TPS22967DSGR

Product Folder Sample & Buy Support & Community Tools & Software Technical Documents TPS22967 SLVSC42A – AUGUST 2013 – REVISED APRIL 2015 TPS22967 Single-Channel, Ultra-Low Resistance Load Switch 1 Features 3 Description • • • The TPS22967 device is a small, ultra-low RON, single-channel load switch with controlled turnon. The device contains an N-channel MOSFET that can operate over an input voltage range of 0.8 V to 5.5 V and can support a maximum continuous current of 4 A. The switch is controlled by an on/off input (ON), which can interface directly with low-voltage control signals. In the TPS22967, a 225-Ω pulldown resistor is added for quick output discharge when the switch is turned off. 1 • • • • • • Integrated Single-Channel Load Switch Input Voltage Range: 0.8 V to 5.5 V Low RON Resistance – RON = 22 mΩ at VIN = 5 V (VBIAS = 5 V) – RON = 22 mΩ at VIN = 3.6 V (VBIAS = 5 V) – RON = 22 mΩ at VIN = 1.8 V (VBIAS = 5 V) 4-A Maximum Continuous Switch Current Low Quiescent Current (50 µA) Low Control Input Threshold Enables Use of 1.2-V, 1.8-V, 2.5-V, and 3.3-V Logic Configurable Rise Time Quick Output Discharge (QOD) WSON 8-Pin Package With Thermal Pad 2 Applications • • • • • • • The TPS22967 is available in a small, space-saving 2-mm × 2-mm 8-pin WSON package (DSG) with integrated thermal pad allowing for high power dissipation. The device is characterized for operation over the free-air temperature range of –40°C to 85°C. Device Information(1) PART NUMBER TPS22967 Ultrabooks™ Notebooks and Netbooks Tablet PCs Consumer Electronics Set-Top Boxes and Residental Gateways Telecom Systems Solid-State Drives (SSD) PACKAGE WSON (8) BODY SIZE (NOM) 2.00 mm × 2.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. 4 Typical Application Schematic Power Supply VIN ON CIN VOUT ON CL RL CT OFF GND GND VBIAS TPS22967 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TPS22967 SLVSC42A – AUGUST 2013 – REVISED APRIL 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Typical Application Schematic............................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 1 2 3 4 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 4 4 4 5 5 6 7 8 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics: VBIAS = 5 V ...................... Electrical Characteristics: VBIAS = 2.5 V ................... Switching Characteristics .......................................... Typical Characteristics .............................................. Detailed Description ............................................ 14 8.1 8.2 8.3 8.4 9 Overview ................................................................. Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ 14 14 14 15 Application and Implementation ........................ 16 9.1 Application Information............................................ 16 9.2 Typical Application ................................................. 17 10 Power Supply Recommendations ..................... 19 11 Layout................................................................... 19 11.1 Layout Guidelines ................................................. 19 11.2 Layout Example .................................................... 20 12 Device and Documentation Support ................. 20 12.1 Trademarks ........................................................... 20 12.2 Electrostatic Discharge Caution ............................ 20 12.3 Glossary ................................................................ 20 13 Mechanical, Packaging, and Orderable Information ........................................................... 20 5 Revision History Changes from Original (August 2013) to Revision A • 2 Page Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: TPS22967 TPS22967 www.ti.com SLVSC42A – AUGUST 2013 – REVISED APRIL 2015 6 Pin Configuration and Functions DSG Package 8-Pin WSON VIN 1 8 VOUT VOUT 8 1 VIN VIN 2 7 VOUT VOUT 7 2 VIN ON 3 6 CT CT 6 3 ON VBIAS 4 5 GND GND 5 4 VBIAS BOTTOM VIEW TOP VIEW Pin Functions PIN NAME NO. I/O DESCRIPTION CT 6 O Switch slew rate control. Can be left floating. See Application and Implementation for more information. GND 5 – Device ground. ON 3 I Active high switch control input. Do not leave floating. VBIAS 4 I Bias voltage. Power supply to the device. Recommended voltage range for this pin is 2.5 V to 5.5 V. See Application Information section for more information. VIN 1, 2 I Switch input. Input capacitor recommended for minimizing VIN dip. Recommended voltage range for this pin for optimal RON performance is 0.8 V to VBIAS. VOUT 7, 8 O Switch output. – Thermal pad (exposed center pad) to alleviate thermal stress. Tie to GND. See Layout Example for layout guidelines. Thermal Pad Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: TPS22967 3 TPS22967 SLVSC42A – AUGUST 2013 – REVISED APRIL 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT (2) VIN Input voltage –0.3 6 V VOUT Output voltage –0.3 6 V VBIAS Bias voltage –0.3 6 V VON ON voltage –0.3 6 V IMAX Maximum continuous switch current 4 A IPLS Maximum pulsed switch current, pulse VBIAS but it will exhibit RON greater than what is listed in the Electrical Characteristics: VBIAS = 5 V table. See Figure 31 for an example of a typical device. Notice the increasing RON as VIN exceeds VBIAS voltage. Never exceed the maximum voltage rating for VIN and VBIAS. 