TPS22966TDPUTQ1

Product Folder Order Now Support & Community Tools & Software Technical Documents TPS22966-Q1 SLVSC71B – DECEMBER 2013 – REVISED MARCH 2020 TPS22966-Q1 Dual-Channel, Ultralow Resistance Load Switch 1 Features 2 Applications • • • • 1 • • • • • • • • • Qualified for Automotive Applications AEC-Q100 Qualified With the Following Results: – Device Temperature Grade 2: –40°C to 105°C Ambient Operating Temperature Range – Device HBM ESD Classification Level H1C – Device CDM ESD Classification Level C6 Integrated Dual-Channel Load Switch Input Voltage Range: 0 V to 5.5 V Ultralow ON-Resistance (RON) – RON = 16 mΩ at VIN = 5 V (VBIAS = 5 V) – RON = 16 mΩ at VIN = 3.3 V (VBIAS = 5 V) – RON = 16 mΩ at VIN = 1.8 V (VBIAS = 5 V) 4-A Maximum Continuous Switch Current per Channel Low Quiescent Current – 80 µA (Both Channels) – 80 µA (Single Channel) Low Control Input Threshold Enables Use of 1.2-V, 1.8-V, 2.5-V, and 3.3-V Logic Configurable Rise Time Quick Output Discharge (QOD) SON 14-Pin Package With Thermal Pad Infotainment ADAS (Advanced Driver Assistance Systems) 3 Description The TPS22966-Q1 device is a small, ultralow RON, dual-channel load switch with adjustable rise time. The device contains two N-channel MOSFETs that can operate over an input voltage range of 0 V to 5.5 V and can support a maximum continuous current of up to 4 A per channel. Each switch is independently controlled by an on/off input (ON1 and ON2), which can interface directly with low-voltage control signals. The TPS22966-Q1 includes a 230-Ω on-chip resistor for quick output discharge when the switch is turned off. The TPS22966-Q1 is available in a small, spacesaving 2-mm × 3-mm 14-SON package (DPU) with integrated thermal pad allowing for high power dissipation. The device is characterized for operation over the free-air temperature range of –40°C to 105°C. Device Information(1) PART NUMBER TPS22966-Q1 PACKAGE BODY SIZE (NOM) WSON (14) 3.00 mm × 2.00 mm (1) For all available packages, see the orderable addendum at the end of the datasheet. Typical Application Schematic VIN1 Dual Power Supply ON CIN VOUT1 ON1 CL RL CT1 OFF CT2 or GND VBIAS Dual DC/DC converter VIN2 ON CIN VOUT2 ON2 CL OFF TPS22966-Q1 GND GND 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TPS22966-Q1 SLVSC71B – DECEMBER 2013 – REVISED MARCH 2020 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 2 3 4 6.1 6.2 6.3 6.4 6.5 6.6 6.7 6.8 4 4 4 5 5 6 7 8 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics: VBIAS = 5 V ...................... Electrical Characteristics: VBIAS = 2.5 V ................... Switching Characteristics .......................................... Typical Characteristics .............................................. Parameter Measurement Information ................ 13 Detailed Description ............................................ 14 8.1 Overview ................................................................. 14 8.2 Functional Block Diagram ....................................... 14 8.3 Feature Description................................................. 15 8.4 Device Functional Modes........................................ 15 9 Application and Implementation ........................ 16 9.1 Application Information............................................ 16 9.2 Typical Application ................................................. 18 10 Power Supply Recommendations ..................... 20 11 Layout................................................................... 20 11.1 Layout Guidelines ................................................. 20 11.2 Layout Example .................................................... 21 12 Device and Documentation Support ................. 22 12.1 12.2 12.3 12.4 12.5 Trademarks ........................................................... Electrostatic Discharge Caution ............................ Glossary ................................................................ Receiving Notification of Documentation Updates Support Resources ............................................... 22 22 22 22 22 13 Mechanical, Packaging, and Orderable Information ........................................................... 22 4 Revision History Changes from Revision A (March 2015) to Revision B • Changed Input voltage range from 0.8 V to 0 V in the Recommended Operating Conditions table .................................... 4 Changes from Original (December 2013) to Revision A • 2 Page Page Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1 Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: TPS22966-Q1 TPS22966-Q1 www.ti.com SLVSC71B – DECEMBER 2013 – REVISED MARCH 2020 5 Pin Configuration and Functions DPU Package 14-Pin WSON 1 14 14 VIN1 1 VOUT1 VOUT1 VIN1 VIN1 VOUT1 VOUT1 VIN1 ON1 CT 1 CT 1 ON1 VBIAS GND GND CT2 ON2 VBIAS ON2 CT2 VIN2 VOUT2 VOUT2 VIN2 VIN2 VOUT2 VOUT2 VIN2 Top View Bottom View Pin Functions PIN NO. NAME I/O DESCRIPTION 1 VIN1 I Switch 1 input. Place an optional decoupling capacitor between this pin and GND for reduce VIN dip during turnon of the channel. See Application Information section for more information. 