User's Guide
SLVU912 – June 2013
TPS65310AEVM and TPS65311EVM Evaluation Module
TI's TPS65310AEVM and TPS65311EVM evaluation modules (EVM) help engineers evaluate the
operation and performance of the TPS65310A and TPS65311 power supply IC for safety applications. The
devices offer configurability through the Serial Peripheral Interface (SPI).
The EVM contains either the TPS65310A or TPS65311 and some circuitry for basic operation. It has an
on board USB-to-SPI interface but can also run without it or with a different SPI interface, for example,
from an MCU supplied to the EVM.
Table 1. Device and Package Configurations
CONVERTER
IC
PACKAGE
IC1
TPS65310AQRVJQ1
S-PVQFN-N56
1
2
3
4
Contents
Background .................................................................................................................. 3
Setup ......................................................................................................................... 3
2.1
Input/Output Connector Description ............................................................................. 3
2.2
Supply ............................................................................................................... 4
2.3
Jumper Setting ..................................................................................................... 4
2.4
Test Points .......................................................................................................... 6
2.5
BUCK1 Voltage Regulator ........................................................................................ 6
2.6
BUCK2 Voltage Regulator ........................................................................................ 6
2.7
BUCK3 Voltage Regulator ........................................................................................ 7
2.8
BOOST Voltage Regulator ........................................................................................ 7
2.9
LDO Voltage Regulator ........................................................................................... 7
GUI Software ................................................................................................................ 8
EVM Schematic, PCB Layouts, and Bill of Materials ................................................................. 13
4.1
EVM Schematic ................................................................................................... 13
4.2
Board Picture ...................................................................................................... 15
4.3
Board Assembly .................................................................................................. 16
4.4
Board Layout ...................................................................................................... 18
4.5
Bill of Materials .................................................................................................... 20
List of Figures
1
GUI-Software Start Screen ................................................................................................ 8
2
GUI Software Connected to USB ......................................................................................... 9
3
GUI Software Auto Update ............................................................................................... 10
4
GUI Software LDO Turned ON .......................................................................................... 11
5
GUI Software HS EN ON and HS PWM ON ........................................................................... 12
6
EVM Schematic (1 of 2) .................................................................................................. 13
7
EVM Schematic (2 of 2) .................................................................................................. 14
8
EVM Top View ............................................................................................................. 15
9
EVM Bottom View ......................................................................................................... 15
10
Top Assembly Layer ...................................................................................................... 16
PowerPAD is a trademark of Texas Instruments.
Microsoft is a registered trademark of Microsoft Corporation.
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11
12
13
..................................................................................................
Top Layer Routing .........................................................................................................
Layer2 Routing .............................................................................................................
Bottom Assembly Layer
17
18
19
List of Tables
2
.....................................................................................
1
Device and Package Configurations
2
Connectors ................................................................................................................... 3
3
EVM Supply Voltage ........................................................................................................ 4
4
EVM Jumper for Operation Without Using USB Interface and GUI Software
5
EVM Jumper for Operation with USB Interface and GUI Software................................................... 5
6
EVM Test Points ............................................................................................................ 6
7
Bill of Materials............................................................................................................. 20
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Background
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1
Background
This document is written as a guide for both the TPS65310AEVM (EVM) and the TPS65311EVM (EVM).
The TPS65310A-Q1 and TPS65311-Q1 devices have the same silicon and functionality but different
EEPROM programming and a small number of other minor differences. The remainder of this document
uses TPS6531xx when referring to the TPS65310A-Q1 and TPS65311-Q1. For illustration purposes, the
TPS65310A is shown in the schematics and board layouts. The TPS6531xx is a power-management unit,
meeting the requirements of DSP-controlled automotive systems (for example, Advanced Driver
Assistance Systems). With its integration of commonly used features it helps to significantly reduce board
space and system costs.
The device includes one high-voltage buck controller for pre-regulation, combined with two buck and one
boost converter for post regulation. A further integrated LDO rounds up the power supply concept and
offers a flexible system design with, in total, five independent voltage rails. The device offers two lowpower states (LPM1 with buck controller active or LPM0 with all rails off) to reduce current consumption in
case the system is constantly connected to the battery line. All outputs are protected against overload and
overtemperature.
