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74F14

74F14

  • 厂商:

    NSC

  • 封装:

  • 描述:

    74F14 - Hex Inverter Schmitt Trigger - National Semiconductor

  • 数据手册
  • 价格&库存
74F14 数据手册
54F 74F14 Hex Inverter Schmitt Trigger December 1994 54F 74F14 Hex Inverter Schmitt Trigger General Description The ’F14 contains six logic inverters which accept standard TTL input signals and provide standard TTL output levels They are capable of transforming slowly changing input signals into sharply defined jitter-free output signals In addition they have a greater noise margin than conventional inverters Each circuit contains a Schmitt trigger followed by a Darlington level shifter and a phase splitter driving a TTL totempole output The Schmitt trigger uses positive feed back to effectively speed-up slow input transition and provide different input threshold voltages for positive and negative-going transitions This hysteresis between the positive-going and negative-going input thresholds (typically 800 mV) is determined internally by resistor ratios and is essentially insensitive to temperature and supply voltage variations Features Y Y Guaranteed 4000V minimum ESD protection Standard Military Drawing 5962-88752 Commercial 74F14PC Military Package Number N14A Package Description 14-Lead (0 300 Wide) Molded Dual-In-Line 14-Lead Ceramic Dual-In-Line 14-Lead (0 150 Wide) Molded Small Outline JEDEC 14-Lead (0 300 Wide) Molded Small Outline EIAJ 14-Lead Cerpack 20-Lead Ceramic Leadless Chip Carrier Type C 54F14DM (Note 2) 74F14SC (Note 1) 74F14SJ (Note 1) 54F14FM (Note 2) 54F14LM (Note 2) J14A M14A M14D W14B E20A Note 1 Devices also available in 13 reel Use Suffix e SCX and SJX Note 2 Military grade device with environmental and burn-in processing Use suffix e DMQB FMQB and LMQB Logic Symbol IEEE IEC Connection Diagrams Pin Assignment DIP SOIC and Flatpak Pin Assignment for LCC TL F 9461 – 1 TL F 9461 – 2 TL F 9461–3 TRI-STATE is a registered trademark of National Semiconductor Corporation C1995 National Semiconductor Corporation TL F 9461 RRD-B30M75 Printed in U S A Unit Loading Fan Out 54F 74F Pin Names Description UL HIGH LOW 10 10 50 33 3 Input IIH IIL Output IOH IOL 20 mA b0 6 mA b 1 mA 20 mA In On Input Output Function Table Input A L H H e HIGH Voltage Level L e LOW Voltage Level Output O H L 2 Absolute Maximum Ratings (Note 1) If Military Aerospace specified devices are required please contact the National Semiconductor Sales Office Distributors for availability and specifications Storage Temperature Ambient Temperature under Bias Junction Temperature under Bias VCC Pin Potential to Ground Pin b 65 C to a 150 C b 55 C to a 125 C b 55 C to a 175 C Recommended Operating Conditions Free Air Ambient Temperature Military Commercial Supply Voltage Military Commercial b 55 C to a 125 C 0 C to a 70 C a 4 5V to a 5 5V a 4 5V to a 5 5V b 0 5V to a 7 0V b 0 5V to a 7 0V Input Voltage (Note 2) b 30 mA to a 5 0 mA Input Current (Note 2) Voltage Applied to Output in HIGH State (with VCC e 0V) b 0 5V to VCC Standard Output b 0 5V to a 5 5V TRI-STATE Output Current Applied to Output in LOW State (Max) twice the rated IOL (mA) ESD Last Passing Voltage (Min) 4000V Note 1 Absolute maximum ratings are values beyond which the device may be damaged or have its useful life impaired Functional operation under these conditions is not implied Note 2 Either voltage limit or current limit is sufficient to protect inputs DC Electrical Characteristics Symbol VT a VTb D VT VCD VOH Parameter Min Positive-Going Threshold Negative-Going Threshold Hysteresis (VT a – VTb) Input Clamp Diode Voltage Output HIGH Voltage Output LOW Voltage Input HIGH Current Input HIGH Current Breakdown Test Output HIGH Leakage Current Input Leakage Test Output Leakage Circuit Current Input LOW Current Output Short-Circuit