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TXB0304
ZHCS470F – SEPTEMBER 2011 – REVISED MAY 2016
TXB0304 具有自动方向感应的 4 位双向电平转换器/电
电压转换器
1 特性
•
1
•
•
•
•
•
•
3 说明
完全对称的电源电压，A 端口和 B 端口上均为
0.9V 到 3.6V
VCC 隔离特性 – 如果任一 VCC 输入接地，则所有输
出处于高阻态
以 VCCA 为基准的输出使能 (OE) 输入电路
低功耗，最大 5μA（ICCA 或 ICCB）
I关闭 支持部分断电模式工作
锁断性能超过 100mA （符合 JESD 78 II 类规范的
要求）
静电放电 (ESD) 保护性能超过 JESD 22 规范要求
– 8000V 人体放电模式 (A114-A)
– 1000V 组件充电模式 (C101)
2 应用
•
•
•
•
个人电子产品
工业
企业
电信
这个 4 位非反向转换器使用两个独立的可配置电源
轨。A 端口设计用于跟踪 VCCA。VCCA可接受从 0.9V
到 3.6V 范围内的任意电源电压。B 端口设计用于跟踪
VCCB。VCCB 可接受
0.9V 到 3.6V 范围内的任意电源电压。这可以实现
1V、1.2V、1.5V、1.8V、2.5V 和 3V 电压节点之间的
任意低压双向转换。对于 TXB0304，当输出使能 (OE)
输入为低时，所有输出均处于高阻态。为确保在上电或
掉电期间均处于高阻态，应将 OE 通过下拉电阻连接
至 GND；该电阻的最小值取决于驱动器的拉电流能
力。OE 器件控制引脚输入电路由 VCCA 供电。该器件
完全 适用于 使用 Ioff 的局部掉电应用。Ioff 电路会禁用
输出，从而在器件掉电时防止电流回流损坏器件。
TXB0304 和 TXBN0304 唯一的区别在于 OE 信号分
别为高电平有效和低电平有效。
器件信息(1)
器件型号
TXB0304
封装
封装尺寸（标称值）
RUT UQFN (12)
2.00mm × 1.70mm
RSV UQFN (16)
2.60mm x 1.80mm
(1) 如需了解所有可用封装，请见数据表末尾的可订购产品附录。
典型应用方框图(TXB0304)
VCCA
Processor
VCCB
Peripheral
Copyright © 2016, Texas Instruments Incorporated
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
English Data Sheet: SCES831
TXB0304
ZHCS470F – SEPTEMBER 2011 – REVISED MAY 2016
www.ti.com.cn
目录
1
2
3
4
5
6
7
8
特性 ..........................................................................
应用 ..........................................................................
说明 ..........................................................................
修订历史记录 ...........................................................
Pin Configuration and Functions .........................
Specifications.........................................................
1
1
1
2
3
4
6.1
6.2
6.3
6.4
6.5
6.6
6.7
6.8
6.9
4
4
4
5
5
6
6
7
7
Absolute Maximum Ratings ......................................
ESD Ratings ............................................................
Recommended Operating Conditions.......................
Thermal Information ..................................................
Electrical Characteristics...........................................
Timing Requirements ................................................
Switching Characteristics ..........................................
Operating Characteristics..........................................
Typical Characteristics ..............................................
Parameter Measurement Information .................. 8
Detailed Description ............................................ 10
8.1 Overview ................................................................. 10
8.2 Functional Block Diagram ....................................... 10
8.3 Feature Description................................................. 11
8.4 Device Functional Modes........................................ 11
9
Application and Implementation ........................ 12
9.1 Application Information............................................ 12
9.2 Typical Application ................................................. 12
10 Power Supply Recommendations ..................... 13
11 Layout................................................................... 13
11.1 Layout Guidelines ................................................. 13
11.2 Layout Example .................................................... 14
12 器件和文档支持 ..................................................... 15
12.1
12.2
12.3
12.4
12.5
12.6
器件支持................................................................
文档支持 ...............................................................
社区资源................................................................
商标 .......................................................................
静电放电警告.........................................................
Glossary ................................................................