An external p-type metal-oxide-semiconductor (PMOS) makes the device capable of sustaining voltage
transients up to 80 V (protection feature). This external PMOS is also used in safety-critical applications to
protect the system in case one of the rails shows a malfunction (undervoltage, overvoltage, or
overcurrent).
An internal Soft Start ensures a controlled start up for all supplies. Each power supply output has
adjustable output voltage based on the external resistor network settings. The device has an integrated
charge pump to provide overdrive voltage for the internal regulators. A reverse battery protection can be
obtained by using the charge pump output to control an external NMOS transistor.
2
Setup
This section describes the jumpers and connectors on the EVM and how to properly connect, set up, and
use the EVM.
2.1
Input/Output Connector Description
The connectors CON4(VBAT) and CON5(GND) are used to supply the EVM. The details about the
connectors are shown in Table 2.
Table 2. Connectors
Connectors
CON #
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Signals
Type
1
LDO
OUTPUT
2
VREF
OUTPUT
3
GND
GND
4
VBAT
SUPPLY
5
GND
GND
6
VINPROT
internal SUPPLY
7
GND
GND
8
GND
GND
9
BUCK1
OUTPUT
10
VSUP5
internal SUPPLY
11
GND
GND
12
BOOST
OUTPUT
13
BUCK2
OUTPUT
14
GND
GND
15
GND
GND
16
BUCK3
OUTPUT
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Setup
2.2
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Supply
The input voltage range for the converter is VBAT = 4.8 V to 36 V. It should be supplied to CON4(VBAT)
respect to CON5(GND). VINPROT is the protected supply and generated EVM internally.
Table 3. EVM Supply Voltage
2.3
Parameter
Min
Typ
Max
VBAT
4.8
14
36
Unit
V
Jumper Setting
Configure the jumpers properly to operate the TPS6531xx. The recommended settings are shown in
Table 4 and Table 5.
Table 4. EVM Jumper for Operation Without Using USB Interface and GUI
Software
4
J#
Jumper Name Description
Standard
J1
LED Driver
connect LED to LED driver
set
J2
VSUP4
connect supply LDO
set
J3
VSUP3
connect supply BUCK3
set
J4
VSUP2
connect supply BUCK2
set
J5
VSUP5
connect supply BOOST
set
J6
Select
EXTSUP
select source external supply from BUCK1
set 1-2
J7
COMP3
compensation BUCK3
open
J8
COMP2
compensation BUCK2
open
J9
WAKE
Wake Up
open
J10 RESN
Reset
set 1-2
J11 PRESN
Reset
set 1-2
J12 IRQ
IRQ
set 1-2
J13 WD
Watchdog
set 1-2
J14 HSPWM
HSPWM signal
set 1-2
J15 CSN
CSN signal SPI
set 1-2
J16 SDO
SDO signal SPI
set 1-2
J17 SDI
SDI signal SPI
set 1-2
J18 SCLK
SCLK signal SPI
set 1-2
J19 VIO-VCC_555
Supply watchdog timer
set
J20 VIO-BUCK3
select VIO voltage from BUCK3
open
J21 VIO-VCC_USB select VIO voltage from VCC_USB
open
J22 VIO-BOOST
select VIO voltage from BOOST
open
J23 VIO-BUCK2
select VIO voltage from BUCK2
set
J24 VIO-BUCK1
select VIO voltage from BUCK1
open
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Table 5. EVM Jumper for Operation with USB Interface and GUI Software
J#
Jumper Name
Description
Standard
J1
LED Driver
connect LED to LED driver
set
J2
VSUP4
connect supply LDO
set
J3
VSUP3
connect supply BUCK3
set
J4
VSUP2
connect supply BUCK2
set
J5
VSUP5
connect supply BOOST
set
J6
Select EXTSUP
select source external supply from BUCK1
set 1-2
J7
COMP3
compensation BUCK3
open
J8
COMP2
compensation BUCK2
open
J9
WAKE
Wake Up
open
J10
RESN
Reset
set 1-2
J11
PRESN
Reset
set 1-2
J12
IRQ
IRQ
set 1-2
J13
WD
Watchdog
set 1-2
J14
HSPWM
HSPWM signal
set 1-2
J15
CSN
CSN signal SPI
set 1-2
J16
SDO
SDO signal SPI
set 1-2
J17
SDI
SDI signal SPI
set 1-2
J18
SCLK
SCLK signal SPI
set 1-2
J19
VIO-VCC_555
Supply watchdog timer
set
J20
VIO-BUCK3
select VIO voltage from BUCK3
open
J21
VIO-VCC_USB
select VIO voltage from VCC_USB
set
J22
VIO-BOOST
select VIO voltage from BOOST
open
J23
VIO-BUCK2
select VIO voltage from BUCK2
open
J24
VIO-BUCK1
select VIO voltage from BUCK1
open
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Setup
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Test Points
The test points are placed to measure different nodes on the board. Details are shown in Table 6.
