TPS22967DSGT

Product Folder Sample & Buy Support & Community Tools & Software Technical Documents TPS22967 SLVSC42A – AUGUST 2013 – REVISED APRIL 2015 TPS22967 Single-Channel, Ultra-Low Resistance Load Switch 1 Features 3 Description • • • The TPS22967 device is a small, ultra-low RON, single-channel load switch with controlled turnon. The device contains an N-channel MOSFET that can operate over an input voltage range of 0.8 V to 5.5 V and can support a maximum continuous current of 4 A. The switch is controlled by an on/off input (ON), which can interface directly with low-voltage control signals. In the TPS22967, a 225-Ω pulldown resistor is added for quick output discharge when the switch is turned off. 1 • • • • • • Integrated Single-Channel Load Switch Input Voltage Range: 0.8 V to 5.5 V Low RON Resistance – RON = 22 mΩ at VIN = 5 V (VBIAS = 5 V) – RON = 22 mΩ at VIN = 3.6 V (VBIAS = 5 V) – RON = 22 mΩ at VIN = 1.8 V (VBIAS = 5 V) 4-A Maximum Continuous Switch Current Low Quiescent Current (50 µA) Low Control Input Threshold Enables Use of 1.2-V, 1.8-V, 2.5-V, and 3.3-V Logic Configurable Rise Time Quick Output Discharge (QOD) WSON 8-Pin Package With Thermal Pad 2 Applications • • • • • • • The TPS22967 is available in a small, space-saving 2-mm × 2-mm 8-pin WSON package (DSG) with integrated thermal pad allowing for high power dissipation. The device is characterized for operation over the free-air temperature range of –40°C to 85°C. Device Information(1) PART NUMBER TPS22967 Ultrabooks™ Notebooks and Netbooks Tablet PCs Consumer Electronics Set-Top Boxes and Residental Gateways Telecom Systems Solid-State Drives (SSD) PACKAGE WSON (8) BODY SIZE (NOM) 2.00 mm × 2.00 mm (1) For all available packages, see the orderable addendum at the end of the data sheet. 4 Typical Application Schematic Power Supply VIN ON CIN VOUT ON CL RL CT OFF GND GND VBIAS TPS22967 1 An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications, intellectual property matters and other important disclaimers. PRODUCTION DATA. TPS22967 SLVSC42A – AUGUST 2013 – REVISED APRIL 2015 www.ti.com Table of Contents 1 2 3 4 5 6 7 8 Features .................................................................. Applications ........................................................... Description ............................................................. Typical Application Schematic............................. Revision History..................................................... Pin Configuration and Functions ......................... Specifications......................................................... 1 1 1 1 2 3 4 7.1 7.2 7.3 7.4 7.5 7.6 7.7 7.8 4 4 4 5 5 6 7 8 Absolute Maximum Ratings ...................................... ESD Ratings.............................................................. Recommended Operating Conditions....................... Thermal Information .................................................. Electrical Characteristics: VBIAS = 5 V ...................... Electrical Characteristics: VBIAS = 2.5 V ................... Switching Characteristics .......................................... Typical Characteristics .............................................. Detailed Description ............................................ 14 8.1 8.2 8.3 8.4 9 Overview ................................................................. Functional Block Diagram ....................................... Feature Description................................................. Device Functional Modes........................................ 14 14 14 15 Application and Implementation ........................ 16 9.1 Application Information............................................ 16 9.2 Typical Application ................................................. 17 10 Power Supply Recommendations ..................... 19 11 Layout................................................................... 19 11.1 Layout Guidelines ................................................. 19 11.2 Layout Example .................................................... 20 12 Device and Documentation Support ................. 20 12.1 Trademarks ........................................................... 20 12.2 Electrostatic Discharge Caution ............................ 20 12.3 Glossary ................................................................ 