single-ended (Coax) and Differential (STP) Operation Configuration
The DS90UB921-Q1EVM supports both Single-ended (Coax) and Differential (STP) operations.
For Single-ended (Coax) operation (default), C82 is 330nF and C84 is 150nF on Top layer. Use SMA
connectors (J28, J29). For Differential (STP) operation, Remove C82 and C84 and populate 100nF on
C80 and C81 on Bottom layer. Use HSD connector (J27).
Figure 1-4. Single-Ended (Coax) at Top Layer
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Single-ended (Coax) and Differential (STP) Operation Configuration
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Figure 1-5. Single-Ended (Coax) Configuration Schematic
Figure 1-6. Differential (STP) at Bottom Layer
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Single-ended (Coax) and Differential (STP) Operation Configuration
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Figure 1-7. Differential (STP) Configuration Schematic
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ALP Software Setup
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1.12 ALP Software Setup
1.12.1 System Requirements
Operating System:
USB:
USB2ANY Firmware Version:
Windows 7 64-bit
USB2ANY
2.5.2.0
1.12.2 Download Contents
TI Analog LaunchPAD can be downloaded from: http://www.ti.com/tool/alp.
Download and extract the zip file to a temporary location that can be deleted later.
Make sure J7 on the DS90UB921-Q1 EVM is connected to a PC USB port with USB cable and power is
applied to the DS90UB921-Q1 EVM.
The following installation instructions are for the Windows 7 64-bit Operating System.
1.12.3 Installation of the ALP Software
Execute the ALP Setup Wizard program called “ALPF_setup_v_x_x_x.exe” that was extracted to a
temporary location on the local drive of your PC.
There are 7 steps to the installation once the setup wizard is started:
1. Select the "Next" button.
2. Select “I accept the agreement” and then select the “Next” button.
3. Select the location to install the ALP software and then select the “Next” button.
4. Select the location for the start menu shortcut and then select the “Next” button.
5. There will then be a screen that allows the creation of a desktop icon. After selecting the desired
choices select the “Next” button.
6. Select the “Install” button, and the software will then be installed to the selected location.
7. Uncheck “Launch Analog LaunchPAD” and select the “Finish” button. The ALP software will start if
“Launch Analog LaunchPAD” is checked, but it will not be useful until the USB driver is installed and
board is attached.
Connect J7 USB jack of the DS90UB921-Q1 EVM board to a PC/laptop USB port using a Type A
1
2
3
4
A to mini-B
1 2 3
4
MINI
USB cable. The “Found New Hardware Wizard” will open on the
PC/laptop.
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ALP Software Setup
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1.12.4 Startup - Software Description
Make sure all the software has been installed and the hardware is powered on and connected to the PC.
Execute “Analog LaunchPAD” shortcut from the start menu. The default start menu location is under All
Programs > Texas Instruments > Analog LaunchPAD vx.x.x > Analog LaunchPAD to start MainGUI.exe.
Figure 1-8. Launching ALP
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ALP Software Setup
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1.12.4.1 Initial ALP Screen
The application should come up in the state shown in Figure 1-9. If it does not, see Section 1.13,
“Troubleshooting ALP Software”.
Under the Devices tab click on “DS90UB921-Q1” to select the device and open up the device profile and
its associated tabs.
Figure 1-9. Initial ALP Screen
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ALP Software Setup
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After selecting the DS90UB921-Q1, the following screen should appear.
Figure 1-10. Follow-up Screen
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ALP Software Setup
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1.12.5 Information Tab
The Information tab is shown below. Please note the device revision could be different.
Figure 1-11. ALP Information Tab
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ALP Software Setup
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1.12.6 Pattern Generator Tab
The SER Pattern Generator tab is shown below.
Figure 1-12. ALP Pattern Generator Tab
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ALP Software Setup
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1.12.7 Registers Tab
The Registers tab is shown below.
Figure 1-13. ALP Registers Tab
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ALP Software Setup
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1.12.8 Registers Tab - Address 0x00 selected
Address 0x00 selected as shown below. Note that the “Value:” box,
value of that register.
, will now show the hex
Figure 1-14. ALP Device ID Selected
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ALP Software Setup
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By double clicking on the Address bar
or a single click on
. Address 0x00 expanded reveals contents by bits. Any register address
displayed can be expanded.
Any RW Type register,
, can be written into by writing the hex value into the “Value:” box,
or putting the pointer into the individual register bit(s) box by a left mouse click to put a check mark
(indicating a “1”) or unchecking to remove the check mark (indicating a “0”). Click the “Apply” button to
write to the register, and “refresh” to see the new value of the selected (highlighted) register.
The box toggles on every mouse click.
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ALP Software Setup
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1.12.9 Scripting Tab
The Scripting tab is shown below.
Figure 1-15. ALP Scripting Tab
The script window provides a full Python scripting environment which can be for running scripts and
interacting with the device in an interactive or automated fashion.
WARNING
Directly interacting with devices either through register
modifications or calling device support library functions can effect
the performance and/or functionality of the user interface and may
even crash the ALP Framework application.
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Troubleshooting ALP Software
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1.13 Troubleshooting ALP Software
1.13.1 ALP Loads the Incorrect Profile
If ALP opens with the incorrect profile loaded the correct profile can be loaded from the
USB2ANY/Aardvark Setup found under the tools menu.
Figure 1-16. USB2ANY Setup
Highlight the incorrect profile in the Defined ALP Devices list and press the remove button.
Figure 1-17. Remove Incorrect Profile
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Troubleshooting ALP Software
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Find the correct profile under the Select a Daughter Board list, highlight the profile and press Add.
Figure 1-18. Add Correct Profile
Select Ok and the correct profile should now be loaded.
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1.13.2 ALP does not detect the EVM
If the following window opens after starting the ALP software, double check the hardware setup.
Figure 1-19. ALP No Devices Error
It may also be that the USB driver is not installed. Check the device manager. There should be a “HIDcompliant device” under the “Human Interface Devices” as shown below.
Figure 1-20. Windows 7, ALP USB Driver
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Troubleshooting ALP Software
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The software should start with only “DS90UB921-Q1” in the “Devices” pull down menu. If there are more
devices then the software is most likely in demo mode. When the ALP is operating in demo mode there is
a “(Demo Mode)” indication in the lower left of the application status bar as shown below.
Figure 1-21. ALP in Demo Mode
Disable the demo mode by selecting the “Preferences” pull down menu and un-checking “Enable Demo
Mode”.
Figure 1-22. ALP Preferences Menu
After demo mode is disabled, the ALP software will poll the ALP hardware. The ALP software will update
and have only “DS90UB921-Q1” under the “Devices” pull down menu.
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Typical Connection and Test Equipment
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1.14 Typical Connection and Test Equipment
The following is a list of typical test equipment that may be used to generate signals for the Serializer
inputs:
1. Digital Video Source – for generation of specific display timing such as Digital Video Processor or
Graphics Controller (GPU).
2. Any other signal generator / video source - This video generator may be used for video signal sources.
3. Any other signal / video generator that provides the correct input levels as specified in the datasheet.
The picture below shows a typical test set up using a Graphics Controller and display.
Figure 1-23. Typical Test Setup for Video Application
The picture below shows a typical test set up using a video generator and logic analyzer.
Figure 1-24. Typical Test Setup for Evaluation
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Equipment References
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1.15 Equipment References
NOTE: Please note that the following references are supplied only as a courtesy to our valued
customers. It is not intended to be an endorsement of any particular equipment or supplier.
