0
登录后你可以
  • 下载海量资料
  • 学习在线课程
  • 观看技术视频
  • 写文章/发帖/加入社区
创作中心
发布
  • 发文章

  • 发资料

  • 发帖

  • 提问

  • 发视频

创作活动
SCANSTA101SMX/NOPB

SCANSTA101SMX/NOPB

  • 厂商:

    BURR-BROWN(德州仪器)

  • 封装:

    NFBGA49

  • 描述:

    IC TEST MASTER LOW-VOLT 49FBGA

  • 数据手册
  • 价格&库存
SCANSTA101SMX/NOPB 数据手册
SCANSTA101 www.ti.com SNLS057J – MAY 2002 – REVISED APRIL 2013 SCANSTA101 Low Voltage IEEE 1149.1 System Test Access (STA) Master Check for Samples: SCANSTA101 FEATURES DESCRIPTION • The SCANSTA101 is designed to function as a test master for an IEEE 1149.1 boundary scan test system. It is suitable for use in embedded IEEE 1149.1 applications and as a component in a standalone boundary scan tester. 1 2 • • • • • • • • • • • Compatible with IEEE Std. 1149.1 (JTAG) Test Access Port and Boundary Scan Architecture Supported by Texas Instruments' SCAN Ease (SCAN Embedded Application Software Enabler) Software Rev 2.0 Uses Generic, Asynchronous Processor Interface; Compatible with a Wide Range of Processors and Processor Clock (PCLK) Frequencies 16-Bit Data Interface (IP Scalable to 32-bit) 2k x 32 Bit Dual-Port Memory Load-on-the-Fly (LotF) and Preloaded Vector Operating Modes Supported On-Board Sequencer Allows Multi-Vector Operations such as those Required to Load Data Into an FPGA On-Board Compares Support Test Data In (TDI) Validation Against Preloaded Expected Data 32-Bit Linear Feedback Shift Register (LFSR) at the Test Data In (TDI) Port for Signature Compression State, Shift, and BIST Macros Allow Predetermined Test Mode Select (TMS) Sequences to be Utilized Operates at 3.3 V Supply Voltages with 5 V Tolerant I/O Outputs Support Power-Down TRI-STATE Mode. The SCANSTA101 is an enhanced version of, and a replacement for, the SCANPSC100. The SCANSTA101 supports the IEEE 1149.1 Test Access Port (TAP) standard and the IEEE 1532 standard for in-system configuration of programmable devices. The SCANSTA101 improves test vector throughput and reduces software overhead in the system processor. The SCANSTA101 presents a simple, register-based interface to the system processor. Texas Instruments provides C-language source code which can be included in the embedded system software. The combination of the SCANSTA101 and its support software comprises a simple API for boundary scan operations. The interface from the SCANSTA101 to the system processor is implemented by reading and writing registers, some of which map to locations in the SCANSTA101 memory. Hardware handshaking and interrupt lines are provided as part of the processor interface. The SCANSTA101 is available as a stand-alone device packaged in a 49-pin NFBGA package. It is also available as an IP macro for synthesis in programmable logic devices. 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright © 2002–2013, Texas Instruments Incorporated SCANSTA101 SNLS057J – MAY 2002 – REVISED APRIL 2013 www.ti.com SCANSTA101 ARCHITECTURE Figure 1. SCANSTA101 STA Master and Interfaces Figure 1 shows a high level view of the SCANSTA101 STA Master and its interfaces. Table 1 provides a brief description of each of these interfaces. provides a brief description of the device pins and their functions. The device is composed of three interfaces around a dual-port memory. These interfaces are the Parallel Processor Interface (PPI), Serial Scan Interface (SSI), and Test and Debug Interface. The System Input block designates inputs that have global use across the device. The Test and Debug Interface supports BIST, boundary scan, and internal scan for the SCANSTA101. Table 1. INTERFACE DESCRIPTIONS Interface Description Parallel Processor Interface Used for configuration, ScanMaster scan chain loads and reads, programmable device file loads and reads, and status monitoring. Serial Scan Interface Performs parallel to serial conversion, sequences and formats the outgoing serial stream to conform to 1149.1 protocol. Test and Debug Interface IEEE 1149.1 TAP System Inputs Interface inputs for system control, i.e. clock, reset and output tristate control. 2 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 SCANSTA101 www.ti.com SNLS057J – MAY 2002 – REVISED APRIL 2013 CONNECTION DIAGRAM Figure 2. NFBGA Package Pinout (Top View) PIN DESCRIPTIONS Pin Name No. Pins I/O VCC 4 N/A Power GND 4 N/A Ground D(15:0) 16 I/O Bidirectional Data Bus. Signals are bonded out for the packaged device. 16 I/O Bidirectional Data Bus. These signals are not available in the packaged device. A(4:0) 5 I Address Bus SCK 1 I The system clock that drives all internal timing. TCK_SM is a gated, divided and buffered version of SCK. INT 1 O Interrupt Output OE 1 I Output enable that will TRI-STATE all 1149.1 "_SM" outputs when high. DTACK 1 O DTACK is used to synchronize asynchronous transfers between the host and the SCANSTA101. When CE is high, DTACK is tristated. When CE is low, DTACK is enabled. DTACK goes low when data has been registered and then goes tri-state when the cycle has completed. R/W 1 I R/W defines a PPI cycle. Read when high, write when low. STB 1 I Strobe is used for timing all PPI transfers. D(15:0), or D(31:0) in 32-bit mode (1), are at TRI-STATE when STB is high. Data valid setup is with respect to the falling edge of STB and data valid hold is with respect to rising edge of STB. CE 1 I Chip Enable, when low, enables the PPI for data transfers. CE can remain low during back-to-back accesses. D(15:0), or D(31:0) in 32-bit mode (1), and DTACK are tristated when CE is high. RST 1 I Asynchronous reset, when low, initializes the SCANSTA101. TDO 1 O Test Data Out is the serial scan output from the SCANSTA101. TDO is enabled when OE is low. D(31:16) (1) (1) Description D(31:16) in the Parallel Processor Interface and TRST1_SM in the Serial Scan Interface are not bonded out for the packaged device. These are used in the 32-bit IP Macro Mode only. Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 3 SCANSTA101 SNLS057J – MAY 2002 – REVISED APRIL 2013 www.ti.com PIN DESCRIPTIONS (continued) Pin Name No. Pins I/O TDI 1 I Test Data In is the serial scan input to the SCANSTA101. TMS 1 I Test Mode Select. The Test Mode Select pin is a serial input used to accept control logic to the test & debug interface. TCK 1 I Test Clock Input for 1149.1 TRST 1 I Test Reset. This pin should be tied to ground by a 1K resistor to hold the Test and Debug Interface in the Test-Logic-Reset state during device power-up. This avoids invalid states when ramping supply voltages. TDI_SM 1 I STA Master Test Data Input in the Serial Scan Interface TDO_SM 1 O STA Master Test Data Output in the Serial Scan Interface TMS_SM 1 O STA Master Test Mode Select in the Serial Scan Interface TCK_SM 1 O STA Master Test Clock in the Serial Scan Interface TRST0_SM 1 O STA Master Test Reset output in the Serial Scan Interface 1 O Redundant ScanMaster TRST. This signal is not available for the packaged device. 1 O The TRI-STATE notification pin exerts a high signal when TDO_SM is at TRI-STATE TRST1_SM (1) TRIST_SM Description These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 4 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 SCANSTA101 www.ti.com SNLS057J – MAY 2002 – REVISED APRIL 2013 ABSOLUTE MAXIMUM RATINGS (1) (2) −0.5V to +4.0V Supply Voltage (VCC) DC Input Diode Current (IIK) VI = −0.5V −20 mA VO = −0.5V −20 mA DC Input Voltage (VI) −0.5V to +4.0V DC Output Diode Current (IOK) DC Output Voltage (VO) −0.5V to +4.0V DC Output Source/Sink Current (IO) ±50 mA DC VCC or Ground Current per Output Pin ±50 mA DC Latchup Source or Sink Current ±300 mA Junction Temperature Plastic +150°C Storage Temperature −65°C to +150°C Lead Temperature (Solder, 4sec) 49L NFBGA 220°C Max Pkg Power Capacity @ 25°C 49L NFBGA 1.47W Thermal Resistance (θJA) 49L NFBGA 85°C/W Package Derating 11.8mW/°C above +25°C ESD Last Passing Voltage (Min) (1) (2) 2000V Absolute maximum ratings are those values beyond which damage to the device may occur. The datasheet specifications should be met, without exception, to ensure that the system design is reliable over its power supply, temperature, and output/input loading variables. Texas Instruments does not recommend operation of SCAN STA products outside of recommended operation conditions. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/ Distributors for availability and specifications. RECOMMENDED OPERATING CONDITIONS Supply Voltage (VCC) 3.0V to 3.6V Input Voltage (VI) 0V to VCC Output Voltage (VO) 0V to VCC −40°C to +85°C Operating Temperature (TA) DC ELECTRICAL CHARACTERISTICS Over recommended operating supply voltage and temperature ranges unless otherwise specified. Symbol Parameter Conditions Min Max Units VIH Minimum High Input Voltage VOUT = 0.1V or VCC − 0.1V VIL Maximum Low Input Voltage VOUT = 0.1V or VCC − 0.1V VOH Minimum High Output Voltage IOUT = −100 μA, VIN = VIL or VIH Minimum High Output Voltage, TDO_SM, TMS_SM, TCK_SM, TRST0_SM outputs only IOH = −24 mA, VIN = VIL or VIH Minimum High Output Voltage, All other outputs including 1149.1 IOH = −12 mA, VIN = VIL or VIH Maximum Low Output Voltage IOUT = +100 μA, VIN = VIL or VIH 0.2 V Maximum Low Output Voltage, TDO_SM, TMS_SM, TCK_SM, TRST0_SM outputs only IOL = 24 mA, VIN = VIL or VIH 0.5 V Maximum Low Output Voltage, all other outputs including 1149.1 IOL = 12mA, VIN = VIL or VIH 0.4 V IIN Maximum Input Leakage Current, All pins except TDI, TMS, TRST, TDI_SM VIN = VCC for TDI, OE, VIN = VCC, GND for All Others ±5.0 μA IILR Maximum Input Leakage Current, TDI, TMS, TRST, TDI_SM VIN = GND -200 μA IIH Maximum Input Leakage Current, TDI, TMS, TRST, TDI_SM VIN = VCC 5.0 μA IOZ Maximum TRI-STATE Leakage Current VIN = VCC, GND, VIN (OE, R/W, CE, STB) = VIL, VIH ±5.0 μA VOL 2.1 V 0.8 VCC-0.2V V V V 2.2 2.4 -45 V Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 5 SCANSTA101 SNLS057J – MAY 2002 – REVISED APRIL 2013 www.ti.com DC ELECTRICAL CHARACTERISTICS (continued) Over recommended operating supply voltage and temperature