15
15
15
15
15
15
13 机械、封装和可订购信息 ....................................... 15
4 修订历史记录
注：之前版本的页码可能与当前版本有所不同。
Changes from Revision E (August 2014) to Revision F
Page
•
已更改说明部分....................................................................................................................................................................... 1
•
已更改Absolute Maximum Ratings、Recommended Operating Conditions (1) (2)、Switching Characteristics
和Electrical Characteristics表。.............................................................................................................................................. 1
Changes from Revision D (October 2012) to Revision E
Page
•
已添加 ESD 额定值表，特性 描述部分，器件功能模式，应用和实施部分，电源相关建议部分，布局部分，器件和文
档支持部分以及机械、封装和可订购信息部分。 .................................................................................................................... 1
•
Changed VCCA and VCCB in the ABS MAX table to VCCA and VCCB in 3 places ................................................................ 4
•
Changed in ELEC CHARAC table the 0.9 x VCCA and 0.9 x VCCB from MAX column into the MIN column ......................... 5
•
Changed in ELEC CHARAC table 0.2 (2 places) in the MIN column to the MAX ................................................................. 5
Changes from Revision C (May 2012) to Revision D
•
Page
Added Application Information section ................................................................................................................................ 12
Changes from Revision B (September 2011) to Revision C
Page
•
Added package pin out diagram notes................................................................................................................................... 3
2
Copyright © 2011–2016, Texas Instruments Incorporated
TXB0304
www.ti.com.cn
ZHCS470F – SEPTEMBER 2011 – REVISED MAY 2016
5 Pin Configuration and Functions
RSV Package
16-Pin UQFN
TXB0304 Top View
NC
V CCB
14
13
16
1
12
B1
2
11
B2
3
10
B3
4
9
A4
15
A3
NC
A2
V CCA
A1
B4
RUT Package
12-Pin UQFN
TXB0304 Top View
7
GND
OE
NC
GND
8
5
6
RSV Package
16-Pin UQFN
TXBN0304 Top View
NC
V CCB
14
13
16
1
12
B1
2
11
B2
3
10
B3
4
9
A4
15
B4
7
GND
/OE
NC
GND
8
5
6
A.
A3
NC
A2
V CCA
A1
RUT Package
12-Pin UQFN
TXBN0304 Top View
See Layout Guidelines for notes about
package pin out diagrams.
Pin Functions
PIN
NAME
TXB0304
TXBN0304
TYPE
DESCRIPTION
RSV
RUT
RSV
RUT
A1
1
2
1
2
I/O
Input/output 1
A2
2
3
2
3
I/O
Input/output 2
A3
3
4
3
4
I/O
Input/output 3
A4
4
5
4
5
I/O
Input/output 4
B1
12
10
12
10
I/O
Input/output 4
B2
11
9
11
9
I/O
Input/output 3
B3
10
8
10
8
I/O
Input/output 2
Input/output 1
B4
Referenced to VCCA
Referenced to VCCB
9
7
9
7
I/O
6, 7
6
6,7
6
GND
NC
5, 14, 15
—
5, 14, 15
—
—
OE
8
12
—
—
I
3-state output-mode enable. Pull OE (TXB0304) low to place all
outputs in 3-state mode. Referenced to VCCA.
OE
—
—
8
12
I
3-state output-mode enable. Pull OE (TXBN0304) high to place all
outputs in 3-state mode.
Referenced to VCCA.
VCCA
16
1
16
1
—
A-port supply voltage 0.9 V ≤ VCCA ≤ 3.6 V
VCCB
13
11
13
11
—
B-port supply voltage 0.9 V ≤ VCCB ≤ 3.6 V
GND
Copyright © 2011–2016, Texas Instruments Incorporated
Ground
No connection; not internally connected
3
TXB0304
ZHCS470F – SEPTEMBER 2011 – REVISED MAY 2016
www.ti.com.cn
6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)
VCCA
VCCB
(1)
MIN
MAX
–0.5
4.6
–0.5
4.6
A port
–0.5
4.6
B port
–0.5
4.6
Supply voltage
UNIT
V
VI
Input voltage
VO
Voltage applied to any output in the highimpedance or power-off state
A port
–0.5
4.6
B port
–0.5
4.6
VO
Voltage applied to any output in the high
or low state (2)
A port
–0.5
VCCA + 0.5
B port
–0.5
VCCB + 0.5
IIK
Input clamp current
VI < 0
–50
mA
IOK
Output clamp current
VO < 0
–50
mA
IO
Continuous output current
±50
mA
Continuous current through VCCA, VCCB, or GND
V
V
V
±100
mA
Tstg
Storage temperature
–65
150
°C
TJ
Junction temperature
–40
125
°C
(1)
(2)
Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
The value of VCCA and VCCB are provided in the recommended operating conditions table.
6.2 ESD Ratings
VALUE
Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins
V(ESD)
(1)
(2)
Electrostatic discharge
(1)
UNIT
±8000
Charged device model (CDM), per JEDEC specification JESD22-C101,
all pins (2)
V
±1000
JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.3 Recommended Operating Conditions (1) (2)
VCCA
VCCA
VCCB
Supply voltage
VIH
High-level input voltage
VIL
Low-level input voltage
VO
Voltage range applied to any output in
the high-impedance or power-off state
Δt/Δv
Input transition rise or fall rate
TA
Operating free-air temperature
(1)
(2)
4
VCCB
MIN
MAX
0.9
3.6
Data inputs
0.9 V to 3.6 V
0.9 V to 3.6 V
VCCI × 0.65
VCCI
OE/OE
0.9 V to 3.6 V
0.9 V to 3.6 V
VCCA × 0.65
3.6
Data inputs
0.9 V to 3.6 V
0.9 V to 3.6 V
0
VCCI × 0.35
0.9 V to 1.2 V
0.9 V to 3.6 V
0
VCCA × 0.3
OE/OE
1.2 V to 3.6 V
0.9 V to 3.6 V
0
VCCA × 0.35
A-port
0.9 V to 3.6 V
0.9 V to 3.6 V
0
3.6
B-port
0.9 V to 3.6 V
0.9 V to 3.6 V
0
3.6
A-port inputs
0.9 V to 3.6 V
0.9 V to 3.6 V
40
B-port inputs
0.9 V to 3.6 V
0.9 V to 3.6 V
40
–40
85
UNIT
V
V
V
V
ns/V
°C
The A and B sides of an unused data I/O pair must be held in the same state, such as, both at VCCI or both at GND.
