SPD11N10
SPU11N10
Preliminary data
SIPMOS Power-Transistor
Product Summary
Feature
N-Channel
Enhancement mode
175°C operating temperature
Avalanche rated
dv/dt rated
VDS
100
RDS(on)
170
m
ID
10.5
A
P-TO251
Type
Package
Ordering Code
Marking
SPD11N10
P-TO252
Q67042-S4121
11N10
SPU11N10
P-TO251
Q67042-S4122
11N10
V
P-TO252
Maximum Ratings,at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Continuous drain current
ID
Value
A
TC=25°C
10.5
TC=100°C
7.8
Pulsed drain current
ID puls
Unit
41.2
TC=25°C
EAS
60
mJ
dv/dt
6
kV/µs
Gate source voltage
VGS
±20
V
Power dissipation
Ptot
50
W
-55... +175
°C
Avalanche energy, single pulse
ID =10.5 A , VDD =25V, RGS =25
Reverse diode dv/dt
IS =10.5A, VDS =80V, di/dt=200A/µs, Tjmax =175°C
TC=25°C
Operating and storage temperature
Tj , Tstg
IEC climatic category; DIN IEC 68-1
55/175/56
Page 1
2002-01-31
SPD11N10
SPU11N10
Preliminary data
Thermal Characteristics
Parameter
Symbol
Values
Unit
min.
typ.
max.
Characteristics
Thermal resistance, junction - case
RthJC
-
-
3
Thermal resistance, junction - ambient, leaded
RthJA
-
-
100
SMD version, device on PCB:
RthJA
-
-
75
-
-
50
@ min. footprint
@ 6 cm 2 cooling area
1)
K/W
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Values
Unit
min.
typ.
max.
V(BR)DSS
100
-
-
VGS(th)
2.1
3
4
Static Characteristics
Drain-source breakdown voltage
V
VGS =0V, ID =1mA
Gate threshold voltage, VGS = VDS
ID = 21 µA
Zero gate voltage drain current
µA
IDSS
VDS =100V, VGS =0V, Tj =25°C
-
0.01
1
VDS =100V, VGS =0V, Tj =125°C
-
1
100
IGSS
-
1
100
nA
RDS(on)
-
137
170
m
Gate-source leakage current
VGS =20V, VDS=0V
Drain-source on-state resistance
VGS =10V, ID =7.8A
1Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
Page 2
2002-01-31
SPD11N10
SPU11N10
Preliminary data
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter
Symbol
Conditions
Values
Unit
min.
typ.
max.
2.6
5.8
-
S
pF
Dynamic Characteristics
Transconductance
gfs
VDS 2*ID *RDS(on)max ,
ID =7.8A
Input capacitance
Ciss
VGS =0V, VDS =25V,
-
320
400
Output capacitance
Coss
f=1MHz
-
72
90
Reverse transfer capacitance
Crss
-
43
54
Turn-on delay time
td(on)
VDD =50V, VGS=10V,
-
8.2
10
Rise time
tr
ID =10.5A, RG =28
-
46
58
Turn-off delay time
td(off)
-
29
36
Fall time
tf
-
23
29
-
2.3
2.9
-
7.8
9.8
-
14.6
18.3
V(plateau) VDD =80V, ID=10.5A
-
6.4
-
V
IS
-
-
10.5
A
-
-
41.2
ns
Gate Charge Characteristics
Gate to source charge
Qgs
Gate to drain charge
Qgd
Gate charge total
Qg
VDD =80V, ID =10.5A
VDD =80V, ID =10.5A,
nC
VGS =0 to 10V
Gate plateau voltage
Reverse Diode
Inverse diode continuous
TC=25°C
forward current
Inverse diode direct current,
ISM
pulsed
Inverse diode forward voltage
VSD
VGS =0V, IF =10.5A
-
0.93
1.25
V
Reverse recovery time
trr
VR =50V, IF =lS ,
-
57
71
ns
Reverse recovery charge
Qrr
diF /dt=100A/µs
-
134
167
nC
Page 3
2002-01-31
SPD11N10
SPU11N10
Preliminary data
1 Power dissipation
2 Drain current
Ptot = f (TC )
ID = f (TC )
55
parameter: VGS 10 V
SPD11N10
12
A
W
10
45
9
40
8
35
ID
Ptot
SPD11N10
7
30
6
25
5
20
4
15
3
10
2
5
1
0
0
20
40
60
80
0
0
100 120 140 160 °C 190
20
40
60
80
100 120 140 160 °C 190
TC
TC
3 Safe operating area
4 Transient thermal impedance
ID = f ( VDS )
ZthJC = f (tp )
parameter : D = 0 , TC = 25 °C
parameter : D = tp /T