2 VIN1 I Switch 1 input. Place an optional decoupling capacitor between this pin and GND for reduce VIN dip during turnon of the channel. See Application Informationfor more information. 3 ON1 I Active high switch 1 control input. Do not leave floating. 4 VBIAS I Bias voltage. Power supply to the device. See Application Information for more information. 5 ON2 I Active high switch 2 control input. Do not leave floating. 6 VIN2 I Switch 2 input. Place an optional decoupling capacitor between this pin and GND for reduce VIN dip during turnon of the channel. See Application Information for more information. 7 VIN2 I Switch 2 input. Place an optional decoupling capacitor between this pin and GND for reduce VIN dip during turnon of the channel. See Application Information for more information. 8 VOUT2 O Switch 2 output. 9 VOUT2 O Switch 2 output. 10 CT2 O Switch 2 slew rate control. Can be left floating. Capacitor used on this pin should be rated for a minimum of 25 V for desired rise time performance. 11 GND – Ground 12 CT1 O Switch 1 slew rate control. Can be left floating. Capacitor used on this pin should be rated for a minimum of 25 V for desired rise time performance. 13 VOUT1 O Switch 1 output. 14 VOUT1 O Switch 1 output. 15 Thermal Pad O Thermal pad (exposed center pad) to alleviate thermal stress. Tie to GND. See Layout Guidelines for layout guidelines. Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: TPS22966-Q1 3 TPS22966-Q1 SLVSC71B – DECEMBER 2013 – REVISED MARCH 2020 www.ti.com 6 Specifications 6.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT VIN1,2 Input voltage –0.3 6 V VOUT1,2 Output voltage –0.3 6 V VON1,2 ON-pin voltage –0.3 6 V VBIAS VBIAS voltage –0.3 6 V IMAX Maximum continuous switch current per channel 4 A IPLS Maximum pulsed switch current per channel, pulse VBIAS but it will exhibit RON greater than what is listed in Electrical Characteristics. See Figure 32 for an example of a typical device. Notice the increasing RON as VIN exceeds VBIAS voltage. 50 VBIAS = 2.5V 45 VBIAS = 3.3V VBIAS = 3.6V 40 VBIAS = 4.2V RON (m ) VBIAS = 5V 35 VBIAS = 5.5V 30 25 20 Temperature = 25£C, IOUT = -200mA 15 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 4 4.4 4.8 5.2 5.6 VIN (V) C023 Figure 32. RON vs. VIN (Single Channel) 16 Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: TPS22966-Q1 TPS22966-Q1 www.ti.com SLVSC71B – DECEMBER 2013 – REVISED MARCH 2020 Application Information (continued) 9.1.4 Safe Operating Area (SOA) The SOA curves in Figure 33 show the continuous current carrying capability of the device versus ambient temperature (TA) to ensure reliable operation over 100,000 hours of device lifetime. Each curve represents a specific percent of time that the switch is on. The 100% curve represents use for a full 24 hours in a day. The 75% curve indicates 18 hours of use in a day while the 12.5% curve shows 3 hours of use per day. Examples on how to use this plot: • The application has an ambient temperature of 60°C and the switch will be on 100% of the time. The maximum continuous current that can be applied is approximately 2.1 A. • The application requires the switch to be on 12.5% of the time and the current while on will be 3 A. The maximum ambient temperature is approximately 100°C. • The application requires 2 A and will be operated at 70°C. The switch can be on for a maximum of 75% of the time. • It is expected that most applications will not have specific use cases as defined in the examples above. Different use cases can be combined to generate a more complete view of a specific application. This example shows use under various conditions simplified to an average use case. The application requires operation at 4 A for 25% of the time, 1 A for 25% of the time and is off the remaining 50% of the time. Ambient temperature will vary from 25°C to 50°C. Will there be any limitations? The average current can be calculated as (4 A × 25% + 1 A * 25% + 0 A * 50%). The average current calculates to be 1.25 A. Assuming worst case temperature of 50°C, the resulting application is within the safe operating area. 5.00 Continuous Current (A) 4.00 3.00 2.00 1.00 100% On time 75% On time VBIAS = 5.0 V 12.5% On time 0.00 -40 -15 10 35 60 85 110 Ambient Temperature (°C) C002 Figure 33. Safe Operating Area Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: TPS22966-Q1 17 TPS22966-Q1 SLVSC71B – DECEMBER 2013 – REVISED MARCH 2020 www.ti.com 9.2 Typical Application VIN1 Dual Power Supply ON CIN VOUT1 ON1 CL RL CT1 OFF CT2 or GND VBIAS Dual DC/DC converter VOUT2 VIN2 ON CIN ON2 CL OFF TPS22966-Q1 GND GND Figure 34. Typical Application Schematic 9.2.1 Design Requirements For this design example, use the parameters listed in Table 3 as the input parameters. Table 3. Design Parameters DESIGN PARAMETER VALUE Input voltage 3.3 V Bias voltage 5V Load capacitance (CL) 22 µF Maximum acceptable inrush current 400 mA 9.2.2 Detailed Design Procedure When the switch is enabled, the output capacitors must be charged up from 0 V to the set value (3.3 V in this example). This charge arrives in the form of inrush current. Inrush current can be calculated using Equation 2: Inrush Current = C × dV/dt where • • • C = output capacitance dV = output voltage dt = rise time (2) The TPS22966-Q1 offers adjustable rise time for VOUT. This feature allows the user to control the inrush current during turnon. The appropriate rise time can be calculated using Table 3 and the inrush current equation. 