VCCI is the supply voltage associated with the input port.
Copyright © 2011–2016, Texas Instruments Incorporated
TXB0304
www.ti.com.cn
ZHCS470F – SEPTEMBER 2011 – REVISED MAY 2016
6.4 Thermal Information
TXB0304
THERMAL METRIC (1)
RUT (UQFN)
RSV (UQFN)
12 PINS
16 PINS
UNIT
RθJA
Junction-to-ambient thermal resistance
116.4
131.7
°C/W
RθJC(top)
Junction-to-case (top) thermal resistance
45.7
55.8
°C/W
RθJB
Junction-to-board thermal resistance
46.9
55.3
°C/W
ψJT
Junction-to-top characterization parameter
0.6
1.4
°C/W
ψJB
Junction-to-board characterization parameter
46.9
55.3
°C/W
(1)
For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
6.5 Electrical Characteristics
over operating free-air temperature range (unless otherwise noted)
PARAMETER
High-level
output
voltage
TEST CONDITIONS
VCCA
VCCB
TA = 25°C
0.9 V to 3.6 V
Low-level
VOLA output
voltage
IOL = 20 μA
–40°C to 85°C
0.9 V to 3.6 V
High-level
VOHB output
voltage
IOH = –20 μA
TA = 25°C
0.9 V to 3.6 V
Low-level
VOLB output
voltage
IOL = 20 μA
–40°C to 85°C
0.9 V to 3.6 V
II
OE
VI = VCCI or GND
A port
VI or VO = 0 to 3.6 V
Ioff
B port
IOZ
A or B port
VI or VO = 0 to 3.6 V
OE = GND
TA = 25°C
–40°C to 85°C
TA = 25°C
–40°C to 85°C
TA = 25°C
–40°C to 85°C
TA = 25°C
–40°C to 85°C
TYP MAX
0.9 x
VCCA
IOH = –20 μA
VOHA
MIN
V
0.2
0.9 V to 3.6 V
0.9 V to 3.6 V
0V
0 V to 3.6 V
0.9 V to 3.6 V
0V
0.9 V to 3.6 V
0.9 V to 3.6 V
UNIT
0.9 x
VCCB
V
V
0.2
±1
±2
V
μA
±1
±2
±1
μA
±2
±1
±2
μA
ICCA
VI = VCCI or GND, IO = 0
–40°C to 85°C
0.9 V to 3.6 V
0.9 V to 3.6 V
5
μA
ICCB
VI = VCCI or GND, IO = 0
–40°C to 85°C
0.9 V to 3.6 V
0.9 V to 3.6 V
5
μA
ICCA + ICCB
VI = VCCI or GND, IO = 0
–40°C to 85°C
0.9 V to 3.6 V
0.9 V to 3.6 V
10
μA
High-Z state
ICCZA supply
current
VI = VCCI or GND,
IO = 0, OE = GND
–40°C to 85°C
0.9 V to 3.6 V
0.9 V to 3.6 V
5
μA
High-Z state
ICCZB supply
current
VI = VCCI or GND,
IO = 0, OE = GND
–40°C to 85°C
0.9 V to 3.6 V
0.9 V to 3.6 V
5
μA
Ci
TA = 25°C
0.9 V to 3.6 V
0.9 V to 3.6 V
Cio
OE
A port
B port
TA = 25°C, OE = GND
Copyright © 2011–2016, Texas Instruments Incorporated
0.9 V to 3.6 V
0.9 V to 3.6 V
3
6.7
6.7
pF
pF
5
TXB0304
ZHCS470F – SEPTEMBER 2011 – REVISED MAY 2016
www.ti.com.cn
6.6 Timing Requirements
over recommended operating free-air temperature range (unless otherwise noted)
PARAMETER
Data rate
LOAD
VCCA
VCCB
CL = 15 pF
0.9 to 3.6 V
CL = 15 pF
1.2 to 3.6 V
CL = 15 pF
MIN
MAX
UNIT
0.9 to 3.6 V
50
Mbps
1.2 to 3.6 V
100
Mbps
1.8 to 3.6 V
1.8 to 3.6 V
140
Mbps
CL = 30 pF
0.9 to 3.6 V
0.9 to 3.6 V
40
Mbps
CL = 30 pF
1.2 to 3.6 V
1.2 to 3.6 V
90
Mbps
CL = 30 pF
1.8 to 3.6 V
1.8 to 3.6 V
130
Mbps
CL = 50 pF
1.2 to 3.6 V
1.2 to 3.6 V
80
Mbps
CL = 50 pF
1.8 to 3.6 V
1.8 to 3.6 V
120
Mbps
CL = 100 pF
1.2 to 3.6 V
1.2 to 3.6 V
70
Mbps
CL = 100 pF
1.8 to 3.6 V
1.8 to 3.6 V
100
Mbps
6.7 Switching Characteristics
over operating free-air temperature range (unless otherwise noted). (For parameter descriptions, see Figure 2 and Figure 3.)
