IRGS4615DPbF
IRGB4615DPbF
Insulated Gate Bipolar Transistor with Ultrafast Soft Recovery Diode
C
VCES = 600V
C
C
IC = 15A, TC = 100°C
E
G
tsc > 5µs, Tjmax = 175°C
G
E
VCE(on) typ. = 1.55V @ 8A
TO-220AB
IRGB4615DPbF
G
C
E
Gate
Collector
Em itter
Benefits
High efficiency in a wide range of applications and switching frequencies
Improved reliability due to rugged hard switching performance and higher
power capability
Square RBSOA and maximum junction temperature 175°C
Positive VCE(ON) temperature coefficient and tighter distribution of
parameters
5μs short circuit SOA
Lead-free, RoHS compliant
IRGS4615DPbF
IRGS4615DTRRPbF
IRGS4615DTRLPbF
IRGB4615DPbF
E
→
Features
Low VCE(ON) and switching losses
Base part number
D2-Pak
IRGS4615DPbF
n-channel
Applications
• Appliance Drives
• Inverters
• UPS
G
C
Excellent current sharing in parallel operation
Enables short circuit protection scheme
Environmentally friendly
Standard Pack
Form
Tube
Tape and Reel Right
Tape and Reel Left
Tube
Package Type
2
D PAK
TO-220AB
Orderable Part Number
Quantity
50
800
800
50
IRGS4615DPbF
IRGS4615DTRRPbF
IRGS4615DTRLPbF
IRGB4615DPbF
Absolute Maximum Ratings
VCES
IC@ TC = 25°C
IC@ TC = 100°C
ICM
ILM
IF@TC=25°C
IF@TC=100°C
IFM
VGE
PD @ TC =25°
PD @ TC =100°
TJ
TSTG
1
Parameter
Collector-to-Emitter Breakdown Voltage
Continuous Collector Current
Continuous Collector Current
Max.
600
23
15
Pulsed Collector Current, VGE = 15V
Clamped Inductive Load Current, VGE = 20V
Diode Continuous Forward Current
Diode Continuous Forward Current
Diode Maximum Forward Current
Continuous Gate-to-Emitter Voltage
Transient Gate-to-Emitter Voltage
Maximum Power Dissipation
Maximum Power Dissipation
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds (1.6mm from case)
Mounting Torque, 6-32 or M3 Screw
TO-220
c
f
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Units
V
24
32
14
9
32
± 20
± 30
99
50
A
V
W
-40 to + 175
°C
300
10lbf. In (1.1 N.m)
November 14, 2014
IRGS/B4615DPbF
Thermal Resistance
RθJC
RθJC
RθCS
Parameter
Thermal Resistance, Junction-to-Case -(each IGBT)
Thermal Resistance, Junction-to-Case -(each Diode)
Thermal Resistance, Case-to-Sink (flat, greased surface)
d
d
h
Thermal Resistance, Junction-to-Ambient (PCB mount D2PAK)
Thermal Resistance, Junction-to-Ambient ( Socket mount: TO-220)
RθJA
Min.
–––
–––
–––
Typ.
–––
–––
0.5
Max.
1.51
3.66
–––
–––
–––
–––
–––
40
62
Units
°C/W
Electrical Characteristics @ TJ = 25°C (unless otherwise specified)
Parameter
Min.
