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ASL1500SHNY

ASL1500SHNY

  • 厂商:

    NXP(恩智浦)

  • 封装:

    VFQFN32

  • 描述:

    IC LED BOOST DVR 1PH 32HVQFN

  • 数据手册
  • 价格&库存
ASL1500SHNY 数据手册
ASL1500SHN Single phase boost converter Rev. 4 — 26 October 2017 Product data sheet 1. Introduction The ASL1500SHN is a highly integrated and flexible single phase DC-to-DC boost converter IC. It has an SPI interface allowing control and diagnostic communication with an external microcontroller. It is designed primarily for use in automotive LED lighting applications and provides an optimized supply voltage for ASLx415SHN Multi-channel LED Buck Driver. 2. General description The ASL1500SHN has a fixed frequency peak current mode control with parabolic/non-linear slope compensation. It can operate with input voltages from 5.5 V to 40 V. It can be configured via SPI for output voltages of up to 80 V, to power the LED buck driver IC. The ASL1500SHN boost converter drives one external low-side N channel MOSFET from an internally regulated adjustable supply to drive either logic or standard level MOSFET. The integrated SPI interface also allows for programming the supply under/over voltage range, output voltage range and DC-to-DC switching frequency. It enables the optimization of external components and flexibility for EMC design. This interface can also be used to provide diagnostic information such as the driver temperature. Additional features include input under-voltage lockout and thermal shutdown when the junction temperature of the ASL1500SHN exceeds +175 C. The device is housed in a very small HVQFN32 pin package with an exposed thermal pad. It is designed to meet the stringent requirements of automotive applications. It is fully AEC Q100 grade 1 qualified. It operates over the 40 C to +125 C ambient automotive temperature range. ASL1500SHN NXP Semiconductors Single phase boost converter 3. Features and benefits                     The ASL1500SHN is an automotive grade product that is AEC-Q100 grade 1 qualified. Operating ambient temperature range of 40 C to +125 C Wide operating input voltage range from +5.5 V to +40 V Output voltage programmable via SPI interface Flexible output voltage with 3 % accuracy programmable via SPI Fixed Frequency Operation via built-in oscillator Slope compensation to track the frequency and output voltage Programmable control loop compensation Fast high efficiency FET switching Programmable internal gate driver voltage regulator Gate switching is halted when overvoltage on output is detected Support both Logic Level and Standard Level FETs Low Electro Magnetic Emission (EME) and high Electro Magnetic Immunity (EMI) Output voltage monitoring Supply voltage measurement Control signal to enable the device Read-back programmed voltage and frequency range via SPI Junction temperature monitoring via SPI Small package outline HVQFN32 Low quiescent current Vth(det)pon and EN = high VBAT < Vth(det)pon or EN = low Off Cfg_dn = 1 Configuration VBAT < Vth(det)pon or EN = low VBAT < Vth(det)pon or EN = low Fail silent Operation Cfg_dn = 0 VBAT > V_VIN_OV or VBAT < V_VIN_UV or Tj > Tsd(otp) or VGG_err = 1 or VGG_ok 1->0 VBAT > V_VIN_OV or VBAT < V_VIN_UV or Tj > Tsd(otp) or VGG_err = 1 or VGG_ok 1->0 aaa-015303 Fig 3. State diagram Table 3. Operating modes Mode Control registers Configuration Diagnostic VGG registers registers Vout1 Remarks Off n.a. n.a. Configuration read/write read/write n.a. off off device is off, no communication possible. read off off VGG is off if no outputs were previously enabled read according off to register VGG is on as soon as one of the outputs has been enabled Operation read/write read read locked according to register configuration registers are locked Fail silent read/write read read[1] off off communication possible, but all outputs off. Restart via EN possible. [1] Setting the bit cfg_dn to 0 also grants write access to the configuration registers. 