400 mA = 22 μF × 3.3 V/dt dt = 181.5 μs (3) (4) To ensure an inrush current of less than 400 mA, choose a CT value that will yield a rise time of more than 181.5 μs. See the oscilloscope captures in for an example of how the CT capacitor can be used to reduce inrush current. 18 Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: TPS22966-Q1 TPS22966-Q1 www.ti.com SLVSC71B – DECEMBER 2013 – REVISED MARCH 2020 9.2.3 Application Curves VBIAS = 5 V ; VIN = 3.3 V ; CL = 22 μF Figure 35. Inrush Current With CT = 0 pF Figure 36. Inrush Current With CT = 220 pF Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: TPS22966-Q1 19 TPS22966-Q1 SLVSC71B – DECEMBER 2013 – REVISED MARCH 2020 www.ti.com 10 Power Supply Recommendations The device is designed to operate from a VBIAS range of 2.5 V to 5.5 V and a VIN voltage range of 0 V to 5.5 V. The power supply should be well regulated and placed as close to the device terminals as possible. It must be able to withstand all transient and load current steps. In most situations, using an input capacitance of 1 uF is sufficient to prevent the supply voltage from dipping when the switch is turned on. In cases where the power supply is slow to respond to a large transient current or large load current step, additional bulk capacitance may be required on the input. The requirements for larger input capacitance can be mitigated by adding additional capacitance to the CT pin. This will cause the load switch to turn on more slowly. Not only will this reduce transient inrush current, but it will also give the power supply more time to respond to the load current step. 11 Layout 11.1 Layout Guidelines For best performance, all traces should be as short as possible. To be most effective, the input and output capacitors should be placed close to the device to minimize the effects that parasitic trace inductances may have on normal operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects along with minimizing the case to ambient thermal impedance. The maximum IC junction temperature should be restricted to 150°C under normal operating conditions. To calculate the maximum allowable power dissipation, PD(max) for a given output current and ambient temperature, use the following equation: PD(max) = TJ(max) - TA θJA where • • • • PD(max) = maximum allowable power dissipation TJ(max) = maximum allowable junction temperature (150°C for the TPS22966-Q1) TA = ambient temperature ΘJA = junction to air thermal impedance. See Thermal Information section. This parameter is highly dependent upon board layout. (5) Figure 37 shows an example of a layout. Notice the thermal vias located under the exposed thermal pad of the device. This allows for thermal diffusion away from the device. 20 Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: TPS22966-Q1 TPS22966-Q1 www.ti.com SLVSC71B – DECEMBER 2013 – REVISED MARCH 2020 11.2 Layout Example VOUT1 capacitor VIN1 capacitor VIN2 capacitor CT1 capacitor Thermal relief vias CT2 capacitor VOUT2 capacitor Figure 37. Layout Example Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: TPS22966-Q1 21 TPS22966-Q1 SLVSC71B – DECEMBER 2013 – REVISED MARCH 2020 www.ti.com 12 Device and Documentation Support 12.1 Trademarks E2E is a trademark of Texas Instruments. All other trademarks are the property of their respective owners. 12.2 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.3 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 12.4 Receiving Notification of Documentation Updates To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper right corner, click on Alert me to register and receive a weekly digest of any product information that has changed. For change details, review the revision history included in any revised document. 12.5 Support Resources TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight from the experts. Search existing answers or ask your own question to get the quick design help you need. Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of Use. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 22 Submit Documentation Feedback Copyright © 2013–2020, Texas Instruments Incorporated Product Folder Links: TPS22966-Q1 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TPS22966TDPURQ1 ACTIVE WSON DPU 14 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 105 966TQ1 TPS22966TDPUTQ1 ACTIVE WSON DPU 14 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 105 966TQ1 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of