ranges unless otherwise specified. Symbol Parameter Conditions Min VCC = 0.0V Max Units 5.0 μA IOFF Power Off Leakage Current All pins except TDI, TMS, TRST, and TDI_SM ICC Maximum Quiescent Supply Current 250 μA ICCmax Maximum Supply Current All inputs low 1.2 mA ICCT Maximum ICC/Input VIN = VCC − 0.6V 250 μA AC ELECTRICAL CHARACTERISTICS/OPERATING REQUIREMENTS Over recommended operating supply voltage and temperature ranges unless otherwise specified. CL = 50 pF, RL = 500Ω unless otherwise specified. Symbol Parameter Conditions # of SCK (1) (2) Min Max Units PARALLEL PROCESSOR INTERFACE (PPI) tS1 Set Up Time CE, R/W, Addr, Data to STB tH1 Hold Time CE, R/W, Addr, Data to DTACK See Figure 12 and Figure 13 tD1 Propagation Delay STB low to DTACK low, Register Write See Figure 12 2 or 3 11.5 ns tD1 Propagation Delay STB low to DTACK low, Register Read See Figure 13 4 or 5 11.5 ns tD1 Propagation Delay STB low to DTACK low, Memory Write: 16-bit first access See Figure 12 3 or 4 11.5 ns Propagation Delay STB low to DTACK low, Memory Write: 16-bit second access See Figure 12 7 or 8 11.5 ns Propagation Delay STB low to DTACK low, Memory Read: 16-bit first access See Figure 13 9 or 10 11.5 ns Propagation Delay STB low to DTACK low, Memory Read: 16-bit second access See Figure 13 3 or 4 11.5 ns Propagation Delay STB high to DTACK TRISTATE, Register Write See Figure 12 1 or 2 10.0 ns Propagation Delay STB high to DTACK TRISTATE, Register Read See Figure 13 1 or 2 10.0 ns Propagation Delay STB high to DTACK TRISTATE, Memory Write: 16-bit first access See Figure 12 1 or 2 10.0 ns Propagation Delay STB high to DTACK TRISTATE, Memory Write: 16-bit second access See Figure 12 1 or 2 10.0 ns Propagation Delay STB high to DTACK TRISTATE, Memory Read: 16-bit first access See Figure 13 1 or 2 10.0 ns Propagation Delay STB high to DTACK TRISTATE, Memory Read: 16-bit second access See Figure 13 1 or 2 10.0 ns tD1 tD1 tD1 tD2 tD2 tD2 tD2 tD2 tD2 (1) (2) 6 See Figure 12 and Figure 13 0 ns 0 ns Due to uncertainty in the relationship of the STB placement to the system clock, SCK, the STB may be detected during the current or the next SCK cycle. An absolute maximum delay can be calculated as: (Max # SCK) x (SCK Period) + tD.For example, for tD1 (STB low to DTACK low, register write), the # SCK cycles is 2 or 3 and the delay, tD, is 11.5ns. For a SCK with a 100ns period, the absolute maximum delay is (3 x 100ns) + 11.5, or 311.5ns. Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 SCANSTA101 www.ti.com SNLS057J – MAY 2002 – REVISED APRIL 2013 AC ELECTRICAL CHARACTERISTICS/OPERATING REQUIREMENTS (continued) Over recommended operating supply voltage and temperature ranges unless otherwise specified. CL = 50 pF, RL = 500Ω unless otherwise specified. Symbol tD3 tpHL1 Parameter Conditions # of SCK Propagation Delay Output data valid to DTACK low, all read cycles See Figure 13 1 Propagation Delay STB low to INT low, register write (clears Interrupt) See Figure 12 5 or 6 tW Clock Pulse Width, SCK, H or L fMAX Clock Frequency, SCK tRELEASE Release Time, RST to STB Symbol Min (1) (2) Max Units ns 10.5 ns 3.0 ns 66 2 Parameter Conditions MHz ns Min Max Units SERIAL SCAN INTERFACE (SSI) tD5 Propagation Delay SCK to TCK_SM See Figure 14 11.5 ns tD6 Propagation Delay SCK to TDO_SM See Figure 14 12.0 ns tD7 Propagation Delay SCK to TMS_SM See Figure 14 12.5 ns tD8 Propagation Delay - tpLH SCK to TRIST_SM See Figure 14 15.0 ns tD9 Propagation Delay - tpHL SCK to TRIST_SM See Figure 14 12.5 ns tD10 Propagation Delay SCK to TDO_SM disable See Figure 14 12.5 ns tD11 Propagation Delay SCK to TDO_SM enable See Figure 14 14.0 ns tEN1 Enable Delay OE low to TCK_SM, TDO_SM, TMS_SM, or TRST0_SM See Figure 14 12.0 ns tDIS1 Disable Delay OE high to TCK_SM, TDO_SM, TMS_SM, or TRST0_SM See Figure 14 11.0 ns tEN2 Enable Delay OE low to TRIST_SM 10.0 ns tDIS2 Disable Delay OE high to TRIST_SM 11.5 ns tDIS3 Disable Delay RST low to TRST0_SM 12.5 ns tS2 Setup Time SCK to TDI_SM See Figure 14 3.5 ns tH2 Hold Time SCK to TDI_SM See Figure 14 2.0 ns TEST & DEBUG INTERFACE TIMING REQUIREMENTS (SCAN) tS Setup Time TMS to TCK 2.0 ns tH Hold Time TMS to TCK 1.0 ns tS Setup Time TDI to TCK 1.0 ns tH Hold Time TDI to TCK 2.0 ns tW Pulse Width TCK (H or L) 10.0 ns Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 7 SCANSTA101 SNLS057J – MAY 2002 – REVISED APRIL 2013 Symbol www.ti.com Parameter Conditions Min Max Units tWL Reset Pulse Width TRST (L) 2.5 ns tREC Recovery Time TCK from TRST 2.0 ns fMAX Maximum Clock Frequency, TCK 25 MHz APPLICATIONS/PROGRAMMERS REFERENCE Table 2. REGISTER SUMMARY Address Type Mnemonic Register Active Register Bits 00h RW START Start Register 5 0000h Reset Value 01h RW STATUS Status Register 10 0000h 02h RW INTCTRL Interrupt Control Register 8 0000h 03h RW INTSTAT Interrupt Status Register 8 0000h 04h RW SETUPR Setup Register 8 0043h 05h RW CLKDIV Clock Divider Register 6 0000h 07h RW EXPR TDI_SM LFSR Exponent Register 3 0000h 08h RW LSSEDR TDI_SM LSB Seed Register 16 0000h 09h RW MSSEDR TDI_SM MSB Seed Register 16 0000h 0Ah RW LSRESR TDI_SM LSB Result Register 16 0000h 0Bh RW MSRESR TDI_SM MSB Result Register 16 0000h 0Ch RW INDEXR Index Register 16 0000h 11h RW VINDEXR Vector Index Register 16 0000h 13h RW HTINDEXR Header/Trailer Index Register 16 0000h 15h RW MINDEXR Macro Index Register 16 0000h 17h RW SINDEXR Sequencer Index Register 16 0000h 19h RW BSINDEXR Bridge Support Register 16 0000h Table 3. MEMORY/REGISTER ADDRESS MAP A4 A3 A2 A1 A0 Function Base Address Long Word Index Structure/Size 0 0 0 0 0 0 0 0 0 Start N/A N/A 16-bit Register 1 Status N/A N/A 0 0 0 16-bit Register 1 0 Interrupt Control N/A N/A 16-bit Register 0 0 0 0 0 1 1 Interrupt Status N/A N/A 16-bit Register 1 0 0 Setup N/A N/A 0 16-bit Register 0 1 0 1 Clock Divider N/A N/A 16-bit Register 0 0 1 1 1 TDI_SM LFSR Exponent N/A N/A 16-bit Register 0 1 0 0 0 TDI_SM LFSR LSB Seed N/A N/A 16-bit Register (1) 0 1 0 0 1 TDI_SM LFSR MSB Seed N/A N/A 16-bit Register (1) 0 1 0 1 0 TDI_SM LFSR LSB Result N/A N/A 16-bit Register (1) 0 1 0 1 1 TDI_SM LFSR MSB Result N/A N/A 16-bit Register (1) 0 1 1 0 0 Index Register N/A N/A 16-bit Register (2) 0 1 1 0 1 TDO_SM 0 0 - 0x1BF See (3) See (3) 0 (1) (2) (3) 8 1 1 1 0 TDI_SM 0 x 1C0 0 - 0x1BF The TDI_SM LFSR result and seed registers require two sequential reads/writes for each register pair. The Index register is used to set the individual address pointers. Writing to the Index register will set each of the individual address pointers (TDO_SM, TDI_SM, Expected, and Mask). The individual address pointers will automatically increment with each long word read from TDI_SM or each long word written to the TDO_SM, Expected, or Mask memory spaces. The actual address is calculated from the base address of the memory area plus the content of its address pointer. Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 SCANSTA101 www.ti.com SNLS057J – MAY 2002 – REVISED APRIL 2013 Table 3. MEMORY/REGISTER ADDRESS MAP (continued) (4) A4 A3 A2 A1 A0 Function Base Address Long Word Index Structure/Size 0 1 1 1 1 Expected 0 x 380 0 - 0x1BF See (3) 1 0 0 0 0 Mask 0 x 540 0 - 0x1BF See (3) 1 0 0 0 1 Vector Index N/A N/A 16-bit Register 1 0 0 1 0 Vector 1 0 x 700 0x0 - 0x1 See Vector 2 0 x 700 0x2 - 0x3 Vector 3 0 x 700 0x4 - 0x5 (4) , Table 4 Vector 4 0 x 700 0x6 - 0x7 1 0 0 1 1 Header/Trailer Index N/A N/A 16-bit Register 1 0 1 0 0 Data Header 0 x 708 0x0 - 0x1F See Table 5 Data Trailer 0 x 728 0x20 - 0x3F Instruction Header 0 x 748 0x40 - 0x5F Instruction Trailer 0 x 768 0x60 - 0x7F 1 0 1 0 1 Macro Index N/A N/A 16-bit Register 1 0 1 1 0 Macro 1 0 x 788 0x0 Macro 2 0 x 789 0x1 See Table 6, Table 7 and Table 8 Macro 3 . . . 0 x 78A . . . 0x2 . . . Macro 16 0 x 797 0xF 1 0 1 1 1 Sequencer Index N/A N/A 16-bit Register 1 1 0 0 0 Sequencer 0 x 798 0x0 - 0x1F See Table 9 1 1 0 0 1 Scan Bridge Support Index N/A N/A 16-bit Register 1 1 0 1 0 Scan Bridge Support 0 x 7B8 0x0 - 0x3F See Table 10 The upper two bytes of each vector are ignored. These have been inserted to make the space align on long word boundaries. Table 4. VECTOR STRUCTURE Bit(s) Function 0x00 - 0x1F Length (maximum of 4G) 0x20 - 0x27 Macro Number (1 of 256) Room for scaleability 0x28 - 0x2E Reserved 0x2F Preloaded data / Load-on-the-fly (LotF) 0x30 - 0x3F Reserved Table 5. HEADER/TRAILER STRUCTURE Bit(s) Function 0x00 - 0x1F 32-bit count 0x20 - 0x3FF 124 bytes (992 bits) header/trailer data (1) (1) Count must be greater than zero if the Header/Trailer Usage bits are not equal to "000" or "111". Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 9 SCANSTA101 SNLS057J – MAY 2002 – REVISED APRIL 2013 www.ti.com Table 6. MACRO STRUCTURE Bit(s) Function 0x1F Compare 0x1E Use Mask / Compare full length of vector (not including header/trailer) 0x1D - 0x1B Post-shift TCK_SM Count 0x1A - 0x18 Pre-shift TCK_SM Count 0x17 Sync Bit Support Enable 0x16 Macro Structure Bit 8 Enable (Ignored for the shift macros with or without capture) 0x15 Macro Structure bit 7 Enable (Ignored for the shift macros with or without capture) 0x14 - 0x12 Header/Trailer Usage 0x11 Macro Type bit 1 0x10 Macro Type bit 0 0xF - 0x9 Last 7 TMS_SM bits 0x8 Presented during the falling edge of TCK_SM at terminal count during a Shift macro. Use in the same manner as other TMS bits for State and BIST Macros. 