PARAMETER
tpd
FROM
(INPUT)
TO
(OUTPUT)
LOAD
VCCA
VCCB
A
B
CL = 15
0.9-3.6
0.9-3.6
18.9
30
A
B
CL = 15
1.2-3.6
1.2-3.6
7.5
11.5
A
B
CL = 15
1.8-3.6
1.8-3.6
3.7
4.8
A
B
CL = 30
0.9-3.6
0.9-3.6
19.5
34
A
B
CL = 30
1.2-3.6
1.2-3.6
7.8
11.9
A
B
CL = 30
1.8-3.6
1.8-3.6
3.8
5.2
A
B
CL = 50
1.2-3.6
1.2-3.6
8
12.3
A
B
CL = 50
1.8-3.6
1.8-3.6
4
5.4
A
B
CL = 100
1.2-3.6
1.2-3.6
8.6
13.5
A
B
CL = 100
1.8-3.6
1.8-3.6
4.5
6
B
A
CL = 15
0.9-3.6
0.9-3.6
18.9
30
B
A
CL = 15
1.2-3.6
1.2-3.6
7.5
11.5
B
A
CL = 15
1.8-3.6
1.8-3.6
3.7
5
B
A
CL = 30
0.9-3.6
0.9-3.6
19.5
34
B
A
CL = 30
1.2-3.6
1.2-3.6
7.8
11.9
B
A
CL = 30
1.8-3.6
1.8-3.6
3.8
5.2
B
A
CL = 50
1.2-3.6
1.2-3.6
8
12.3
B
A
CL = 50
1.8-3.6
1.8-3.6
4
5.4
B
A
CL = 100
1.2-3.6
1.2-3.6
8.6
13.5
B
A
CL = 100
1.8-3.6
1.8-3.6
4.5
0.9-3.6
0.9-3.6
262
1.2-3.6
1.2-3.6
64
1.8-3.6
1.8-3.6
37
0.9-3.6
0.9-3.6
332
1.2-3.6
1.2-3.6
76
1.8-3.6
1.8-3.6
41
A
ten
OE
B
(1)
6
CL = 15
CL = 15
MIN
TYP (1)
MAX
UNIT
ns
ns
6
ns
A
CL = 15
0.9-3.6
0.9-3.6
172
ns
B
CL = 15
0.9-3.6
0.9-3.6
169
ns
tdis
OE
trB, tfB
B-port rise and fall times
CL = 15
0.9-3.6
0.9-3.6
2.95
tsA, tsA
A-port rise and fall times
CL = 15
0.9-3.6
0.9-3.6
3.1
tSK(O)
Channel-to-channel skew
CL = 15
0.9-3.6
0.9-3.6
ns
ns
0.15
ns
TA = 25°C
Copyright © 2011–2016, Texas Instruments Incorporated
TXB0304
www.ti.com.cn
ZHCS470F – SEPTEMBER 2011 – REVISED MAY 2016
6.8 Operating Characteristics
Cpd - power dissipation capacitance measured at TA = 25°C.
PARAMETER
CpdA
CpdB
CpdA
CpdB
(1)
TYP (1)
TEST CONDITIONS
A-port input, B-port output
34
B-port input, A-port output
CL = 0, f = 10 MHz, tr = tf = 1 ns, OE = VCCA (outputs enabled)
A-port input, B-port output
34
34
B-port input, A-port output
34
A-port input, B-port output
0.01
B-port input, A-port output
0.01
CL = 0, f = 10 MHz, tr = tf = 1 ns, OE = GND (outputs disabled)
A-port input, B-port output
B-port input, A-port output
0.01
0.01
UNIT
pF
pF
pF
pF
VCCA, VCCB 0.9 V to 3.6 V
6.9 Typical Characteristics
OE Pin Input Capacitance (pF)
6
40
25qC (Room Temperature)
85qC
5
4
3
2
1
0
0
0.5
1
1.5
2
2.5
VCCA (V)
3
3.5
4
D001
Figure 1. Input Capacitors for OE Pin (CI) vs Power Supply (VCCA)
Copyright © 2011–2016, Texas Instruments Incorporated
7
TXB0304
ZHCS470F – SEPTEMBER 2011 – REVISED MAY 2016
www.ti.com.cn
7 Parameter Measurement Information
2 × VCCO
From Output
Under Test
50 kΩ
From Output
Under Test
CL
15 pF
50 k
VCCI/2
TEST
S1
t PZL/t PLZ
t PHZ/t PZH
2 × VCCO
Open
tW
VCCI
Input
Open
50 kΩ
LOAD CIRCUIT FOR
ENABLE/DISABLE
TIME MEASUREMENT
LOAD CIRCUIT FOR MAX DATA RATE,
PULSE DURATION PROPAGATION
DELAY OUTPUT RISE AND FALL TIME
MEASUREMENT
S1
VCCI/2
VCCI
0V
t PLH
Output
Input
t PHL
VCCO/2
0.9 x VCCO
0.1 x VCCO
VCCI/2
VCCI/2
0V
VOH
VCCO/2
tr
tf
VOL
VOLTAGE WAVEFORMS
PULSE DURATION
VOLTAGE WAVEFORMS
PROPAGATION DELAY TIMES
A.
