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FDMC86260ET150

FDMC86260ET150

  • 厂商:

    MURATA-PS(村田)

  • 封装:

    PQFN-8

  • 描述:

    这一 N 沟道 MOSFET 器件采用飞兆的高级 PowerTrench 工艺生产,该工艺专为最大限度地降低通态电阻并保持卓越的开关性能而量身定制。

  • 数据手册
  • 价格&库存
FDMC86260ET150 数据手册
Is Now Part of To learn more about ON Semiconductor, please visit our website at www.onsemi.com Please note: As part of the Fairchild Semiconductor integration, some of the Fairchild orderable part numbers will need to change in order to meet ON Semiconductor’s system requirements. Since the ON Semiconductor product management systems do not have the ability to manage part nomenclature that utilizes an underscore (_), the underscore (_) in the Fairchild part numbers will be changed to a dash (-). This document may contain device numbers with an underscore (_). Please check the ON Semiconductor website to verify the updated device numbers. The most current and up-to-date ordering information can be found at www.onsemi.com. Please email any questions regarding the system integration to Fairchild_questions@onsemi.com. ON Semiconductor and the ON Semiconductor logo are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent-Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. FDMC86260ET150 N 沟道 Power Trench® MOSFET 150 V, 25 A, 34 mΩ 特性 概述  TJ 额定值扩展:175°C 该 N 沟道 MOSFET 采用飞兆先进的 PowerTrench® 工艺生产, 这一先进工艺是专为最大限度地降低通态电阻并保持卓越开关性 能而定制的。  最大 rDS(on) = 34 mΩ (VGS = 10 V, ID = 5.4 A)  最大 rDS(on) = 44 mΩ (VGS = 6 V, ID = 4.8 A) 应用  高性能沟道技术可实现极低的 rDS(on)  DC-DC 转换  100% 经过 UIL 测试  终端为无铅产品  符合 RoHS 标准 引脚 1 引脚 1 D D 顶 D S S S S D S D S D G D G D 底 Power 33 MOSFET 最大额定值 TA = 25 °C 除非另有说明 符号 参数 VDS 漏极-源极电压 VGS 栅极-源极电压 漏极电流 ID - 连续 TC = 25 °C - 连续 TC = 100 °C - 连续 TA = 25 °C - 脉冲 EAS 单脉冲雪崩能量 PD TJ, TSTG 功耗 TC = 25 °C 功耗 TA = 25 °C 额定值 150 单位 V ±20 V 25 (注 5) (注 5) 18 (注 1a) 5.4 (注 4) 116 (注 3) 121 65 2.8 (注 1a) -55 ? +175 工作和存储结温范围 A mJ W °C 热性能 RθJC 结至外壳热阻 (注 1) 2.3 RθJA 结至环境热阻 (注 1a) 53 °C/W 封装标识与定购信息 器件标识 FDMC86260ET © 2015 飞兆半导体公司 FDMC86260ET150 修订版 C1 器件 FDMC86260ET150 封装 Power33 1 卷尺寸 13 ’’ 带宽 12 mm 数量 3000 个 www.fairchildsemi.com FDMC86260ET150 N 沟道 Power Trench® MOSFET 2015 年 3 月 符号 参数 测试条件 最小值 典型值 最大值 单位 关断特性 BVDSS 漏极-源极击穿电压 ID = 250 μA, VGS = 0 V ΔBVDSS ΔTJ 击穿电压温度系数 ID = 250 μA, 参考温度为 25 °C IDSS 零栅极电压漏极电流 VDS = 120 V, VGS = 0 V 1 μA 栅极-源极漏电流 VGS = ±20 V, VDS = 0 V ±100 nA VGS(th) 栅极-源极阈值电压 VGS = VDS, ID = 250 μA 4 V ΔVGS(th) ΔTJ 栅极-源极阈值电压温度系数 ID = 250 μA, 参考温度为 25 °C -9 VGS = 10 V, ID = 5.4 A 27 漏极至源极静态导通电阻 VGS = 6 V, ID = 4.8 A 31 44 VGS = 10 V, ID = 5.4 A, TJ = 125 °C 55 69 VDD = 10 V, ID = 5.4 A 19 IGSS 150 V 110 mV/°C 导通特性 rDS(on) gFS 正向跨导 2 2.7 mV/°C 34 mΩ S 动态特性 Ciss 输入电容 Coss 输出电容 Crss 反向传输电容 Rg 栅极阻抗 VDS = 75 V, VGS = 0 V, f = 1 MHz 1000 1330 pF 105 140 pF 4.8 10 pF 0.6 1.8 Ω 0.1 开关特性 td(on) 导通延迟时间 tr 上升时间 td(off) 关断延迟时间 VDD = 75 V, ID = 5.4 A, VGS = 10 V, RGEN = 6 Ω 9.5 19 ns 2 10 ns ns 17 30 10 ns 下降时间 3.3 Qg(TOT) 总栅极电荷 VGS = 0 V 至 10 V 15 21 nC Qg(TOT) 总栅极电荷 VGS = 0 V 至 6 V 9.7 14 nC tf Qgs Qgd 总栅极电荷 VDD = 75 V, ID = 5.4 A 栅极-漏极 “ 米勒 ” 电荷 4.0 nC 3.1 nC 漏极-源极二极管特性 VSD 源极-漏极二极管正向电压 trr 反向恢复时间 Qrr 反向恢复电荷 VGS = 0 V,IS = 5.4 A (注 2) 0.77 1.3 V VGS = 0 V, IS = 1.9 A (注 2) 0.72 1.2 V IF = 5.4 A, di/dt = 100 A/μs 64 102 ns 85 137 nC 注意: 1. RθJA 取决于安装在一平方英寸衬垫, 2oz 铜焊盘以及 FR-4 材质尺寸 1.5 x 1.5in. 的衬垫上的器件。 RθCA 由用户的电路板设计确定。 b. 125 安装在 2 oz 最小铜焊盘上 时的 °C/W a. 53 安装在 2 oz 最小 1 in2 铜 焊盘上时的 °C/W SS SF DS DF G SS SF DS DF G 2. 脉冲测试:脉冲宽度:
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