Digital Video Pattern Generator:
Astrodesign
www.astro-americas.com
Logic Analyzer:
keysight Technologies
www.keysight.com
Corelis CAS-1000-I2C/E I2C Bus Analyzer and Exerciser Products:
www.corelis.com/products/I2C-Analyzer.htm
Aardvark I2C/SPI Host Adapter Part Number: TP240141
www.totalphase.com/products/aardvark_i2cspi
1.16 Cable References
For optimal performance, we recommend Shielded Twisted Pair (STP) 100ohm differential impedance and
24 AWG (or larger diameter) cable for high-speed data applications. Also Single-Ended Coaxial (Coax)
Leoni Dacar 535-2 series cable:
Leoni Dacar 462 series cable:
www.leoni-automotive-cables.com
Rosenberger HSD connector:
www.rosenberger.de/en/Products/35_Automotive_HSD.php
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Chapter 2
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Bill of Materials
Table 2-1. Bill of Materials
DESIGNATOR
DESCRIPTION
PART NUMBER
MANUFACTURER
!PCB1
Printed Circuit Board
SV601263
Any
1
C1
CAP, CERM, 0.1uF, 16V, +/-10%, X7R, 0402
GRM155R71C104KA88D
MuRata
1
C2
CAP, CERM, 0.1uF, 16V, +/-10%, X7R, 0402
GRM155R71C104KA88D
MuRata
1
C3
CAP, CERM, 10uF, 10V, +/-10%, X7R, 0805
GRM21BR71A106KE51L
MuRata
1
C4
CAP, CERM, 4.7uF, 16V, +/-10%, X7R, 0805
GRM21BR71C475KA73L
MuRata
1
C5
CAP, CERM, 0.01uF, 100V, +/-5%, X7R, 0603
06031C103JAT2A
AVX
1
C6
CAP, CERM, 0.1 µF, 16 V, +/- 10%, X5R, 0603
GRM188R61C104KA01D
MuRata
1
C7
CAP, CERM, 0.1 µF, 16 V, +/- 10%, X5R, 0603
GRM188R61C104KA01D
MuRata
1
C8
CAP, CERM, 4700 pF, 100 V, +/- 10%, X7R, 0805
08051C472KAT2A
AVX
1
C9
CAP, CERM, 4700 pF, 100 V, +/- 10%, X7R, 0805
08051C472KAT2A
AVX
1
C10
CAP, CERM, 4700 pF, 100 V, +/- 10%, X7R, 0805
08051C472KAT2A
AVX
1
C11
CAP, CERM, 4700 pF, 100 V, +/- 10%, X7R, 0805
08051C472KAT2A
AVX
1
C12
CAP, CERM, 4700 pF, 100 V, +/- 10%, X7R, 0805
08051C472KAT2A
AVX
1
C13
CAP, CERM, 4700 pF, 100 V, +/- 10%, X7R, 0805
08051C472KAT2A
AVX
1
C14
CAP, TA, 22uF, 20V, +/-20%, 0.7 ohm, SMD
293D226X0020D2TE3
Vishay-Sprague
1
C15
CAP, CERM, 1uF, 6.3V, +/-20%, X5R, 0402
C1005X5R0J105M
TDK
1
C16
CAP, TA, 2.2uF, 25V, +/-10%, 3.8 ohm, SMD
293D225X9025B2TE3
Vishay-Sprague
1
C17
CAP, CERM, 0.01uF, 100V, +/-10%, X7R, 0805
08051C103KAT2A
AVX
1
C18
CAP, CERM, 0.1uF, 16V, +/-10%, X7R, 0402
GRM155R71C104KA88D
MuRata
1
C19
CAP, CERM, 20 pF, 100 V, +/- 5%, C0G/NP0, 0603 GRM1885C2A200JA01D
MuRata
1
C20
CAP, CERM, 220 pF, 50 V, +/- 1%, C0G/NP0, 0603 06035A221FAT2A
AVX
1
C21
CAP, CERM, 20 pF, 100 V, +/- 5%, C0G/NP0, 0603 GRM1885C2A200JA01D
MuRata
1
C22
CAP, CERM, 200 pF, 50 V, +/- 5%, C0G/NP0, 0402 GRM1555C1H201JA01D
MuRata
1
C23
CAP, CERM, 2200 pF, 50 V, +/- 10%, X7R, 0603
C0603X222K5RACTU
Kemet
1
C24
CAP, CERM, 0.1uF, 16V, +/-10%, X7R, 0402
GRM155R71C104KA88D
MuRata
1
C25
CAP, CERM, 0.1uF, 16V, +/-10%, X7R, 0402
GRM155R71C104KA88D
MuRata
1
C26
CAP, CERM, 10uF, 10V, +/-10%, X7R, 0805
GRM21BR71A106KE51L
MuRata
1
C27
CAP, CERM, 0.1uF, 16V, +/-10%, X7R, 0402
GRM155R71C104KA88D
MuRata
1
C28
CAP, CERM, 0.1uF, 16V, +/-10%, X7R, 0402
GRM155R71C104KA88D
MuRata
1
C29
CAP, CERM, 0.47uF, 16V, +/-10%, X7R, 0603
GRM188R71C474KA88D
MuRata
1
C30
CAP, CERM, 10pF, 50V, +/-5%, C0G/NP0, 0402
GRM1555C1H100JA01D
MuRata
1
C31
CAP, CERM, 10pF, 50V, +/-5%, C0G/NP0, 0402
GRM1555C1H100JA01D
MuRata
1
C32
CAP, CERM, 0.1uF, 16V, +/-10%, X7R, 0402
GRM155R71C104KA88D
MuRata
1
C33
CAP, CERM, 1uF, 16V, +/-10%, X7R, 0603
C1608X7R1C105K
TDK
1
C34
CAP, CERM, 0.1uF, 16V, +/-10%, X7R, 0402
GRM155R71C104KA88D
MuRata
1
C35
CAP, CERM, 4.7 µF, 16 V, +/- 10%, X7R, AECQ200 Grade 1, 0805
GCM21BR71C475KA73L
MuRata
1
C36
CAP, CERM, 4.7 µF, 16 V, +/- 10%, X7R, AECQ200 Grade 1, 0805
GCM21BR71C475KA73L
MuRata
1
SNLU205 – March 2016
Submit Documentation Feedback
QTY
Bill of Materials
Copyright © 2016, Texas Instruments Incorporated
31
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Table 2-1. Bill of Materials (continued)
DESIGNATOR
DESCRIPTION
PART NUMBER
MANUFACTURER
C37
CAP, CERM, 4.7 µF, 16 V, +/- 10%, X7R, AECQ200 Grade 1, 0805
GCM21BR71C475KA73L
MuRata
1
C38
CAP, CERM, 4.7 µF, 16 V, +/- 10%, X7R, AECQ200 Grade 1, 0805
GCM21BR71C475KA73L
MuRata
1
C39
CAP, CERM, 4.7 µF, 16 V, +/- 10%, X7R, AECQ200 Grade 1, 0805
GCM21BR71C475KA73L
MuRata
1
C40
CAP, CERM, 4.7 µF, 16 V, +/- 10%, X7R, AECQ200 Grade 1, 0805
GCM21BR71C475KA73L
MuRata
1
C41
CAP, CERM, 4.7 µF, 16 V, +/- 10%, X7R, AECQ200 Grade 1, 0805
GCM21BR71C475KA73L
MuRata
1
C42
CAP, CERM, 4.7 µF, 16 V, +/- 10%, X7R, AECQ200 Grade 1, 0805
GCM21BR71C475KA73L
MuRata
1
C43
CAP, CERM, 0.1uF, 16V, +/-10%, X7R, 0402
GRM155R71C104KA88D
MuRata
1
C44
CAP, TA, 22uF, 25V, +/-20%, 0.7 ohm, SMD
293D226X0025D2TE3
Vishay-Sprague
1
C45
CAP, TA, 2.2uF, 25V, +/-10%, 6.3 ohm, SMD
293D225X9025A2TE3
Vishay-Sprague
1
C46
CAP, CERM, 0.1uF, 16V, +/-10%, X7R, 0402
GRM155R71C104KA88D
MuRata
1
C47
CAP, CERM, 4.7 µF, 16 V, +/- 10%, X7R, AECQ200 Grade 1, 0805
GCM21BR71C475KA73L
MuRata
1
C48
CAP, CERM, 4.7 µF, 16 V, +/- 10%, X7R, AECQ200 Grade 1, 0805
GCM21BR71C475KA73L
MuRata
1
C49
CAP, CERM, 4.7 µF, 16 V, +/- 10%, X7R, AECQ200 Grade 1, 0805
GCM21BR71C475KA73L
MuRata
1
C50
CAP, CERM, 4.7 µF, 16 V, +/- 10%, X7R, AECQ200 Grade 1, 0805
GCM21BR71C475KA73L
MuRata
1
C51
CAP, CERM, 47uF, 16V, +/-20%, X5R, 1210
GRM32ER61C476ME15L
MuRata
1
C52
CAP, CERM, 10uF, 10V, +/-10%, X7R, 0805
GRM21BR71A106KE51L
MuRata
1
C53
CAP, CERM, 0.1uF, 16V, +/-10%, X7R, 0402
GRM155R71C104KA88D
MuRata
1
C54
CAP, CERM, 0.047 µF, 16 V, +/- 10%, X7R, 0402
GRM155R71C473KA01D
MuRata
1
C55
CAP, CERM, 0.47 µF, 25 V, +/- 10%, X7R, 0603
GRM188R71E474KA12D
MuRata
1
C56
CAP, CERM, 4.7 µF, 16 V, +/- 10%, X7R, AECQ200 Grade 1, 0805
GCM21BR71C475KA73L
MuRata
1
C57
CAP, CERM, 3300pF, 50V, +/-10%, X7R, 0402
GRM155R71H332KA01D
MuRata
1
C58
CAP, CERM, 1uF, 16V, +/-10%, X7R, 0603
C1608X7R1C105K
TDK
1
C59
CAP, CERM, 10 µF, 25 V, +/- 20%, X5R, 0603
GRM188R61E106MA73
MuRata
1
C60
CAP, CERM, 33 pF, 50 V, +/- 5%, C0G/NP0, 0603
06035A330JAT2A
AVX
1
C61
CAP, CERM, 22 µF, 35 V, +/- 20%, X5R, 1206_190 C3216X5R1V226M160AC
TDK
1
C62
CAP, CERM, 4.7 µF, 16 V, +/- 10%, X7R, AECQ200 Grade 1, 0805
GCM21BR71C475KA73L
MuRata
1
C63
CAP, CERM, 0.47 µF, 25 V, +/- 10%, X7R, 0603
GRM188R71E474KA12D
MuRata
1
C64
CAP, CERM, 0.047 µF, 16 V, +/- 10%, X7R, 0402
GRM155R71C473KA01D
MuRata
1
C65
CAP, CERM, 33 pF, 50 V, +/- 5%, C0G/NP0, 0603
06035A330JAT2A
AVX
1
C66
CAP, CERM, 22 µF, 35 V, +/- 20%, X5R, 1206_190 C3216X5R1V226M160AC
TDK
1
C67
CAP, CERM, 0.1 µF, 50 V, +/- 10%, C0G/NP0,
0402
C1005X7R1H104K
TDK
1
C68
CAP, CERM, 10 µF, 25 V, +/- 20%, X5R, 0603
GRM188R61E106MA73
MuRata
1
C69
CAP, CERM, 0.47 µF, 16 V, +/- 10%, X5R, 0402
GRM155R61C474KE01
MuRata
1
C70
CAP, TA, 22uF, 25V, +/-20%, 0.7 ohm, SMD
293D226X0025D2TE3
Vishay-Sprague
1
C71
CAP, TA, 22uF, 25V, +/-20%, 0.7 ohm, SMD
293D226X0025D2TE3
Vishay-Sprague
1
C72
CAP, CERM, 4.7uF, 16V, +/-10%, X7R, 0805
GRM21BR71C475KA73L
MuRata
1
C73
CAP, CERM, 0.1uF, 16V, +/-10%, X7R, 0402
GRM155R71C104KA88D
MuRata
1
C74
CAP, CERM, 0.1uF, 16V, +/-10%, X7R, 0402
GRM155R71C104KA88D
MuRata
1
32
Bill of Materials
QTY
SNLU205 – March 2016
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Table 2-1. Bill of Materials (continued)
DESIGNATOR
DESCRIPTION
PART NUMBER
MANUFACTURER
C75
CAP, CERM, 10uF, 10V, +/-10%, X7R, 0805
GRM21BR71A106KE51L
MuRata
1
C76
CAP, CERM, 4.7uF, 16V, +/-10%, X7R, 0805
GRM21BR71C475KA73L
MuRata
1
C77
CAP, CERM, 0.1uF, 16V, +/-10%, X7R, 0402
GRM155R71C104KA88D
MuRata
1
C78
CAP, CERM, 0.1uF, 16V, +/-10%, X7R, 0402
GRM155R71C104KA88D
MuRata
1
C79
CAP, CERM, 10uF, 10V, +/-10%, X7R, 0805
GRM21BR71A106KE51L
MuRata
1
C80
CAP, CERM, 0.1 µF, 50 V, +/- 10%, X7R, AECQ200 Grade 1, 0402
GCM155R71H104KE02D
MuRata
1
C81
CAP, CERM, 0.1 µF, 50 V, +/- 10%, X7R, AECQ200 Grade 1, 0402
GCM155R71H104KE02D
MuRata
1
C82
CAP, CERM, 0.33 µF, 10 V, +/- 10%, X5R, 0402
C1005X5R1A334K050BB
TDK
1
C83
CAP, CERM, 0.1uF, 16V, +/-10%, X7R, 0402
GRM155R71C104KA88D
MuRata
1
C84
CAP, CERM, 0.15 µF, 10 V, +/- 10%, X5R, 0402
C1005X5R1A154K050BC
TDK
1
C85
CAP, CERM, 4.7pF, 25V, +/-5%, C0G/NP0, 0402
GRM1555C1E4R7CA01D
MuRata
1
C86
CAP, CERM, 4.7pF, 25V, +/-5%, C0G/NP0, 0402
GRM1555C1E4R7CA01D
MuRata
1
D1
LED, Green, SMD
150060VS75000
Wurth Elektronik eiSos
1
D2
LED, Green, SMD
150060VS75000
Wurth Elektronik eiSos
1
D3
LED, Green, SMD
150060VS75000
Wurth Elektronik eiSos
1
D4
LED, Green, SMD
150060VS75000
Wurth Elektronik eiSos
1
D5
LED, Green, SMD
150060VS75000
Wurth Elektronik eiSos
1
D6
LED, Orange, SMD
LTST-C190KFKT
Lite-On
1
D7
Diode, Zener, 7.5V, 550mW, SMB
1SMB5922BT3G
ON Semiconductor
1
D8
LED, Green, SMD
LTST-C190GKT
Lite-On
1
D9
Diode, Schottky, 40V, 1A, SOD-123
1N5819HW-7-F
Diodes Inc.