20 13 Mechanical, Packaging, and Orderable Information ........................................................... 20 5 Revision History Changes from Original (August 2013) to Revision A • 2 Page Added Pin Configuration and Functions section, ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .............................. 1 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: TPS22967 TPS22967 www.ti.com SLVSC42A – AUGUST 2013 – REVISED APRIL 2015 6 Pin Configuration and Functions DSG Package 8-Pin WSON VIN 1 8 VOUT VOUT 8 1 VIN VIN 2 7 VOUT VOUT 7 2 VIN ON 3 6 CT CT 6 3 ON VBIAS 4 5 GND GND 5 4 VBIAS BOTTOM VIEW TOP VIEW Pin Functions PIN NAME NO. I/O DESCRIPTION CT 6 O Switch slew rate control. Can be left floating. See Application and Implementation for more information. GND 5 – Device ground. ON 3 I Active high switch control input. Do not leave floating. VBIAS 4 I Bias voltage. Power supply to the device. Recommended voltage range for this pin is 2.5 V to 5.5 V. See Application Information section for more information. VIN 1, 2 I Switch input. Input capacitor recommended for minimizing VIN dip. Recommended voltage range for this pin for optimal RON performance is 0.8 V to VBIAS. VOUT 7, 8 O Switch output. – Thermal pad (exposed center pad) to alleviate thermal stress. Tie to GND. See Layout Example for layout guidelines. Thermal Pad Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: TPS22967 3 TPS22967 SLVSC42A – AUGUST 2013 – REVISED APRIL 2015 www.ti.com 7 Specifications 7.1 Absolute Maximum Ratings Over operating free-air temperature range (unless otherwise noted) (1) (2) MIN MAX UNIT (2) VIN Input voltage –0.3 6 V VOUT Output voltage –0.3 6 V VBIAS Bias voltage –0.3 6 V VON ON voltage –0.3 6 V IMAX Maximum continuous switch current 4 A IPLS Maximum pulsed switch current, pulse VBIAS but it will exhibit RON greater than what is listed in the Electrical Characteristics: VBIAS = 5 V table. See Figure 31 for an example of a typical device. Notice the increasing RON as VIN exceeds VBIAS voltage. Never exceed the maximum voltage rating for VIN and VBIAS. 50 VBIAS = 2.5V VBIAS = 3.3V 45 VBIAS = 3.6V VBIAS = 4.2V RON (m ) 40 VBIAS = 5V VBIAS = 5.5V 35 Temperature=25C, IOUT=-200mA 30 25 20 0.8 1.2 1.6 2 2.4 2.8 3.2 3.6 4 4.4 4.8 5.2 5.6 VIN (V) C017 Figure 31. RON vs VIN (VIN > VBIAS) 16 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: TPS22967 TPS22967 www.ti.com SLVSC42A – AUGUST 2013 – REVISED APRIL 2015 Application Information (continued) 9.1.4 Safe Operating Area (SOA) The SOA curves show the continuous current carrying capability of the device versus ambient temperature (TA) to ensure reliable operation over 70,000 hours of device lifetime. The different curves represent the percentage On time over device lifetime and can be used as a reference to understand the current carrying capability of TPS22967 under different use cases. TI recommends maintaining continuous current at or below the SOA curves shown in Figure 32. 5 Continuous Current (A) 4 3 2 100% On time 90% On time 70% On time 50% On time 30% On time 1 VBIAS=5.0V 0 -40 -15 10 35 60 85 Ambient Temperature (ºC) C002 On time is the duration of time that the device is enabled (ON ≥ VIH) over 70,000 hour lifetime. Figure 32. Safe Operating Area 9.2 Typical Application Power Supply VIN ON CIN VOUT ON CL RL CT OFF GND GND VBIAS TPS22967 Figure 33. Typical Application Schematic Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: TPS22967 17 TPS22967 SLVSC42A – AUGUST 2013 – REVISED APRIL 2015 www.ti.com Typical Application (continued) 9.2.1 Design Requirements For this design example, use the parameters listed in Table 3 as the input parameters. Table 3. Design Parameters DESIGN PARAMETER EXAMPLE VALUE VIN 3.3 V VBIAS 5V CL 22 μF Maximum Acceptable Inrush Current 400 mA 9.2.2 Detailed Design Procedure 9.2.2.1 Inrush Current When the switch is enabled, the output capacitors must be charged up from 0 V to the set value (3.3 V in this example). This charge arrives in the form of inrush current. Inrush current can be calculated using Equation 2: Inrush Current = C × dV/dt where • • • C = output capacitance. dV = output voltage. dt = rise time. (2) The TPS22967 offers adjustable rise time for VOUT. This feature lets the user control the inrush current during turnon. The appropriate rise time can be calculated using the design requirements and the inrush current equation. 