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FGA50N100BNT

FGA50N100BNT

  • 厂商:

    FAIRCHILD(仙童半导体)

  • 封装:

  • 描述:

    FGA50N100BNT - 1000V, 50A NPT-Trench IGBT CO-PAK - Fairchild Semiconductor

  • 数据手册
  • 价格&库存
FGA50N100BNT 数据手册
FGA50N100BNT 1000V, 50A NPT-Trench IGBT CO-PAK March 2009 FGA50N100BNT 1000V, 50A NPT-Trench IGBT CO-PAK Features • • • • High Speed Switching Low Saturation Voltage : VCE(sat) = 2.5 V @ IC = 60A High Input Impedance RoHS Compliant tm General Description Trench insulated gate bipolar transistors (IGBTs) with NPT technology show outstanding performance in conduction and switching characteristics as well as enhanced avalanche ruggedness. These devices are well suited for UPS, PFC, I-H Jar, induction Heater and Home Appliance. Applications • UPS, PFC, I-H Jar, Induction Heater, Home Appliance. TO-3P GCE Absolute Maximum Ratings Symbol VCES VGES IC ICM (1) PD TJ Tstg TL Description Collector to Emitter Voltage Gate to Emitter Voltage Collector Current Collector Current Pulsed Collector Current Maximum Power Dissipation Maximum Power Dissipation Operating Junction Temperature Storage Temperature Range Maximum Lead Temp. for soldering Purposes, 1/8” from case for 5 seconds @ TC = 25oC @ TC = 100 C o Ratings 1000 ± 25 @ TC = 25oC @ TC = 100oC 50 35 200 156 63 -55 to +150 -55 to +150 300 Units V V A A A W W o o o C C C Notes: 1: Repetitive rating : Pulse width limited by max. junction temperature Thermal Characteristics Symbol RθJC(IGBT) RθJA Parameter Thermal Resistance, Junction to Case Thermal Resistance, Junction to Ambient Typ. - Max. 0.8 40.0 Units o o C /W C /W ©2009 Fairchild Semiconductor Corporation 1 www.fairchildsemi.com FGA50N100BNT Rev. A FGA50N100BNT 1000V, 50A NPT-Trench IGBT CO-PAK Package Marking and Ordering Information Device Marking FGA50N100BNT Device FGA50N100BNTTU Package TO-3PN Packaging Type Rail / Tube Max Qty Qty per Tube 30ea per Box - Electrical Characteristics of the IGBT Symbol Off Characteristics BVCES ICES IGES TC = 25°C unless otherwise noted Parameter Test Conditions Min. Typ. Max. Units Collector to Emitter Breakdown Voltage VGE = 0V, IC = 1mA Collector Cut-Off Current G-E Leakage Current VCE = 1000V, VGE = 0V VGE = ±25V, VCE = 0V 1000 - - 1.0 ±500 V mA nA On Characteristics VGE(th) VCE(sat) G-E Threshold Voltage Collector to Emitter Saturation Voltage IC = 60mA, VCE = VGE IC = 10A, VGE = 15V IC = 60A, VGE = 15V IC = 60A, VGE = 15V, TC = 125oC Dynamic Characteristics Cies Coes Cres Input Capacitance Output Capacitance Reverse Transfer Capacitance VCE = 10V, VGE = 0V, f = 1MHz 6000 260 200 pF pF pF 4.0 5.5 1.5 2.5 3.1 7.0 1.8 2.9 V V V V Switching Characteristics td(on) tr td(off) tf Qg Qge Qgc Turn-On Delay Time Rise Time Turn-Off Delay Time Fall Time Total Gate Charge Gate to Emitter Charge Gate to Collector Charge VCE = 600V, IC = 60A, VGE = 15V, TC = 25oC VCC = 600V, IC = 60A, RG = 10Ω, VGE = 15V, Inductive Load, TC = 25oC 34 68 243 65 257 45 95 100 350 ns ns ns ns nC nC nC FGA50N100BNT Rev. A 2 www.fairchildsemi.com FGA50N100BNT 1000V, 50A NPT-Trench IGBT CO-PAK Typical Performance Characteristics Figure 1. Typical Output Characteristics 200 TC = 25 C o Figure 