1
F1
Fuse, 7 A, 24 V, SMD
0429007.WRML
Littelfuse
1
H1
EMI SHIELD, 13.66 x 12.70 mm, SMT
BMI-S-201-F
Laird-Signal Integrity
Products
1
J1
Header, 100mil, 2x1, Gold, TH
5-146261-1
TE Connectivity
1
J2
Header, 100mil, 2x1, Gold, TH
5-146261-1
TE Connectivity
1
J3
Header, 100mil, 2x1, Gold, TH
5-146261-1
TE Connectivity
1
J4
Header, 100mil, 3x1, Gold, TH
TSW-103-07-G-S
Samtec
1
J5
Header, 100mil, 2x1, Gold, TH
5-146261-1
TE Connectivity
1
J6
Header, 100mil, 2x1, Gold, TH
5-146261-1
TE Connectivity
1
J7
Connector, Receptacle, Mini-USB Type B, R/A, Top 1734035-2
Mount SMT
TE Connectivity
1
J8
Header, 100mil, 2x1, Gold, TH
5-146261-1
TE Connectivity
1
J9
Header, 100mil, 7x2, Tin, TH
PEC07DAAN
Sullins Connector
Solutions
1
J10
Header, 100mil, 5x2, Tin, TH
PEC05DAAN
Sullins Connector
Solutions
1
J11
Header, 100mil, 2x1, Gold, TH
5-146261-1
TE Connectivity
1
J12
Header, 100mil, 2x1, Gold, TH
5-146261-1
TE Connectivity
1
J13
Connector, DC Jack 2.1X5.5 mm, TH
PJ-102A
CUI Inc.
1
J14
Header, 100mil, 3x1, Gold, TH
TSW-103-07-G-S
Samtec
1
J15
Header, 100mil, 2x1, Gold, TH
5-146261-1
TE Connectivity
1
J16
Header, 100mil, 2x1, Gold, TH
5-146261-1
TE Connectivity
1
J17
Header, 100mil, 3x2, Gold, TH
TSW-103-07-G-D
Samtec
1
J18
Header, 100mil, 2x1, Gold, TH
5-146261-1
TE Connectivity
1
J19
Header, 100mil, 2x1, Gold, TH
5-146261-1
TE Connectivity
1
J20
Header, 100mil, 2x1, Gold, TH
5-146261-1
TE Connectivity
1
SNLU205 – March 2016
Submit Documentation Feedback
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Bill of Materials
Copyright © 2016, Texas Instruments Incorporated
33
www.ti.com
Table 2-1. Bill of Materials (continued)
DESIGNATOR
DESCRIPTION
PART NUMBER
MANUFACTURER
J21
Header, 100mil, 4x2, Gold, TH
TSW-104-07-G-D
Samtec
1
J22
Header, 100mil, 2x1, Gold, TH
5-146261-1
TE Connectivity
1
J23
Standard Banana Jack, Insulated, Red
6091
Keystone
1
J24
Standard Banana Jack, Insulated, Black
6092
Keystone
1
J25
Standard Banana Jack, Insulated, Red
6091
Keystone
1
J26
Header, 100mil, 28x2, Gold, TH
TSW-128-07-G-D
Samtec
1
J27
Connector, RF, 50 Ohm, R/A, TH
59S20X-40ML5-Z
Rosenberger
1
J28
Connector, End launch SMA, 50 ohm, SMT
142-0701-851
Emerson Network Power
1
J29
Connector, End launch SMA, 50 ohm, SMT
142-0701-851
Emerson Network Power
1
J30
Header (friction lock), 100mil, 4x1, Gold, TH
0022112042
Molex
1
J31
Header, 100mil, 10x2, TH
PEC10DAAN
Sullins Connector
Solutions
1
J32
Header, 100mil, 2x1, Gold, TH
5-146261-1
TE Connectivity
1
L1
Ferrite Bead, 1000 ohm @ 100 MHz, 0.35 A, 0402
BLM15AX102SN1D
MuRata
1
L2
Ferrite Bead, 60 ohm @ 100MHz, 0.8A, 0603
BK1608HS600-T
Taiyo Yuden
1
L6
Inductor, Shielded Drum Core, Ferrite, 4.7 µH, 4.2
A, 0.02 ohm, SMD
7440650047
Wurth Elektronik
1
L7
Ferrite Bead, 1000 ohm @ 100 MHz, 0.35 A, 0402
BLM15AX102SN1D
MuRata
1
L8
Inductor, Shielded, Ferrite, 2.2 µH, 1.23 A, 0.084
ohm, SMD
VLF302510MT-2R2M
TDK
1
L9
Ferrite Bead, 1000 ohm @ 100 MHz, 0.35 A, 0402
BLM15AX102SN1D
MuRata
1
L10
Inductor, Multilayer, Ferrite, 3.3 µH, 0.6 A, 0.143
ohm, SMD
MLP2520S3R3ST0S1
TDK
1
L11
Coupled inductor, 0.28 A, 0.41 ohm, +/- 25%, SMD
DLW21SN900HQ2L
MuRata
1
LBL?
Thermal Transfer Printable Labels, 1.250" W x
0.250" H - 10,000 per roll
THT-13-457-10
Brady
1
P1
HSD Right Angle Plug for PCB, TH
D4S20D-40ML5-Z
Rosenberger
1
Q1
MOSFET, N-CH, 50 V, 0.22 A, SOT-23
BSS138
Fairchild Semiconductor
1
Q2
MOSFET, N-CH, 50 V, 0.22 A, SOT-23
BSS138
Fairchild Semiconductor
1
R1
RES, 0 ohm, 5%, 0.063W, 0402
ERJ-2GE0R00X
Panasonic
1
R2
RES, 107k ohm, 1%, 0.063W, 0402
CRCW0402107KFKED
Vishay-Dale
1
R3
RES, 255k ohm, 1%, 0.063W, 0402
CRCW0402255KFKED
Vishay-Dale
1
R4
RES, 100k ohm, 1%, 0.1W, 0402
ERJ-2RKF1003X
Panasonic
1
R5
RES, 105k ohm, 1%, 0.063W, 0402
CRCW0402105KFKED
Vishay-Dale
1
R6
RES, 102k ohm, 1%, 0.063W, 0402
CRCW0402102KFKED
Vishay-Dale
1
R7
RES, 17.8k ohm, 1%, 0.063W, 0402
CRCW040217K8FKED
Vishay-Dale
1
R8
RES, 0 ohm, 5%, 0.063W, 0402
ERJ-2GE0R00X
Panasonic
1
R9
RES, 107k ohm, 1%, 0.063W, 0402
CRCW0402107KFKED
Vishay-Dale
1
R10
RES, 255k ohm, 1%, 0.063W, 0402
CRCW0402255KFKED
Vishay-Dale
1
R11
RES, 100k ohm, 1%, 0.1W, 0402
ERJ-2RKF1003X
Panasonic
1
R12
RES, 105k ohm, 1%, 0.063W, 0402
CRCW0402105KFKED
Vishay-Dale
1
R13
RES, 102k ohm, 1%, 0.063W, 0402
CRCW0402102KFKED
Vishay-Dale
1
R14
RES, 17.8k ohm, 1%, 0.063W, 0402
CRCW040217K8FKED
Vishay-Dale
1
R15
RES, 10.0 k, 1%, 0.063 W, 0402
CRCW040210K0FKED
Vishay-Dale
1
R16
RES, 17.8k ohm, 1%, 0.063W, 0402
CRCW040217K8FKED
Vishay-Dale
1
R17
RES, 102k ohm, 1%, 0.063W, 0402
CRCW0402102KFKED
Vishay-Dale
1
R18
RES, 75k ohm, 5%, 0.063W, 0402
CRCW040275K0JNED
Vishay-Dale
1
R19
RES, 140k ohm, 1%, 0.063W, 0402
CRCW0402140KFKED
Vishay-Dale
1
R20
RES, 255k ohm, 1%, 0.063W, 0402
CRCW0402255KFKED
Vishay-Dale
1
34
Bill of Materials
QTY
SNLU205 – March 2016
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Copyright © 2016, Texas Instruments Incorporated
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Table 2-1. Bill of Materials (continued)
DESIGNATOR
DESCRIPTION
PART NUMBER
MANUFACTURER
R21
RES, 107k ohm, 1%, 0.063W, 0402
CRCW0402107KFKED
Vishay-Dale
1
R22
RES, 0 ohm, 5%, 0.063W, 0402
ERJ-2GE0R00X
Panasonic
1
R23
RES, 10.0 k, 1%, 0.063 W, 0402
CRCW040210K0FKED
Vishay-Dale
1
R24
RES, 17.8k ohm, 1%, 0.063W, 0402
CRCW040217K8FKED
Vishay-Dale
1
R25
RES, 102k ohm, 1%, 0.063W, 0402
CRCW0402102KFKED
Vishay-Dale
1
R26
RES, 75k ohm, 5%, 0.063W, 0402
CRCW040275K0JNED
Vishay-Dale
1
R27
RES, 140k ohm, 1%, 0.063W, 0402
CRCW0402140KFKED
Vishay-Dale
1
R28
RES, 255k ohm, 1%, 0.063W, 0402
CRCW0402255KFKED
Vishay-Dale
1
R29
RES, 107k ohm, 1%, 0.063W, 0402
CRCW0402107KFKED
Vishay-Dale
1
R30
RES, 0 ohm, 5%, 0.063W, 0402
ERJ-2GE0R00X
Panasonic
1
R31
RES, 10.0 k, 1%, 0.063 W, 0402
CRCW040210K0FKED
Vishay-Dale
1
R32
RES, 10.0 k, 1%, 0.063 W, 0402
CRCW040210K0FKED
Vishay-Dale
1
R33
RES, 10.0 k, 1%, 0.063 W, 0402
CRCW040210K0FKED
Vishay-Dale
1
R34
RES, 0, 5%, 0.05 W, 0201
ERJ-1GE0R00C
Panasonic
1
R35
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R36
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R37
RES, 0, 5%, 0.05 W, 0201
ERJ-1GE0R00C
Panasonic
1
R38
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R39
RES, 0, 5%, 0.05 W, 0201
ERJ-1GE0R00C
Panasonic
1
R40
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R41
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R42
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R43
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R44
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R45
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R46
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R47
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R48
RES, 4.7k ohm, 5%, 0.063W, 0402
CRCW04024K70JNED
Vishay-Dale
1
R49
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R50
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R51
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R52
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R53