0x7 Loop Bit if Macro type is Shift (for 1149.1 it would be a 0) or BIST 0x6 - 0x0 First 7 TMS_SM Bits (LSB is first bit to be shifted out of TMS_SM) Table 7. HEADER/TRAILER USAGE Bit 2 Bit 1 Bit 0 0 0 0 Function Ignore Headers and Trailers 0 0 1 Use Instruction Header 0 1 0 Use Instruction Trailer 0 1 1 Use both Instruction Header and Trailer 1 0 0 Use Data Header 1 0 1 Use Data Trailer 1 1 0 Use both Data Header and Trailer 1 1 1 Reserved Table 8. Macro Type bits 10 and 11 Bit 1 Bit 0 Function Function 0 0 BIST Macro Loop on loop bit for Vector count. No Data 0 1 Shift Macro Loop on loop bit for vector count. Read data from TDO_SM memory 1 0 Shift Macro with Capture Loop on loop bit for vector count. Read data from TDO_SM memory 1 1 State Macro Do not loop on loop bit of macro. No data to be shifted Table 9. SEQUENCER STRUCTURE Bit(s) Sequence repeat count (up to 255) 0x20 - 0x2F Vector repeat count 0x30 - 0x3F Vector number ..x.. - ..x.. 10 Function 0x00 - 0x1F Repeat vector repeat count and vector number 0x3E0 - 0x3EF Vector repeat count (up to 255) 0x3F0 - 0x3FF Vector number (up to 63) Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 SCANSTA101 www.ti.com SNLS057J – MAY 2002 – REVISED APRIL 2013 Table 10. SCAN BRIDGE SUPPORT STRUCTURE Bit(s) Function 0x00 - 0x0F Levels of Scan Bridge support to be inserted in the scan chain 0x10 - 0x17 Hierarchical Level 0 Scan Bridge Address 0x18 - 0x1F Hierarchical Level 0 Scan Bridge LSP 0x20 - 0x27 Hierarchical Level 1 Scan Bridge Address 0x28 - 0x2F Hierarchical Level 1 Scan Bridge LSP ..x.. - ..x.. Hierarchical Level Scan Bridge Address and LSP 0x7F0 - 0x7F7 Hierarchical Level 125 Scan Bridge Address 0x7F8 - 0x7FF Hierarchical Level 125 Scan Bridge LSP MODULE DESCRIPTIONS Figure 1 shows a high level view of the SCANSTA101. The Parallel Processor Interface (PPI) and the Serial Scan Interface (SSI) connect to each other through a dual-port memory. The PPI provides a parallel interface for transferring data into and out of the dual-port memory, and for configuring, controlling and obtaining the status of the device. The SSI, which resides on the other side of the dual-port memory, provides the parallel-to-serial and serial-to-parallel conversion paths for providing test data and test control to support the STA Master and IEEE 1532 functions. DUAL PORT MEMORY The Dual Port Memory module is a 2048 x 32 bit dual-port memory which acts as the buffer between the PPI and the SSI. There are seven regions of memory as viewed from the processor side. These regions, shown in Table 3, are TDO_SM, TDI_SM, Expected, Mask, Vector, Header/Trailer, Macro. Sequencer, and ScanBridge Support. Each has a pointer which resides in the PPI. The memory is big endian oriented and is viewed as a single entity from the SSI side, and the SSI maintains a pointer. The dual port memory module does not include any logic outside of its own macro function, so all the timing and support logic is included in the PPI and SSI sections. There is no logic included in the SCANSTA101 design to utilize the "busy" indicators to keep the user from overwriting memory locations. The only area where this could occur in memory would be the TDI_SM memory space since both the SSI and PPI can write to this space, but the drivers should not allow PPI writes to this area during normal operations. The Texas Instruments SCAN Ease software does not allow PPI writes to the TDI_SM memory. PARALLEL PROCESSOR INTERFACE The overall function of the PPI is to receive the parallel data from the processor; store the data in the appropriate register or memory location; act on the data if the data are PPI control data; provide status data back to the processor; and provide a read path for result data to the processor. The PPI consists of seven main blocks of logic. These blocks are the Edge Detector (ED), Processor Interface Controller (PIC), the Memory/Register Decoder (MRD), the Word/Long Word Converter (WLWC), the Control Generator (CG), the Status/Interrupt Generator (SIG) and the Flag Generator (FG). WORD/LONG WORD CONVERTER The Word/Long Word Converter (WLWC) has four 16-bit capture registers: a least significant/most significant (LS/MS) word read capture register pair; and a LS/MS word write capture register pair. Each register within the write register pair has a separate enable to allow for the necessary control to accomplish word to long word conversions when in the 16-bit mode. In 32-bit mode, these enables are driven simultaneously. A mux is provided in front of the MS word write capture register to select between the 32-bit and 16-bit mode external bus. Only one enable and a mux select is needed to control the read capture register pair to accomplish the long word to word conversions when in the 16- bit mode. In the 32-bit mode, the mux selection doesn't change, so 32 bits are always driven. A mux is on either side of the LS word read capture register. The mux at the register output provides for selection between the 32-bit and 16-bit mode. The mux at the register input is for selection between register space and memory space. Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 11 SCANSTA101 SNLS057J – MAY 2002 – REVISED APRIL 2013 www.ti.com All the control for this block is provided by the PIC and MRD with the 16/32-bit mode enable coming from the Setup register. EDGE DETECTOR The PPI module can support either an asynchronous or synchronous processor interface. For an asynchronous interface, the circuit initially synchronizes STB and CE to the system clock, SCK, by pipelining these two signals through two flip-flop stages and then performing an edge detection on STB and CE. For a synchronous parallel processor interface, this circuit just performs an edge detection. The outputs of this circuit, one clock wide pulses indicating the detection of negative and positive edges, are used by the Processor Interface Controller (PIC) state machine to start and to end a processor access. PROCESSOR INTERFACE CONTROLLER The Processor Interface Controller (PIC) monitors the incoming processor control signals and sets up the appropriate internal control signals to move the data into memory or into an internal register on a write or to move the data out of memory or out of an internal register on a read. The PIC edge detects the CE and the STB to start the access. The PIC provides the control for the word to long word conversion in the WLWC by controlling the three enables and the mux select (READ_MSW) to the capture registers. The PIC also controls when the internal read/write enable is issued to the memory to complete the read/write operation. Timing for register and memory read and write operations is described in Figure 12 and Figure 13. MEMORY/REGISTER DECODER The Memory/Register Decoder (MRD) contains all six index registers (Index, Vector Index, Header/Trailer Index, Macro Index, Sequencer Index and ScanBridge Support Index) and four address registers (TDI_SM Address, TDO_SM Address, Expected Address and Mask Address). On the PPI side, both index and address registers are used to maintain pointers to their respective memory spaces. The Index register sets values in all four address registers; i.e., writing to the Index register sets all of the address registers. The value written to each address register is the sum of its base address and the value written to the Index register (the offset). All index and address registers except the Index register auto-increment with each access to the corresponding memory space. The MRD provides the address decode to generate all the control and status register enables for the CG and the SIG. The MRD also provides the mux selects for the register or memory selection for the read capture operation in the WLWC. CONTROL GENERATOR The Control Generator includes the seven control registers: the Start, Interrupt Control, Setup, Clock Divider, TDI_SM LFSR Exponent, TDI_SM LFSR LSB Seed, and TDI_SM LFSR MSB Seed registers are included in this block. The CG issues a strobe to the SSI when a write has been issued to the Start or Setup registers so the SSI can react to the new control data. The strobe is derived from edge detecting the enables to the Start or Setup registers. The "new" data to the SSI are the Use Sequencer bit and three Use Vector bits from the Start register, and the TDO Default Value, TRST, ScanBridge Support Initiate/Release, three-bit Sync Bit Length, and two Test Loop-back bits from the Setup register. STATUS/INTERRUPT GENERATOR The Status/Interrupt Generator comprises the four status registers plus the logic to generate the interrupts and to clear the interrupts on a read. The registers are the Status, Interrupt Status, TDI_SM LFSR LSB Result and TDI_SM LFSR MSB Result registers. The SIG receives the LFSR result and strobe signal SSI_LFSR_EN from the SSI and captures the data in the LSB and MSB registers. The SIG receives the compare result bit value from the SSI along with the compare result bit clear and the compare result bit load. The SIG receives the 4 memory space flags from the FG along with their associated load and clear signals so these bits may be constantly updated. The half-full, half-empty, full and empty flags are generated and updated regardless of the states of their respective interrupt enables. The SIG also receives the four interrupt enables for the flags. The SIG also receives the sequencer active and the three vector active signals from the SSI. These are also updated regardless of the enable state. 