Table 6. EVM Test Points
2.5
#
Test Point
1
HSSENSE
2
HSCTRL
3
GND
4
VBAT
5
GND
6
WAKE
7
VINPROT
8
PH1
9
GND
10
BUCK1
11
VSUP5
12
GND
13
BOOST
14
VT_REF
15
PH2
16
BUCK2
17
GND
18
PH3
19
BUCK3
20
BUCK20
21
GND
22
LDO
23
VT_REF
24
GND
25
GND
26
GND
BUCK1 Voltage Regulator
The BUCK1 regulator is a kind of pre-regulator operating in buck configuration using external NMOS
transistors for the High-Side (HS) Switch and the Low-Side (LS) switch. HS and LS transistors are
combined in one package. L1 is the inductance of Buck1, C16_1 to C16_4 are the output capacitors. The
control loop is closed through the resistor divider, R19_2 and R19_1. In addition, the monitor resistor
network, R19_2 and R17_0, are supporting the monitor function of the BUCK1 regulator. C18_0, C18_1,
and R18 are the compensation network to stabilize the voltage regulator. R15 is the current shunt resistor
to provide current feedback information. C104 is the blocking cap to stabilize the supply voltage of the HS
and LS switching transistor. The BUCK1 voltage regulator is turned ON by default.
2.6
BUCK2 Voltage Regulator
The BUCK2 regulator is operating with internal HS and LS transistors. Lx is the coil and Cx the output
caps. The output voltage can be adjusted with R1 and R2. R3 and R4 are the voltage dividers for the
monitoring function. The compensation is done device internally and can be changed by setting jumper Jx.
Cc is the bootstrap cap to provide the higher voltage for the HS gate driver. The BUCK2 voltage regulator
is turned ON by default and can be turned OFF through SPI command, for example, by using the GUI
software and unsetting BUCK2 EN.
6
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2.7
BUCK3 Voltage Regulator
The BUCK3 regulator is operating with internal HS and LS transistors. Lx is the coil and Cx the output
caps. The output voltage can be adjusted with R1 and R2. R3 and R4 are the voltage dividers for the
monitoring function. The compensation is done device internally and can be changed by setting jumper Jx.
Cc is the bootstrap cap to provide the higher voltage for the HS gate driver. The BUCK3 voltage regulator
is turned ON by default and can be turned OFF through SPI command, for example, by using the GUI
software and unsetting BUCK3 EN.
2.8
BOOST Voltage Regulator
The BOOST voltage regulator is supplied out of BUCK1 voltage through the jumper J5. It is turned ON by
default and can be turned OFF through SPI command, for example, by using the GUI software and
unsetting BOOST EN.
2.9
LDO Voltage Regulator
The LDO voltage regulator is supplied out of BUCK1 through the jumper J2. It can be turned on with an
SPI command, for example, by using the GUI software and setting LDO EN.
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GUI Software
3
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GUI Software
The GUI software is intended to support a quick start of the TPS6531xx evaluation. The USB-to-SPI
interface is needed to run the software. The USB cable to the PC can be connected to J10. After the initial
start of the software, installing the Microsoft® .NET connection software may be necessary. The .NET
software can be downloaded at www.microsoft.com.