RES, 0 ohm, 5%, 0.063W, 0402
ERJ-2GE0R00X
Panasonic
1
R54
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R55
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R56
RES, 0 ohm, 5%, 0.063W, 0402
ERJ-2GE0R00X
Panasonic
1
R57
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R58
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R59
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R60
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R61
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R62
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R63
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R64
RES, 0 ohm, 5%, 0.063W, 0402
ERJ-2GE0R00X
Panasonic
1
R65
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R66
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R67
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
SNLU205 – March 2016
Submit Documentation Feedback
QTY
Bill of Materials
Copyright © 2016, Texas Instruments Incorporated
35
www.ti.com
Table 2-1. Bill of Materials (continued)
DESIGNATOR
DESCRIPTION
PART NUMBER
MANUFACTURER
R68
RES, 49.9, 1%, 0.05 W, 0201
ERJ-1GEF49R9C
Panasonic
1
R69
RES, 470 ohm, 5%, 0.063W, 0402
CRCW0402470RJNED
Vishay-Dale
1
R70
RES, 2.4 k, 5%, 0.063 W, 0402
CRCW04022K40JNED
Vishay-Dale
1
R71
RES, 2.4 k, 5%, 0.063 W, 0402
CRCW04022K40JNED
Vishay-Dale
1
R72
RES, 220, 5%, 0.063 W, 0402
CRCW0402220RJNED
Vishay-Dale
1
R73
RES, 220, 5%, 0.063 W, 0402
CRCW0402220RJNED
Vishay-Dale
1
R74
RES, 180, 5%, 0.063 W, 0402
CRCW0402180RJNED
Vishay-Dale
1
R75
RES, 2.4 k, 5%, 0.063 W, 0402
CRCW04022K40JNED
Vishay-Dale
1
R76
RES, 2.4 k, 5%, 0.063 W, 0402
CRCW04022K40JNED
Vishay-Dale
1
R77
RES, 180, 5%, 0.063 W, 0402
CRCW0402180RJNED
Vishay-Dale
1
R78
RES, 100k ohm, 5%, 0.063W, 0402
CRCW0402100KJNED
Vishay-Dale
1
R79
RES, 0, 5%, 0.1 W, 0603
CRCW06030000Z0EA
Vishay-Dale
1
R80
RES, 33 ohm, 5%, 0.063W, 0402
CRCW040233R0JNED
Vishay-Dale
1
R81
RES, 33 ohm, 5%, 0.063W, 0402
CRCW040233R0JNED
Vishay-Dale
1
R82
RES, 1.5 k, 5%, 0.063 W, 0402
CRCW04021K50JNED
Vishay-Dale
1
R83
RES, 33k ohm, 5%, 0.063W, 0402
CRCW040233K0JNED
Vishay-Dale
1
R84
RES, 1.2 M, 5%, 0.1 W, 0603
CRCW06031M20JNEA
Vishay-Dale
1
R85
RES, 0, 5%, 0.063 W, 0402
CRCW04020000Z0ED
Vishay-Dale
1
R86
RES, 33k ohm, 5%, 0.063W, 0402
CRCW040233K0JNED
Vishay-Dale
1
R87
RES, 200 ohm, 5%, 0.063W, 0402
CRCW0402200RJNED
Vishay-Dale
1
R88
RES, 0, 5%, 0.063 W, 0402
RC0402JR-070RL
Yageo America
1
R89
RES, 0, 5%, 0.063 W, 0402
RC0402JR-070RL
Yageo America
1
R90
RES, 124k ohm, 1%, 0.063W, 0402
CRCW0402124KFKED
Vishay-Dale
1
R91
RES, 22.1k ohm, 1%, 0.063W, 0402
CRCW040222K1FKED
Vishay-Dale
1
R92
RES, 100k ohm, 5%, 0.063W, 0402
CRCW0402100KJNED
Vishay-Dale
1
R93
RES, 10.0 k, 1%, 0.063 W, 0402
CRCW040210K0FKED
Vishay-Dale
1
R94
RES, 0 ohm, 5%, 0.063W, 0402
ERJ-2GE0R00X
Panasonic
1
R95
RES, 3.24k ohm, 1%, 0.063W, 0402
CRCW04023K24FKED
Vishay-Dale
1
R96
RES, 806 k, 0.1%, 0.125 W, 0805
RT0805BRD07806KL
Yageo America
1
R97
RES, 10.0 k, 1%, 0.063 W, 0402
CRCW040210K0FKED
Vishay-Dale
1
R98
RES, 180 k, 0.1%, 0.1 W, 0603
RG1608P-184-B-T5
Susumu Co Ltd
1
R99
RES, 0 ohm, 5%, 0.063W, 0402
ERJ-2GE0R00X
Panasonic
1
R100
RES, 10.0 k, 1%, 0.063 W, 0402
CRCW040210K0FKED
Vishay-Dale
1
R101
RES, 361 k, 0.1%, 0.1 W, 0603
RT0603BRD07361KL
Yageo America
1
R102
RES, 10.0 k, 1%, 0.063 W, 0402
CRCW040210K0FKED
Vishay-Dale
1
R103
RES, 10.0 k, 1%, 0.063 W, 0402
CRCW040210K0FKED
Vishay-Dale
1
R104
RES, 180 k, 0.1%, 0.1 W, 0603
RG1608P-184-B-T5
Susumu Co Ltd
1
R105
RES, 0 ohm, 5%, 0.063W, 0402
ERJ-2GE0R00X
Panasonic
1
R106
RES, 29.4 k, 1%, 0.063 W, 0402
CRCW040229K4FKED
Vishay-Dale
1
R107
RES, 10.0 k, 1%, 0.063 W, 0402
CRCW040210K0FKED
Vishay-Dale
1
R108
RES, 3.24k ohm, 1%, 0.063W, 0402
CRCW04023K24FKED
Vishay-Dale
1
R109
RES, 100k ohm, 5%, 0.063W, 0402
CRCW0402100KJNED
Vishay-Dale
1
R110
RES, 0 ohm, 5%, 0.063W, 0402
ERJ-2GE0R00X
Panasonic
1
R111
RES, 0, 5%, 0.1 W, 0603
CRCW06030000Z0EA
Vishay-Dale
1
R112
RES, 100k ohm, 5%, 0.063W, 0402
CRCW0402100KJNED
Vishay-Dale
1
R113
RES, 0 ohm, 5%, 0.063W, 0402
ERJ-2GE0R00X
Panasonic
1
R114
RES, 0, 5%, 0.1 W, 0603
CRCW06030000Z0EA
Vishay-Dale
1
36
Bill of Materials
QTY
SNLU205 – March 2016
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Table 2-1. Bill of Materials (continued)
DESIGNATOR
DESCRIPTION
PART NUMBER
MANUFACTURER
R115
RES, 4.7k ohm, 5%, 0.063W, 0402
CRCW04024K70JNED
Vishay-Dale
1
R116
RES, 4.7k ohm, 5%, 0.063W, 0402
CRCW04024K70JNED
Vishay-Dale
1
R117
RES, 49.9 ohm, 1%, 0.063W, 0402
CRCW040249R9FKED
Vishay-Dale
1
R118
RES, 0 ohm, 5%, 0.063W, 0402
ERJ-2GE0R00X
Panasonic
1
R119
RES, 0 ohm, 5%, 0.063W, 0402
ERJ-2GE0R00X
Panasonic
1
R121
RES, 0, 5%, 0.05 W, 0201
ERJ-1GE0R00C
Panasonic
1
R122
RES, 0, 5%, 0.05 W, 0201
ERJ-1GE0R00C
Panasonic
1
R123
RES, 0, 5%, 0.05 W, 0201
ERJ-1GE0R00C
Panasonic
1
R124
RES, 0, 5%, 0.05 W, 0201
ERJ-1GE0R00C
Panasonic
1
R125
RES, 0, 5%, 0.05 W, 0201
ERJ-1GE0R00C
Panasonic
1
R126
RES, 0, 5%, 0.05 W, 0201
ERJ-1GE0R00C
Panasonic
1
S1
Switch, Slide, SPST 8 poles, SMT
219-8MST
CTS Electrocomponents
1
S2
Switch, Slide, SPST 8 poles, SMT
219-8MST
CTS Electrocomponents
1
S3
Switch, Normally open, 2.3N force, 200k
operations, SMD
KSR221GLFS
C and K Components
1
S4
Switch, SPST, 2 Pos, 25mA, 24VDC, SMD
218-2LPST
CTS Electrocomponents
1
S5
Switch, Normally open, 2.3N force, 200k
operations, SMD
KSR221GLFS
C and K Components
1
SH-J11
Shunt, 100mil, Gold plated, Black
969102-0000-DA
3M
1
SH-J12
Shunt, 100mil, Gold plated, Black
969102-0000-DA
3M
1
SH-J19
Shunt, 100mil, Gold plated, Black
969102-0000-DA
3M
1
SH-J22
Shunt, 100mil, Gold plated, Black
969102-0000-DA
3M
1
T1
Common Mode Filter for Power Line
ACM9070-701-2PL
TDK
1
U1
5 - 96 MHz 24-bit Color FPD-Link III Serializer with
Bidirectional Control Channel, RHS0048A
DS90UB921TRHSRQ1
Texas Instruments
1
U2
Single Output High PSRR LDO, 500 mA, Fixed 3.3
V Output, 2.7 to 6.5 V Input, with Low IQ, 8-pin
SON (DRB), -40 to 125 degC, Green (RoHS & no
Sb/Br)
TPS73533DRBT
Texas Instruments
1
U3
4-CHANNEL ESD-PROTECTION ARRAY FOR
HIGH-SPEED DATA INTERFACES, DRY006A
TPD4E004DRYR
Texas Instruments
1
U4
Mixed Signal MicroController, PN0080A
MSP430F5529IPN
Texas Instruments
1
U5
4.5V to 18V Input, 2-A Synchronous Step-Down
SWIFT™ Converter, PWP0014E
TPS54225PWPR
Texas Instruments
1
U6
2.25MHz 2x800mA Dual Step Down Converter In
Small 3x3mm QFN Package, DRC0010J
TPS62410QDRCRQ1
Texas Instruments
1
U7
1A Low Dropout Adjustable Regulator, 8-pin LLP,
Pb-Free
LM2941LD/NOPB
Texas Instruments
1
U8
Dual Output LDO, 1 A, Fixed 1.8, 3.3 V Output, 2.7
to 10 V Input, 28-pin HTSSOP (PWP), -40 to 125
degC, Green (RoHS & no Sb/Br)
TPS767D318PWP
Texas Instruments
1
U9
Low-Capacitance + / - 15 kV ESD-Protection Array
for High-Speed Data Interfaces, 2 Channels, -40 to
+85 degC, 5-pin SOT (DRL), Green (RoHS & no
Sb/Br)
TPD2E001DRLR
Texas Instruments
1
X1
OSC, 96 MHz, 3.3 Vdc, SMD
FXO-HC736R-96
Fox Electronics
1
Y1
Crystal, 24.000MHz, 20pF, SMD
ECS-240-20-5PX-TR
ECS Inc.
