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FCA47N60-F109

FCA47N60-F109

  • 厂商:

    MURATA-PS(村田)

  • 封装:

    TO-3P-3L

  • 描述:

    SuperFET

  • 数据手册
  • 价格&库存
FCA47N60-F109 数据手册
FCA47N60 N 沟道 SuperFET® MOSFET 600 V, 47 A, 70 mΩ 特性 描述 • 650 V @ TJ = 150°C SuperFET®MOSFET 是飞兆半导体第一代利用电荷平衡技术实 现出色低导通电阻和更低栅极电荷性能的高压超级结 (SJ)MOSFET 系列产品。这项技术专用于最小化导通损耗并提供 卓越的开关性能、dv/dt 额定值和更高雪崩能量。因此,SuperFET MOSFET 非常适用于开关电源应用,如功率因数校正 (PFC)、服 务器 / 电信电源、平板电视电源、 ATX 电源及工业电源应用等。 • 典型值 RDS(on) = 58 mΩ • 超低栅极电荷 (典型值 Qg= 210 nC) • 低有效输出电容 (典型值 Coss(eff.)= 420 pF) • 100% 经过雪崩测试 应用 • 太阳能逆变器 • AC-DC 电源 D G G TO-3PN D S S 绝对最大额定值 符号 FCA47N60 参数 VDSS 漏极-源极电压 ID 漏极电流 - 连续 (TC = 25°C) - 连续 (TC = 100°C) IDM 漏极电流 - 脉冲 VGSS 栅极至源极电压 EAS 单脉冲雪崩能量 IAR 雪崩电流 FCA47N60_F109 单位 600 V 47 29.7 A A 141 A ± 30 V (注 2) 1800 mJ (注 1) 47 A (注 1) EAR 重复雪崩能量 (注 1) 41.7 mJ dv/dt 二极管恢复 dv/dt 峰值 (注 3) 4.5 V/ns PD 功耗 417 3.33 W W/°C (TC = 25°C) - 高于 25°C 的功耗系数 TJ, TSTG 工作和存储温度范围 TL 用于焊接的最大引脚温度,距离外壳 1/8”,持续 5 秒 -55 至 +150 °C 300 °C 热性能 符号 参数 典型值 最大值 单位 RθJC 结至外壳热阻最大值 -- 0.3 °C/W RθJA 结至环境热阻最大值 -- 41.7 °C/W ©2010 飞兆半导体公司 FCA47N60 / FCA47N60_F109 Rev. 1 1 www.fairchildsemi.com FCA47N60 / FCA47N60_F109 — N 沟道 SuperFET® MOSFET 2017 年 9 月 器件标识 FCA47N60 器件 FCA47N60 封装 TO-3PN 卷尺寸 - 带宽 - 数量 30 FCA47N60 FCA47N60_F109 TO-3PN - - 30 电气特性 TC = 25°C 除非另有说明。 符号 参数 测试条件 最小值 典型值 最大值 单位 关断特性 BVDSS 漏极-源极击穿电压 VGS = 0 V, ID = 250 μA, TJ = 25°C 600 -- -- V VGS = 0 V, ID = 250 μA, TJ = 150°C -- 650 -- V ID = 250 μA, 参考 25°C 数值 -- 0.6 -- V/°C ΔBVDSS / ΔTJ 击穿电压温度系数 BVDS 漏极-源极雪崩击穿电压 VGS = 0 V, ID = 47 A -- 700 -- V IDSS 零栅极电压漏极电流 VDS = 600 V, VGS = 0 V VDS = 480 V, TC = 125°C --- --- 1 10 μA μA IGSSF 栅极 - 体漏电流,正向 VGS = 30 V, VDS = 0 V -- -- 100 nA IGSSR 栅极 - 体漏电流,反向 VGS = -30 V, VDS = 0 V -- -- -100 nA VGS(th) 栅极阈值电压 VDS = VGS, ID = 250 μA 3.0 -- 5.0 RDS(on) 漏极-源极 导通电阻 VGS = 10 V, ID = 23.5 A -- 0.058 0.07 gFS 正向跨导 VDS = 20 V, ID = 23.5 A -- VGS(th) 栅极阈值电压 VDS = VGS, ID = 250 μA 3.0 Ciss 输入电容 5900 8000 pF 输出电容 VDS = 25 V, VGS = 0 V, f = 1.0 MHz -- Coss -- 3200 4200 pF Crss 反向传输电容 -- 250 -- pF Coss 输出电容 VDS = 480 V, VGS = 0 V, f = 1.0 MHz -- 160 -- pF Coss eff. 有效输出电容 VDS = 0 V 至 400 V, VGS = 0 V -- 420 -- pF VDD = 300 V, ID = 47 A RG = 25 Ω -- 185 430 ns -- 210 450 ns -- 520 1100 ns -- 75 160 ns -- 210 270 nC -- 38 -- nC -- 110 -- nC 导通特性 40 -- -5.0 动态特性 开关特性 td(on) 导通延迟时间 tr 导通上升时间 td(off) 关断延迟时间 tf 关断下降时间 Qg 总栅极电荷 Qgs 栅源极电荷 Qgd 栅漏极电荷 (注 4) VDS = 480 V, ID = 47 A VGS=10 V (注 4) 漏极 - 源极二极管特性 IS 漏源极二极管最大正向连续电流 -- -- 47 A ISM 漏源极二极管最大正向脉冲电流 -- -- 141 A VSD 漏极 - 源极二极管正向电压 VGS = 0 V, IS = 47 A -- -- 1.4 V trr 反向恢复时间 -- 590 -- ns Qrr 反向恢复电荷 VGS = 0 V, IS = 47 A dIF/dt =100 A/μs -- 25 -- μC (注 4) 注: 1. 重复额定值:脉冲宽度受限于最大结温。 2. IAS = 18 A, RG = 25 Ω, 开始于 TJ = 25°C 3. ISD ≤ 47 A, di/dt ≤ 200 A/μs, VDD = 380 V, 开始于 TJ = 25°C 4. 典型特性本质上独立于工作温度。 ©2010 飞兆半导体公司 FCA47N60 / FCA47N60_F109 Rev. 1 2 www.fairchildsemi.com FCA47N60 / FCA47N60_F109 — N 沟道 SuperFET® MOSFET 封装标识与定购信息 图 1. 导通区域特性图 2. 传输特性 VGS 15.0 V 10.0 V 8.0 V 7.0 V 6.5 V 6.0 V Bottom : 5.5 V Top : ID, Drain Current [A] 10 2 ID , Drain Current [A] 2 1 10 ∝ Notes : 1. 250レs Pulse Test 2. TC = 25∩ 0 10 -1 0 10 10 150∩ 1 10 -55∩ ∝ Note 1. VDS = 40V 2. 250レs Pulse Test 0 10 2 1 10 25∩ 10 4 8 10 图 4. 体二极管正向电压变化与源电流和温度的关系 0.20 IDR , Reverse Drain Current [A] RDS(ON) [ヘ ],Drain-Source On-Resistance 图 3. 导通电阻变化与漏极电流和栅极电压的关系 0.15 VGS = 10V 0.10 VGS = 20V 0.05 0 20 40 60 80 100 120 140 160 180 2 10 1 10 150∩ ∝ Notes : 1. VGS = 0V 2. 250レs Pulse Test 10 200 0.2 0.4 0.6 图 5. 电容特性 1.0 1.2 1.4 1.6 图 6. 栅极电荷特性 30000 12 Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd 20000 VDS = 100V VGS, Gate-Source Voltage [V] 25000 Coss 15000 ∝ Notes : 1. VGS = 0 V 2. f = 1 MHz Ciss 10000 0 -1 10 0.8 VSD , Source-Drain Voltage [V] ID, Drain Current [A] 5000 25∩ 0 ∝ Note : TJ = 25∩ 0.00 Capacitance [pF] 6 VGS , Gate-Source Voltage [V] VDS, Drain-Source Voltage [V] Crss 0 10 1 10 VDS = 250V VDS = 400V 8 6 4 2 ∝ Note : ID = 47A 0 0 50 100 150 200 250 QG, Total Gate Charge [nC] VDS, Drain-Source Voltage [V] ©2010 飞兆半导体公司 FCA47N60 / FCA47N60_F109 Rev. 1 10 3 www.fairchildsemi.com FCA47N60 / FCA47N60_F109 — N 沟道 SuperFET® MOSFET 典型特性 图 7. 击穿电压变化与温度的关系 图 8. 导通电阻变化与温度的关系 3.0 RDS(ON), (Normalized) Drain-Source On-Resistance BVDSS, (Normalized) Drain-Source Breakdown Voltage 1.2 1.1 1.0 ∝ Notes : 1. VGS = 0 V 2. ID = 250 レA 0.9 0.8 -100 -50 0 50 100 150 2.5 2.0 1.5 1.0 ∝ Notes : 1. VGS = 10 V 2. ID = 47 A 0.5 0.0 -100 200 -50 0 o TJ, Junction Temperature [ C] 50 100 150 200 o TJ, Junction Temperature [ C] 图 9. 最大安全工作区与壳温的关系 图 10. 最大漏极电流 50 Operation in This Area is Limited by R DS(on) 2 100 us 40 1 ms ID, Drain Current [A] ID, Drain Current [A] 10 10 ms 1 10 DC 0 10 ∝ Notes : o 1. TC = 25 C -1 10 0 10 20 10 o 2. TJ = 150 C 3. Single Pulse -2 10 30 1 2 10 0 25 3 10 10 50 VDS, Drain-Source Voltage [V] 75 100 125 150 TC, Case Temperature [∩ ] Zヨ JC(t), Thermal Response 图 11. 瞬态热响应曲线 D = 0 .5 10 -1 ∝ N o te s : 1 . Z ヨ J C( t) = 0 .3 ∩ /W M a x . 2 . D u ty F a c to r , D = t 1 /t 2 3 . T J M - T C = P D M * Z ヨ J C( t) 0 .2 0 .1 PDM 0 .0 5 t1 0 .0 2 10 -2 10 0 .0 1 -5 t2 s in g le p u ls e 10 -4 10 -3 10 -2 10 -1 10 0 10 1 t 1 , S q u a r e W a v e P u ls e D u r a tio n [s e c ] ©2010 飞兆半导体公司 FCA47N60 / FCA47N60_F109 Rev. 1 4 www.fairchildsemi.com FCA47N60 / FCA47N60_F109 — N 沟道 SuperFET® MOSFET 典型特性 (接上页) FCA47N60 / FCA47N60_F109 — N 沟道 SuperFET® MOSFET 图 12. 栅极电荷测试电路与波形 图 13. 阻性开关测试电路与波形 VDS RG V 10V GS RL VDS 90% VDD VGS VGS DUT 10% td(on) tr t on td(off) tf t off 图 14. 非箝位感性开关测试电路与波形 VGS ©2010 飞兆半导体公司 FCA47N60 / FCA47N60_F109 Rev. 1 5 www.fairchildsemi.com FCA47N60 / FCA47N60_F109 — N 沟道 SuperFET® MOSFET 图 15. 