The software provides a GUI interface for easy set-up and control of the TPS6531xx. Connecting the FTDI
pins to the SPI pins is required to use the on board USB-to-SPI interface. Set the jumper shown in Table 4
if the EVM will be used without the GUI software or Table 5 if it will be used with the GUI software.
Figure 1. GUI-Software Start Screen
8
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GUI Software
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Figure 2. GUI Software Connected to USB
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GUI Software
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Figure 3. GUI Software Auto Update
10
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GUI Software
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Figure 4. GUI Software LDO Turned ON
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GUI Software
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Figure 5. GUI Software HS EN ON and HS PWM ON
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EVM Schematic, PCB Layouts, and Bill of Materials
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4
EVM Schematic, PCB Layouts, and Bill of Materials
The following sections contain the schematic, board pictures, PCB layouts, and BOM for this EVM.
4.1
EVM Schematic
Figure 6 and Figure 7 are the schematics for this EVM.
R41
R38
R1
R39
J6
R40
J7
J8
R2
CON3
CON2
CON1
TP22
TP1
CON5
TP3
CON4
Q1
C47
TP23
R5
TP2
C46
D1
R37
Q2
R36
TP4
D3
C50
J1
C49
C48
C45
C51
TP5
CON15
IC1
TP21
R35
TP20
R3
Q3
CON16
R4
L1
C1
C44
C2
R32
TP18
L5
R33
TP19
D2
C40
D6
C41
C42
C43
C39
C38
R30
R31
R34
C3
TP7
C36
CON6
TP6
PGND3
C8
C37
IC1
Q4
R29
R6
R28
C4
C34
C5
C35
C7
CON7
C6
TP8
C33
D5
R7
C28
R27
R26
C29
C30
Q4
R25
C31
C32
R8
L2
L4
C27
C9
CON8
R23
R24
TP16
PGND2
PGND1
TP15
CON313
TP9
C15
TP10
R9
TP14
C11
J2
J3
J4
PGND5
CON9
C13
J5
R15
C10
C12
C14
TP13
R11
R22
D4
C24
C17
R19
CON14
TP17
CON12
C16
R10
C25
C26
TP12
L3
R12
C22
CON11
R20
R13
C23
R18
TP24
R17
C20
C19
R16
C18
R14
R21
TP25
TP26
TP11
CON10
C21
Figure 6. EVM Schematic (1 of 2)
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EVM Schematic, PCB Layouts, and Bill of Materials
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C56
J24
J23
OSC1
R60
J22
C55
J21
J19
J20
C62
L6
IC5
R63
C57
R61
IC3
R64
CON17
R62
C60
C61
C63
C52
R42
R43
IC2
C59
R44
C53
R55
R56
R57
R58
R59
J18
J17
R45
J16
R46
J15
J14
C58
J13
J12
J11
J10
R53
SW1
J9
R54
R49
R50
IC4
R51
C54
R52
R47
R48
Figure 7. EVM Schematic (2 of 2)
14
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4.2
EVM Schematic, PCB Layouts, and Bill of Materials
Board Picture
Figure 8 and Figure 9 are top and bottom picture of this EVM.
Figure 8. EVM Top View
Figure 9. EVM Bottom View
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EVM Schematic, PCB Layouts, and Bill of Materials
4.3
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Board Assembly
Figure 10 and Figure 11 show the board layout for the EVM PCB. The EVM offers resistors, capacitors
and jumpers to operate the TPS6531xx device. The TPS6531xx converter offers high efficiency, but does
dissipate power. The PowerPAD™ package offers an exposed thermal pad to enhance thermal
performance. This must be soldered to the copper landing on the PCB for optimal performance. The PCB
provides 2 oz copper planes on the top and bottom to dissipate heat.
Figure 10. Top Assembly Layer
16
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EVM Schematic, PCB Layouts, and Bill of Materials
Figure 11. Bottom Assembly Layer
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EVM Schematic, PCB Layouts, and Bill of Materials
4.4
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Board Layout
The EVM is a 2-layer board. Details are shown in Figure 12 and Figure 13.