1
SNLU205 – March 2016
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Bill of Materials
Copyright © 2016, Texas Instruments Incorporated
37
Appendix A
SNLU205 – March 2016
EVM PCB Schematics
LEDs
RGB
J9 (SMA/SMB)
1 0 0 o h m d i ff e r e n t i a l t r a c e u n t i l t h e e n d t h e n 5 0 o h m s i n g l e e n d e d
50ohm single ended t rac es
J11 (SMA)
1 0 0 o h m d i ff e r e n t i a l t r a c e
DS90UB921-Q1
FPD3
P1 (HSD)
1 0 0 o h m d i ff e r e n t i a l t r a c e
J43 (28x2)
USB-2-ANY
EXT UC
MODE_SEL
I2C
EXT CONN
IDx
All other traces not specified are 50ohm single ended trace
GPIO
I2S
INTB
5V
3.3V
USB
Power
12v Power Source
1.8V
Copyright © 2016, Texas Instruments Incorporated
38
EVM PCB Schematics
SNLU205 – March 2016
Submit Documentation Feedback
Copyright © 2016, Texas Instruments Incorporated
Appendix A
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VDD33
C4
4.7µF
R33
10.0k
J4
1
2
3
L1
1000 ohm
VDDIO
TSW-103-07-G-S
J5
GND
1
2
X1
J6
1
2
1
2
5-146261-1
E/D
VCC
GND
OUT
4
5-146261-1
C5
0.01µF
3
FXO-HC736R-96
96 MHz
GND
GND
R34
0 PCLK
VDD33_C
Undefined
VDDIO_C
U1
22
30
PLACE RESISTORS UNDER BOARD
DIN0/R0
DIN1/R1
DIN2/R2
DIN3/R3
DIN4/R4
DIN5/R5
DIN6/R6
DIN7/R7
DIN8/G0
DIN9/G1
DIN10/G2
DIN11/G3
DIN12/G4
DIN13/G5
DIN14/G6
DIN15/G7
DIN16/B0
DIN17/B1
DIN18/B2
DIN19/B3
DIN20/B4
DIN21/B5
DIN22/B6
DIN23/B7
R35
DIN0/R0
DIN1/R1 49.9 49.9
R36
DIN2/R2 49.9 R38
DIN3/R3 49.9 R40
DIN4/R4 49.9 R41
DIN5/R5 49.9 R42
DIN6/R6 49.9 R43
DIN7/R7 49.9 R44
DIN8/G0 49.9 R45
DIN9/G1 49.9 R46
DIN10/G2 49.9 R47
DIN11/G3 49.9 R49
DIN12/G4 49.9 R50
DIN13/G5 49.9 R51
DIN14/G6 49.9 R52
DIN15/G7 49.9 R54
DIN16/B0 49.9 R55
DIN17/B1 49.9 R57
DIN18/B2 49.9 R58
DIN19/B3 49.9 R59
DIN20/B4 49.9 R60
DIN21/B5 49.9 R61
DIN22/B6 49.9 R62
DIN23/B7 49.9 R63
CAPHS_12
CAPP_12
CAPL12
DIN0/R0
DIN1/R1
DIN2/R2
DIN3/R3
DIN4/R4
DIN5/R5
DIN6/R6
DIN7/R7
DIN8/G0
DIN9/G1
DIN10/G2
DIN11/G3
DIN12/G4
DIN13/G5
DIN14/G6
DIN15/G7
DIN16/B0
DIN17/B1
DIN18/B2
DIN19/B3
DIN20/B4
DIN21/B5
DIN22/B6
DIN23/B7
DIN0/R0 25
DIN1/R1 26
DIN2/R2 27
DIN3/R3 28
DIN4/R4 29
DIN5/R5 32
DIN6/R6 33
DIN7/R7 34
DIN8/G0 35
DIN9/G1 36
DIN10/G2 37
DIN11/G3 38
DIN12/G4 39
DIN13/G5 40
DIN14/G6 41
DIN15/G7 42
DIN16/B0 43
DIN17/B1 44
DIN18/B2 45
DIN19/B3 46
DIN20/B4 47
DIN21/B5 48
DIN22/B6 1
DIN23/B7 2
17
14
7
VDD33
DOUT+
VDDIO
DOUT-
DIN0/R0/GPIO0
DIN1/R1/GPIO1
DIN2/R2
DIN3/R3
DIN4/R4
DIN5/R5
DIN6/R6
DIN7/R7
DIN8/G0/GPIO2
DIN9/G1/GPIO3
G2/DIN10
G3/DIN11
G4/DIN12
G5/DIN13
G6/DIN14
G7/DIN15
GPO_REG4/B0/DIN16
I2S_DB/GPO_REG5/B1/DIN17
B2/DIN18
B3/DIN19
B4/DIN20
B5/DIN21
B6/DIN22
B7/DIN23
CMF
HS
VS
DE
PCLK
I2S_CLK
GPO_REG6/I2S_DA
GPO_REG7/I2S_WC
PDB
MODE_SEL
FSEL
SCL
SDA
IDx
REM_INTB
INTB
20
DOUT_P
19
DOUT_N
23
CMF
3
HS
4
VS
5
DE
10
PCLK
13
11
12
I2S_CLK
I2S_DA
I2S_WC
21
24
15
PDB_R
MODE_SEL
FSEL
8
9
6
SCL_R
SDA_R
IDx
16
REM_INTB
31
INTB_R
DOUT0_P
DOUT0_N
CMF
HS
VS
DE
PCLK
I2S_CLK
I2S_DA
I2S_WC
IDx
IDx
MODE_SEL
SDA_R
SCL_R
MODE_SEL
R37
R39
0
0
SDA
SCL
FSEL
VDDIO_C
REM_INTB
CAPHS12
R48
4.7k
INTB_R
CAPP12
RES1
CAPL12
PAD
18
R53 0
RES1
RES1
R56
INTB
0
49
DS90UB921TRHSRQ1
GND
GND
DN I RESI ST ORS A B OV E
PDB_R
R64
0
PDB
GND
PCLK
HS
VS
DE
49.9
49.9
49.9
49.9
R65
R66
R67
R68
DN I RESI ST ORS R2 1 2 -R2 1 5
GND
Copyright © 2016, Texas Instruments Incorporated
SNLU205 – March 2016
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EVM PCB Schematics
Copyright © 2016, Texas Instruments Incorporated
39
Appendix A
www.ti.com
VBUS
VDD33_UC
U2A
L2
8
C15
1µF
5
IN
R79
1
OUT
EN
0
3
NR/FB
GND
C16
2.2µF
9
60 ohm
D7
1SMB5922BT3G
7.5V
4
C14
22µF
C17
0.01µF
TPS73533DRBT
J7
R80
9
GND
33
DM
R81
DP
IO3
6
5
IO4
VCC
4
33
11
8
VBUS
10
F1
0429007.WRML
1
2
3
4
5
R82
U3
TPD4E004DRYR
1.5k
J8
PUR
VUSB
C18
0.1µF
1
2
5-146261-1
GND
S5
2
KSR221GLFS
3
GND
1
33k
IO2
IO1
R83
C19
C20
220pF
DNP
2
R84
1.2M
20pF
R85
GND
GND
0
14
12
10
8
6
4
2
Y1
24MHz
13
11
9
7
5
3
1
VDD33_UC
C22
R86
33k
GND
C21
1
GND
J9
PEC07DAAN
20pF
V18
VBUS
VUSB
USB2ANY CONNECTOR
200pF
C23
2200pF
J10
DM
SDA
SDA
1
3
5
PUR
GND
GND
GND
GPIO4/SPI(SIMO)/UART(TXD) 7
GPIO6/PWM1/SPI(CS)
9
DP
SCL
2
SCL
4 GPIO3/PWM2
6
8 GPIO5/SPI(SOMI)/UART(RXD)
10 GPIO7/PWM0
GND
PEC05DAAN
8
9
GND
10
GPIO10/VEREF-
11
D8
Green
12
C26
10µF
C27
0.1µF
13
14
15
R87
200
16
17
3
18
Q2
1 BSS138
19
C28
0.1µF
GND
C29
0.47µF
GND
62
61
VSSU
PU.0/DP
64
63
PUR
PU.1/DM
67
65
VBUS
68
66
V18
VUSB
AVSS2
P5.2/XT2IN
72
70
P5.3/XT2OUT
74
73
71
PJ.0/TDO
PJ.2/TMS
PJ.1/TDI/TCLK
76
75
PJ.3/TCK
P6.0/CB0/A0
77
78
69
P4.7/PM_NONE
P4.6/PM_NONE
P5.0/A8/VREF+/VEREF+
P4.5/PM_UCA1RXD/PM_UCA1SOMI