12 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 SCANSTA101 www.ti.com SNLS057J – MAY 2002 – REVISED APRIL 2013 If an interrupt enable is set then an interrupt will be generated. If an interrupt occurs at the same time as the interrupt status is being read, then the interrupt will be set after the read is complete. All bits in the Interrupt Status register are cleared when the register is read. FLAG GENERATOR The FG takes in the TDI_SM or TDO_SM pointer values from the PPI address pointers, compares them and generates the appropriate flags. If a flag condition has occurred, it is passed, along with the corresponding load enable, to the SIG to set the bit in the status register. If the flag condition changes, then the clear for the corresponding bit is passed to the SIG to clear the flag. The TDO_SM empty and the TDI_SM full flags are passed to the SSI also. A counter enable is passed from the SSI to indicate to the FG when the SSI's pointer value has changed. If a decrement and an increment occur at the same time to either of the counters, the counter value will not change. PPI INTERFACE TIMING The processor accesses to SCANSTA101 can be classified into six categories: • register read • register write • 16-bit memory read • 16-bit memory write • 32-bit memory read • 32-bit memory write Register reads and register writes are performed the same whether the device is in 16-bit mode or 32-bit mode. In 32-bit mode, only the LS word is used. The MS word is ignored. The timing for the 16-bit and 32-bit modes is exactly the same. The 16-bit mode memory write is accomplished by performing two consecutive register writes with the only difference being that the actual write occurs on the second access. The 16-bit mode register read consists of two accesses, with the first access performed similar to the 16-bit register read but requiring one more clock to complete the memory access. Since all 32-bits of the memory data are captured on the first access, the second memory read access is 2 clocks shorter than the first. The processor initiates a write cycle by asserting CE followed by STB. A set time prior to asserting STB, the R/W is driven low and the address and data buses are driven by valid address and data, respectively. After edge detecting the STB and registering all the inputs, the address is decoded to determine which internal address within the SCANSTA101 will be written by the processor. The DTACK will be asserted on the same rising edge of SCK on which the negative edge of the STB signal is detected, indicating to the processor that it can deassert the STB. When the SCANSTA101 detects the positive edge of the STB, it will deassert the DTACK indicating to the processor that it can start a new cycle. The processor can start a new cycle by asserting the STB and by driving the address and data buses with new address and data. A read cycle is similar to the write cycle except that the DTACK will not be asserted until the selected address location's contents are loaded. So, for a 16-bit register read it takes one more clock than it does for a write cycle. Reads and writes to the SCANSTA101 memory require two consecutive accesses in the 16-bit external bus mode. The memory writes are similar to register writes; the processor performs two consecutive 16-bit writes to write to the selected memory location. During a memory read, the DTACK line is not asserted until the contents of the memory is loaded into the capture registers. For this reason the first read from the memory requires five clocks which includes the memory access time, while the second read is done in three clock cycles. SERIAL SCAN INTERFACE The Serial Scan Interface consists of the following units: • Clock Divider and TCK_SM Control • TAP Tracker • Pointer Generator • Structure (Sequencer/Vector/Macro/ScanBridge) Decoder Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 13 SCANSTA101 SNLS057J – MAY 2002 – REVISED APRIL 2013 • • • • • • www.ti.com Structure (Sequencer/Vector/Macro/ScanBridge) Control Registers Count Generator Shifter (TDO_SM/TDI_SM/TMS_SM) Comparator Expected and Mask Registers Serial Scan Interface Controller (SSIC) and ScanBridge Controller The clock divider unit divides the system clock SCK based on the programmable divisor set in the clock divider to generate TCK_SM. The TCK_SM control unit gates TCK_SM if the TDO_SM buffer is empty. The TAP Tracker unit tracks the target's TAP controller state. The TAP Tracker determines whether the target's TAP controller is in SIR or SDR state, so that the necessary pad bits are inserted. The shifter block contains two 32-bit shift registers for TDO_SM and TDI_SM respectively, and a 16-bit shift register for TMS_SM. The comparator unit compares the serial input on the TDI_SM pin with the expected data, bit by bit, if the compare bit of the Macro Structure is set. If the compare/mask bit is set, then the comparator unit compares only those bits that are unmasked. Expected and Mask Registers contain the data fetched from the memory. This data is used by the comparator to compare the TDI_SM input with the expected data. The SSIC provides the timing and control signals to synchronize the operation of the various blocks in the SSI. The ScanBridge Controller consists of the control logic to set up the ScanBridge hierarchy, if the ScanBridge Support Initiate/Release bit is enabled, prior to scanning test vectors out of TDO_SM. CLOCK DIVIDER AND TCK_SM CONTROL The clock divider is a binary divider with only one bit of the clock divider register set to one at any given time. The SCANSTA101 SSI ignores bits 0, and 8-15 of the clock divider register, so the supported divisors are 2, 4, 8, 16, 32, 64 and 128. To generate a TCK_SM of frequency SCK/4, the clock divider register should be set to 4 (00000100). This will enable the gate at the output of bit 2 of the counter to generate a clock of SCK divided by 4. If in LotF mode, the TCK_SM enable from the SSIC will gate TCK_SM when the TDO_SM buffer is empty. TAP TRACKER The TAP Tracker consists of a 16-bit register to track the IEEE Standard 1149.1 TAP state machine. The register is one-hot encoded (meaning that only one bit in the TAP tracker register, corresponding to the current TAP state, is set at a time) and will continuously track the target's TAP Controller based on the TMS_SM sequence. The TAP Tracker is used by the ScanBridge support controller to determine whether the target's TAP controller is in SIR or SDR state so that it can insert an appropriate number of pre and post-shift pad bits. The TAP Tracker will enter Test-Logic Reset state upon setting the TRST bit (bit 5) in the Setup register or by issuing a sequence of five TMS_SM high bits. SHIFTER The Shifter block contains two 32-bit shift registers for TDO_SM and TDI_SM respectively, and one 16-bit shift register for TMS_SM. The TMS_SM shifter block diagram is shown in Figure 3, the TDO_SM shifter block diagram is shown in Figure 4, and the TDI_SM shifter block diagram is shown in Figure 5. Before the start of a vector processing the TMS_SM shifter is loaded with the least significant 16 bits of the macro structure. Based on the pre-shift TCK_SM count, the TMS_SM shifter will skip (7 - pre-shift count) least significant bits. e.g., if the pre-shift count is 4, the least significant 3 bits of the TMS_SM shifter will not be used to drive TMS_SM during pre-shift. Similarly, if the post-shift is less than 7 then, during post shift only the number of bits equal to the post-shift count following the macro structure bit 8 will be used to drive TMS_SM. 14 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 SCANSTA101 www.ti.com SNLS057J – MAY 2002 – REVISED APRIL 2013 The SCANSTA101 memory is organized in big endian format. A memory write is accomplished by two consecutive writes to the same location. When embedded software loads the TDO_SM memory, the least significant 16 bits are written first and then the most significant 16 bits. Therefore, when the Sequencer or a Vector is initialized the SSIC can directly fetch and load the long word to the TDO_SM shifter without any modification. Figure 3. TMS_SM Shifter Figure 4. TDO_SM Shifter Figure 5. TDI_SM Shifter Reading from TDI_SM memory is accomplished by two consecutive reads. When reading from the TDI_SM memory, the first read will contain the least significant 16 bits and the second read the most significant 16 bits. The TDI_SM shifter unit consists of two 32-bit shift registers as shown in Figure 5. The shift register on top in the figure is the LFSR register. Before using the TDI_SM LFSR register, the LFSR Exponent and LFSR Seed registers must be written with valid data. The LFSR Exponent register must be written with a 3-bit binary encoded value that selects one of the five available polynomials. The value written to the LFSR Seed registers is used to initialize the TDI_SM LFSR register to a predetermined state. Once the test vector has completely scanned in, the final contents of the LFSR register are transferred to the LFSR Result registers. Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 15 SCANSTA101 SNLS057J – MAY 2002 – REVISED APRIL 2013 www.ti.com The 32-bit shift register at the bottom is used to shift in TDI_SM directly in normal mode or to shift in TMS_SM or TDO_SM in the loop-back mode. After each long word of 32 bits is shifted into this register, the contents of the register are transferred to the corresponding TDI memory location before the next shift operation. SHIFTER IMPLEMENTATION Shift register implementation is illustrated in Figure 6. Shift out enable for the TMS_SM and TDO_SM shifters is generated by comparing the clock pulse counter output to the clock divider - 1. Shift in enable for the TDI_SM shifter is generated by comparing the clock pulse counter to the programmable divisor/2 - 1. These enables are gated by the control signals from SSIC so that data are shifted out (TMS_SM/TDO_SM) or shifted in (TDI_SM) only when necessary. Figure 6. Shift Register Implementation and Timing 16 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 SCANSTA101 www.ti.com SNLS057J – MAY 2002 – REVISED APRIL 2013 COMPARATOR AND EXPECTED/MASK REGISTERS The One-Bit Comparator, when enabled, compares the TDI_SM input with expected data. When the compare feature is enabled (in preloaded vector mode only) the SSIC pre-fetches data into Expected and Mask registers from the address locations for the current vector being processed. The comparator will compare each bit on the TDI_SM input with the corresponding bit from the expected register. If the mask feature is enabled, then the comparison is performed only on those bits that are not masked, i.e., on those bits for which the mask is set to zero. Table 11 shows how the Compare and Use Mask/Compare bits in the Macro Structure are used. Table 11. Compare and Use Mask/Compare Bit Descriptions Compare Use Mask/Compare Description 0 0 Do Not Compare 0 1 Compare with Mask 1 0 Compare without Mask 1 