Figure 12. Top Layer Routing
18
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EVM Schematic, PCB Layouts, and Bill of Materials
Figure 13. Layer2 Routing
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EVM Schematic, PCB Layouts, and Bill of Materials
4.5
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Bill of Materials
Table 7. Bill of Materials
ITEM
QTY
MFG
MFG PART#
REF DES
DESCRIPTION
VALUE or FUNCTION
1
Any
HLV037
PCB
Printed Circuit Board
SIZE 95x95x1.5mm
1
0
UNINSTALLED
CAP_0603 (UN)
C20
UNINSTALLED CAP0603
2
0
UNINSTALLED
CAP_0805 (UN)
C9
UNINSTALLED CAP0805
3
2
SULLINS
PEC02SAAN
J1, J19
HEADER,THU,1x2,2.54mm
4
13
SULLINS
PEC03SAAN
J6, J7, J8, J9, J10, J11, J12, J13, J14, J15, J16, J17, J18
HEADER,THU,1x3,2.54mm
5
0
UNINSTALLED
RES_0805 (UN)
R7, R22, R35
6
4
GND_SHORT
PGND1, PGND2, PGND3, PGND5
BOGUS PART NOT INSTALLED
NOT INSTALLED OR KITTED
7
1
AVX
06035C272JAT2A
C21
CAP,SMT,0603
CAPACITOR,SMT,0603,CERAMIC,0.0027uF,50V,5%,X7R
8
2
KEMET
C0603C101J5GAC
C35, C36
CAP,SMT,0603
CAPACITOR,SMT,0603,CERAMIC,100pF,50V,5%,COGR
9
3
KEMET
C0603C103J1RAC
C18, C34, C37
CAP,SMT,0603
CAPACITOR,SMT,0603,CERAMIC,0.01uF,100V,5%,X7R
10
0
KEMET
C0603C103J1RAC (UN)
C3, C33, C38, C51
CAP,SMT,0603
UNINSTALLED CAPACITOR, SMT, 0603, CER,
0.01uF,100V,5%,X7R
11
10
KEMET
C0603C104J3RAC
C4, C6, C7, C15, C27, C44, C45, C50, C61, C62
CAP,SMT,0603
CAPACITOR,SMT,0603,CERAMIC,0.1uF,25V,5%,X7R
12
9
KEMET
C0603C105K4PAC
C22, C28, C39, C46, C48, C49, C52, C57, C63
CAP,SMT,0603
CAPACITOR,SMT,0603,CERAMIC,1.0uF,16V,10%,X5R
13
2
KEMET
C0603C470J5GAC
C16, C19
CAP,SMT,0603
CAPACITOR,SMT,0603,CERAMIC,COG(NPO),50V,5%, 47pF
14
1
KEMET
C0603C472J5RAC
C17
CAP,SMT,0603
CAPACITOR,SMT,0603,CERAMIC,X7R,0.0047uF,50V,5%
15
5
KEMET
C0805C104K5RAC
C53, C54, C58, C59, C60
CAP,SMT,0805
CAPACITOR,SMT,0805,CERAMIC,0.1uF,50V,10%,X7R
16
2
KEMET
C0805C330J5GAC
C55, C56
CAP,SMT,0805
CAPACITOR,SMT,0805,CERAMIC,33pF,50V,5%,C0G(NP0)
17
13
MURATA
GRM21BR71A106KE51L
C10, C11, C12, C13, C14, C23, C29, C30, C31, C40, C41, C42, C47
CAP,SMT,0805
