UPB1511TB-E3

PRELIMINARY DATA SHEET BIPOLAR DIGITAL INTEGRATED CIRCUIT µPB1511TB 800 MHz INPUT DIVIDE BY 2, 4 PRESCALER IC FOR PORTABLE SYSTEMS The µPB1511TB is a silicon monolithic integrated circuit designed as a divide by 2, 4 prescaler IC for portable radio systems. This IC is manufactured using NEC’s 30 GHz fmax UHS0 (Ultra High Speed Process) silicon bipolar process. Consequently, this IC is lower circuit current and smaller package than conventional µPB1509GV. FEATURES • Operating frequency • Low current consumption • High-density surface mounting • Supply voltage • Selectable division : fin = 50 to 700 MHz @ ÷ 2, 50 to 800 MHz @ ÷ 4 : 3.5 mA @ VCC = 3.0 V : 6-pin super minimold : VCC = 2.4 to 3.3 V : ÷ 2, ÷ 4 APPLICATIONS • Portable radio systems • Cellular/cordless telephone 2nd local prescaler ORDERING INFORMATION Part Number Package 6-pin super minimold Marking C2Z Supplying Form Embossed tape 8 mm wide. Pin 1, 2, 3 face the tape perforation side. Qty 3 kpcs/reel. µPB1511TB-E3 Remark To order evaluation samples, please contact your local NEC sales office. (Part number for sample order: µPB1511TB) Caution Electro-static sensitive devices The information in this document is subject to change without notice. Before using this document, please confirm that this is the latest version. Not all devices/types available in every country. Please check with local NEC representative for availability and additional information. Document No. P14731EJ1V0DS00 (1st edition) Date Published June 2000 N CP(K) Printed in Japan © 2000 µPB1511TB PIN CONNECTIONS Pin No. (Top View) 3 2 1 (Bottom View) 4 5 6 4 5 6 3 2 1 Pin Name OUT GND SW IN IN VCC 1 2 C2Z 3 4 5 6 PRODUCT LINE-UP Part Number ICC (mA) 5.0 3.5 VCC (V) 2.2 to 5.5 2.4 to 3.3 ÷2 fin (MHz) 50 to 700 50 to 700 ÷4 fin (MHz) 50 to 800 50 to 800 ÷8 fin (MHz) 50 to 1 000 − Package 8-pin SSOP 6-pin super minimold µPB1509 GV µPB1511TB Remark This table shows the TYP. values of main parameters. Please refer to ELECTRICAL CHARACTERISTICS. INTERNAL BLOCK DIAGRAM D IN IN CLK Q D CLK Q OUT Q Q SW 2 Preliminary Data Sheet P14731EJ1V0DS00 µPB1511TB SYSTEM APPLICATION EXAMPLE One of the example for usage Low Noise Tr. RX DEMOD. I Q VCO VCO SW ÷N ÷N PLL PLL µ PB1511TB I 0° TX PA Phase Shifter 90° Q Quadulator Modulator This block diagram schematically shows the µPB1511TB’s location in one of the example application system. The other applications are also acceptable for divider use. Preliminary Data Sheet P14731EJ1V0DS00 3 µPB1511TB PIN EXPLANATIONS Applied Voltage (V)  Pin No. Symbol Functions and Explanation 1 OUT Divided frequency output pin. This pin is designed as emitter follower output. This pin can output 0.2 VP-P MIN. with 200 Ω load. This pin should be coupled to load device with capacitor (example: 1 000 pF) for DC cut. Ground pin. Ground pattern on the board should be formed as widely as possible to minimize ground impedance. Divide ratio control pin. Divide ratio can be determined by following applied level to these pins. SW H Divide ratio 1/2 L 1/4 2 GND 0 3 SW H/L These pins must be each equipped with bypass capacitor to minimize their impedance. 4 IN   Signal input pin. This pin should be coupled to signal source with capacitor (example: 1 000 pF) for DC cut. Signal input bypass pin. This pin must be equipped with bypass capacitor (example: 1 000 pF) to minimize ground impedance. Power supply pin. This pin must be equipped with bypass capacitor (example: 1 000 pF) to minimize ground impedance. 