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型号厂商描述数据手册替代料参考价格
PBGAAMKOR[AmkorTechnology] PBGA - Innovative designs and expanding package offerings provide a platform from prototype-to-production - Amkor Technology获取价格
LCCAMKOR[AmkorTechnology] LCC - Leadless Chip Carrier Package - Amkor Technology获取价格
MQFPAMKOR[AmkorTechnology] MQFP - Amkor’s MQFP IC package portfolio provides - Amkor Technology获取价格
FCCSPAMKOR[AmkorTechnology] FCCSP - a flip chip solution in a CSP package format. - Amkor Technology获取价格
MCMPBGAAMKOR[AmkorTechnology] MCMPBGA - Innovative designs and expanding package offerings provide a platform from prototype-to-production - Amkor Technology获取价格
LQFPAMKOR[AmkorTechnology] LQFP - Low Profile Quad Flat Pack (LQFP) Packages - Amkor Technology获取价格
CMCMAMKOR[AmkorTechnology] CMCM - Ceramic Multi-Chip Module Package - Amkor Technology获取价格
CERDIPAMKOR[AmkorTechnology] CERDIP - Ceramic Dual-Inline Package - Amkor Technology获取价格
PLCCAMKOR[AmkorTechnology] PLCC - Amkor’s PLCC IC package portfolio provides - Amkor Technology获取价格
PPGAAMKOR[AmkorTechnology] PPGA - Plastic Pin Grid Array Package - Amkor Technology获取价格
CVBGAAMKOR[AmkorTechnology] CVBGA - ChipArray® Packages - Amkor Technology获取价格
CSOICAMKOR[AmkorTechnology] CSOIC - Ceramic Small Outline Integrated Circuit Package - Amkor Technology获取价格
CPGAAMKOR[AmkorTechnology] CPGA - Ceramic Pin Grid Array Package - Amkor Technology获取价格
CLGAAMKOR[AmkorTechnology] CLGA - Ceramic Land Grid Array Package - Amkor Technology获取价格
ETCSPAMKOR[AmkorTechnology] ETCSP - the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height. - Amkor Technology获取价格
POWERSOP2AMKOR[AmkorTechnology] POWERSOP2 - Exceptional performance through the innovative design of PSOPs offer - Amkor Technology获取价格
CSSOPAMKOR[AmkorTechnology] CSSOP - Ceramic Shrink Small Outline Package - Amkor Technology获取价格
CSPNLAMKOR[AmkorTechnology] CSPNL - Wafer Level Packaging - Amkor Technology获取价格