CL includes probe and jig capacitance.
B.
All input pulses are supplied by generators having the following characteristics: PRR 10 MHz, ZO = 50 Ω, dv/dt ≥ 1
V/ns.
C.
The outputs are measured one at a time, with one transition per measurement.
D.
tPLH and tPHL are the same as tpd.
E.
VCCI is the VCC associated with the input port.
F.
VCCO is the VCC associated with output port.
G.
All parameters and waveforms are not applicable to all devices.
Figure 2. Load Circuits and Voltage Waveforms
8
Copyright © 2011–2016, Texas Instruments Incorporated
TXB0304
www.ti.com.cn
ZHCS470F – SEPTEMBER 2011 – REVISED MAY 2016
Parameter Measurement Information (continued)
VCCA
VCCA / 2
OE input
VCCA / 2
0V
tPLZ
tPZL
VOH
Output
Waveform 1
S1 at 2 × VCCO
VCCO / 2
VCCO × 0.2
(see Note 3)
tPHZ
tPZH
Output
Waveform 2
S1 at GND
(see Note 3)
VOL
VCCO × 0.9
VOH
VCCO / 2
0V
(1)
tPLZ and tPHZ are the same as tdis.
(2)
tPZL and tPZH are the same as ten.
(3)
Waveform 1 is for an output with internal such that the output is high, except when OE is high. Waveform 2 is for an
output with conditions such that the output is low, except when OE is high.
Figure 3. Enable and Disable Times
Copyright © 2011–2016, Texas Instruments Incorporated
9
TXB0304
ZHCS470F – SEPTEMBER 2011 – REVISED MAY 2016
www.ti.com.cn
8 Detailed Description
8.1 Overview
The TXB0304 and TXBN0304 can be used in level-translation applications for interfacing devices or systems
operating at different interface voltages with one another.
8.1.1 Architecture
The TXB0304 and TXBN0304 architecture (see Figure 4) does not require a direction-control signal to control the
direction of data flow from A to B or from B to A. In a dc state, the output drivers of the TXB0304 can maintain a
high or low, but are designed to be weak, so that they can be overdriven by an external driver when data on the
bus starts flowing the opposite direction. The output one shots detect rising or falling edges on the A or B ports.
During a rising edge, the one shot turns on the PMOS transistors (T1, T3) for a short duration, which speeds up
the low-to-high transition. Similarly, during a falling edge, the one shot turns on the NMOS transistors (T2, T4) for
a short duration, which speeds up the high-to-low transition. The typical output impedance during output
transition is 30 Ω at VCCO = 0.9 V to 1 V, 10 Ω at VCCO = 1.1 V to 1.7 V, and 5 Ω at VCCO = 1.8 V to 3.3 V.
8.2 Functional Block Diagram
VCCA
VCCB
One
Shot
T1
1 kΩ
One
Shot
T2
B
A
One
Shot
T3
1 kΩ
T4
One
Shot
Copyright © 2016, Texas Instruments Incorporated
Figure 4. Architecture of TXB0304 I/O Cell
10
Copyright © 2011–2016, Texas Instruments Incorporated
TXB0304
www.ti.com.cn
ZHCS470F – SEPTEMBER 2011 – REVISED MAY 2016
8.3 Feature Description
8.3.1 Input Driver Requirements
Typical IIN vs VIN characteristics of the TXB0304//TXBN0304 are shown in Figure 5. For proper operation, the
device driving the data I/Os of the TXB0304 must have drive strength of at least ±3 mA.
IIN
VT/1k
0
VT
VIN
-(VCC – VT)/1k
(1)
VCC is power supply of TXB0304.
(2)
VT is the input threshold voltage of TXB0304 (typically it is VCC/2).
Figure 5. Typical IIN vs VIN Curve
8.4 Device Functional Modes
8.4.1 Enable and Disable
The TXB0304 has an OE input that is used to disable the device by setting OE = low (OE = high for TXBN0304),
which places all I/Os in the high-impedance (Hi-Z) state. The disable time (tdis) indicates the delay between when
OE goes low and when the outputs actually get disabled (Hi-Z). The enable time (ten) indicates the amount of
time the user must allow for the one-shot circuitry to become operational after OE is high.