50 VBIAS = 2.5V VBIAS = 3.3V 45 VBIAS = 3.6V VBIAS = 4.2V RON (m ) 40 VBIAS = 5V VBIAS = 5.5V 35 Temperature=25C, IOUT=-200mA 30 25 20 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 4 4.4 4.8 5.2 5.6 VIN (V) C017 Figure 31. RON vs VIN (VIN > VBIAS) 16 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: TPS22967 TPS22967 www.ti.com SLVSC42A – AUGUST 2013 – REVISED APRIL 2015 Application Information (continued) 9.1.4 Safe Operating Area (SOA) The SOA curves show the continuous current carrying capability of the device versus ambient temperature (TA) to ensure reliable operation over 70,000 hours of device lifetime. The different curves represent the percentage On time over device lifetime and can be used as a reference to understand the current carrying capability of TPS22967 under different use cases. TI recommends maintaining continuous current at or below the SOA curves shown in Figure 32. 5 Continuous Current (A) 4 3 2 100% On time 90% On time 70% On time 50% On time 30% On time 1 VBIAS=5.0V 0 -40 -15 10 35 60 85 Ambient Temperature (ºC) C002 On time is the duration of time that the device is enabled (ON ≥ VIH) over 70,000 hour lifetime. Figure 32. Safe Operating Area 9.2 Typical Application Power Supply VIN ON CIN VOUT ON CL RL CT OFF GND GND VBIAS TPS22967 Figure 33. Typical Application Schematic Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: TPS22967 17 TPS22967 SLVSC42A – AUGUST 2013 – REVISED APRIL 2015 www.ti.com Typical Application (continued) 9.2.1 Design Requirements For this design example, use the parameters listed in Table 3 as the input parameters. Table 3. Design Parameters DESIGN PARAMETER EXAMPLE VALUE VIN 3.3 V VBIAS 5V CL 22 μF Maximum Acceptable Inrush Current 400 mA 9.2.2 Detailed Design Procedure 9.2.2.1 Inrush Current When the switch is enabled, the output capacitors must be charged up from 0 V to the set value (3.3 V in this example). This charge arrives in the form of inrush current. Inrush current can be calculated using Equation 2: Inrush Current = C × dV/dt where • • • C = output capacitance. dV = output voltage. dt = rise time. (2) The TPS22967 offers adjustable rise time for VOUT. This feature lets the user control the inrush current during turnon. The appropriate rise time can be calculated using the design requirements and the inrush current equation. 400 mA = 22 μ F × 3.3 V/dt dt = 181.5 μs (3) (4) To ensure an inrush current of less than 400 mA, choose a CT value that will yield a rise time of more than 181.5 μs. See Application Curves for an example of how the CT capacitor can be used to reduce inrush current. 9.2.3 Application Curves VBIAS = 5 V VIN = 3.3 V CL = 22 μF Figure 34. Inrush Current With CT = 0 pF 18 VBIAS = 5 V VIN = 3.3 V CL = 22 μF Figure 35. Inrush Current with CT = 220 pF Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: TPS22967 TPS22967 www.ti.com SLVSC42A – AUGUST 2013 – REVISED APRIL 2015 10 Power Supply Recommendations The device is designed to operate from a VBIAS range of 2.5 V to 5.5 V and a VIN range of 0.8 V to 5.5 V. The power supply must be well regulated and placed as close to the device terminals as possible. It must be able to withstand all transient and load current steps. In most situations, using an input capacitance of 1 μF is sufficient to prevent the supply voltage from dipping when the switch is turned on. In cases where the power supply is slow to respond to a large transient current or large load current step, additional bulk capacitance may be required on the input. The requirements for larger input capacitance can be mitigated by adding additional capacitance to the CT pin. This additional capacitance causes the load switch to turn on more slowly. Not only will this reduce transient inrush current, but it will also give the power supply more time to respond to the load current step. 11 Layout 11.1 Layout Guidelines For best performance, all traces must be as short as possible. To be most effective, the input and output capacitors must be placed close to the device to minimize the effects that parasitic trace inductances may have on normal operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects along with minimizing the case to ambient thermal impedance. The maximum IC junction temperature must be restricted to 125°C under normal operating conditions. To calculate the maximum allowable dissipation, PD(max) for a given output current and ambient temperature, use Equation 5 as a guideline: PD(max) = TJ(max) - TA θJA where • • • • PD(max) = maximum allowable power dissipation. TJ(max) = maximum allowable junction temperature (125°C for the TPS22967). TA = ambient temperature of the device. ΘJA = junction to air thermal impedance. See Thermal Information. This parameter is highly dependent upon board layout. (5) Figure 36 shows an example of a layout. Notice the thermal vias under the exposed thermal pad of the device. This allows for thermal diffusion away from the device. Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: TPS22967 19 TPS22967 SLVSC42A – AUGUST 2013 – REVISED APRIL 2015 www.ti.com 11.2 Layout Example Figure 36. Layout Example 12 Device and Documentation Support 12.1 Trademarks Ultrabooks is a trademark of Intel. All other trademarks are the property of their respective owners. 12.2 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.3 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 20 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: TPS22967 PACKAGE OPTION ADDENDUM www.ti.com 21-Feb-2015 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (°C) Device Marking (4/5) TPS22967DSGR ACTIVE WSON DSG 8 3000 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 ZTU TPS22967DSGT ACTIVE WSON DSG 8 250 Green (RoHS & no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR -40 to 85 ZTU (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 21-Feb-2015 In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 24-May-2019 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant TPS22967DSGR WSON DSG 8 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 TPS22967DSGR WSON DSG 8 3000 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 TPS22967DSGT WSON DSG 8 250 180.0 8.4 2.3 2.3 1.15 4.0 8.0 Q2 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 24-May-2019 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) TPS22967DSGR WSON DSG 8 3000 210.0 185.0 35.0 TPS22967DSGR WSON DSG 8 3000 210.0 185.0 35.0 TPS22967DSGT WSON DSG 8 250 210.0 185.0 35.0 Pack Materials-Page 2 GENERIC PACKAGE VIEW DSG 8 WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD 2 x 2, 0.5 mm pitch This image is a representation of the package family, actual package may vary. Refer to the product data sheet for package details. 4224783/A www.ti.com PACKAGE OUTLINE DSG0008A WSON - 0.8 mm max height SCALE 5.500 PLASTIC SMALL OUTLINE - NO LEAD 2.1 1.9 A B PIN 1 INDEX AREA 2.1 1.9 0.32 0.18 0.4 0.2 OPTIONAL TERMINAL TYPICAL C 0.8 MAX SEATING PLANE 0.05 0.00 0.08 C EXPOSED THERMAL PAD (0.2) TYP 0.9 0.1 5 4 6X 0.5 2X 1.5 SEE OPTIONAL TERMINAL 9 8 1 PIN 1 ID 1.6 0.1 8X 0.4 8X 0.2 0.32 0.18 0.1 0.05 C A B C 4218900/C 04/2019 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance. www.ti.com EXAMPLE BOARD LAYOUT DSG0008A WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD (0.9) 8X (0.5) ( 0.2) VIA TYP 1 8 8X (0.25) (0.55) SYMM 9 (1.6) 6X (0.5) 5 4 SYMM (R0.05) TYP (1.9) LAND PATTERN EXAMPLE SCALE:20X 0.07 MIN ALL AROUND 0.07 MAX ALL AROUND SOLDER MASK OPENING METAL METAL UNDER SOLDER MASK NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK OPENING SOLDER MASK DEFINED SOLDER MASK DETAILS 4218900/C 04/2019 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature number SLUA271 (www.ti.com/lit/slua271). 5. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown on this view. It is recommended that vias under paste be filled, plugged or tented. www.ti.com EXAMPLE STENCIL DESIGN DSG0008A WSON - 0.8 mm max height PLASTIC SMALL OUTLINE - NO LEAD 8X (0.5) SYMM METAL 1 8 8X (0.25) (0.45) SYMM 9 (0.7) 6X (0.5) 5 4 (R0.05) TYP (0.9) (1.9) SOLDER PASTE EXAMPLE BASED ON 0.125 mm THICK STENCIL EXPOSED PAD 9: 87% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE SCALE:25X 4218900/C 04/2019 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. www.ti.com IMPORTANT NOTICE AND DISCLAIMER TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS” AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you permission to use these resources only for development of an application that uses the TI products described in the resource. Other reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims, damages, costs, losses, and liabilities arising out of your use of these resources. TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable warranties or warranty disclaimers for TI products. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright © 2019, Texas Instruments Incorporated