| ETCSP | AMKOR[AmkorTechnology] | ETCSP - the first ball grid array capable of an extremely thin 0.5 mm maximum mounted height. - Amkor Technology | | | 获取价格 |
| POWERSOP2 | AMKOR[AmkorTechnology] | POWERSOP2 - Exceptional performance through the innovative design of PSOPs offer - Amkor Technology | | | 获取价格 |
| CSSOP | AMKOR[AmkorTechnology] | CSSOP - Ceramic Shrink Small Outline Package - Amkor Technology | | | 获取价格 |
| CSPNL | AMKOR[AmkorTechnology] | CSPNL - Wafer Level Packaging - Amkor Technology | | | 获取价格 |
| MCMPBGA | AMKOR[AmkorTechnology] | MCMPBGA - Innovative designs and expanding package offerings provide a platform from prototype-to-production - Amkor Technology | | | 获取价格 |
| LQFP | AMKOR[AmkorTechnology] | LQFP - Low Profile Quad Flat Pack (LQFP) Packages - Amkor Technology | | | 获取价格 |
| CMCM | AMKOR[AmkorTechnology] | CMCM - Ceramic Multi-Chip Module Package - Amkor Technology | | | 获取价格 |
| CERDIP | AMKOR[AmkorTechnology] | CERDIP - Ceramic Dual-Inline Package - Amkor Technology | | | 获取价格 |
| PLCC | AMKOR[AmkorTechnology] | PLCC - Amkor’s PLCC IC package portfolio provides - Amkor Technology | | | 获取价格 |
| PPGA | AMKOR[AmkorTechnology] | PPGA - Plastic Pin Grid Array Package - Amkor Technology | | | 获取价格 |
| CVBGA | AMKOR[AmkorTechnology] | CVBGA - ChipArray® Packages - Amkor Technology | | | 获取价格 |
| CSOIC | AMKOR[AmkorTechnology] | CSOIC - Ceramic Small Outline Integrated Circuit Package - Amkor Technology | | | 获取价格 |
| CPGA | AMKOR[AmkorTechnology] | CPGA - Ceramic Pin Grid Array Package - Amkor Technology | | | 获取价格 |
| CLGA | AMKOR[AmkorTechnology] | CLGA - Ceramic Land Grid Array Package - Amkor Technology | | | 获取价格 |
| PBGA | AMKOR[AmkorTechnology] | PBGA - Innovative designs and expanding package offerings provide a platform from prototype-to-production - Amkor Technology | | | 获取价格 |
| LCC | AMKOR[AmkorTechnology] | LCC - Leadless Chip Carrier Package - Amkor Technology | | | 获取价格 |
| MQFP | AMKOR[AmkorTechnology] | MQFP - Amkor’s MQFP IC package portfolio provides - Amkor Technology | | | 获取价格 |
| FCCSP | AMKOR[AmkorTechnology] | FCCSP - a flip chip solution in a CSP package format. - Amkor Technology | | | 获取价格 |
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