8.1.1 Off mode The ASL1500SHN switches to off mode, if the input voltage drops below the power-on detection threshold (Vth(det)pon) or the EN pin is low. The SPI interface and output are turned off when the ASL1500SHN is in the Off mode. 8.1.2 Configuration mode The ASL1500SHN switches from off mode to configuration mode, as soon the input voltage is above the power-on detection threshold (Vth(det)pon) and pin EN is high. ASL1500SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 6 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter The configuration registers can be set when the ASL1500SHN is in the Configuration mode. 8.1.3 Operation mode The ASL1500SHN switches from configuration mode to operation mode, as soon as the configuration done bit is set. Once the bit is set, the configuration registers are locked and cannot be changed. In operation mode, the output is available as configured via the SPI interface. Setting the bit Vout1en, starts up the gate driver. Once the gate driver is in regulation (signaled by bit VGG_ok), the output voltage Vo1(prog) is turned on accordingly. When the converters are on, the battery monitoring functionality is available. 8.1.4 Fail silent mode The ASL1500SHN switches from Operation mode to Fail silent mode, when the junction temperature exceeds the over temperature shutdown threshold or a VGG error is detected. It will also switch modes when the input voltage is below the under voltage detection threshold or above the over voltage detection threshold. In Fail silent mode, the output is turned off and only the SPI interface remains operational. 8.2 Boost converter configuration The ASL1500SHN is an automatic boost converter IC delivering constant DC-to-DC voltage to a load. It has a fixed frequency current-mode control for an enhanced stable operation. The ASL1500SHN offers one phase. The phase consists of a coil, a resistor, a MOSFET and a diode as shown in Figure 4. L D Vout M G1 FB1 SNH1 R SNL1 aaa-017531 Fig 4. Phase of the boost converter with IC and application connections To allow flexible use of the ASL1500SHN, the configuration is based on virtual phases. These phases are then mapped to a real, physical phase according to the physical connections and conditions of the circuitry around the ASL1500SHN as shown in Figure 5. ASL1500SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 7 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter V1_1 V1_2 CONTROL LOOP 1 V1_3 V1_4 FLEXIBLE MAPPING VIA REGISTER SETTINGS V2_1 G1 V2_2 CONTROL LOOP 2 V2_3 V2_4 aaa-017532 Fig 5. Mapping of virtual phases (V1_1 to V2_4) to physical phase (G1) 8.2.1 Configuration of the virtual phases The ASL1500SHN can generate up to four internal phases at up to two virtual outputs. With the internal phase control enable registers, it can be selected, how many virtual phases are generated for the individual virtual outputs. Table 4. Bit Internal phase control enable for output 1, address 0x0Bh Symbol 7:4 3 EN_P4_1 Description Value Function reserved 0000 reserved; should remain cleared for future use phase 4 enabled 0 1 2 EN_P3_1 phase 3 enabled 0 1 1 EN_P2_1 phase 2 enabled 0 1 0 EN_P1_1 phase 1 enabled 0 1 ASL1500SHN Product data sheet phase 4 is off phase 4 is enabled phase 3 is off phase 3 is enabled phase 2 is off phase 2 is enabled phase 1 is off phase 1 is enabled All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 8 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter Table 5. Internal phase control enable for output 2, address 0x0Ch Bit Symbol Description Value Function 7:4 - reserved 0000 reserved; should remain cleared for future use 3 EN_P4_2 phase 4 enabled 0 phase 4 is off 1 2 EN_P3_2 phase 4 is enabled phase 3 enabled 0 phase 3 is off 1 1 EN_P2_2 phase 3 is enabled phase 2 enabled 0 phase 2 is off 1 0 EN_P1_2 phase 2 is enabled phase 1 enabled 0 phase 1 is off 1 phase 1 is enabled 8.2.2 Association of physical phases to the output voltages The phase that the ASL1500SHN offers, must be associated to the output. Table 6. Bit Gate driver output, address 0x02h Symbol 7:1 0 O_G1 Description Value Function reserved 0000000 reserved; should remain clear for future use association phase 1 0 phase 1 is connected to Vout1 1 not allowed 8.2.3 Association of connected phases to the internal phase generation The physical phase that the ASL1500SHN offers, must be associated to one of the virtual phases of the output. It is established with the gate driver phase and phase select configuration registers. Table 7. Bit Gate driver phase, address 0x0Fh Symbol 7:1 0 O_GP1 Description Value Function reserved 000000 reserved; should remain clear for future use association phase 1 0 phase 1 is connected to Vout1 1 Table 8. Bit 7:2 1:0 ASL1500SHN Product data sheet not allowed Phase select configuration, address 0x10h Symbol Description Value Function reserved 0000 reserved; should remain clear for future use Phsel1[1:0] association phase 1 0x0h routing from phase 1 0x1h routing from phase 2 0x2h routing from phase 3 0x3h routing from phase 4 