V(BR)CES
Collector-to-Emitter Breakdown Voltage
600
ΔV(BR)CES/ΔTJ Temperature Coeff. of Breakdown Voltage —
—
Collector-to-Emitter Saturation Voltage
—
VCE(on)
—
Gate Threshold Voltage
4.0
VGE(th)
—
ΔVGE(th)/ΔTJ Threshold Voltage temp. coefficient
gfe
Forward Transconductance
—
—
ICES
Collector-to-Emitter Leakage Current
—
—
VFM
Diode Forward Voltage Drop
—
Gate-to-Emitter Leakage Current
—
IGES
Typ. Max. Units
Conditions
—
—
V
VGE = 0V, Ic =100 μA
0.3
—
V/°C VGE = 0V, Ic = 250μA ( 25 -175oC )
IC = 8.0A, VGE = 15V, T J = 25°C
1.55 1.85
IC = 8.0A, VGE = 15V, T J = 150°C
1.95
—
V
IC = 8.0A, VGE = 15V, T J = 175°C
2.00
—
VCE = VGE, IC = 250μA
—
6.5
V
— mV/°C VCE = VGE, IC = 250μA ( 25 -175oC )
-18
VCE = 50V, IC = 8.0A, PW =80μs
5.6
—
S
—
25
μA VGE = 0V,VCE = 600V
VGE = 0V, VCE = 600V, T J =175°C
400
—
IF = 8.0A
1.80
2.8
V
IF = 8.0A, T J = 175°C
1.30
—
—
±100 nA VGE = ± 20 V
e
Switching Characteristics @ TJ = 25°C (unless otherwise specified)
Qg
Qge
Qgc
Eon
Eoff
Etotal
td(on)
tr
td(off)
tf
Eon
Eoff
Etotal
td(on)
tr
td(off)
tf
Cies
Coes
Cres
Parameter
Total Gate Charge (turn-on)
Gate-to-Emitter Charge (turn-on)
Gate-to-Collector Charge (turn-on)
Turn-On Switching Loss
Turn-Off Switching Loss
Total Switching Loss
Turn-On delay time
Rise time
Turn-Off delay time
Fall time
Turn-On Switching Loss
Turn-Off Switching Loss
Total Switching Loss
Turn-On delay time
Rise time
Turn-Off delay time
Fall time
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
RBSOA
Reverse Bias Safe Operating Area
SCSOA
Short Circuit Safe Operating Area
Erec
trr
Irr
Reverse recovery energy of the diode
Diode Reverse recovery time
Peak Reverse Recovery Current
Conditions
Typ. Max. Units
19
—
IC = 8.0A
5
—
nC VCC = 400V
8
—
VGE = 15V
70
—
IC = 8.0A, VCC = 400V, VGE = 15V
145
—
μJ RG = 47Ω, L=1mH, LS= 150nH, TJ = 25°C
Energy losses include tail and diode reverse recovery
—
215
—
IC = 8.0A, VCC = 400V
30
—
ns
R
15
G = 47Ω, L=1mH, LS= 150nH
—
TJ = 25°C
95
—
20
165
—
IC = 8.0A, VCC = 400V, VGE = 15V
240
—
μJ RG = 47Ω, L=1mH, LS= 150nH, TJ = 175°C
Energy losses include tail and diode reverse recovery
—
405
—
IC = 8.0A, VCC = 400V
28
—
ns RG = 47Ω, L=1mH, LS= 150nH
17
—
TJ = 175°C
117
—
35
535
—
VGE = 0V
pF VCC = 30V
45
—
15
—
f = 1Mhz
TJ = 175°C, IC = 32A
FULL SQUARE
VCC = 480V, Vp =600V
RG = 47Ω, VGE = +20V to 0V
VCC = 400V, Vp =600V
5
—
μs
—
RG = 47Ω, VGE = +15V to 0V
o
—
—
165
μJ TJ = 175 C
60
ns VCC = 400V, IF = 8.0A
—
—
—
14
—
A
VGE = 15V, Rg = 47Ω, L=1mH, LS=150nH
Min.
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
—
Notes:
VCC = 80% (VCES ), VGE = 20V, L = 100 μH, RG = 47 Ω.
Rθ is measured at TJ approximately 90°C.
Refer to AN-1086 for guidelines for measuring V(BR)CES safely.
Pulse width limited by max. junction temperature.
Values influenced by parasitic L and C in measurement
When mounted on 1" square PCB (FR-4 or G-10 Material). For recommended footprint and soldering techniques refer to application
note #AN-994: http://www.irf.com/technical-info/appnotes/an-994.pdf
2
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g
g
IRGS/B4615DPbF
24
110
22
100
20
90
18
80
70
14
Ptot (W)
IC (A)
16
12
10
60
50
8
40
6
30
4
20
2
10
0
25
50
75
100
125
150
0
175
25
50
75
100
125
150
175
TC (°C)
TC (°C)
Fig. 1 - Maximum DC Collector Current vs.