5 IN 6 VCC 2.4 to 3.3 4 Preliminary Data Sheet P14731EJ1V0DS00 µPB1511TB ABSOLUTE MAXIMUM RATINGS Parameter Supply Voltage Input Voltage Total Power Dissipation Symbol VCC Vin PD TA = +25°C TA = +25°C, SW pin Mounted on double sided copper clad 50 × 50 × 1.6 mm epoxy glass PWB (TA = +85°C) Conditions Ratings 3.6 3.6 200 Unit V V mW Operating Ambient Temperature Storage Temperature TA Tstg −40 to +85 −55 to +150 °C °C RECOMMENDED OPERATING CONDITIONS Parameter Supply Voltage Operating Ambient Temperature Symbol VCC TA MIN. 2.4 −40 TYP. 3.0 +25 MAX. 3.3 +85 Unit V °C ELECTRICAL CHARACTERISTICS (TA = +25°C, VCC = 3.0 V) Parameter Circuit Current Upper Limit Operating Frequency 1 Upper Limit Operating Frequency 2 Symbol ICC fin(U)1 fin(U)2 Test Conditions No signals Pin = −20 to 0 dBm Pin = −20 to −5 dBm @ ÷ 2 @÷4 Pin = −20 to 0 dBm Pin = −20 to −5 dBm fin = 50 to 800 MHz fin = 50 to 500 MHz RL = 200 Ω MIN. 3.1 500 700 800   −20 −20 0.2 0.7 × VCC −0.5 TYP. 3.5        0.3   MAX. 4.1    50 500 −5 0  VCC + 0.5 VCC × 0.3 Unit mA MHz MHz Lower Limit Operating Frequency 1 Lower Limit Operating Frequency 2 Input Power 1 Input Power 2 Output Voltage Divide Ratio Control Input High Divide Ratio Control Input Low fin(L)1 fin(L)2 Pin1 Pin2 Vout VIH VIL MHz MHz dBm dBm VP-P V V Preliminary Data Sheet P14731EJ1V0DS00 5 µPB1511TB TEST CIRCUIT 1 000 pF 3 SW 2 GND 1 OUT 1 000 pF 150 Ω IN IN VCC 4 1 000 pF High Impedance Oscilloscope 5 6 1 000 pF 50 Ω Signal Generator 1 000 pF 50 Ω Counter (or Spectrum Analyzer) Power Supply Divide Ratio Setting SW H L 1/2 1/4 PACKAGE DIMENSIONS 6-pin super minimold (Unit: mm) 2.1±0.1 1.25±0.1 2.0±0.2 1.3 0.65 0.65 0.1 MIN. 0.9±0.1 0.7 6 Preliminary Data Sheet P14731EJ1V0DS00 0 to 0.1 0.15+0.1 –0 0.2+0.1 –0.05 µPB1511TB NOTE ON CORRECT USE (1) Observe precautions for handling because of electrostatic sensitive devices. (2) Form a ground pattern as widely as possible to minimize ground impedance (to prevent undesired oscillation). Keep the track length of the ground pins as short as possible. (3) Connect a bypass capacitor (example: 1 000 pF) to the VCC pin. RECOMMENDED SOLDERING CONDITIONS This product should be soldered under the following recommended conditions. For soldering methods and conditions other than those recommended below, contact your NEC sales representative. Soldering Method Infrared Reflow Soldering Conditions Package peak temperature: 235°C or below Time: 30 seconds or less (at 210°C) Note Count: 3, Exposure limit: None Package peak temperature: 215°C or below Time: 40 seconds or less (at 200°C) Note Count: 3, Exposure limit: None Soldering bath temperature: 260°C or below Time: 10 seconds or less Note Count: 1, Exposure limit: None Pin temperature: 300°C Time: 3 seconds or less (per side of device) Note Exposure limit: None Recommended Condition Symbol IR35-00-3 VPS VP15-00-3 Wave Soldering WS60-00-1 Partial Heating – Note After opening the dry pack, keep it in a place below 25°C and 65% RH for the allowable storage period. Caution Do not use different soldering methods together (except for partial heating). For details of recommended soldering conditions for surface mounting, refer to information document SEMICONDUCTOR DEVICE MOUNTING TECHNOLOGY MANUAL (C10535E). Preliminary Data Sheet P14731EJ1V0DS00 7 µPB1511TB ATTENTION OBSERVE PRECAUTIONS FOR HANDLING ELECTROSTATIC SENSITIVE DEVICES NESAT (NEC Silicon Advanced Technology) is a trademark of NEC Corporation. • The information in this document is current as of June, 2000. The information is subject to change without notice. For actual design-in, refer to the latest publications of NEC's data sheets or data books, etc., for the most up-to-date specifications of NEC semiconductor products. Not all products and/or types are available in every country. Please check with an NEC sales representative for availability and additional information. • No part of this document may be copied or reproduced in any form or by any means without prior written consent of NEC. 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(Note) (1) "NEC" as used in this statement means NEC Corporation and also includes its majority-owned subsidiaries. (2) "NEC semiconductor products" means any semiconductor product developed or manufactured by or for NEC (as defined above). M8E 00. 4