2. Typical Output Characteristics 200 TC = 125 C o 20V 15V 10V 20V 15V 10V 9V Collector Current, IC [A] 9V 120 Collector Current, IC [A] 160 160 120 8V 80 8V 80 7V 40 7V VGE = 6V 40 VGE = 6V 0 0 2 4 6 8 Collector-Emitter Voltage, VCE [V] 10 0 0 2 4 6 8 Collector-Emitter Voltage, VCE [V] 10 Figure 3. Typical Saturation Voltage Characteristics 200 Common Emitter VGE = 15V Figure 4. Transfer Characteristics 200 Common Emitter VCE = 20V Collector Current, IC [A] TC = 25 C TC = 125 C o Collector Current, IC [A] 160 o o 160 TC = 25 C TC = 125 C o 120 120 80 80 40 40 0 0 1 2 3 4 5 6 Collector-Emitter Voltage, VCE [V] 7 0 2 4 6 8 10 Gate-Emitter Voltage,VGE [V] 12 Figure 5. Saturation Voltage vs. Case Temperature at Variant Current Level 4.5 Collector-Emitter Voltage, VCE [V] Common Emitter VGE = 15V 90A Figure 6. Saturation Voltage vs. VGE 20 Collector-Emitter Voltage, VCE [V] Common Emitter TC = -40 C o 16 60A 3.0 30A 12 60A 8 30A 90A IC = 10A IC = 10A 4 1.5 1.0 25 50 75 100 125 o Collector-EmitterCase Temperature, TC [ C] 0 0 4 8 12 16 Gate-Emitter Voltage, VGE [V] 20 FGA50N100BNT Rev. A 3 www.fairchildsemi.com FGA50N100BNT 1000V, 50A NPT-Trench IGBT CO-PAK Typical Performance Characteristics Figure 7. Saturation Voltage vs. VGE 20 Collector-Emitter Voltage, VCE [V] Common Emitter o Figure 8. Saturation Voltage vs. VGE 20 Common Emitter o Collector-Emitter Voltage, VCE [V] TC = 25 C TC = 125 C 16 16 12 60A 12 60A 8 30A 90A 8 30A 90A 4 IC = 10A 4 0 0 4 8 12 16 Gate-Emitter Voltage, VGE [V] 20 0 0 IC = 10A 4 8 12 16 Gate-Emitter Voltage, VGE [V] 20 Figure 9. Capacitance Characteristics 8000 Figure 10. Gate charge Characteristics 15 Common Emitter o Gate-Emitter Voltage, VGE [V] TC = 25 C 12 VCC = 200V 6000 Capacitance [pF] Cies Common Emitter VGE = 0V, f = 1MHz 9 400V 600V 4000 TC = 25 C o 6 2000 Coes Cres 3 0 1 10 Collector-Emitter Voltage, VCE [V] 30 0 0 55 110 165 220 Gate Charge, Qg [nC] 275 Figure 11. SOA Characteristics 500 Figure 12. Load Current vs. Frequency 120 VCC = 600V load Current : peak of square wave Load Current [A] 100 Collector Current, Ic [A] 10µs 100 80 60 40 10 100µs 1ms 1 *Notes: 10 ms DC o o 0.1 1. TC = 25 C 2. TJ = 150 C 3. Single Pulse 20 Duty cycle : 50% o T = 100 C C 0.01 1 10 100 1000 3000 Collector-Emitter Voltage, VCE [V] 0 0 10 Power Dissipation = 63W 10 10 Frequency [kHz] 1 2 10 3 FGA50N100BNT Rev. A 4 www.fairchildsemi.com FGA50N100BNT 1000V, 50A NPT-Trench IGBT CO-PAK Typical Performance Characteristics Figure 13. Turn-on Characteristics vs. Gate Resistance 300 Figure 14. Turn-off Characteristics vs. Gate Resistance 2000 1000 td(off) Switching Time [ns] 100 tr Switching Time [ns] 100 td(on) tf Common Emitter VCC = 600V, VGE = 15V IC = 60A TC = 25 C o o Common Emitter VCC = 600V, VGE = 15V IC = 60A TC = 25 C TC = 125 C o o 10 10 20 30 40 Gate Resistance, RG [Ω] 50 10 10 TC = 125 C 20 30 40 50 Gate Resistance, RG [Ω] Figure 15. Turn-on Characteristics vs. Collector Current 200 Figure 16. Turn-off Characteristics vs. Collector Current 1000 100 Switching Time [ns] Switching Time [ns] tr td(off) Common Emitter VGE = 15V, RG = 10Ω td(on) 100 TC = 25 C TC = 125 C o o tf Common Emitter VGE = 15V, RG = 10Ω TC = 25 C TC = 