8.4.2 Pullup or Pulldown Resistor on I/O Lines
The TXB0304/TXBN0304 is designed to drive capacitive loads of up to 100 pF. The output drivers of the
TXB0304 have low dc drive strength. If pull-up or pull-down resistors are connected externally to the data I/Os,
their values must be kept higher than 20 kΩ to ensure that they do not contend with the output drivers of the
TXB0304. but if the receiver is integrated with the smaller pull down or pull up resistor, below formula can be
used for estimation to evaluate the VOH and VOL .
Vol = VCCout ´
1.5kΩ
1.5kΩ + Rpu
Voh = VCCout ´
(1)
Rpd
1.5kΩ + Rpd
where
•
•
•
•
VCCOUT is the output port supply voltage on either VCCA or VCCB
RPD is the value of the external pull down resistor
RPU is the value of the external pull up resistor
1.5 kΩ is the counting the variation of the serial resistor 1kΩ in the I/O line.
(2)
Because of this restriction on external resistors, the TXB0304 should not be used in applications such as I2C or
1-Wire where an open-drain driver is connected on the bidirectional data I/O. For these applications, use a
device from the TI TXS010X series of level translators.
Copyright © 2011–2016, Texas Instruments Incorporated
11
TXB0304
ZHCS470F – SEPTEMBER 2011 – REVISED MAY 2016
www.ti.com.cn
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
The TXB0304 can be used in level-translation applications for interfacing devices or systems operating at
different interface voltages with one another. It can only translate push-pull CMOS logic outputs. If for open-drain
signal translation, please refer to TI TXS010X products. Any external pull-down or pull-up resistors are
recommended larger than 20 kΩ.
9.2 Typical Application
3.3 V
1.8 V
0.1 mF
VCCA
0.1 mF
VCCB
OE
1.8-V
System Controller
3.3-V
System
TXB0304
A1
A2
A3
A4
Data
GND
B1
B2
B3
B4
Data
Copyright © 2016, Texas Instruments Incorporated
Figure 6. Typical Application Schematic
9.2.1 Design Requirements
For this design example, use the parameters listed in Table 1.
Table 1. Design Parameters
DESIGN PARAMETERS
EXAMPLE VALUE
Input voltage range
0.9 V to 3.6 V
Output voltage range
0.9 V to 3.6 V
9.2.2 Detailed Design Procedure
To begin the design process, determine the following:
• Input voltage range
- Use the supply voltage of the device that is driving the TXB0304 device to determine the input voltage
range. For a valid logic high the value must exceed the VIH of the input port. For a valid logic low the
value must be less than the VIL of the input port.
• Output voltage range
- Use the supply voltage of the device that the TXB0304 device is driving to determine the output voltage
range.
- Don’t recommend to have the external pull-up or pull-down resistors. If mandatory, it is recommended
the value should be larger than 20 kΩ.
12
Copyright © 2011–2016, Texas Instruments Incorporated
TXB0304
www.ti.com.cn
ZHCS470F – SEPTEMBER 2011 – REVISED MAY 2016
• An external pull-down or pull-up resistor decreases the output VOH and VOL. Use the below equations in
section 8.5.2 to draft estimate the VOH and VOL as a result of an external pull-down and pull-up resistor.
9.2.3 Application Curve
Figure 7. Level-Translation of a 2.5-MHz Signal
10 Power Supply Recommendations
There is no requirement for the power sequence. During operation, TXB0304 can work at both VCCA ≤ VCCB and
VCCA ≥ VCCB , During power-up sequencing, any power supply can be ramped up first. The TXB0304 has circuitry
that disables all output ports when either VCC is switched off (VCCA/B = 0 V).
11 Layout
11.1 Layout Guidelines
To ensure reliability of the device, following common printed-circuit board layout guidelines is recommended.
• Bypass capacitors should be used on power supplies. And should be placed as close as possible to the VCCA,
VCCB pin and GND pin
• Short trace-lengths should be used to avoid excessive loading.
• For long transmission lines, place a series resistor equivalent to the impedance of the transmission lines to
avoid signal integrity issues
• PCB signal trace-lengths must be kept short enough so that the round-trip delay of any reflection is less than
the one-shot duration, approximately 10 ns, ensuring that any reflection encounters low impedance at the
source driver.
• Pullup resistors are not required on both sides for Logic I/O.
• If pullup or pulldown resistors are needed, the resistor value must be over 20 kΩ.
• 20 kΩ is a safe recommended value, if the customer can accept higher Vol or lower Voh, smaller pull up or
pull down resistor is allowed, the draft estimation is Vol = Vccout × 1.5k/(1.5k + Rpu) and Voh = Vccout ×
Rpd/(1.5k + Rpd).
• If pullup resistors are needed, please refer to the TXS0104 or contact TI.
• For detailed information, refer to application note SCEA043.