CAPACITOR,SMT,0805,CERAMIC,10uF,10V,10%,X7R
18
1
MURATA
GRM21BR71E225KA73L
C5
CAP,SMT,0805
CAPACITOR,SMT,0805,CERAMIC,2.2uF,25V,10%,X7R
19
1
MURATA
GRM31CR6YA106KA12L
C24
CAP,SMT,1206
CAPACITOR,SMT,1206,CER, 10uF,35V,10%,X5R
20
1
KEMET
C1210C225K1RAC
C8
CAP,SMT,1210
CAPACITOR,SMT,1210,CERAMIC,2.2uF,100V,10%,X7R
21
2
MURATA
GRM32ER61E226KE15L
C25, C26
CAP,SMT,1210
CAPACITOR,SMT,1210,CER, 22uF,25V,10%,X5R
22
1
VISHAY
94SVP187X0016E12
C43
CAP,SMT,ALUM
CAPACITOR,SMT,2P,ALUM,180uF,16V,20%,-55~105C,ESR0.022ohm@100K
23
0
VISHAY
94SVP187X0016E12 (UN)
C32
CAP,SMT,ALUM
UNINSTALLED CAPACITOR, SMT, 2P, ALUM, 180uF, 16V,
20%ESR-0.022ohm@100K
24
2
PANASONIC
EEETG1J470P
C1, C2
CAPACITOR,SMT,ELEC
CAPACITOR,SMT,2P,ELEC,47uF,63V,20%,-40~125C
25
1
WUERTH
61400416121
CON17
CON,THU,4P
USB RECEPTACLE,TYPE B, RIGHT ANGLE
26
1
DIODES INC
DFLS1150
D1
DIODE,SMT
SCHOTTKEY BARRIER DIODE,SMT,1A, 150V
27
1
COMCHIP
CDBC580-G
D3
DIODE,SMT,2P
SCHOTTKY RECTIFIER,SMT,80V,5A
28
1
NXP
PMEG2010AEH
D4
DIODE,SMT,SOD123F
SCHOTTKY BARRIER DIODE,SMT,SOD123F,1A, 20V
29
0
NXP
PMEG2010AEH (UN)
D5, D6
DIODE,SMT,SOD123F
UNINSTALLED SCHOTTKEY BARRIER
DIODE,SMT,SOD123F,1A, 20V
30
1
INFINEON
IPG20N06S4L-26
Q4
FET,SMT,P-PG-TDSON-8-4,NCHANNEL
HEXFET,N-CHANNEL,POWER MOSFET,P-PG-TDSON-8-4
31
1
VISHAY
Si7469DP
Q3
FET,SMT,PowerPak SO8
P-CHANNEL,MOSFET,PowerPak SO8,-80V,-28A,0.029 RDS,83W
32
1
VISHAY
Si2309CDS
Q1
FET,SMT,SOT23-3
P-CHANNEL,MOSFET,SOT23-3,-60V,-1.6A,0.45 RDS,1.7W
33
0
VISHAY
Si2309CDS (UN)
Q2
FET,SMT,SOT23-3
UNINSTALLED P-CHANNEL,MOSFET,SOT23-3,-60V,-1.6A,0.45
RDS,1.7W
20
UNINSTALLED RES0805
TPS65310AEVM and TPS65311EVM Evaluation Module
SLVU912 – June 2013
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Copyright © 2013, Texas Instruments Incorporated
EVM Schematic, PCB Layouts, and Bill of Materials
www.ti.com
Table 7. Bill of Materials (continued)
ITEM
QTY
MFG
MFG PART#
REF DES
DESCRIPTION
VALUE or FUNCTION
34
1
MICROCHIP
93LC46BT-I/SN
IC4
IC,SMT,8P
1K MICROWIRE COMPATIBLE SERIAL EEPROM,2.5~5.5V
35
1
FUTURE
TECHNOLOGY
DEVICES INT.