P5.1/A9/VREF-/VEREF-
P4.4/PM_UCA1TXD/PM_UCA1SIMO
AVCC1
DVCC2
DVSS2
P5.4/XIN
P5.5/XOUT
P4.3/PM_UCB1CLK/PM_UCA1STE
AVSS1
P4.2/PM_UCB1SOMI/PM_UCB1SCL
P8.0
P4.1/PM_UCB1SIMO/PM_UCB1SDA
P8.1
P4.0/PM_UCB1STE/PM_UCA1CLK
59
58
57
56
55
54
53
52
GPIO5/SPI(SOMI)/UART(RXD)
51
GPIO4/SPI(SIMO)/UART(TXD)
VDD33_UC
50
49
48
C25
0.1µF
47
46
GND
45
R88
SCL
0
P8.2
R89
DVCC1
P3.7/TB0OUTH/SVMOUT
DVSS1
VCORE
21
22
23
24
25
26
27
28
29
30
31
32
33
34
35
36
GND
GPIO7/PWM0
TEST/SBWTCK
MSP430F5529IPN
P7.3/CB11/A15
P1.0/TA0CLK/ACLK
P1.1/TA0.0
P1.2/TA0.1
P1.3/TA0.2
P1.4/TA0.3
P1.5/TA0.4
P1.6/TA1CLK/CBOUT
P1.7/TA1.0
P2.0/TA1.1
P2.1/TA1.2
P2.2/TA2CLK/SMCLK
P2.3/TA2.0
P2.4/TA2.1
P2.5/TA2.2
P2.6/RTCCLK/DMAE0
P2.7/UCB0STE/UCA0CLK
2
20
P7.2/CB10/A14
P3.6/TB0.6
P3.2/UCB0CLK/UCA0STE
P3.3/UCA0TXD/UCA0SIMO
C24
0.1µF
P5.6/TB0.0
60
P3.5/TB0.5
P3.4/UCA0RXD/UCA0SOMI
44
SDA
0
43
42
41
39
40
7
P5.7/TB0.1
U4
P3.1/UCB0SOMI/UCB0SCL
GPIO11/VEREF+
P7.4/TB0.2
P7.0/CB8/A12
P7.1/CB9/A13
P7.6/TB0.4
P7.5/TB0.3
P3.0/UCB0SIMO/UCB0SDA
VDD33_UC
P6.7/CB7/A7
37
6
P6.6/CB6/A6
P7.7/TB0CLK/MCLK
38
5
P6.5/CB5/A5
RST/NMI/SBWTDIO
4
P6.4/CB4/A4
P6.1/CB1/A1
80
3
P6.2/CB2/A2
2
P6.3/CB3/A3
1
79
GND
GPIO7/PWM0
GPIO6/PWM1/SPI(CS)
GPIO3/PWM2
GPIO3/PWM2
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40
EVM PCB Schematics
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Appendix A
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5 0 o h m s i n g l e -e n d e d t r a c e s
J26
C80
DOUT0SMA_P
3
DOUT0_P
L10_P
4
DIN0/R0
DIN1/R1
DIN2/R2
DIN3/R3
DIN4/R4
DIN5/R5
DIN6/R6
DIN7/R7
DIN8/G0
DIN9/G1
DIN10/G2
DIN11/G3
DIN12/G4
DIN13/G5
DIN14/G6
DIN15/G7
DIN16/B0
DIN17/B1
DIN18/B2
DIN19/B3
DIN20/B4
DIN21/B5
DIN22/B6
DIN23/B7
HS
VS
DE
PCLK
0.1µF
DNP
L11
DLW21SN900HQ2L
C81
DOUT0SMA_N
DOUT0_N
1
DIN0/R0
DIN1/R1
DIN2/R2
DIN3/R3
DIN4/R4
DIN5/R5
DIN6/R6
DIN7/R7
DIN8/G0
DIN9/G1
DIN10/G2
DIN11/G3
DIN12/G4
DIN13/G5
DIN14/G6
DIN15/G7
DIN16/B0
DIN17/B1
DIN18/B2
DIN19/B3
DIN20/B4
DIN21/B5
DIN22/B6
DIN23/B7
HS
VS
DE
PCLK
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
42
44
46
48
50
52
54
56
2
1
3
5
7
9
11
13
15
17
19
21
23
25
27
29
31
33
35
37
39
41
43
45
47
49
51
53
55
L10_N
D4S20D-40ML5-Z
0.1µF
DNP
P1
EMITTER
SMA_D0N
SMA_D0P
1
3
PAIR A1
2
4
PAIR A2
GND
GND
TSW-128-07-G-D
GND
5 0 o h m s i n g l e -e n d e d t r a c e s
Layout note:
Overlay footprint for SMA and FAKRA
connector - signal pin 1 on both is the
Same pad
U9
3
5
IO1
IO2
1
VCC
NC
GND
2
J27
1
5
4
3
2
VDD33
SCL
SDA
4
59S20X-40ML5-Z
TPD2E001DRLR
J28
C82
GND
VDD33
DOUT0_P
DOUT_P
DOUTSMA0_P
1
GND
142-0701-851
5
4
3
2
0.33µF
5 0 o h m s i n g l e -e n d e d t r a c e
100 OHM DIFFERENTIAL
0 .6 2 5 "
SCL
SDA
SCL
SDA
R116
4.7k
R118
R119
J30
0
0
1
2
3
4
GND
C85
4.7pF
J29
C84
C86
4.7pF
DOUT0_N
DOUT_N
DOUTSMA0_N
0.15µF
5 0 o h m s i n g l e -e n d e d t r a c e
1
R117
49.9
142-0701-851
5
4
3
2
R115
4.7k
C83
0.1µF
0022112042
GND
GND
PLACE RESISTORS CLOSE TO J30
J31
1
3
5
7
9
11
13
15
17
19
R121
R122
R123
R124
R125
R126
2
4
6
8
10
12
14
16
18
20
0
0
0
0
0
0
DIN0/R0
DIN1/R1
DIN8/G0
DIN9/G1
DIN16/B0
DIN17/B1
I2S_DA
I2S_WC
I2S_CLK
REM_INTB
PEC10DAAN
J32
GND
1
2
INTB
5-146261-1
GND
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41
Appendix A
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VDD33_C
VDD33_C
R2
107k
R3
255k
R4
100k
R5
105k
R6
102k
R7
17.8k
R15
10.0k
R16
17.8k
R17
102k
R18
75k
R19
140k
R20
255k
R21
107k
R22
0
GND
Mode Select (MODE_SEL)
R9
107k
R10
255k
R11
100k
R12
105k
R13
102k
R14
17.8k
R23
10.0k
R24
17.8k
R25
102k
R26
75k
R27
140k
R28
255k
R29
107k
R30
0
GND
16
15
14
13
12
11
10
9
GND
R8
0
GND
I2C Address Select (IDx)
16
15
14
13
12
11
10
9
R1
0
1
2
3
4
5
6
7
8
S2
219-8MST
1
2
3
4
5
6
7
8
S1
219-8MST
IDx
J2
J1
1
2
C2
0.1µF
'b
8
C1
0.1µF
1
2
1
x0
8
1
x0
C
2
x0
2
x0
4
2
x0
8
2
x0
C
3
x0
3
x0
4
1
2
3
4
5
6
7
8
MODE_SEL
5-146261-1
5-146261-1
GND
GND
VDD33_C
VDD33_C
J3
R31
10.0k
R32
10.0k
1
2
5-146261-1
S3
PDB
KSR221GLFS
FSEL
4
3
C3
10µF
GND
S4
1
2
GND
D
B
P
E
F
S
L
Mode Switches
GND
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42
EVM PCB Schematics
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Appendix A
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M1
M2
C8
4700pF
M3
C9
4700pF
M4
C10
4700pF
M5
C11
4700pF
M6
C12
4700pF
ZZ1
Assembly Note
Place H1 over X1
C13
4700pF
Label Table
Variant
GND
GND
GND
GND
GND
Label Text
001
H1
DS90UB921-Q1EVM
GND
1
BMI-S-201-F
GND
PCB
LOGO
PCB Number: PRJ_Number
PCB Rev: PCB_Rev
VDD_EXT
VBUS
VDD5V
12V_IN_B4JUMP
VDD33
VDD5V
LBL?