All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 9 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter 8.2.4 Enabling of connected phases The gate driver enable register is used to configure which of the phases is active. Table 9. Bit Gate driver enable, address 0x01h Symbol 7:1 0 EN_G1 Description Value Function reserved 0000000 reserved; should remain clear for future use phase 1 enabled 0 1 phase 1 is off phase 1 is enabled 8.2.5 Configuration of the boost converter frequencies The operation frequency of the boost converter can be set with via several SPI registers. For the regulation loop, an integer number downscales the internal oscillator frequency. The slower clock controls the off-time of a phase and the delay from one phase of the regulation loop to the next internal phase. The number of phases determinates finally when the phase is turned on again and defines so the operation frequency of the boost converter. switching frequency phase delay and phase off parameters phase active Ph0 clk COUNTER (DIV N) PHASE GATING COUNTER Ph1 Ph2 Ph3 combined reset rst_n phase_gen_rst config change slope comp clk PHASE CONTROL GENERATOR aaa-017533 Fig 6. Table 10. ASL1500SHN Product data sheet Phase control generator Clock divider for Vout1, address 0x09h Bit Symbol Description Value Function 7:0 Clkdiv1 [7:0] clock divider for output voltage 1 0x00h clock is not divided ... clock is divided by clkdiv1[7:0]+1 0xFFh clock is divided by 256 All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 10 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter Table 11. Phase-off time and phase delay of output 1, address 0x0Dh Bit Symbol Description Value 7:3 Phdel1 [4:0] delay to next 0x0h phase of output1 ... Function phase delay is 1 clock period of the divided clock phase delay is Phdel1[4:0]+1 clock period of the divided clock 0x1Fh 2:0 Phoff1 [2:0] phase delay is 32 clock periods of the divided clock phase-off time of 0x0h output1 ... phase-off time is 1 clock period of the divided clock phase-off time is Phoff1[2:0] clock period of the divided clock 0x7h phase-off time is 7 clock periods of the divided clock Note: To obtain the best performance of the internal slope compensation, keep the settings of the delay between the phases as close to 32 as possible. 8.2.6 Control loop parameter setting The ASL1500SHN is able to operate with a wide range of external components and offers wide range of operating frequencies. To achieve maximum performance for each set of operation conditions, set the control loop parameters in accordance with the external components and operating frequency. Table 12. Bit Loop filter proportional configuration, address 0x11h Description Value Function 7:4 Symbol reserved 0000 reserved; should remain cleared for future use 3:0 Prop1[3:0] proportional 0x0h factor output 1 ... proportional factor output 1 is 0.05 proportional factor output 1 is Prop1[3:0]*0.05+0.05 0xFh Table 13. Bit Loop filter integral configuration, address 0x12h Symbol 7:4 3:0 Integ1[3:0] Table 14. Bit ASL1500SHN Product data sheet Description Value Function reserved 0000 reserved; should remain cleared for future use integral factor output 1 0x0h integral factor output 1 is 0.005 ... integral factor output 1 is Integ1[3:0]*0.005+0.005 0xFh integral factor output 1 is 0.08 Slope compensation configuration, address 0x13h Symbol 7:4 3:0 proportional factor output 1 is 0.8 Slpcmp1[3:0] Description Value Function reserved 0000 reserved; should remain cleared for future use slope compensation factor output 1 0x0h slope compensation factor output 1 = 112 k 0x1h slope compensation factor output 1 = 84 k 0x2h slope compensation factor output 1 = 70 k 0x4h slope compensation factor output 1 = 56 k 0x8h slope compensation factor output 1 = 28 k All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 11 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter Table 15. Bit Current sense slope resistor configuration, address 0x14h Symbol 7:2 1:0 Slpr1[1:0] Description Value Function reserved 0000 reserved; should remain cleared for future use 2'b00 - 250  slope resistor 0x0h configuration 0x1h for gate driver 1 0x2h 2'b10 - 1000  0x3h 2'b11 - 1500  2'b01 - 500  8.3 Output voltage programmability The ASL1500SHN provides the possibility to program the output voltage and output overvoltage protection of the output via the SPI interface. 