User's Guide
SNVA223 – June 2007
AN-1593 LM3508 Evaluation Board
1
Introduction
The LM3508 is a synchronous step-up DC/DC converter designed for white LED applications. The
evaluation board is set up to drive four standard VF white LEDs from a 2.7 V to 5.5 V input supply. A fifth
LED can be placed across the R1 pad for testing up to five low VF LEDs. The LED current is set using the
RSET resistor via the equation ILED = 0.2V/RSET. The evaluation board comes with RSET = 10 Ω for
approximately 20 mA LED current. LED dimming is achieved by applying a PWM waveform of up to 100
kHz to the DIM pin.
2
Schematic
SW
L1
VIN
VOUT
D1
COUT
CIN
D2
D3
2 3 4 LEDs
SW
OUT
IN
D4
EN
LM3508
EN
DIM
DIM
R1
OPEN
ILED
SET
GND
PGND
RSET
PGND
ISET
3
IOUT
Bill of Materials
Designator
Component
Part Number
Manufacturer
U1
LM3508TL, µSMD 9-bump
LM3508
National Semiconductor
L
22 µH, ISAT = 330 mA
VLF3010AT-220MR33
TDK
CIN
1 µF, 10V Ceramic
C1608JB1A105M
TDK
COUT
1 µF, 25V Ceramic
C3216X7R1E105K
C1608JB1E105M
TDK
D1–D3
White LED
LW M67C
Osram
R1
0 Ω Resistor
CRCW0603
Vishay
R1
10 Ω Resistor
CRCW060310R0F
Vishay
All trademarks are the property of their respective owners.
SNVA223 – June 2007
Submit Documentation Feedback
AN-1593 LM3508 Evaluation Board
Copyright © 2007, Texas Instruments Incorporated
1
Bill of Materials
www.ti.com
Figure 1. LM3508 Evaluation Board Layout Topside
Figure 2. LM3508 Evaluation Board Layout Mid Layer 1
2
AN-1593 LM3508 Evaluation Board
SNVA223 – June 2007
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
Bill of Materials
www.ti.com
Figure 3. LM3508 Evaluation Board Layout Mid Layer 2
Figure 4. LM3508 Evaluation Board Layout Bottom Side
SNVA223 – June 2007
Submit Documentation Feedback
AN-1593 LM3508 Evaluation Board
Copyright © 2007, Texas Instruments Incorporated
3
Board Operation
4
www.ti.com
Board Operation
To operate the LM3508 evaluation board, connect a 2.7 V to 5.5 V supply between the VIN header and
PGND.
5
Jumper Connections
•
•
•
•
EN is a 3-position jumper (see the bottom right jumper in Figure 2). The middle pin connects to EN of
the device. The top pin of the EN header connects to PGND (device disabled) and the bottom pin
connects to the VIN (device enabled).
DIM is a 3-position header (see Figure 2). The middle pin connects to DIM of the LM3508. The left pin
of the DIM header connects to PGND (current source off). The right pin connects to VIN (current
source on with max LED current of 20 mA). Drive DIM with aPWM waveform (VH > 1.1V, VL < 0.5 V) at
up to 100 kHz to adjust the LED brightness.
2 3 4 LEDs is a 3-position header (see Figure 2). Leave open to configure the board for four series
LEDs. Place a jumper across the top and middle pin to short D3 and D4 (2 LED solution). Place a
jumper across the bottom and middle pin to short only D4 (3 LED solution).
The OPEN header opens the current path from the cathode of D4 and the input to the current source.
Normally this is shorted. This is for demonstrating OVP and/or disconnecting the LEDs.
R1 is a short (0 Ω), which can be replaced with a sense resistor for measuring the LED current or
replaced with a fifth LED for evaluation of low VF LEDs. EN has an internal 383 kΩ pull-down resistor
which places the part in shutdown by default. DIM also has an internal 383 kΩ pull-down resistor that
turns off the current source by default. For more information regarding the operation of the LM3508, see
the LM3508 data sheet.
4
AN-1593 LM3508 Evaluation Board
SNVA223 – June 2007
Submit Documentation Feedback
Copyright © 2007, Texas Instruments Incorporated
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components as meeting ISO/TS16949 requirements, mainly for automotive use. In any case of use of
non-designated products, TI will not be responsible for any failure to meet ISO/TS16949.
Products
Applications
Audio
www.ti.com/audio
Automotive and Transportation
www.ti.com/automotive
Amplifiers
amplifier.ti.com
Communications and Telecom
www.ti.com/communications
Data Converters
dataconverter.ti.com
Computers and Peripherals
www.ti.com/computers
DLP® Products
www.dlp.com
Consumer Electronics
www.ti.com/consumer-apps
DSP
dsp.ti.com
Energy and Lighting
www.ti.com/energy
Clocks and Timers
www.ti.com/clocks
Industrial
www.ti.com/industrial
Interface
interface.ti.com
Medical
www.ti.com/medical
Logic
logic.ti.com
Security
www.ti.com/security
Power Mgmt
power.ti.com
Space, Avionics and Defense
www.ti.com/space-avionics-defense
Microcontrollers
microcontroller.ti.com
Video and Imaging
www.ti.com/video
RFID
www.ti-rfid.com
OMAP Applications Processors
www.ti.com/omap
TI E2E Community
e2e.ti.com
Wireless Connectivity
www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2015, Texas Instruments Incorporated