2
2
2
2
2
PCB Label
Size: 1.25" x 0.25"
D4
Green
D5
Green
D6
Orange
1
1
D3
Green
1
1
D2
Green
1
D1
Green
PCB
LOGO
R70
2.4k
R71
2.4k
R75
2.4k
R76
2.4k
R72
220
R73
220
R74
180
R77
180
3
R69
470
Texas Instruments
Q1
1 BSS138
PCB
LOGO
2
Board Silkscreen Label: "Not for EMI Testing"
R78
100k
FCC disclaimer
ZZ2
Label Assembly Note
This Assembly Note is for PCB labels only
GND
GND
GND
GND
GND
GND
INTB
ZZ3
Label Assembly Note
These assemblies are ESD sensitive, ESD precautions shall be observed
ZZ4
Label Assembly Note
These assemblies must be clean and free from flux and all contaminants. Use of no clean flux is not acceptable
ZZ5
Label Assembly Note
These assemblies must comply with workmanship standards IPC-A-610 Class 2., unless otherwise specified
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43
Appendix A
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CAPL12
ZZ6
Assembly Note
Place Jumper on J12
CMF IS 2.5V REGULATOR
ZZ7
Assembly Note
Place Jumper on J11
VDD_EXT
SH-J11
SH-J12
J11
J12
D9
T1
4
1N5819HW-7-F
40V
C44
22µF
14
C43
0.1µF
C45
2.2µF
13
C46
5V_SW
PJ-102A
12
L6
ACM9070-701-2PL
0.1µF
11
4.7µH
GND
C51
47µF
C52
10µF
10
C53
0.1µF
9
8
GND
R90
R91
124k
22.1k
VO
VIN
VFB
VBST
VREG5
SW2
SS
SW1
GND
PGND2
PG
PGND1
EN
5V_LDO
GND
C59
10µF
VDD5V
SW1
5-146261-1 R97
10.0k
1
3
5
GND
R102
1
3
5
7
DEF_1
SW2
VDD33
ADJ2
GND
PAD
4
C47
R92
6
L10
L7
1000 ohm
R95
3.24k
C61
22µF
C58
1µF
1
3.3µH
R101
GND
R99
C65
33pF
361k
C56
VDDIO_C
L9
DNI
GND
8
11
VDD18_SW
VDD_EXT
0.047µF
C63
C62
0.47µF
4.7µF
VDD_EXT
GND
C66
22µF
R104
180k
R103
10.0k LM2941LD/NOPB
U7
J18
1
2
3
C70
C69
0.47µF 22µF
SH-J19
C68
C67
1
10µF
0.1µF
4
6
J19
1 GND
2
J21
R108
3.24k
ADJ
NC
NC
GND
GND
5
8
0
R106
29.4k
7
2
C71
22µF
R107
10.0k
100k
GND
VDD5V
R110
GND
1
2
C72
4.7µF
C73
0.1µF
5-146261-1
0
U8A
5
6
11
12
1IN
1IN
1OUT
1OUT
2IN
2IN
2OUT
2OUT
1RESET
2RESET
R113
GND
OUT
ON/OFF
R109
5-146261-1
J22
IN
5V_LDO
R105
5-146261-1
1
2
C76
4.7µF
C77
0.1µF
0
4
10
1EN
2EN
EP
1GND
2GND
R111
23
24
C74
0.1µF
17
18
28
22
0
VDD1V8_LDO
C75
10µF
R112
100k
29
3
9
VDD33_LDO
GND
R114
0
TPS767D318PWP
J23
C78
0.1µF
U8B
VDDIO_EXT
C55
0.47µF 4.7µF
VDDIO
5-146261-1
0
J20
J25
C54
0.047µF
1000 ohm C64
GND
180k
ZZ8
Assembly Note
Place Jumper on J19
6092
4.7µF 4.7µF 4.7µF 4.7µF
GND
100k
7
C50
VDD33_C
VDD33
5
R98
10
2
4
6
8
6091
C49
C42
CAPP_12
1
2
10.0k
0
C60
33pF
DNP
GND
J24
C48
C41
J15
5-146261-1
VDD33_EXT
4.7µF 4.7µF
GND
3
R93
R96
806k
5
VDDIO_EXT
SH-J22
C40
4.7µF
GND
R94
6
TPS62410QDRCRQ1
ZZ9
Assembly Note
Place Jumper on J22
C39
4.7µF
1
MODE/DATA
R100
10.0k
GND
VDD1V8_LDO VDD18_SW
VDDIO
EN2
10.0k
DNP
J17
CAPHS_12
GND
2
C57
3300pF
VDD33_SW
L8
EN1
2
2
4
6
4
2.2µH
9
VDD33_SW VDD33_EXT VDD33_LDO
VDD33
FB1
2
1
7
C36 C37 C38
4.7µF 4.7µF 4.7µF 4.7µF
GND
VIN
J16
TSW-103-07-G-S
C35
GND
U6
3
C7
0.1µF
15
GND
J14
1
2
3
VDD5V
C6
0.1µF
DNP
GND
VCC
PAD
5V_SW
10pF
DAP
1
2
1
1
GND
U5 TPS54225PWPR
Undefined
C31
10pF
3
2
VDD_EXT
C30
9
5-146261-1
3
2
C33
1µF
5-146261-1
12V_IN_B4JUMP
J13
C32
0.1µF
C34
0.1µF
1
2
THESE ARE ESD CAPS, ONLY POPULATE 1 EXCEPT CAPL12 WHICH HAS 2
CMF
CMF
1
2
7
8
13
14
15
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
NC
16
19
20
21
25
26
27
GND
C79
10µF
GND
TPS767D318PWP
GND
6091
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EVM PCB Schematics
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Appendix B
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Board Layout
Board Layers
Figure B-1. Top Layer
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Board Layout
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45
Appendix B
www.ti.com
Figure B-2. Inner GND Layer
46
Board Layout
SNLU205 – March 2016
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Copyright © 2016, Texas Instruments Incorporated
Appendix B
www.ti.com
Figure B-3. Inner Power Supply Layer
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Board Layout
Copyright © 2016, Texas Instruments Incorporated
47
Appendix B
www.ti.com
Figure B-4. Inner GND Layer
48
Board Layout
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Copyright © 2016, Texas Instruments Incorporated
Appendix B
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Figure B-5. Inner Power Supply Layer
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Board Layout
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49
Appendix B
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Figure B-6. Bottom Layer
50
Board Layout
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Copyright © 2016, Texas Instruments Incorporated
STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES
1.
Delivery: TI delivers TI evaluation boards, kits, or modules, including any accompanying demonstration software, components, or
documentation (collectively, an “EVM” or “EVMs”) to the User (“User”) in accordance with the terms and conditions set forth herein.
Acceptance of the EVM is expressly subject to the following terms and conditions.
1.1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility
evaluation, experimentation, or scientific analysis of TI semiconductors products. EVMs have no direct function and are not
finished products. EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product. For
clarification, any software or software tools provided with the EVM (“Software”) shall not be subject to the terms and conditions
set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software
1.2 EVMs are not intended for consumer or household use. EVMs may not be sold, sublicensed, leased, rented, loaned, assigned,
or otherwise distributed for commercial purposes by Users, in whole or in part, or used in any finished product or production
system.
2
Limited Warranty and Related Remedies/Disclaimers:
2.1 These terms and conditions do not apply to Software. The warranty, if any, for Software is covered in the applicable Software
License Agreement.
2.2 TI warrants that the TI EVM will conform to TI's published specifications for ninety (90) days after the date TI delivers such EVM
to User. Notwithstanding the foregoing, TI shall not be liable for any defects that are caused by neglect, misuse or mistreatment
by an entity other than TI, including improper installation or testing, or for any EVMs that have been altered or modified in any
way by an entity other than TI. Moreover, TI shall not be liable for any defects that result from User's design, specifications or
instructions for such EVMs. Testing and other quality control techniques are used to the extent TI deems necessary or as
mandated by government requirements. TI does not test all parameters of each EVM.
2.3 If any EVM fails to conform to the warranty set forth above, TI's sole liability shall be at its option to repair or replace such EVM,
or credit User's account for such EVM. TI's liability under this warranty shall be limited to EVMs that are returned during the
warranty period to the address designated by TI and that are determined by TI not to conform to such warranty. If TI elects to
repair or replace such EVM, TI shall have a reasonable time to repair such EVM or provide replacements. Repaired EVMs shall
be warranted for the remainder of the original warranty period. Replaced EVMs shall be warranted for a new full ninety (90) day
warranty period.
3
Regulatory Notices:
3.1 United States
3.1.1
Notice applicable to EVMs not FCC-Approved:
This kit is designed to allow product developers to evaluate electronic components, circuitry, or software associated with the kit
to determine whether to incorporate such items in a finished product and software developers to write software applications for
use with the end product. This kit is not a finished product and when assembled may not be resold or otherwise marketed unless
all required FCC equipment authorizations are first obtained. Operation is subject to the condition that this product not cause
harmful interference to licensed radio stations and that this product accept harmful interference. Unless the assembled kit is
designed to operate under part 15, part 18 or part 95 of this chapter, the operator of the kit must operate under the authority of
an FCC license holder or must secure an experimental authorization under part 5 of this chapter.
3.1.2
For EVMs annotated as FCC – FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant:
CAUTION
This device complies with part 15 of the FCC Rules. Operation is subject to the following two conditions: (1) This device may not
cause harmful interference, and (2) this device must accept any interference received, including interference that may cause
undesired operation.
Changes or modifications not expressly approved by the party responsible for compliance could void the user's authority to
operate the equipment.
FCC Interference Statement for Class A EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class A digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference when the equipment is
operated in a commercial environment. This equipment generates, uses, and can radiate radio frequency energy and, if not
installed and used in accordance with the instruction manual, may cause harmful interference to radio communications.
Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to
correct the interference at his own expense.
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
SPACER
FCC Interference Statement for Class B EVM devices
NOTE: This equipment has been tested and found to comply with the limits for a Class B digital device, pursuant to part 15 of
the FCC Rules. These limits are designed to provide reasonable protection against harmful interference in a residential
installation. This equipment generates, uses and can radiate radio frequency energy and, if not installed and used in accordance
with the instructions, may cause harmful interference to radio communications. However, there is no guarantee that interference
will not occur in a particular installation. If this equipment does cause harmful interference to radio or television reception, which
can be determined by turning the equipment off and on, the user is encouraged to try to correct the interference by one or more
of the following measures:
•
•
•
•
Reorient or relocate the receiving antenna.
Increase the separation between the equipment and receiver.
Connect the equipment into an outlet on a circuit different from that to which the receiver is connected.
Consult the dealer or an experienced radio/TV technician for help.
3.2 Canada
3.2.1
For EVMs issued with an Industry Canada Certificate of Conformance to RSS-210
Concerning EVMs Including Radio Transmitters:
This device complies with Industry Canada license-exempt RSS standard(s). Operation is subject to the following two conditions:
(1) this device may not cause interference, and (2) this device must accept any interference, including interference that may
cause undesired operation of the device.