峰值二极管恢复 dv/dt 测试电路与波形 DUT + VDS _ I SD L Driver RG VGS VGS ( Driver ) Same Type as DUT VDD • dv/dt controlled by RG • ISD controlled by pulse period Gate Pulse Width D = -------------------------Gate Pulse Period 10V IFM , Body Diode Forward Current I SD ( DUT ) di/dt IRM Body Diode Reverse Current VDS ( DUT ) Body Diode Recovery dv/dt VSD VDD Body Diode Forward Voltage Drop ©2010 飞兆半导体公司 FCA47N60 / FCA47N60_F109 Rev. 1 6 www.fairchildsemi.com FCA47N60 / FCA47N60_F109 — N 沟道 SuperFET® MOSFET 机械尺寸 TO-3PN 3L 图 16. TO3, 3 引脚、塑料, EIAJ SC-65 封装图纸是作为一项服务提供给考虑飞兆半导体元件的客户的。图纸可能会在没有任何通知的情况下做出一些改动。请注意图纸上的版 本或日期,如有疑问,请联系飞兆半导体代表核实或获得最新版本。封装规格说明并不扩大飞兆半导体全球范围内的条款与条件,尤其 是其中涉及飞兆半导体产品保修的部分。 随时访问飞兆半导体在线封装网页,可以获取最新的封装图纸: http://www.fairchildsemi.com/package/packageDetails.html?id=PN_TT3P0-003 ©2010 飞兆半导体公司 FCA47N60 / FCA47N60_F109 Rev. 1 7 www.fairchildsemi.com *Trademarks of System General Corporation, used under license by Fairchild Semiconductor. DISCLAIMER FAIRCHILD SEMICONDUCTOR RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION, OR DESIGN. FAIRCHILD DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. THESE SPECIFICATIONS DO NOT EXPAND THE TERMS OF FAIRCHILD’S WORLDWIDE TERMS AND CONDITIONS, SPECIFICALLY THE WARRANTY THEREIN, WHICH COVERS THESE PRODUCTS. LIFE SUPPORT POLICY FAIRCHILD’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF FAIRCHILD SEMICONDUCTOR CORPORATION. As used here in: 1. Life support devices or systems are devices or systems which, (a) are intended for surgical implant into the body or (b) support or sustain life, and (c) whose failure to perform when properly used in accordance with instructions for use provided in the labeling, can be reasonably expected to result in a significant injury of the user. 2. A critical component in any component of a life support, device, or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. ANTI-COUNTERFEITING POLICY Fairchild Semiconductor Corporation’s Anti-Counterfeiting Policy. Fairchild’s Anti-Counterfeiting Policy is also stated on our external website, www.Fairchildsemi.com, under Sales Support. Counterfeiting of semiconductor parts is a growing problem in the industry. All manufactures of semiconductor products are experiencing counterfeiting of their parts. Customers who inadvertently purchase counterfeit parts experience many problems such as loss of brand reputation, substandard performance, failed application, and increased cost of production and manufacturing delays. Fairchild is taking strong measures to protect ourselves and our customers from the proliferation of counterfeit parts. Fairchild strongly encourages customers to purchase Fairchild parts either directly from Fairchild or from Authorized Fairchild Distributors who are listed by country on our web page cited above. Products customers buy either from Fairchild directly or from Authorized Fairchild Distributors are