1 Compare with Mask The Results of Compare bit (bit 15 of Status register) stores the comparison results in the status register. This bit defaults to fail (zero) and will be updated only after the current vector is processed. In the case of a single vector the Results of Compare bit will be set to one (pass) only if all the bits in the scanned in vector match the expected vector. However, in the case of the sequencer only the results of final vector comparison will be taken into account. Each vector within the sequencer is repeated until the vector repeat count is exhausted. The sequence is repeated until the sequencer repeat count is exhausted. Figure 7 illustrates the compare logic. After reset and before every sequencer process, flip-flops 1 and 3 are initialized to zero while flip-flop 2 is set to 1. When the compare feature is enabled flip-flop 1 is continuously updated with the immediate comparison results (1 for pass and 0 for fail). Flip-flop 2 is reset to zero when a mismatch occurs and remains in this state for the remainder of the current vector processing. When the current vector is completely processed flip-flop 3 (Results of Compare register) will be updated with the current status. Figure 7. Compare Logic Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 17 SCANSTA101 SNLS057J – MAY 2002 – REVISED APRIL 2013 www.ti.com SERIAL SCAN INTERFACE CONTROLLER AND SCANBRIDGE CONTROLLER The Serial Scan Interface Controller (SSIC) remains in the Idle state until new data are written to the Start register. When this event occurs the following operations are performed: 1. If the ScanBridge Support Initiate/Release bit was not set previously and is currently set in the Setup register, the SSIC initializes the ScanBridge Controller (SBC) to perform the following steps to set up all ScanBridges in the hierarchy. (a) Determine the number of levels of ScanBridge support to be inserted (from the ScanBridge support structure) (b) Sequence TMS_SM so that all ScanBridges in the same level of hierarchy enter the SIR state, and then shift in the address (from the ScanBridge structure) to select a ScanBridge in the current level of hierarchy. The ScanBridge's TAP controller is then sequenced through the Update-IR state. (c) Sequence TMS_SM so that the selected ScanBridge's TAP controller enters the SIR state, then scan in the MODESEL instruction to put its mode register in the data path. (d) Sequence the selected ScanBridge's TAP controller to enter the Shift-DR state and scan in the LSP contents (from the ScanBridge structure) into its mode register. The ScanBridge's TAP controller is then sequenced through the Update-DR state. (e) Repeat Step 1C, but this time scan in the UNPARK instruction so that the LSP is inserted into the active scan chain. (f) Sequence the ScanBridge's TAP controller to enter the RTI state (the LSP will not be unparked until its TAP controller enters RTI). (g) Repeat Steps 1B through Step 1G to configure the ScanBridges in the remaining hierarchy levels. One set of pre-shift pad and post-shift pad bits is added to the patterns for each hierarchy level between the STA Master and the ScanBridge being configured. The pad bits are used to bypass the intermediate levels of hierarchy. (h) For the subsequent vectors, if the TAP Tracker enters the (a) SDR state, the SCANSTA101 will add one pre-shift bit for the pad register and one post-shift bit for the bypass register for each level of hierarchy. (b) SIR state, the SCANSTA101 will add one pre-shift bit for the pad register and eight post-shift bits for the ScanBridge instruction register for each level of hierarchy. The eight post-shift bits will be all ones, forcing the ScanBridge into bypass mode. (i) The pad bits need to be stripped when loading a vector into TDI_SM. This will be done by having a status flag to indicate whether the vector that is being scanned out has ScanBridge support or not. If the scanned-out vector has ScanBridge support, then the pad bits will be stripped when the TAP Tracker enters the SDR or SIR states. 2. If the ScanBridge Support Initiate/Release bit was set previously and is currently reset in the Setup register, the SSIC will toggle TCK_SM five times while TMS_SM is held high. This will return all selected ScanBridges to the wait-for-address state and park the LSPs in the Test-Logic-Reset state. When the ScanBridge support is released the user should make sure that the Use Vector and Use Sequencer bits in the Start register are not set, so that the SSIC will not start processing a vector or the sequencer immediately after releasing the ScanBridge support. Once the ScanBridge support is released the user may start processing a vector or the sequencer by writing to the Start register. 3. If the sequencer is enabled (the Use Sequencer bit in the Start register is one), (a) Clear the Results of Compare bit and set the Using Sequencer bit in the Status register. (b) Fetch the sequence repeat count. (c) If the sequence repeat count is zero, the sequence is complete so reset the Using Sequencer bit and return to the Idle state, otherwise fetch the next vector number and its repeat count. (d) If the vector number is zero, decrement the sequence repeat count and return to Step 3C. If the vector number is illegal, i.e., other than 001, 010, 011, or 100, decrement the sequence repeat count and return to Step 3C. (e) If the vector repeat count is equal to zero, fetch the next vector number and its repeat count and go to Step 3D. If the repeat count is non-zero fetch the vector structure. (f) If the pre-load bit in the vector structure is not set, reset the Using Sequencer bit and return to the Idle state. 4. If the sequencer is not enabled but a vector is enabled (the Use Vector bits in the Start register are nonzero), fetch the current vector structure and set the appropriate Using Vector bits in the Status register. If neither the sequencer nor a vector is enabled, return to the Idle state. 5. Fetch the Macro Structure to be used, set the vector/macro control bits and store the TMS_SM bits in the 18 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 SCANSTA101 www.ti.com SNLS057J – MAY 2002 – REVISED APRIL 2013 Structure Control registers. 6. If the Pre-shift TCK_SM Count is not zero, then enable TCK_SM and drive TMS_SM using the first seven bits of the macro until the Pre-shift TCK_SM Count is zero. During pre-shift, TDO_SM will be driven with its previous value. 7. If the macro type is State then, (a) If the Macro Structure Bit 7 is enabled, set TMS_SM to the bit 7 value of the macro structure and drive TDO_SM with its previous value. (b) If the Macro Structure Bit 8 is enabled, set TMS_SM to the bit 8 value of the macro structure and drive TDO_SM with it's previous value and then go to Step 10. (c) If the sequencer is being used, then decrement the vector repeat count and return to Step 3E. If a vector is being used, return to the Idle state. 8. If the macro type is BIST then, (a) If the Macro Structure Bit 7 is enabled, set the count length, set TMS_SM to the bit 7 value of the macro structure and drive TDO_SM with the default value (Setup register bit 6) until the count length is zero. (b) If the Macro Structure Bit 8 is enabled, set TMS_SM to the bit 8 value of the macro structure and drive TDO_SM with the default value (Setup register bit 6) and then go to Step 10. (c) If the sequencer is being used then, decrement the vector repeat count and return to Step 3E. If a vector is being used, return to the Idle state. 9. If the macro type is Shift or Shift with Capture then, (a) If the macro type is Shift with Capture, enable TDI capture. (b) If the Sync Bit Support Enable bit is set, fetch sync bit count, set the count length, set TMS_SM to the loop bit and drive the TDO_SM high until sync bit count is zero. (c) If the ScanBridge Support Initiate/Release bit is set, drive the TDO_SM with pre- PAD bit (high) and while TMS_SM remains set to the loop bit. Repeat for each level of hierarchy. (d) If the Use Data/Instruction Header is enabled, fetch the header length and data, set the count length, and drive the TDO_SM with header data until the header length is zero and while TMS_SM remains set to the loop bit. (e) If the Compare or Mask/Compare is set, enable the comparator. (f) Set the vector count length, and drive the TDO_SM with vector data until the count length is one and while TMS_SM remains set to the loop bit. In the LotF mode if the count length is not zero and the TDO buffer is empty, then gate TCK_SM until more data are available in the TDO buffer. When TCK_SM is disabled TMS_SM and TDO_SM will be driven with their previous values. (g) If the Use Data/Instruction Trailer is enabled, fetch the trailer length and data, set the count length, and drive TDO_SM with trailer data until the trailer length is one and while TMS_SM remains set to the loop bit. (h) If the ScanBridge Support Initiate/Release bit is set: (a) If the TAP tracker is in the Shift-IR state and the number of levels of hierarchy is greater than one, set the count length to eight, and drive TDO_SM with post-shift pad bits (all high) until the count length is zero for each level of hierarchy and while TMS_SM remains set to the loop bit. (b) If the TAP tracker is in the Shift-DR state and the number of levels of hierarchy is greater than one, drive TDO_SM with a post-shift pad bit (high) for each level of hierarchy and while TMS_SM remains set to the loop bit. (c) For the final level of hierarchy or if there is only one level of hierarchy, and if the TAP tracker is in the Shift-IR state, set the count length to eight, and drive TDO_SM with post-shift pad bits (all high) until the count length is one and while TMS_SM remains set to the loop bit. (i) If the Sync Bit Support Enable is set, fetch sync bit count, set the count length, and drive the TDO_SM high until sync bit count is one and while TMS_SM remains set to the loop bit. (j) Set TMS_SM to bit 8 of the TMS_SM Macro Structure sequence and drive TDO_SM with the final vector bit or trailer bit or post-shift pad bit or sync bit. After shifting out the final vector bit, disable the comparator and register the comparison results. 