Case Temperature
Fig. 2 - Power Dissipation vs. Case
Temperature
100
100
10μs
10
IC A)
IC (A)
100μs
10
DC 1ms
1
Tc = 25°C
Tj = 175°C
Single Pulse
0.1
1
1
10
100
1000
10
100
VCE (V)
VCE (V)
Fig. 4 - Reverse Bias SOA
TJ = 175°C; VCE = 15V
Fig. 3 - Forward SOA,
TC = 25°C; TJ ≤ 175°C
30
VGE = 15V
VGE = 12V
VGE = 10V
VGE = 8.0V
VGE = 18V
VGE = 15V
VGE = 12V
VGE = 10V
VGE = 8.0V
25
20
ICE (A)
20
ICE (A)
30
VGE = 18V
25
15
15
10
10
5
5
0
0
0
2
4
6
8
0
2
VCE (V)
Fig. 5 - Typ. IGBT Output Characteristics
TJ = -40°C; tp = 80μs
3
1000
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4
6
8
V CE (V)
Fig. 6 - Typ. IGBT Output Characteristics
TJ = 25°C; tp = 80μs
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November 14, 2014
IRGS/B4615DPbF
80
30
VGE = 18V
VGE = 15V
VGE = 12V
VGE = 10V
VGE = 8.0V
25
60
-40°C
25°C
175°C
50
IF (A)
ICE (A)
20
70
15
40
30
10
20
5
10
0
0
0
2
4
6
0.0
8
1.0
2.0
Fig. 7 - Typ. IGBT Output Characteristics
TJ = 175°C; tp = 80μs
Fig. 8 - Typ. Diode Forward Characteristics
tp = 80μs
20
20
18
18
16
16
ICE = 4.0A
12
ICE = 16A
10
ICE = 4.0A
14
ICE = 8.0A
VCE (V)
VCE (V)
14
8
ICE = 8.0A
12
ICE = 16A
10
8
6
6
4
4
2
2
0
0
5
10
15
5
20
10
15
20
VGE (V)
V GE (V)
Fig. 9 - Typical VCE vs. VGE
TJ = -40°C
Fig. 10 - Typical VCE vs. VGE
TJ = 25°C
35
20
18
TJ = 25°C
TJ = 175°C
30
16
14
ICE = 4.0A
25
ICE = 16A
20
ICE = 8.0A
12
10
ICE (A)
VCE (V)
4.0
VF (V)
V CE (V)
8
6
15
10
4
5
2
0
0
5
10
15
20
0
5
Fig. 11 - Typical VCE vs. VGE
TJ = 175°C
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10
15
V GE (V)
V GE (V)
4
3.0
Fig. 12 - Typ. Transfer Characteristics
VCE = 50V; tp = 10μs
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November 14, 2014
IRGS/B4615DPbF
1000
500
450
400
300
Swiching Time (ns)
Energy (μJ)
350
EOFF
250
200
EON
150
tdOFF
100
tF
tdON
tR
10
100
50
0
1
0
5
10
15
20
0
5
10
I C (A)
20
IC (A)
Fig. 14 - Typ. Switching Time vs. IC
TJ = 175°C; L=1mH; VCE= 400V
RG= 47Ω; VGE= 15V
Fig. 13 - Typ. Energy Loss vs. IC
TJ = 175°C; L = 1mH; VCE = 400V, RG = 47Ω; VGE = 15V.