10
10 1
2 SPD11N10
SPD11N10
K/W
tp = 4.9µs
DS
/I
D
A
10 0
DS
(
R
ID
10 1
Z thJC
on
)
=
V
10 µs
10 -1
100 µs
D = 0.50
10
10
-2
0.20
1 ms
0
0.10
0.05
single pulse
10 ms
DC
0.02
10 -3
0.01
10 -1 0
10
10
1
10
2
V
10
3
10 -4 -7
10
10
-6
10
-5
10
-4
10
-3
10
-2
s
10
0
tp
VDS
Page 4
2002-01-31
SPD11N10
SPU11N10
Preliminary data
5 Typ. output characteristic
6 Typ. drain-source on resistance
ID = f (VDS ); Tj=25°C
RDS(on) = f (ID )
parameter: tp = 80 µs
parameter: VGS
25
400
h
g
m
VGS[V]=
f
15
e
a= 5
b= 5.5
c= 6
d= 6.5
e= 7
f= 8
g= 9
h= 10
RDS(on)
ID
A
a
b
c
d
e
f
300
250
g
200
h
10
d
150
c
a= 5
b= 5.5
c= 6
d= 6.5
VGS[V]=
100
5
b
50
e= 7
f= 8
g= 9
h= 10
a
0
0
2
4
6
8
10
V
0
0
13
4
8
12
16
20
28
A
ID
VDS
7 Typ. transfer characteristics
8 Typ. forward transconductance
ID= f ( VGS ); VDS 2 x ID x RDS(on)max
parameter: tp = 80 µs
gfs = f(ID ); Tj=25°C
parameter: gfs
7
12
S
A
5
ID
g fs
8
4
6
3
4
2
2
0
0
1
1
2
3
4
5
0
0
7
V
1
2
3
4
5
6
7
8
A
10
ID
VGS
Page 5
2002-01-31
SPD11N10
SPU11N10
Preliminary data
9 Drain-source on-state resistance
10 Typ. gate threshold voltage
RDS(on) = f (Tj )
VGS(th) = f (Tj)
parameter : ID = 7.8 A, VGS = 10 V
parameter: VGS = VDS
SPD11N10
4
750
m
V
ID =1mA
550
VGS(th)
RDS(on)
600
500
450
3
400
350
2.5
300
250
98%
200
typ
150
2
ID =21µA
100
50
0
-60
-20
20
60
100
140
°C
1.5
-65
200
-35
-5
25
55
85
115
Tj
°C
175
Tj
11 Typ. capacitances
12 Forward character. of reverse diode
C = f (VDS)
IF = f (VSD )
parameter: VGS =0V, f=1 MHz
parameter: Tj , tp = 80 µs
10
3
10 2
SPD11N10
A
pF
Ciss
C
IF
10 1
10 2
Coss
10 0
Crss
Tj = 25 °C typ
Tj = 175 °C typ
Tj = 25 °C (98%)
Tj = 175 °C (98%)
10 1
0
5
10
15
20
25
30
V
40
10 -1
0
0.4
0.8
1.2
1.6
2
2.4 V
3
VSD
VDS
Page 6
2002-01-31
SPD11N10
SPU11N10
Preliminary data
13 Typ. avalanche energy
14 Typ. gate charge
EAS = f (Tj )
VGS = f (QGate )
par.: ID = 10.5 A , VDD = 25 V, RGS = 25
parameter: ID = 10.5 A pulsed
60
16
SPD11N10
mJ
V
50
12
VGS
EAS
45
40
0,2 VDS max
10
0,8 VDS max
35
30
8
25
6
20
15
4
10
2
5
0
25
45
65
85
105
125
145
°C
185
0
0
4
8
12
16
nC
24
QGate
Tj
15 Drain-source breakdown voltage
V(BR)DSS = f (Tj )
SPD11N10
120
V (BR)DSS
V
114
112
110
108
106
104
102
100
98
96
94
92
90
-60
-20
20
60
100
140
°C
200
Tj
Page 7
2002-01-31
Preliminary data
SPD11N10
SPU11N10
Published by
Infineon Technologies AG,
Bereichs Kommunikation
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.
Attention please!
The information herein is given to describe certain components and shall not be considered as warranted
characteristics.
Terms of delivery and rights to technical change reserved.
We hereby disclaim any and all warranties, including but not limited to warranties of non-infringement,
regarding circuits, descriptions and charts stated herein.
Infineon Technologies is an approved CECC manufacturer.
Information
For further information on technology, delivery terms and conditions and prices please contact your nearest
Infineon Technologies Office in Germany or our Infineon Technologies Reprensatives worldwide (see address list).
Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon Technologies Office.
Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
or system Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.
Page 8
2002-01-31