10. If the post-shift TCK_SM Count is not zero, then enable TCK_SM and drive TMS_SM using the last seven bits of the macro until the post-shift TCK_SM Count is zero. 11. If the Sequencer is being used, (a) Decrement the sequence repeat count and return to Step 3C if the Compare or Mask/Compare is enabled and the results of compare is a fail. (b) Decrement the vector repeat count and return to Step 3E if the if the Compare or Mask/Compare is enabled and the results of compare is a pass. Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 19 SCANSTA101 SNLS057J – MAY 2002 – REVISED APRIL 2013 www.ti.com (c) Decrement the vector repeat count and return to Step 3E if the Compare or Mask/ Compare is not enabled. 12. If the Vector is being used return to the Idle state. MODE REGISTER WRITE TO VECTOR/SEQUENCER START Figure 8 shows the timing from the processor write to the start of vector processing. Figure 9 shows the timing from the processor write to the start of sequencer processing. A processor write to the Start registers is indicated by a "new data" pulse. On the same SCK rising edge when the "new data" is detected to be high, the Start or Setup register contents will be updated with new data. So, the decoding of the enables takes place during the next clock cycle to determine whether to process the sequencer or a vector. Therefore, one clock after the "new data" is detected, the SSIC starts loading the pointer register on consecutive cycles with the appropriate addresses to fetch the Sequencer, Vector and Macro Structures. Once the headers are decoded and Structure Control Registers are set up, the SSIC loads the pointer register so that data from the TDO_SM memory area is fetched and loaded into the TDO_SM shifter before being shifted out. However if there are any sync bits and/or header bits and/or ScanBridge support is enabled, then the sync bits and/or header bits and/or ScanBridge prePAD bits will be loaded into the TDO_SM shifter before processing the actual test vector. Once the actual test vector is completely shifted out, again depending on the ScanBridge support and/or the use of trailers, post-PAD bits and the trailer bits are loaded and shifted out through the TDO_SM shifter. The count length will be decremented by one with each shift. After shifting out all the current shifter contents the shifter will be loaded with new data before the falling edge of the next TCK_SM, if the count length is not exhausted. In the case where data cannot be loaded from the memory before the next falling edge of TCK_SM, the TCK_SM will be gated until the data is available. Figure 8. Timing from Mode Register Write to Vector Start Figure 9. Timing from Mode Register to Sequencer Start 20 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 SCANSTA101 www.ti.com SNLS057J – MAY 2002 – REVISED APRIL 2013 WRITING AND READING PARTIAL LONG WORDS Care should be taken when writing a partial long word to TDO_SM memory or reading a partial long word from TDI_SM memory. Since the TDO_SM shifter shifts out LSB first, the valid (meaningful) bits within a partial long word (i.e., long word containing less than 32 valid bits to be shifted to the scan chain) must be stored and written into the memory as the least significant bits. This will assure that the desired bits will be accurately loaded into the TDO_SM shifter and shifted out to the boundary scan chain. For instance, to shift a 3-bit (110) sequence the partial long word should be written to the TDO_SM memory as shown in Figure 10 (only the least significant 16 bits are shown). A subsequent enable and load of the vector structure with the correct length will initialize the shift operation and only the bits that are significant will be shifted out to the scan chain. Figure 10. Writing a Partial Long Word to the TDO_SM Memory Data is shifted from the scan chain into the TDI_SM shifter from MSB to LSB. Consequently, the valid (meaningful) bits in a partial long word shifted into the TDI_SM shifter will reside in the upper significant bit locations. For example, if a scan operation involves shifting and evaluating 69 bits returning to TDI_SM, the TDI_SM memory will be loaded with two long words (i.e., two full long words plus a partial long word containing 5 meaningful bits). If the last 5 bits shifted back to the TDI_SM shifter are 11010, then upon completion of the shift operation, the TDI_SM shifter will contain the following partial long word as shown in Figure 11 (only the most significant 16 bits are shown), which will subsequently be loaded into the TDI_SM memory. Following a read of a partial long word, the embedded test software must adjust the position of the valid bits read from the TDI_SM shifter/buffer or the position of the expected data to assure that an accurate comparison is made (and the non-meaningful bits are masked). Figure 11. Reading a Partial Long Word from the TDI_SM Memory TDO_SM IMPLEMENTATION The behavior of the TDO_SM output depends on the macro type that is being processed and the SETUP register bits 11 and 10, as shown in Table 12, regardless of the TAP tracker state. For shift macros, the TDO_SM output also depends on the current macro structure's TMS_SM bit number as explained below. Table 12. TDO_SM Output Behavior SETUP[11:10] TDO_SM 00 Hold Previous value 01 or 10 Default TDO value (Bit 6 of the SETUP register) 11 High Impedance (1) (1) Default TDO value (bit 6 of the SETUP register) may be set to a 0 when SETUP[11:10]=01 and to a 1 when SETUP[11:10]=10. For BIST and STATE macros, the TDO_SM output behaves as shown in the above table. For the shift macros, with or without capture, the TDO_SM output behaves as per the table only when the corresponding TMS_SM output is not driven by the macro structure bit 7 or 8. On each falling edge of the TCK_SM following the TCK_SM falling edge on which the TMS_SM changes state from bit 6 of the macro structure to bit 7 of the macro structure, the serial test vector data fetched from the memory is presented on the TDO_SM output. On the falling edge of the TCK_SM on which the final bit of the test vector is presented on the TDO_SM output, the TMS_SM is presented with macro structure bit 8. On the subsequent TCK_SM falling edges, and on the TCK_SM falling edges before the TMS_SM changes state from bit 6 to bit 7 of the macro structure, the TDO_SM will behave as per the table above. Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 21 SCANSTA101 SNLS057J – MAY 2002 – REVISED APRIL 2013 www.ti.com HARDWARE INTERFACE DETAILS Table 13. System Interface Signal Description Signal Name No. of Bits Pin Type Driver Type Freq. MHz Description SCK 1 I LVTTL 66 System Clock: This is the main clock signal to the SCANSTA101. SCK is used to clock all internal circuitry RST 1 I,H LVTTL N/A Hardware Reset signal (with hysteresis (H)): This is the SCANSTA101 asynchronous reset signal. This signal resets the entire SCANSTA101 and sets all registers to their respective default values. OE 1 I LVTTL N/A Output enable: will TRI-STATE all 1149.1 outputs when high. Table 14. Parallel Processor Interface Signal Descriptions Signal Name No. of Bits Pin Type Driver Type Freq. MHz Description DATA(31:16) 16 I/O LVTTL (weakest driver) N/A Bidirectional Data Bus. Not bonded out in packaged part. These are only used in the 32-bit macro version. DATA(15:0) 16 I/O LVTTL N/A Bidirectional Data Bus. ADDRESS(4:0) 5 I LVTTL N/A Address Bus CE 1 I LVTTL N/A Chip Enable, when low, enables the PPI for transfers. DATA(31:0) and DTACK are tristated when CE is high. R/W 1 I LVTTL N/A Read/Write defines a PPI cycle. Read when high, write when low. STB 1 I LVTTL N/A Strobe is used for timing all PPI transfers. DATA(31:0) are tristated when STB is high. Data valid setup is with respect to the falling edge of STB and data valid hold is with respect to rising edge of STB. DTACK 1 O O/D N/A Data Acknowledge (open drain - sustained tristate). DTACK is used to synchronize asynchronous transfers between the host and the SCANSTA101. During write cycles, DTACK goes low when data has been registered and then goes to high impedance when the cycle has been completed. During read cycles DTACK goes low when data bus is driven with the valid data and then goes to high impedance when the cycle has been completed. INT 1 O LVTTL N/A Interrupt is used to trigger a host interrupt for any of the defined interrupt events. Signal is active high. Table 15. Serial Scan Interface Signal Descriptions Signal Name No. Pin Type Driver Type Freq. MHz TDI_SM 1 I LVTTL up to 25 ScanMaster Test Data Input (weak pullup) TDO_SM 1 O LVTTL up to 25 ScanMaster Test Data Output TMS_SM 1 O LVTTL up to 25 ScanMaster Test Mode Select TCK_SM 1 O LVTTL up to 25 ScanMaster Test Clock TRST0_SM 1 O LVTTL N/A ScanMaster Test Reset TRST1_SM 1 O LVTTL N/A Redundant ScanMaster Test Reset (not bonded out) TRIST_SM 1 O LVTTL N/A The tristate notification pin exerts a high when TDO_SM is tristated. 