FT2232D
IC2
IC,SMT,LQFP-48
DUAL USB UART/ FIFO IC
36
1
TI
TPS65310AQRVJQ1
IC1
IC,SMT,QFN-56EP
DUT,SMT,QFN,56RTQ,0.5mmLS,8.15x8.15x1.0mm,THERMAL
PAD
37
1
TI
TLC555ID
IC5
IC,SMT,SO-8
LinCMOS TIMER, SMT, 3V~15V
38
1
DIODES INC
BAW567DW-7-F
IC3
IC,SMT,SOT363-6
QUAD SURFACE MOUNT SWITCHING DIODE ARRAY
39
2
EPCOS
B82462G4332M000
L4, L5
INDUCTOR,SMT,2P
INDUCTOR,SMT,3.3uH,20%,2.3A
40
1
SUMIDA
CDRH3D28NP-3R3N
L3
INDUCTOR,SMT,2P
INDUCTOR,SMT,SHIELD, 3.3uH
41
2
COILCRAFT
MSS1260T-103ML
L1, L2
INDUCTOR,SMT,2P
INDUCTOR,SMT,10uH,20%,6.9A,SHIELD
42
1
WUERTH
744028220
L6
INDUCTOR,THU,2P
INDUCTOR,SMT,POWER CHOKE,22uH,400mA30%
43
9
FISCHER
SL 11 SMD 062
J2, J3, J4, J5, J20, J21, J22, J23, J24
JUMPER,SMD,2P,2.54
JUMPER,SMD,2P,2.54
44
1
OSRAM
LBY87S-L1M2-35
D2
LED,SMT,0805
SIDELED,SMT,0805,BLUE,3.4V
45
2
VISHAY
CRCW06030000Z0
R6, R8
RES,SMT,0603
RESISTOR,SMT,0603,0 OHM,1%,1/10W
46
1
VISHAY
CRCW0603100KF
R2
RES,SMT,0603
RESISTOR,SMT,0603,1%,1/10W,100K
47
7
VISHAY
CRCW060310K0F
R5, R49, R50, R51, R52, R55, R62
RES,SMT,0603
RESISTOR,SMT,0603,1%,1/10W,10.0K
48
1
VISHAY
CRCW060311K5F
R63
RES,SMT,0603
RESISTOR,SMT,0603,1%,1/10W,11.5K
49
1
VISHAY
CRCW06031K74F
R39
RES,SMT,0603
RESISTOR,SMT,0603,1%,1/10W,1.74K
50
4
VISHAY
CRCW06031M00F
R56, R57, R58, R59
RES,SMT,0603
RESISTOR,SMT,0603,1%,1/10W,1.00M
51
1
VISHAY
CRCW060323K7F
R36
RES,SMT,0603
RESISTOR,SMT,0603,1%,1/10W,23.7K
52
1
VISHAY
CRCW060339K0F
R54
RES,SMT,0603
RESISTOR,SMT,0603,1%,1/10W,39.0K
53
3
VISHAY
CRCW060351R1F
R11, R20, R40
RES,SMT,0603
RESISTOR,SMT,0603,1%,1/10W,51.1
54
1
VISHAY
CRCW06035K76F
R64
RES,SMT,0603
RESISTOR,SMT,0603,1%,1/10W,5.76K
55
2
VISHAY
CRCW060360K4F
R10, R12
RES,SMT,0603
RESISTOR,SMT,0603,1%,1/10W,60.4K
56
1
VISHAY
CRCW06038K25F
R15
RES,SMT,0603
RESISTOR,SMT,0603,1%,1/10W,8.25K
57
1
PANASONIC
ERA-3YEB123V
R17
RES,SMT,0603
RESISTOR,SMT,0603,12K,0.1%,1/16W
58
5
PANASONIC
ERA-3YEB162V
R18, R27, R28, R29, R34
RES,SMT,0603
RESISTOR,SMT,0603,1.6K,0.1%,1/16W
59
2
PANASONIC
ERA-3YEB163V
R14, R16
RES,SMT,0603
RESISTOR,SMT,0603,16.0K,0.1%,1/16W
60
1
PANASONIC
ERA-3YEB821V
R38
RES,SMT,0603
RESISTOR,SMT,0603,820 OHM,0.1%,1/16W
61
1
VISHAY
TNPW060310R0BE
R1
RES,SMT,0603
RESISTOR,SMT,0603,THIN FILM,10 OHM,0.1%,1/10W,25ppm
62
2
VISHAY
TNPW06034K99BE
R25, R26
RES,SMT,0603
RESISTOR,SMT,0603,THIN FILM,4.99K,0.1%,1/10W,25ppm
63
2
VISHAY
TNPW060351R1BE
R24, R32
RES,SMT,0603