Copyright © 2011–2016, Texas Instruments Incorporated
13
TXB0304
ZHCS470F – SEPTEMBER 2011 – REVISED MAY 2016
www.ti.com.cn
11.2 Layout Example
VCCA
Keep OE high until VCCA and
VCCB are powered up
Bypass Capacitor
OE
VCCA
1
From
Controller
A1
2
To
Controller
A2
3
From
Controller
A3
A3
4
To
Controller
A4
A4
5
12
TXB0304
6
Bypass Capacitor
11 VCCB
10
B1
To
System
9
B2
From
System
8
B3
B3
To
System
7
B4
From
System
GND
LEGEND
VIA to Power Plane
Polygonal Copper Pour
VIA to GND Plane (Inner Layer)
Figure 8. TXB0304 PCB Layout
14
版权 © 2011–2016, Texas Instruments Incorporated
TXB0304
www.ti.com.cn
ZHCS470F – SEPTEMBER 2011 – REVISED MAY 2016
12 器件和文档支持
12.1 器件支持
12.1.1 开发支持
关于 TI TXS010X 产品，请访问 www.ti.com.cn/product/cn/txs0101。
关于 TXB0304 IBIS 模型，请参见 SCEM544。
12.2 文档支持
12.2.1 相关文档
相关文档请参见以下部分：
• 应用报告，《使用 TXB 型转换器进行电压转换的相关指南》，SCEA043
• 用户指南，《TXB0304 评估模块》,SCEU003
12.3 社区资源
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.4 商标
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.5 静电放电警告
这些装置包含有限的内置 ESD 保护。 存储或装卸时，应将导线一起截短或将装置放置于导电泡棉中，以防止 MOS 门极遭受静电损
伤。
12.6 Glossary
SLYZ022 — TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 机械、封装和可订购信息
以下页中包括机械、封装和可订购信息。这些信息是针对指定器件可提供的最新数据。这些数据会在无通知且不对
本文档进行修订的情况下发生改变。欲获得该数据表的浏览器版本，请查阅左侧的导航栏。
版权 © 2011–2016, Texas Instruments Incorporated
15
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都遵循在订单确认时所提供的TI 销售条款与条件。
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Copyright © 2016, 德州仪器半导体技术（上海）有限公司
PACKAGE OPTION ADDENDUM
www.ti.com
25-Oct-2016
PACKAGING INFORMATION
Orderable Device
Status
(1)
Package Type Package Pins Package
Drawing
Qty
Eco Plan
Lead/Ball Finish
MSL Peak Temp
(2)
(6)
(3)
Op Temp (°C)
Device Marking
(4/5)
TXB0304RSVR
ACTIVE
UQFN
RSV
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
ZTJ
TXB0304RUTR
ACTIVE
UQFN
RUT
12
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
(737 ~ 73R ~ 73V)
TXBN0304RSVR
ACTIVE
UQFN
RSV
16
3000
Green (RoHS
& no Sb/Br)
CU NIPDAU |
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
ZTK
TXBN0304RUTR
ACTIVE
UQFN
RUT
12
3000
Green (RoHS
& no Sb/Br)
CU NIPDAUAG
Level-1-260C-UNLIM
-40 to 85
74R
(1)
The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2)
Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3)
MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4)
There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5)
Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6)
Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Addendum-Page 1
Samples
PACKAGE OPTION ADDENDUM
www.ti.com
25-Oct-2016
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
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TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
Addendum-Page 2
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Aug-2017
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device
Package Package Pins
Type Drawing
TXB0304RSVR
UQFN
SPQ
Reel
Reel
A0
Diameter Width (mm)
(mm) W1 (mm)
RSV