Concernant les EVMs avec appareils radio:
Le présent appareil est conforme aux CNR d'Industrie Canada applicables aux appareils radio exempts de licence. L'exploitation
est autorisée aux deux conditions suivantes: (1) l'appareil ne doit pas produire de brouillage, et (2) l'utilisateur de l'appareil doit
accepter tout brouillage radioélectrique subi, même si le brouillage est susceptible d'en compromettre le fonctionnement.
Concerning EVMs Including Detachable Antennas:
Under Industry Canada regulations, this radio transmitter may only operate using an antenna of a type and maximum (or lesser)
gain approved for the transmitter by Industry Canada. To reduce potential radio interference to other users, the antenna type
and its gain should be so chosen that the equivalent isotropically radiated power (e.i.r.p.) is not more than that necessary for
successful communication. This radio transmitter has been approved by Industry Canada to operate with the antenna types
listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated.
Antenna types not included in this list, having a gain greater than the maximum gain indicated for that type, are strictly prohibited
for use with this device.
Concernant les EVMs avec antennes détachables
Conformément à la réglementation d'Industrie Canada, le présent émetteur radio peut fonctionner avec une antenne d'un type et
d'un gain maximal (ou inférieur) approuvé pour l'émetteur par Industrie Canada. Dans le but de réduire les risques de brouillage
radioélectrique à l'intention des autres utilisateurs, il faut choisir le type d'antenne et son gain de sorte que la puissance isotrope
rayonnée équivalente (p.i.r.e.) ne dépasse pas l'intensité nécessaire à l'établissement d'une communication satisfaisante. Le
présent émetteur radio a été approuvé par Industrie Canada pour fonctionner avec les types d'antenne énumérés dans le
manuel d’usage et ayant un gain admissible maximal et l'impédance requise pour chaque type d'antenne. Les types d'antenne
non inclus dans cette liste, ou dont le gain est supérieur au gain maximal indiqué, sont strictement interdits pour l'exploitation de
l'émetteur
3.3 Japan
3.3.1
Notice for EVMs delivered in Japan: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page 日本国内に
輸入される評価用キット、ボードについては、次のところをご覧ください。
http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_01.page
3.3.2
Notice for Users of EVMs Considered “Radio Frequency Products” in Japan: EVMs entering Japan may not be certified
by TI as conforming to Technical Regulations of Radio Law of Japan.
If User uses EVMs in Japan, not certified to Technical Regulations of Radio Law of Japan, User is required by Radio Law of
Japan to follow the instructions below with respect to EVMs:
1.
2.
3.
Use EVMs in a shielded room or any other test facility as defined in the notification #173 issued by Ministry of Internal
Affairs and Communications on March 28, 2006, based on Sub-section 1.1 of Article 6 of the Ministry’s Rule for
Enforcement of Radio Law of Japan,
Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to
EVMs, or
Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
with respect to EVMs. Also, do not transfer EVMs, unless User gives the same notice above to the transferee. Please note
that if User does not follow the instructions above, User will be subject to penalties of Radio Law of Japan.
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【無線電波を送信する製品の開発キットをお使いになる際の注意事項】 開発キットの中には技術基準適合証明を受けて
いないものがあります。 技術適合証明を受けていないもののご使用に際しては、電波法遵守のため、以下のいずれかの
措置を取っていただく必要がありますのでご注意ください。
1.
2.
3.
電波法施行規則第6条第1項第1号に基づく平成18年3月28日総務省告示第173号で定められた電波暗室等の試験設備でご使用
いただく。
実験局の免許を取得後ご使用いただく。
技術基準適合証明を取得後ご使用いただく。
なお、本製品は、上記の「ご使用にあたっての注意」を譲渡先、移転先に通知しない限り、譲渡、移転できないものとします。
上記を遵守頂けない場合は、電波法の罰則が適用される可能性があることをご留意ください。 日本テキサス・イ
ンスツルメンツ株式会社
東京都新宿区西新宿６丁目２４番１号
西新宿三井ビル
3.3.3
Notice for EVMs for Power Line Communication: Please see http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
電力線搬送波通信についての開発キットをお使いになる際の注意事項については、次のところをご覧くださ
い。http://www.tij.co.jp/lsds/ti_ja/general/eStore/notice_02.page
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4
EVM Use Restrictions and Warnings:
4.1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND/OR SAFETY CRITICAL EVALUATIONS, INCLUDING BUT NOT
LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS.
4.2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling
or using the EVM, including without limitation any warning or restriction notices. The notices contain important safety information
related to, for example, temperatures and voltages.
4.3 Safety-Related Warnings and Restrictions:
4.3.1
User shall operate the EVM within TI’s recommended specifications and environmental considerations stated in the user
guide, other available documentation provided by TI, and any other applicable requirements and employ reasonable and
customary safeguards. Exceeding the specified performance ratings and specifications (including but not limited to input
and output voltage, current, power, and environmental ranges) for the EVM may cause personal injury or death, or
property damage. If there are questions concerning performance ratings and specifications, User should contact a TI
field representative prior to connecting interface electronics including input power and intended loads. Any loads applied
outside of the specified output range may also result in unintended and/or inaccurate operation and/or possible
permanent damage to the EVM and/or interface electronics. Please consult the EVM user guide prior to connecting any
load to the EVM output. If there is uncertainty as to the load specification, please contact a TI field representative.
During normal operation, even with the inputs and outputs kept within the specified allowable ranges, some circuit
components may have elevated case temperatures. These components include but are not limited to linear regulators,
switching transistors, pass transistors, current sense resistors, and heat sinks, which can be identified using the
information in the associated documentation. When working with the EVM, please be aware that the EVM may become
very warm.
4.3.2
EVMs are intended solely for use by technically qualified, professional electronics experts who are familiar with the
dangers and application risks associated with handling electrical mechanical components, systems, and subsystems.
User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees,
affiliates, contractors or designees. User assumes all responsibility and liability to ensure that any interfaces (electronic
and/or mechanical) between the EVM and any human body are designed with suitable isolation and means to safely
limit accessible leakage currents to minimize the risk of electrical shock hazard. User assumes all responsibility and
liability for any improper or unsafe handling or use of the EVM by User or its employees, affiliates, contractors or
designees.
4.4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international, federal,
state, or local laws and regulations related to User’s handling and use of the EVM and, if applicable, User assumes all
responsibility and liability for compliance in all respects with such laws and regulations. User assumes all responsibility and
liability for proper disposal and recycling of the EVM consistent with all applicable international, federal, state, and local
requirements.
5.
Accuracy of Information: To the extent TI provides information on the availability and function of EVMs, TI attempts to be as accurate
as possible. However, TI does not warrant the accuracy of EVM descriptions, EVM availability or other information on its websites as
accurate, complete, reliable, current, or error-free.
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6.
Disclaimers:
6.1 EXCEPT AS SET FORTH ABOVE, EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM (AND THE
DESIGN OF THE EVM ITSELF) ARE PROVIDED "AS IS" AND "WITH ALL FAULTS." TI DISCLAIMS ALL OTHER
WARRANTIES, EXPRESS OR IMPLIED, REGARDING SUCH ITEMS, INCLUDING BUT NOT LIMITED TO ANY IMPLIED
WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF ANY
THIRD PARTY PATENTS, COPYRIGHTS, TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS.
6.2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN, NOTHING IN THESE TERMS AND
CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE, PATENT, OR ANY
OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI, ITS SUPPLIERS/LICENSORS OR ANY OTHER THIRD
PARTY, TO USE THE EVM IN ANY FINISHED END-USER OR READY-TO-USE FINAL PRODUCT, OR FOR ANY
INVENTION, DISCOVERY OR IMPROVEMENT MADE, CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF
THE EVM.
7.
USER'S INDEMNITY OBLIGATIONS AND REPRESENTATIONS. USER WILL DEFEND, INDEMNIFY AND HOLD TI, ITS
LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS, DAMAGES, LOSSES,
EXPENSES, COSTS AND LIABILITIES (COLLECTIVELY, "CLAIMS") ARISING OUT OF OR IN CONNECTION WITH ANY
HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS. THIS OBLIGATION
SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE, REGULATION, OR THE LAW OF TORT, CONTRACT OR ANY
OTHER LEGAL THEORY, AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED.
8.
Limitations on Damages and Liability:
8.1 General Limitations. IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL, COLLATERAL, INDIRECT, PUNITIVE,
INCIDENTAL, CONSEQUENTIAL, OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE
TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER, REGARDLESS OF WHETHER TI HAS
BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. EXCLUDED DAMAGES INCLUDE, BUT ARE NOT LIMITED
TO, COST OF REMOVAL OR REINSTALLATION, ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS
OR SERVICES, RETESTING, OUTSIDE COMPUTER TIME, LABOR COSTS, LOSS OF GOODWILL, LOSS OF PROFITS,
LOSS OF SAVINGS, LOSS OF USE, LOSS OF DATA, OR BUSINESS INTERRUPTION. NO CLAIM, SUIT OR ACTION SHALL
BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED.
8.2 Specific Limitations. IN NO EVENT SHALL TI'S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION
ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS, OR ANY USE OF ANY TI EVM
PROVIDED HEREUNDER, EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER
THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR DAMAGES ARE CLAIMED. THE EXISTENCE
OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND
CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT.
9.
Return Policy. Except as otherwise provided, TI does not offer any refunds, returns, or exchanges. Furthermore, no return of EVM(s)
will be accepted if the package has been opened and no return of the EVM(s) will be accepted if they are damaged or otherwise not in
a resalable condition. If User feels it has been incorrectly charged for the EVM(s) it ordered or that delivery violates the applicable
order, User should contact TI. All refunds will be made in full within thirty (30) working days from the return of the components(s),
excluding any postage or packaging costs.
10. Governing Law: These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas,
without reference to conflict-of-laws principles. User agrees that non-exclusive jurisdiction for any dispute arising out of or relating to
these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County, Texas.
Notwithstanding the foregoing, any judgment may be enforced in any United States or foreign court, and TI may seek injunctive relief
in any United States or foreign court.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated
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IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
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TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
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TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
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Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
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Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
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Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
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In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
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requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
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Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
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