22 Description Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 SCANSTA101 www.ti.com SNLS057J – MAY 2002 – REVISED APRIL 2013 Figure 12. PPI Write Cycle Timing Diagram Figure 13. PPI Read Cycle Timing Diagram Figure 14. SSI Timing Diagram with Clock Divider set to 4 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 23 SCANSTA101 SNLS057J – MAY 2002 – REVISED APRIL 2013 www.ti.com Figure 15. SSI Timing Diagram with Clock Divider set to 8 Table 16. SCANSTA101 1149.1 Signal Descriptions No. of Bits Pin Type Driver Type Freq. MHz TDO 1 O LVTTL up to 25 SCANSTA101 Test Data Out TDI 1 I,U LVTTL up to 25 SCANSTA101 Test Data In (pullup (U)) TMS 1 I,U LVTTL up to 25 SCANSTA101 Test Mode Select (pullup (U)) TCK 1 I LVTTL up to 25 SCANSTA101 Test Clock TRST 1 I,U,H LVTTL N/A Signal Name Description SCANSTA101 Test Reset (pullup (U) & hysteresis (H)) SAFE MODE This device implements the following design rules to provide Single Event Upset/Single Event Error (SEU/SEE) protection: • Triple modular redundancy (TMR) for TRST0_SM and TRST1_SM outputs with the help of a TMR D flip-flop . • After reset all scan interface outputs are driven to SEU tolerant safe values as shown below: – TMS_SM = 1 – TCK_SM = 0 – TDO_SM = high-Z – TRST0_SM = 0 – TRST1_SM = 0 • The EXTEST and the HIGHZ outputs from the JTAG TAP controller are gated with TRST to protect the boundary scan cells from inadvertently entering the test mode. CLOCK GENERATION AND DISTRIBUTION Input Clock (SCK): Up to 66 MHz Output Clock (TCK_SM): TCK_SM is a divided, registered version of SCK. • Selectable: to 1/2, 1/4, 1/8, 1/16, 1/32, 1/64, and 1/128 of SCK. • Frequency: up to 25 MHz 24 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 SCANSTA101 www.ti.com SNLS057J – MAY 2002 – REVISED APRIL 2013 RESET STRATEGY The incoming external hardware reset (RST) will be synchronized to the incoming clock (SCK) and is combined with the soft reset to generate a synchronized internal reset (SYS_RST_N). During operation, the chip can be reset by writing a '1' to the Reset bit in the Setup register. All logic throughout the device will be initialized, all control and status registers will be in a known default state, all PPI memory address pointers will default to their respective base addresses, the SSI memory pointer will default to zero, the Tap Tracker will be reset to TLR, and the clock division counter will be initialized to all zeroes after deassertion of the internal reset. The Reset bit in the Setup register is self clearing. The TRST bit in the Setup register, when set, resets the SSI logic and drives the TRST0_SM and TRST1_SM to zero. SOFTWARE INTERFACE DETAILS REGISTER DEFINITIONS The following sections include descriptions of each addressable register in the ScanMaster memory space. Following the title of the particular register, the mnemonic for the register is included in parentheses as well as the physical address location in hexadecimal notation (value preceded by $). KEY- RO: Read Only; RW: Read/Write. Table 17. Start Register (START) ($00) (1) Bit(s) Type Address Offset Reset Value 15:14 RO Reserved Field 0 00b 13 RW Onboard Memory BIST 0 0b 12:9 RO Reserved 0 0000b 8 RW Use Sequencer 0 0b 7:3 RO Reserved Use Vector x 0 0000h 2:0 RW Use Vector x 0 000b (1) Reset Source SYS_RST SYS_RST SYS_RST Reserved Use Vector x for future growth for the number of vectors. Onboard Memory BIST ScanMaster memory BIST enable. This bit is self clearing when BIST result is written to the Memory BIST Result bit in the Status register. '1' Initiate on chip memory BIST '0' On chip memory BIST complete Use Sequencer Sequencer enable/disable (For preloaded vectors only) '1' Enable sequencer '0' Disable sequencer Use Vector Use Vector x designates the vector "x" which is enabled, where "x" is the vector number, a binary encoding of bits . Only vectors 1 through 4 are valid. Vectors 5 through 7 reserved for future use. '000' No vector enabled '001' Vector 1 enabled '010' Vector 2 enabled '011' Vector 3 enabled '100' Vector 4 enabled Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 25 SCANSTA101 SNLS057J – MAY 2002 – REVISED APRIL 2013 www.ti.com Table 18. Status Register (STATUS) ($01) (1) (2) (3) (4) Bit(s) Type 15 RW Results of Compare 14 RW 13 RW 12 RW TDO Status Half-empty 11 RW TDO Status Empty 10 RW TDI Status Full 9 RW TDI Status Half-full 8 RW Using Sequencer Address Offset Reset Value Reset Source 0 0b SYS_RST BIST Running 0 0b SYS_RST Memory BIST Result 0 0b SYS_RST 0 0b SYS_RST 0 0b SYS_RST 0 0b SYS_RST 0 0b SYS_RST 0 0b SYS_RST 0 00000b 0 000b (2) (3) (3) 7:3 RO Reserved Using Vector x 2:0 RW Using Vector x (4) SYS_RST Write capability to the register is only for test and debug purposes. Drivers should disable writes to the register during normal operation. Results of Compare bit is toggled after a compare is complete and it is set to the mismatch state when sequencer is kicked off again. Remains in last state until next compare completed or until set to the mismatch state. Half full or half empty designates 56 long words. Reserved Using Vector x for future growth for the number of vectors. Results of Compare Results of compare between TDI_SM and Expected memory space '1' Compare match '0' Compare mismatch BIST Running Indicates the BIST operation is still active '1' BIST operation active '0' BIST operation complete or BIST operation not running Memory BIST Result ScanMaster BIST result. BIST result will be held until overwritten by next BIST operation. '1' Passed memory BIST '0' Failed memory BIST TDO Status Half TDO_SM memory space status half empty '1' TDO_SM memory space half empty '0' TDO_SM memory space not half empty TDO Status Empty TDO_SM memory space status empty '1' TDO_SM memory space empty '0' TDO_SM memory space not empty TDI Status Full TDI_SM memory space status full '1' TDI_SM memory space full '0' TDI_SM memory space not full TDI Status Half TDI_SM memory space status half full '1' TDI_SM memory space half full '0' TDI_SM memory space not half full Using Sequencer Sequencer active and processing. Bit cleared when sequence complete. '1' Sequencer active '0' Sequencer inactive Using Vector 26 Field (1) Using Vector x designates the vector "x" currently running, where "x" is the vector number, a binary encoding of bits . Only vectors 1 through 4 are valid. Vectors 5 through 7 reserved for future use. Field cleared when vectors complete. '000' No vector active. '001' Vector 1 active. '010' Vector 2 active. '011' Vector 3 active. '100' Vector 4 active. Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 SCANSTA101 www.ti.com SNLS057J – MAY 2002 – REVISED APRIL 2013 Table 19. Interrupt Control Register (INTCTRL) ($02) (1) (2) (3) Bit(s) Type 15:13 RO Reserved Field 12 RW TDO Half-empty Interrupt Enable 11 RW TDO Empty Interrupt Enable 10 RW TDI Full Interrupt Enable 9 RW TDI Half-full Interrupt Enable Address Offset Reset Value 0 000b 0 0b SYS_RST 0 0b SYS_RST 0 0b SYS_RST 0 0b SYS_RST 0 0b SYS_RST 0 00000b 0 000b (1) (1) (2) 8 RW Sequencer Interrupt Enable 7:3 RO Reserved Vector x Interrupt Enable 2:0 RW Vector x Interrupt Enable (3) (2) Reset Source SYS_RST Half full or half empty designates 56 long words. Drivers should not allow Sequencer Interrupt Enable and Vector x Interrupt Enable to be set at same time. Sequencer Interrupt Enable has priority over the Vector x Interrupt Enable. Reserved Vector x Interrupt Enable for future growth for the number of vectors. TDO Half-empty Interrupt Enable TDO_SM memory space half empty interrupt enable '1' Enable TDO_SM memory space half empty interrupt '0' Disable TDO_SM memory space half empty interrupt TDO Empty Interrupt Enable TDO_SM memory space empty interrupt enable '1' Enable TDO_SM memory space empty interrupt '0' Disable TDO_SM memory space empty interrupt TDI Full Interrupt Enable TDI_SM memory space full interrupt enable '1' Enable TDI_SM memory space full interrupt '0' Disable TDI_SM memory space full interrupt TDI Half-full Interrupt Enable TDI_SM memory space half full interrupt enable '1' Enable TDI_SM memory space half full interrupt '0' Disable TDI_SM memory space half full interrupt Sequencer Interrupt Enable Sequencer activity complete interrupt enable '1' Enable Sequencer activity complete interrupt '0' Disable Sequencer activity complete interrupt Vector Interrupt Enable Vector "x" complete interrupt enable, where "x" is the vector number, a binary encoding of bits . Only vector interrupts 1 through 4 are valid. Vector interrupts 5 through 7 reserved for future use. '000' No vector interrupt enabled '001' Vector 1 interrupt enabled '010' Vector 2 interrupt enabled '011' Vector 3 interrupt enabled '100' Vector 4 interrupt enabled Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 27 SCANSTA101 SNLS057J – MAY 2002 – REVISED APRIL 2013 www.ti.com Table 20. Interrupt Status Register (INTSTAT) ($03) (1) (2) (3) (4) Bit(s) Type 15:13 RO Reserved Field 12 RW TDO Half-empty Interrupt 11 RW TDO Empty Interrupt 10 RW TDI Full Interrupt 9 RW TDI Half-full Interrupt Address Offset Reset Value 0 00b 0 0b SYS_RST 0 1b SYS_RST 0 0b SYS_RST 0 0b SYS_RST 0 0b SYS_RST 0 00000b 0 000b (2) (2) 8 RW Sequencer Interrupt 7:3 RO Reserved Vector x Interrupt 2:0 RW Vector x Interrupt (1) (3) (4) (4) Reset Source SYS_RST This register is writable in debug mode only. Half full or half empty designates 56 long words. Reserved Vector x Interrupt for future growth for the number of vectors. Drivers shouldn't allow Sequencer Interrupt and Vector x Interrupt to be set at same time. Sequencer Interrupt has priority over the Vector x Interrupt. TDO Half-empty Interrupt TDO_SM memory space half empty status '1' TDO_SM memory space half empty '0' TDO_SM memory space not half empty TDO Empty Interrupt TDO_SM memory space empty status '1' TDO_SM memory space empty '0' TDO_SM memory space not empty TDI Full Interrupt TDI_SM memory space full status '1' TDI_SM memory space full '0' TDI_SM memory space not full TDI Half-full Interrupt TDI_SM memory space half full status '1' TDI_SM memory space half full '0' TDI_SM memory space not half full Sequencer Interrupt Sequencer completed status '1' Sequencer processing completed '0' Sequencer processing or not started Vector Interrupt Vector "x" completed status, where "x" is the vector number, a binary encoding of bits . Only vectors 1 through 4 are valid. Vectors 5 through 7 reserved for future use. '000' No vector completed activity '001' Vector 1 completed '010' Vector 2 completed '011' Vector 3 completed '100' Vector 4 completed Table 21. Setup Register (SETUPR) ($04) 28 Bit(s) Type Field Address Offset Reset Value Reset Source SYS_RST 15 RW 16/32 bit Mode 0 0b 14:10 RO Reserved 0 00h 11:10 