16
3000
177.8
B0
(mm)
K0
(mm)
P1
(mm)
12.4
2.0
2.8
0.7
4.0
W
Pin1
(mm) Quadrant
12.0
Q1
TXB0304RUTR
UQFN
RUT
12
3000
180.0
9.5
1.9
2.3
0.75
4.0
8.0
Q1
TXBN0304RSVR
UQFN
RSV
16
3000
177.8
12.4
2.0
2.8
0.7
4.0
12.0
Q1
TXBN0304RUTR
UQFN
RUT
12
3000
180.0
8.4
1.95
2.3
0.75
4.0
8.0
Q1
Pack Materials-Page 1
PACKAGE MATERIALS INFORMATION
www.ti.com
3-Aug-2017
*All dimensions are nominal
Device
Package Type
Package Drawing
Pins
SPQ
Length (mm)
Width (mm)
Height (mm)
TXB0304RSVR
UQFN
RSV
16
3000
202.0
201.0
28.0
TXB0304RUTR
UQFN
RUT
12
3000
184.0
184.0
19.0
TXBN0304RSVR
UQFN
RSV
16
3000
202.0
201.0
28.0
TXBN0304RUTR
UQFN
RUT
12
3000
202.0
201.0
28.0
Pack Materials-Page 2
IMPORTANT NOTICE
重要声明
德州仪器 (TI) 公司有权按照最新发布的 JESD46 对其半导体产品和服务进行纠正、增强、改进和其他修改，并不再按最新发布的 JESD48 提
供任何产品和服务。买方在下订单前应获取最新的相关信息，并验证这些信息是否完整且是最新的。
TI 公布的半导体产品销售条款 (http://www.ti.com/sc/docs/stdterms.htm) 适用于 TI 已认证和批准上市的已封装集成电路产品的销售。另有其
他条款可能适用于其他类型 TI 产品及服务的使用或销售。
复制 TI 数据表上 TI 信息的重要部分时，不得变更该等信息，且必须随附所有相关保证、条件、限制和通知，否则不得复制。TI 对该等复制文
件不承担任何责任。第三方信息可能受到其它限制条件的制约。在转售 TI 产品或服务时，如果存在对产品或服务参数的虚假陈述，则会失去
相关 TI 产品或服务的明示或暗示保证，且构成不公平的、欺诈性商业行为。TI 对此类虚假陈述不承担任何责任。
买方和在系统中整合 TI 产品的其他开发人员（总称“设计人员”）理解并同意，设计人员在设计应用时应自行实施独立的分析、评价和判断，且
应全权 负责并确保 应用的安全性， 及设计人员的 应用 （包括应用中使用的所有 TI 产品）应符合所有适用的法律法规及其他相关要求。设计
人员就自己设计的 应用声明，其具备制订和实施下列保障措施所需的一切必要专业知识，能够 (1) 预见故障的危险后果，(2) 监视故障及其后
果，以及 (3) 降低可能导致危险的故障几率并采取适当措施。设计人员同意，在使用或分发包含 TI 产品的任何 应用前， 将彻底测试该等 应用
和 该等应用中所用 TI 产品的 功能。
TI 提供技术、应用或其他设计建议、质量特点、可靠性数据或其他服务或信息，包括但不限于与评估模块有关的参考设计和材料（总称“TI 资
源”），旨在帮助设计人员开发整合了 TI 产品的 应用， 如果设计人员（个人，或如果是代表公司，则为设计人员的公司）以任何方式下载、
访问或使用任何特定的 TI 资源，即表示其同意仅为该等目标，按照本通知的条款使用任何特定 TI 资源。
TI 所提供的 TI 资源，并未扩大或以其他方式修改 TI 对 TI 产品的公开适用的质保及质保免责声明；也未导致 TI 承担任何额外的义务或责任。
TI 有权对其 TI 资源进行纠正、增强、改进和其他修改。除特定 TI 资源的公开文档中明确列出的测试外，TI 未进行任何其他测试。
设计人员只有在开发包含该等 TI 资源所列 TI 产品的 应用时， 才被授权使用、复制和修改任何相关单项 TI 资源。但并未依据禁止反言原则或
其他法理授予您任何TI知识产权的任何其他明示或默示的许可，也未授予您 TI 或第三方的任何技术或知识产权的许可，该等产权包括但不限
于任何专利权、版权、屏蔽作品权或与使用TI产品或服务的任何整合、机器制作、流程相关的其他知识产权。涉及或参考了第三方产品或服务
的信息不构成使用此类产品或服务的许可或与其相关的保证或认可。使用 TI 资源可能需要您向第三方获得对该等第三方专利或其他知识产权
的许可。
TI 资源系“按原样”提供。TI 兹免除对资源及其使用作出所有其他明确或默认的保证或陈述，包括但不限于对准确性或完整性、产权保证、无屡
发故障保证，以及适销性、适合特定用途和不侵犯任何第三方知识产权的任何默认保证。TI 不负责任何申索，包括但不限于因组合产品所致或
与之有关的申索，也不为或对设计人员进行辩护或赔偿，即使该等产品组合已列于 TI 资源或其他地方。对因 TI 资源或其使用引起或与之有关
的任何实际的、直接的、特殊的、附带的、间接的、惩罚性的、偶发的、从属或惩戒性损害赔偿，不管 TI 是否获悉可能会产生上述损害赔
偿，TI 概不负责。
除 TI 已明确指出特定产品已达到特定行业标准（例如 ISO/TS 16949 和 ISO 26262）的要求外，TI 不对未达到任何该等行业标准要求而承担
任何责任。
如果 TI 明确宣称产品有助于功能安全或符合行业功能安全标准，则该等产品旨在帮助客户设计和创作自己的 符合 相关功能安全标准和要求的
应用。在应用内使用产品的行为本身不会 配有 任何安全特性。设计人员必须确保遵守适用于其应用的相关安全要求和 标准。设计人员不可将
任何 TI 产品用于关乎性命的医疗设备，除非已由各方获得授权的管理人员签署专门的合同对此类应用专门作出规定。关乎性命的医疗设备是
指出现故障会导致严重身体伤害或死亡的医疗设备（例如生命保障设备、心脏起搏器、心脏除颤器、人工心脏泵、神经刺激器以及植入设
备）。此类设备包括但不限于，美国食品药品监督管理局认定为 III 类设备的设备，以及在美国以外的其他国家或地区认定为同等类别设备的
所有医疗设备。
TI 可能明确指定某些产品具备某些特定资格（例如 Q100、军用级或增强型产品）。设计人员同意，其具备一切必要专业知识，可以为自己的
应用选择适合的 产品， 并且正确选择产品的风险由设计人员承担。设计人员单方面负责遵守与该等选择有关的所有法律或监管要求。
设计人员同意向 TI 及其代表全额赔偿因其不遵守本通知条款和条件而引起的任何损害、费用、损失和/或责任。
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