125 C o o 10 10 20 30 40 50 60 70 80 90 100 10 10 20 30 40 50 60 70 80 90 100 Collector Current, IC [A] Collector Current, IC [A] Figure 17. Switching Loss vs. Gate Resistance 50 Common Emitter VCC = 600V, VGE = 15V IC = 60A Fig 18. Switching Loss vs. Collector Current 30 10 Switching Loss [mJ] Eon o Switching Loss [mJ] TC = 25 C o 10 TC = 125 C Eon 1 Eoff Eoff Common Emitter VCC = 600V, VGE = 15V IC = 60A TC = 25 C TC = 125 C o o 1 10 20 30 40 Gate Resistance, RG [Ω] 50 0.1 10 20 30 40 50 60 70 80 90 100 Collector Current, IC [A] FGA50N100BNT Rev. A 5 www.fairchildsemi.com FGA50N100BNT 1000V, 50A NPT-Trench IGBT CO-PAK Typical Performance Characteristics Figure 19. Turn off Switching SOA Characterisics 250 100 Collector Current, IC [A] 10 Safe Operating Area VGE = 15V, TC = 125 C o 1 1 10 100 1000 3000 Collector-Emitter Voltage, VCE [V] Figure 20.Transient Thermal Impedance of IGBT 1 Thermal Response [Zthjc] 0.5 0.2 0.1 0.1 0.05 0.02 0.01 0.01 single pulse Duty Factor, D = t1/t2 Peak Tj = Pdm x Zthjc + TC 1E-3 1E-5 1E-4 1E-3 0.01 0.1 1 10 Rectangular Pulse Duration [sec] FGA50N100BNT Rev. A 6 www.fairchildsemi.com FGA50N100BNT 1000V, 50A NPT-Trench IGBT CO-PAK Mechanical Dimensions TO-3PN FGA50N100BNT Rev. A 7 www.fairchildsemi.com TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. Auto-SPM™ Build it Now™ CorePLUS™ CorePOWER™ CROSSVOLT™ CTL™ Current Transfer Logic™ EcoSPARK® EfficentMax™ EZSWITCH™* ™* ® Fairchild® Fairchild Semiconductor® FACT Quiet Series™ FACT® FAST® FastvCore™ FETBench™ FlashWriter®* FPS™ F-PFS™ FRFET® SM Global Power Resource Green FPS™ Green FPS™ e-Series™ Gmax™ GTO™ IntelliMAX™ ISOPLANAR™ MegaBuck™ MICROCOUPLER™ MicroFET™ MicroPak™ MillerDrive™ MotionMax™ Motion-SPM™ OPTOLOGIC® OPTOPLANAR® ® PowerTrench PowerXS™ Programmable Active Droop™ QFET® QS™ Quiet Series™ RapidConfigure™ ™ Saving our world, 1mW/W/kW at a time™ SmartMax™ SMART START™ SPM® STEALTH™ SuperFET™ SuperSOT™-3 SuperSOT™-6 SuperSOT™-8 SupreMOS™ SyncFET™ Sync-Lock™ ® * ® The Power Franchise ® TinyBoost™ TinyBuck™ TinyLogic® TINYOPTO™ TinyPower™ TinyPWM™ TinyWire™ TriFault Detect™ TRUECURRENT™* μSerDes™ PDP SPM™ Power-SPM™ UHC® Ultra FRFET™ UniFET™ VCX™ VisualMax™ XS™ * Trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used herein: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation's Anti-Counterfeiting Policy. Fairchild's Anti-Counterfeiting Policy is also stated on our external website, www.fairchildsemi.com, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufacturers of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed applications, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild's quality standards for handling and storage and provide access to Fairchild's full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address any warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Advance Information Preliminary No Identification Needed Obsolete Product Status Formative / In Design First Production Full Production Not In Production Definition Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. Rev. I40 © 2008 Fairchild Semiconductor Corporation www.fairchildsemi.com
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