RW TDO_SM Ctrl 0 00b SYS_RST 9:7 RW Sync Bit Length 0 000b SYS_RST 6 RW Default TDO Value 0 1b SYS_RST 5 RW Debug Mode 0 0b SYS_RST 4 RW ScanBridge Support Initiate/ Release 0 0b SYS_RST 3 RW TRST 0 0b SYS_RST 2 RW Reset 0 0b SYS_RST 1:0 RW Test Loop-Back 0 11b SYS_RST Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 SCANSTA101 www.ti.com SNLS057J – MAY 2002 – REVISED APRIL 2013 16/32 bit Mode Selects 16-bit or 32-bit external interface mode '1' 32-bit external interface mode (used in macro form only) '0' 16-bit external interface mode TDO_SM Ctrl TDO_SM Control bits '00' Hold previous value '01' Default TDO Value '10' Default TDO Value '11' High impedance Sync Bit Length "x" Sync Bit Length bits represents the number of sync bits to be used when the Sync Bit Support Enable bit (17 in the Macro Structure) is set. The value "x" is the binary encoded numeric value. Default TDO Value The value in this register will be sent out on the TDO_SM pin when performing a BIST or a STATE Macro. '1' Drive TDO_SM to one. '0' Drive TDO_SM to zero. Debug Mode Control bit to put SCANSTA101 in debug mode '1' Debug mode. '0' Normal mode. ScanBridge Support Initiate/Release ScanBridge support enable '1' Enable ScanBridge support '0' Disable ScanBridge support TRST Processor initiated ScanMaster test reset (on TRST0_SM and TRST1_SM_N). Bit is cleared by a processor write. '1' Set TRST outputs low (active) and reset SSI logic. '0' Set TRST outputs high Reset Processor commanded synchronous reset to the serial scan logic for 2 clocks. This bit is self clearing. '1' Reset the entire chip. '0' Release serial scan logic reset Test Loop-Back Test loop-back mode bits '00' Normal operation '01' Loop-back TDO_SM to TDI_SM '10' Loop-back TMS_SM to TDI_SM '11' All Dot1 (1149.1) pins placed in SEU tolerant safe mode with: TMS_SM = 1, TCK_SM = 0, TDO_SM = Z, TRST0_SM = 0 Table 22. Clock Divider Register (CLKDIV) ($05) Bit(s) Type 15:8 RO Reserved 7:1 RW Divisor 0 (1) RO Field Reserved (hard coded) (1) Address Offset Reset Value 0 00h 0 00h 0 0b Reset Source SYS_RST LSB of the Clock Divider register is hard coded to zero. Divisor Clock divisor for the division of the SCK clock to the serial scan clock. '0000000' No serial scan clock generated. '0000001' Divide SCK by 2 '0000010' Divide SCK by 4 '0000100' Divide SCK by 8 '0001000' Divide SCK by 16 '0010000' Divide SCK by 32 '0100000' Divide SCK by 64 '1000000' Divide SCK by 128 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 29 SCANSTA101 SNLS057J – MAY 2002 – REVISED APRIL 2013 www.ti.com Table 23. TDI_SM LFSR Exponent Register (EXPR) ($07) Bit(s) Type Address Offset Reset Value 15:3 RO Reserved Field 0 0000h 2:0 RW LFSR 0 000b LFSR Exponent LFSR exponent. Binary encoding for the selection between three polynomials. '000' No polynomial selected '001' Polynomial 1: X32 + X7 + X5 + X3 + X2 + X + 1 '010' Polynomial 2: X32 + X28 + X27 + X + 1 '011' Polynomial 3: X32 + X7 + X6 + X2 + 1 Table 24. TDI_SM LFSR LSB Seed Register (LSSEDR) ($08) (1) (2) Bit(s) Type 15:0 RW Field LSW LFSR Seed Address Offset Reset Value Reset Source 0 0000h SYS_RST LSW LFSR Seed is the LS word of the LFSR seed. This register along with register MSSEDR form a register pair and should be read/written with two consecutive read/write accesses. Bit(s) Type 15:0 RW Field MSW LFSR Seed (1) (2) Address Offset Reset Value Reset Source 0 0000h SYS_RST MSW LFSR Seed is the MS word of the LFSR seed. This register along with register LSSEDR form a register pair and should be read/ written with two consecutive read/write accesses. Table 26. TDI_SM LFSR LSB Result Register (LSRESR) ($0A) (1) (2) Bit(s) Type 15:0 RW Field LSW LFSR Result Reset Value Reset Source 0 0000h SYS_RST LSW LFSR Result is the LS word of the LFSR result. This register along with register MSRESR form a register pair and should be read/written with two consecutive read/write accesses. Bit(s) Type 15:0 RW Field MSW LFSR Result Reset Value Reset Source 0 0000h SYS_RST MSW LFSR Result is the MS word of the LFSR result. This register along with register LSRESR form a register pair and should be read/ written with two consecutive read/write accesses. Bit(s) Type 15:0 RW Field Index (1) (2) (3) Address Offset Reset Value Reset Source 0 0000h SYS_RST Index sets the individual address memory pointer. Address memory pointer must be on a long word boundary. Writing to this register sets the TDO_SM, TDI_SM, Expected and Mask pointers. These pointers will automatically increment with each long word read from the TDI_SM space and each long word write to the other TDO_SM, Expected and Mask spaces. Table 29. Vector Index Register (VINDEXR) ($11) (1) (2) 30 (1) (2) Address Offset Table 28. Index Register (INDEXR) ($0C) (1) (2) (3) (1) (2) Address Offset Table 27. TDI_SM LFSR MSB Result Register (MSRESR) ($0B) (1) (2) SYS_RST (1) (2) Table 25. TDI_SM LFSR MSB Seed Register (MSSEDR) ($09) (1) (2) Reset Source Bit(s) Type 15:0 RW Field Vector Index (1) (2) Address Offset Reset Value Reset Source 0 0000h SYS_RST Vector Index sets the Vector address memory pointer. Address memory pointer must be on a long word boundary. Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 SCANSTA101 www.ti.com SNLS057J – MAY 2002 – REVISED APRIL 2013 Table 30. Header/Trailer Index Register (HTINDEXR) ($13) (1) (2) Bit(s) Type 15:0 RW Field Address Offset Reset Value Reset Source 0 0000h SYS_RST Header/Trailer Index Header/Trailer Index sets the Header/Trailer address memory pointer. Address memory pointer must be on a long word boundary. Table 31. Macro Index Register (MINDEXR) ($15) (1) (2) Bit(s) Type 15:0 RW Field (1) (2) Address Offset Reset Value Reset Source 0 0000h SYS_RST Macro Index Macro Index sets the Macro address memory pointer. Address memory pointer must be on a long word boundary. Table 32. Sequencer Index Register (SINDEXR) ($17) (1) (2) (1) (2) Bit(s) Type 15:0 RW Field (1) (2) Address Offset Reset Value Reset Source 0 0000h SYS_RST Sequencer Index Sequencer Index sets the Sequencer address memory pointer. Address memory pointer must be on a long word boundary. Table 33. ScanBridge Support Index Register (BSINDEXR) ($19) (1) (2) Bit(s) Type 15:0 RW Field (1) (2) Address Offset Reset Value Reset Source 0 0000h SYS_RST ScanBridge Index ScanBridge Index sets the ScanBridge Support address memory pointer. Address memory pointer must be on a long word boundary. TESTABILITY DETAILS - IEEE 1149.1 SUPPORT Table 34. Supported IEEE 1149.1 Instruction Set Instruction Mnemonic Binary Instruction Code Description EXTEST 000 Allows off-chip circuitry and interconnect to be tested. SAMPLE/PRELOAD 001 Allows snapshot of normal operation. Also allows data to be loaded on parallel output boundary scan registers. BYPASS 111 Places device in bypass mode so that there is single shift register stage between TDI and TDO. IDCODE 010 Allows scanning of the device identification register. HIGHZ 011 Will TRI-STATE all output drivers with the exception of TDO. CLAMP 100 Allows the state of the signals driven from component pins to be determined from the boundary-scan register while the BYPASS register is selected as the serial path between TDI and TDO. RUNBIST 110 Enables on chip BIST logic to perform memory BIST. SCANTEST 101 Allows the assertion of internal test_mode signal to prevent the asynchronous resets from inadvertently resetting the flip-flops during internal scan. Used in factory test. Table 35. IDCODE Register Description Version Part Number Manufacturer Identity Start Bit "0000" "1111 1100 0001 0111" "000 0000 1111" "1" Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 31 SCANSTA101 SNLS057J – MAY 2002 – REVISED APRIL 2013 www.ti.com Table 36. Boundary Scan Register Definition BSR Bit# Signal Name BSR Bit# Signal Name BSR Bit# Signal Name BSR Bit# Signal Name 0 SCK 10 DTACK 20 DATA[7] 30 TCK_SM 1 RST 11 INT 21 DATA[6] 31 TRST0_SM 2 R/W 12 DATA[15] 22 DATA[5] 32 TDI_SM 3 STB 13 DATA[14] 23 DATA[4] 33 OE 4 CE 14 DATA[13] 24 DATA[3] 34 TRIST 5 ADDRESS[4] 15 DATA[12] 25 DATA[2] 6 ADDRESS[3] 16 DATA[11] 26 DATA[1] 7 ADDRESS[2] 17 DATA[10] 27 DATA[0] 8 ADDRESS[1] 18 DATA[9] 28 TDO_SM 9 ADDRESS[0] 19 DATA[8] 29 TMS_SM BIST SUPPORT The memory BIST can be initiated through JTAG interface using the RUNBIST instruction or by setting the Onboard Memory BIST bit in the Start register. When the memory BIST is initiated through the JTAG interface the result of pass/fail will be set in the Memory BIST Result bit in the Status register and also in the BIST status register that can be accessed through the JTAG interface. The BIST status register is a one bit register and is connected in the serial path of TDO and TDI when the RUNBIST instruction is scanned into the instruction register. Once the BIST is done, the contents of the BIST status register can be scanned out to determine whether the memory BIST passed or failed. If the memory BIST is initiated through the Onboard Memory BIST bit in the Start register the result of pass/fail will be set only in the BIST Result bit in the status register. The memory BIST will initialize the memory to zero. 32 Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 SCANSTA101 www.ti.com SNLS057J – MAY 2002 – REVISED APRIL 2013 REVISION HISTORY April, 2013 – Changed layout of National Data Sheet to TI format. January, 2010 – Applications information updates and clarification. No specification changes. Submit Documentation Feedback Copyright © 2002–2013, Texas Instruments Incorporated Product Folder Links: SCANSTA101 33 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) (3) Device Marking (4/5) (6) SCANSTA101SM/NOPB ACTIVE NFBGA NZA 49 416 RoHS & Green SNAGCU Level-4-260C-72 HR -40 to 85 SCANSTA101 SM SCANSTA101SMX/NOPB ACTIVE NFBGA NZA 49 2000 RoHS & Green SNAGCU Level-4-260C-72 HR -40 to 85 SCANSTA101 SM (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of
SCANSTA101SMX/NOPB 价格&库存

很抱歉,暂时无法提供与“SCANSTA101SMX/NOPB”相匹配的价格&库存,您可以联系我们找货

免费人工找货