350
1000
300
EOFF
Swiching Time (ns)
250
Energy (μJ)
15
EON
200
150
100
tdOFF
100
tdON
tR
tF
50
0
10
0
25
50
75
100
125
0
25
RG (Ω)
50
75
100
125
RG (Ω)
Fig. 15 - Typ. Energy Loss vs. RG
TJ = 175°C; L = 1mH; VCE = 400V, ICE = 8A; VGE = 15V
30
25
25
RG =10 Ω
20
RG =22 Ω
15
RG =47 Ω
10
RG = 100 Ω
Fig. 16- Typ. Switching Time vs. RG
TJ = 175°C; L=1mH; VCE= 400V
ICE= 8A; VGE= 15V
IRR (A)
IRR (A)
20
15
10
5
5
0
0
5
10
15
20
0
0
25
IF (A)
Fig. 17 - Typical Diode IRR vs. IF
TJ = 175°C
5
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50
75
100
125
RG (Ω)
Fig. 18 - Typical Diode IRR vs. RG
TJ = 175°C; IF = 8.0A
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November 14, 2014
IRGS/B4615DPbF
1400
25
10Ω
1200
47 Ω
QRR (nC)
IRR (A)
1000
15
10
16A
22Ω
20
100Ω
800
8.0A
600
4.0A
400
5
200
0
0
0
500
0
1000
500
1000
1500
diF /dt (A/μs)
diF /dt (A/μs)
Fig. 20 - Typical Diode QRR
VCC= 400V; VGE= 15V; TJ = 175°C
Fig. 19- Typical Diode IRR vs. diF/dt
VCC= 400V; VGE= 15V;
ICE= 8A; TJ = 175°C
500
450
18
80
16
70
14
60
12
50
10
40
8
30
6
20
300
Time (μs)
Energy (μJ)
350
250
10 Ω
200
22 Ω
150
47 Ω
100 Ω
100
50
10
4
0
0
5
10
15
20
8
10
12
14
16
Fig. 22- Typ. VGE vs Short Circuit Time
VCC=400V, TC =25°C
Fig. 21 - Typical Diode ERR vs. IF
TJ = 175°C
16
14
Cies
300V
12
100
VGE (V)
Capacitance (pF)
18
VGE (V)
I F (A)
1000
Current (A)
400
Coes
400V
10
8
6
10
Cres
4
2
0
1
0
20
40
60
80
100
VCE (V)
Fig. 23- Typ. Capacitance vs. VCE
VGE= 0V; f = 1MHz
6
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0
5
10
15
20
Q G, Total Gate Charge (nC)
Fig. 24 - Typical Gate Charge vs. VGE
ICE = 8A, L=600μH
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IRGS/B4615DPbF
Thermal Response ( ZthJC )
10
1
D = 0.50
0.20
0.1
0.10
0.05
τJ
0.02
0.01
R1
R1
τJ
τ1
R2
R2
R3
R3
Ri (°C/W)
τC
τ2
τ1
τ2
τ3
τ
τ3
Ci= τi/Ri
Ci= τi/Ri
0.01
SINGLE PULSE
( THERMAL RESPONSE )
0.001
1E-006
1E-005
τι (sec)
0.555579 0.000216
0.590565 0.00117
0.365255 0.009076
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.0001
0.001
0.01
0.1
t1 , Rectangular Pulse Duration (sec)
Fig 25. Maximum Transient Thermal Impedance, Junction-to-Case (IGBT)
10
Thermal Response ( ZthJC )
D = 0.50
1
0.20
0.10
0.05
0.1
0.02
0.01
0.01
0.001
1E-006
τJ
0.0001
R2
R2
R3
R3
Ri (°C/W)
τC
τ1
τ2
τ2
τ3
τ
τ3
Ci= τi/Ri
Ci= τi/Ri
SINGLE PULSE
( THERMAL RESPONSE )
1E-005
R1
R1
τJ
τ1
τι (sec)
0.821094 0.000233
1.913817 0.001894
0.926641 0.014711
Notes:
1. Duty Factor D = t1/t2
2. Peak Tj = P dm x Zthjc + Tc
0.001
0.01
0.1
1
t1 , Rectangular Pulse Duration (sec)
Fig. 26. Maximum Transient Thermal Impedance, Junction-to-Case (DIODE)
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IRGS/B4615DPbF
L
L
DUT
0
VCC
1K
Fig.C.T.1 - Gate Charge Circuit (turn-off)
Fig.C.T.3 - S.C.SOA Circuit
Fig.C.T.5 - Resistive Load Circuit
8
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80 V
+
-
DUT
Rg
480V
Fig.C.T.2 - RBSOA Circuit
Fig.C.T.4 - Switching Loss Circuit
Fig.C.T.6 - Typical Filter Circuit for
V(BR)CES Measurement
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November 14, 2014
IRGS/B4615DPbF
500
25
500
25
400
20
400
20
tr
90% ICE
15
tf
10
5% ICE
100
5
200
90% test
t
10
100
10% test current
5
5% V CE
5% V CE
0
0
0
0
EOFF Loss
-100
-0.40
0.10
EON Loss
-5
1.10
0.60
-100
11.70
Time (μs)
Fig. WF1 - Typ. Turn-off Loss Waveform
@ TJ = 175°C using Fig. CT.4
Fig. WF2 - Typ. Turn-on Loss Waveform
@ TJ = 175°C using Fig. CT.4
15
500
tRR
10%
Peak
IRR
Peak
IRR
-20
-0.05
VCE (V)
IRR (A)
ICE
300
0.05
0.15
time (μS)
WF.3- Typ. Reverse Recovery Waveform
@ TJ = 175°C using CT.4
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80
60
200
40
100
20
0
-15
9
VCE
400
0
-10
100
QRR
5
-5
-5
12.10
11.90
Time(μs)
10
15
TEST
ICE (A)
200
300
VCE (V)
VCE (V)
300
0
-100
-5.00
0.00
5.00
-20
10.00
time (μS)
WF.4- Typ. Short Circuit Waveform
@ TJ = 25°C using CT.3
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November 14, 2014
IRGS/B4615DPbF
TO-220AB Package Outline (Dimensions are shown in millimeters (inches))
TO-220AB Part Marking Information
EXAMPLE: T HIS IS AN IRF1010
LOT CODE 1789
AS S EMBLED ON WW 19, 2000
IN T HE AS S EMBLY LINE "C"
INT ERNAT IONAL
RECT IFIER
LOGO
Note: "P" in as s embly line position
indicates "Lead - Free"
AS S EMBLY
LOT CODE
PART NUMBER
DAT E CODE
YEAR 0 = 2000
WEEK 19
LINE C
TO-220AB packages are not recommended for Surface Mount Application.