RESISTOR,SMT,0603,THIN FILM,51.1 OHM,0.1%,1/10W
64
2
VISHAY
TNPW0603806RBE
R30, R31
RES,SMT,0603
RESISTOR,SMT,0603,THIN FILM,0.1%,1/10W, 806OHM
65
1
VISHAY
TNPW06038K45BE
R19
RES,SMT,0603
RESISTOR,SMT,0603,THIN FILM,8.45K,0.1%,1/10W
66
5
VISHAY
CRCW08050000Z
R13, R21, R23, R33, R41
RES,SMT,0805
RESISTOR,SMT,0805,THICK FILM,1/8W,0 OHM
67
1
VISHAY
CRCW080510K0F
R48
RES,SMT,0805
RESISTOR,SMT,0805,THICK FILM,1%,1/8W,10.0K
68
1
VISHAY
CRCW08051K00F
R53
RES,SMT,0805
RESISTOR,SMT,0805,THICK FILM,1%,1/8W,1.00K
69
1
VISHAY
CRCW08051M00F
R60
RES,SMT,0805
RESISTOR,SMT,0805,THICK FILM,1%,1/8W,1.0M
70
2
VISHAY
CRCW080527R0F
R43, R44
RES,SMT,0805
RESISTOR,SMT,0805,THICK FILM,1%,1/8W,27.0 OHM
SLVU912 – June 2013
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TPS65310AEVM and TPS65311EVM Evaluation Module
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21
EVM Schematic, PCB Layouts, and Bill of Materials
www.ti.com
Table 7. Bill of Materials (continued)
ITEM
QTY
MFG
MFG PART#
REF DES
DESCRIPTION
VALUE or FUNCTION
71
0
VISHAY
CRCW08052K00F (UN)
R46
RES,SMT,0805
UNINSTALLED RESISTOR,SMT,0805,THICK
FILM,1%,1/8W,2.00K
72
2
VISHAY
CRCW08052K20F
R42, R47
RES,SMT,0805
RESISTOR,SMT,0805,THICK FILM,1%,1/8W,2.20K
73
1
VISHAY
CRCW0805470RF
R61
RES,SMT,0805
RESISTOR,SMT,0805,THICK FILM,1%,1/8W,470 OHM
74
1
VISHAY
CRCW080547K0F
R45
RES,SMT,0805
RESISTOR,SMT,0805,THICK FILM,1%,1/8W,47.0K
75
2
PANASONIC
ERJ-P06J681V
R3, R4
RES,SMT,0805
RESISTOR,SMT,0805,THICK FILM,680 OHM,5%,1/4W
76
1
PANASONIC
ERJ-L12KF22MU
R9
RES,SMT,1812
RESISTOR,SMT,1812,0.022 OHM,0.5W,1%
77
1
ABRACON
AWSZT-6.00MGD-T
OSC1
RESONATOR,SMT,2P
RESONATOR,SMT,2P,CERAMIC,6.00 MHz
78
1
BOURNS
7914G-1-000E
SW1
SWITCH,SMT,4P
SWITCH, SMT, 4P, SPST, NO
79
16
BUERKLIN
12H6161
CON1, CON2, CON3, CON4, CON5, CON6, CON7, CON8, CON9, CON10,
CON11, CON12, CON14, CON15, CON16, CON313
TESTPOINT,THU,1P
TEST POINTS,THU
80
26
KEYSTONE
5002
TP1, TP2, TP3, TP4, TP5, TP6, TP7, TP8, TP9, TP10, TP11, TP12, TP13,
TP14, TP15, TP16, TP17, TP18, TP19, TP20, TP21, TP22, TP23, TP24, TP25,
TP26
TESTPOINT,THU,1P
TESTPOINT,THU,MINIATURE,0.1LS,120TL, WHITE
81
1
MURATA
NCP18XH103F03
R37
THERMISTOR,SMT,0603
THERMISTOR,SMT,0603,NTC,10K@25/C,1%
82
20
FISCHER
CAB 4 G S
2.54mm JUMPER
2.54mm JUMPER
22
TPS65310AEVM and TPS65311EVM Evaluation Module
SLVU912 – June 2013
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