400 mA = 22 μ F × 3.3 V/dt dt = 181.5 μs (3) (4) To ensure an inrush current of less than 400 mA, choose a CT value that will yield a rise time of more than 181.5 μs. See Application Curves for an example of how the CT capacitor can be used to reduce inrush current. 9.2.3 Application Curves VBIAS = 5 V VIN = 3.3 V CL = 22 μF Figure 34. Inrush Current With CT = 0 pF 18 VBIAS = 5 V VIN = 3.3 V CL = 22 μF Figure 35. Inrush Current with CT = 220 pF Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: TPS22967 TPS22967 www.ti.com SLVSC42A – AUGUST 2013 – REVISED APRIL 2015 10 Power Supply Recommendations The device is designed to operate from a VBIAS range of 2.5 V to 5.5 V and a VIN range of 0.8 V to 5.5 V. The power supply must be well regulated and placed as close to the device terminals as possible. It must be able to withstand all transient and load current steps. In most situations, using an input capacitance of 1 μF is sufficient to prevent the supply voltage from dipping when the switch is turned on. In cases where the power supply is slow to respond to a large transient current or large load current step, additional bulk capacitance may be required on the input. The requirements for larger input capacitance can be mitigated by adding additional capacitance to the CT pin. This additional capacitance causes the load switch to turn on more slowly. Not only will this reduce transient inrush current, but it will also give the power supply more time to respond to the load current step. 11 Layout 11.1 Layout Guidelines For best performance, all traces must be as short as possible. To be most effective, the input and output capacitors must be placed close to the device to minimize the effects that parasitic trace inductances may have on normal operation. Using wide traces for VIN, VOUT, and GND helps minimize the parasitic electrical effects along with minimizing the case to ambient thermal impedance. The maximum IC junction temperature must be restricted to 125°C under normal operating conditions. To calculate the maximum allowable dissipation, PD(max) for a given output current and ambient temperature, use Equation 5 as a guideline: PD(max) = TJ(max) - TA θJA where • • • • PD(max) = maximum allowable power dissipation. TJ(max) = maximum allowable junction temperature (125°C for the TPS22967). TA = ambient temperature of the device. ΘJA = junction to air thermal impedance. See Thermal Information. This parameter is highly dependent upon board layout. (5) Figure 36 shows an example of a layout. Notice the thermal vias under the exposed thermal pad of the device. This allows for thermal diffusion away from the device. Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: TPS22967 19 TPS22967 SLVSC42A – AUGUST 2013 – REVISED APRIL 2015 www.ti.com 11.2 Layout Example Figure 36. Layout Example 12 Device and Documentation Support 12.1 Trademarks Ultrabooks is a trademark of Intel. All other trademarks are the property of their respective owners. 12.2 Electrostatic Discharge Caution These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. 12.3 Glossary SLYZ022 — TI Glossary. This glossary lists and explains terms, acronyms, and definitions. 13 Mechanical, Packaging, and Orderable Information The following pages include mechanical, packaging, and orderable information. This information is the most current data available for the designated devices. This data is subject to change without notice and revision of this document. For browser-based versions of this data sheet, refer to the left-hand navigation. 20 Submit Documentation Feedback Copyright © 2013–2015, Texas Instruments Incorporated Product Folder Links: TPS22967 PACKAGE OPTION ADDENDUM www.ti.com 10-Dec-2020 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan (2) Lead finish/ Ball material MSL Peak Temp Op Temp (°C) Device Marking (3) (4/5) (6) TPS22967DSGR ACTIVE WSON DSG 8 3000 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 ZTU TPS22967DSGT ACTIVE WSON DSG 8 250 RoHS & Green NIPDAU Level-2-260C-1 YEAR -40 to 85 ZTU (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may reference these types of products as "Pb-Free". RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption. Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of