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
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November 14, 2014
IRGS/B4615DPbF
D2Pak Package Outline
Dimensions are shown in millimeters (inches)
D2Pak Part Marking Information
T HIS IS AN IRF530S WIT H
LOT CODE 8024
AS S EMBLED ON WW 02, 2000
IN T HE AS S EMBLY LINE "L"
INT ERNAT IONAL
RECT IFIER
LOGO
PART NUMBER
F530S
DAT E CODE
YEAR 0 = 2000
WEEK 02
LINE L
AS S EMBLY
LOT CODE
OR
INT ERNAT IONAL
RECT IFIER
LOGO
AS S EMBLY
LOT CODE
PART NUMBER
F530S
DAT E CODE
P = DES IGNATES LEAD - FREE
PRODUCT (OPT IONAL)
YEAR 0 = 2000
WEEK 02
A = AS S EMBLY S ITE CODE
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
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November 14, 2014
IRGS/B4615DPbF
D2Pak Tape & Reel Information (Dimensions are shown in millimeters (inches))
TRR
1.60 (.063)
1.50 (.059)
4.10 (.161)
3.90 (.153)
FEED DIRECTION 1.85 (.073)
1.65 (.065)
1.60 (.063)
1.50 (.059)
11.60 (.457)
11.40 (.449)
0.368 (.0145)
0.342 (.0135)
24.30 (.957)
23.90 (.941)
15.42 (.609)
15.22 (.601)
TRL
10.90 (.429)
10.70 (.421)
1.75 (.069)
1.25 (.049)
4.72 (.136)
4.52 (.178)
16.10 (.634)
15.90 (.626)
FEED DIRECTION
13.50 (.532)
12.80 (.504)
27.40 (1.079)
23.90 (.941)
4
330.00
(14.173)
MAX.
NOTES :
1. COMFORMS TO EIA-418.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSION MEASURED @ HUB.
4. INCLUDES FLANGE DISTORTION @ OUTER EDGE.
60.00 (2.362)
MIN.
26.40 (1.039)
24.40 (.961)
3
30.40 (1.197)
MAX.
4
Note: For the most current drawing please refer to IR website at http://www.irf.com/package/
12
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November 14, 2014
IRGS/B4615DPbF
Qualification Information†
Industrial
Qualification Level
Moisture Sensitivity Level
(per JEDEC JESD47F)
2
MSL1
N/A
D Pak
TO-220
RoHS Compliant
††
Yes
† Qualification standards can be found at International Rectifier’s web site: http://www.irf.com/product-info/reliability
†† Applicable version of JEDEC standard at the time of product release
Revision History
Date
11/14/2014
Comments
• Added note
to IFM Diode Maximum Forward Current on page 1.
• Added note
to switching losses test condition on page 2.
• Updated package outline on page 10.
f
g
IR WORLD HEADQUARTERS: 101 N. Sepulveda Blvd., El Segundo, California 90245, USA
To contact International Rectifier, please visit http://www.irf.com/whoto-call/
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November 14, 2014