Current Power Supply Current Power Supply Current b 60 54F 74F Typ 17 09 08 b1 2 Units Max 20 11 V V V V V 05 05 20 0 50 100 70 250 50 VCC 5 0V 5 0V 5 0V Min Min Conditions 15 07 04 IIN e b18 mA IOH e b1 mA IOH e b1 mA IOH e b1 mA IOL e 20 mA IOL e 20 mA VIN e 2 7V VIN e 7 0V VOUT e VCC IID e 1 9 mA All Other Pins Grounded VIOD e 150 mV All Other Pins Grounded VIN e 0 5V VOUT e 0V VO e HIGH VO e LOW 54F 10% VCC 74F 10% VCC 74F 5% VCC 54F 10% VCC 74F 10% VCC 54F 74F 54F 74F 54F 74F 74F 74F 25 25 27 VOL IIH IBVI ICEX VID IOD IIL IOS ICCH ICCL V mA mA mA V Min Max Max Max Max 00 Max Max Max Max 4 75 3 75 b0 6 b 150 mA mA mA mA mA 25 25 3 AC Electrical Characteristics 74F Symbol Parameter TA e a 25 C VCC e a 5 0V CL e 50 pF Min tPLH tPHL Propagation Delay In x On 40 35 Max 10 5 85 54F TA VCC e Mil CL e 50 pF Min 40 35 Max 13 0 10 0 74F TA VCC e Com CL e 50 pF Min 40 35 Max 11 5 90 ns Units Ordering Information The device number is used to form part of a simplified purchasing code where the package type and temperature range are defined as follows 74F Temperature Range Family 74F e Commercial 54F e Military Device Type Package Code P e Plastic DIP D e Ceramic DIP F e Flatpak L e Leadless Chip Carrier (LCC) S e Small Outline SOIC JEDEC SJ e Small Outline SOIC EIAJ 14 S C X Special Variations QB e Military grade device with environmental and burn-in processing X e Devices shipped in 13 reels Temperature Range C e Commercial (0 C to a 70 C) M e Military (b55 C to a 125 C) 4 Physical Dimensions inches (millimeters) 20-Terminal Ceramic Leadless Chip Carrier (L) NS Package Number E20A 5 Physical Dimensions inches (millimeters) (Continued) 14-Lead Ceramic Dual-In-Line Package (D) NS Package Number J14A 14-Lead (0 150 Wide) Molded Small Outline Package JEDEC (S) NS Package Number M14A 6 Physical Dimensions inches (millimeters) (Continued) 14-Lead (0 300 Wide) Molded Small Outline Package EIAJ (SJ) NS Package Number M14D 14-Lead (0 300 Wide) Molded Dual-In-Line Package (P) NS Package Number N14A 7 54F 74F14 Hex Inverter Schmitt Trigger Physical Dimensions inches (millimeters) (Continued) 14-Lead Ceramic Flatpak (F) NS Package Number W14B LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL SEMICONDUCTOR CORPORATION As used herein 1 Life support devices or systems are devices or systems which (a) are intended for surgical implant into the body or (b) support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the labeling can be reasonably expected to result in a significant injury to the user National Semiconductor Corporation 2900 Semiconductor Drive P O Box 58090 Santa Clara CA 95052-8090 Tel 1(800) 272-9959 TWX (910) 339-9240 National Semiconductor GmbH Livry-Gargan-Str 10 D-82256 F4urstenfeldbruck Germany Tel (81-41) 35-0 Telex 527649 Fax (81-41) 35-1 National Semiconductor Japan Ltd Sumitomo Chemical Engineering Center Bldg 7F 1-7-1 Nakase Mihama-Ku Chiba-City Ciba Prefecture 261 Tel (043) 299-2300 Fax (043) 299-2500 2 A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system or to affect its safety or effectiveness National Semiconductor Hong Kong Ltd 13th Floor Straight Block Ocean Centre 5 Canton Rd Tsimshatsui Kowloon Hong Kong Tel (852) 2737-1600 Fax (852) 2736-9960 National Semiconductores Do Brazil Ltda Rue Deputado Lacorda Franco 120-3A Sao Paulo-SP Brazil 05418-000 Tel (55-11) 212-5066 Telex 391-1131931 NSBR BR Fax (55-11) 212-1181 National Semiconductor (Australia) Pty Ltd Building 16 Business Park Drive Monash Business Park Nottinghill Melbourne Victoria 3168 Australia Tel (3) 558-9999 Fax (3) 558-9998 National does not assume any responsibility for use of any circuitry described no circuit patent licenses are implied and National reserves the right at any time without notice to change said circuitry and specifications
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