genuine parts, have full traceability, meet Fairchild’s quality standards for handing and storage and provide access to Fairchild’s full range of up-to-date technical and product information. Fairchild and our Authorized Distributors will stand behind all warranties and will appropriately address and warranty issues that may arise. Fairchild will not provide any warranty coverage or other assistance for parts bought from Unauthorized Sources. Fairchild is committed to combat this global problem and encourage our customers to do their part in stopping this practice by buying direct or from authorized distributors. PRODUCT STATUS DEFINITIONS Definition of Terms Datasheet Identification Product Status Definition Advance Information Formative / In Design Datasheet contains the design specifications for product development. Specifications may change in any manner without notice. Preliminary First Production Datasheet contains preliminary data; supplementary data will be published at a later date. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve design. No Identification Needed Full Production Datasheet contains final specifications. Fairchild Semiconductor reserves the right to make changes at any time without notice to improve the design. Obsolete Not In Production Datasheet contains specifications on a product that is discontinued by Fairchild Semiconductor. The datasheet is for reference information only. Rev. I66 ©2010 飞兆半导体公司 FCA47N60 / FCA47N60_F109 Rev. 1 8 www.fairchildsemi.com FCA47N60 / FCA47N60_F109 — N 沟道 SuperFET® MOSFET TRADEMARKS The following includes registered and unregistered trademarks and service marks, owned by Fairchild Semiconductor and/or its global subsidiaries, and is not intended to be an exhaustive list of all such trademarks. Sync-Lock™ F-PFS™ AccuPower™ ® FRFET® AX-CAP®* ®* ® SM BitSiC™ Global Power Resource PowerTrench GreenBridge™ PowerXS™ Build it Now™ TinyBoost® Green FPS™ Programmable Active Droop™ CorePLUS™ TinyBuck® ® Green FPS™ e-Series™ QFET CorePOWER™ TinyCalc™ QS™ Gmax™ CROSSVOLT™ TinyLogic® Quiet Series™ GTO™ CTL™ TINYOPTO™ RapidConfigure™ IntelliMAX™ Current Transfer Logic™ TinyPower™ ISOPLANAR™ DEUXPEED® ™ TinyPWM™ Dual Cool™ Marking Small Speakers Sound Louder TinyWire™ EcoSPARK® Saving our world, 1mW/W/kW at a time™ and Better™ TranSiC™ EfficentMax™ SignalWise™ MegaBuck™ TriFault Detect™ ESBC™ SmartMax™ MICROCOUPLER™ TRUECURRENT®* SMART START™ MicroFET™ ® μSerDes™ Solutions for Your Success™ MicroPak™ SPM® MicroPak2™ Fairchild® STEALTH™ MillerDrive™ Fairchild Semiconductor® UHC® SuperFET® MotionMax™ FACT Quiet Series™ ® Ultra FRFET™ SuperSOT™-3 mWSaver FACT® UniFET™ SuperSOT™-6 OptoHiT™ FAST® VCX™ SuperSOT™-8 OPTOLOGIC® FastvCore™ VisualMax™ OPTOPLANAR® SupreMOS® FETBench™ VoltagePlus™ SyncFET™ FPS™ XS™
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