8.3.1 Output voltage target programming The target output voltage can be programmed via the Output voltage registers. As the ASL1500SHN is a boost converter, the output voltage cannot be lower than the supply voltage minus the drop of the converter diode (Dx in Figure 4). Table 16. Output voltage 1 register, address 0x03h Bit Symbol Description Value Function 7:0 V_Vout_1[7:0] target voltage output 1 0x00h output 1 is turned off ... target voltage output 1 = 0.3606 * V_Vout_1[7:0] 0xFFh maximum target output voltage = 90 V 8.3.2 Output overvoltage protection programming Due to fast changes in the supply or the output, it is possible that the output voltage is disturbed. To avoid high voltages that may result into damage of attached components, the ASL1500SHN offers a programmable overvoltage protection threshold. Once the output voltage is above this threshold, the gate pin of the output stops toggling. It results in a halt of the energy delivery to the output. Once the output voltage recovers and is below the threshold again, the gate pin starts toggling again. The regulation loop regulates the output back to the target value. For stable operation of the device, the limit voltage output register should be programmed around 5 V higher than the output voltage registers. Table 17. ASL1500SHN Product data sheet Limit voltage output 1 register, address 0x05h Bit Symbol Description Value Function 7:0 Vmax_Vout_1[7:0] limit voltage output 1 0x00h output 1 is turned off ... target voltage output 1 = 0.3606 * Vmax_Vout_1[7:0] 0xFFh maximum output over voltage protection output 1 = 90 V All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 12 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter 8.4 Coil peak current limitation The ASL1500SHN offers a function to limit peak current inside the coil and therefore to limit the input current for the system. Furthermore this functionality can be used to avoid magnetic saturation of the coils. It also allows some soft start feature to be realized with this function. With the Max phase current Vout1 register, the maximum peak current for the phase can be configured. Once the voltage between pins SNSLx and SNSHx reaches this level, the gate will be turned off until the next switching cycle. To avoid sub harmonic oscillations when the coil peak current limitation is becoming active, the slope compensation remains active. It reduces the coil peak current towards the end of the switching cycle to ensure stable operation of the system. In order to avoid that this function interferes with the normal regulation, the limit should be placed well above the max expected current. Table 18. Maximum phase current Vout1 register, address 0x07h Bit Symbol Description Value 7:0 I_max[7:0] coil current limitation Function 0x00h no current allowed ... maximum peak current = (I_max_per_phase_Vout1 [7:0] * 1.8 V / 256 - 0.24 V) / Rsense 0x80 max allowed setting = (128/255*1,8V-0,24) V / Rsense ... not allowed 0xFFh not allowed 8.5 Enabling the output voltage The ASL1500SHN provides one output voltage. In operation mode, the output voltage is turned on with the bit Vout1en. As soon as the output is turned on, the VGG voltage regulator is turned on. After the gate driver start-up time, the gate driver starts switching, provided the bit VGG_ok is set. Table 19. Function control register, address 0x00h Bit Symbol Description Value Function 7:4 reserved 3 0 ASL1500SHN Product data sheet reserved; should remain cleared for future use 0 chip select low count feature is disabled 1 chip select low count feature is enabled reserved 0 reserved; should remain cleared for future use enable output 1 0 output 1 is turned off 1 output 1 is turned on when the device is in operation mode Cnt_CSB count chip select time 2 1 0000 Vout1en Cfg_dn configuration 0 done bit 1 device is in configuration mode - no configuration lock device is in operation mode - configuration lock is active All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 13 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter 8.6 Frequency trimming To ensure the ASL1500SHN operates inside the specified oscillator frequency range, it is mandatory to adjust the internal oscillator frequency of the device. To measure the actual internal frequency, the device is measuring the time that the CSB pin is low during an SPI transfer. This time information can be used to adjust the oscillator frequency of the device. The recommended procedure for the time adjustment is shown in Figure 7. Frequency trimming start Enable CSB low count feature (CNT_CSB = 1) Disable CSB low count feature (CNT_CSB = 0) With defined, CSB LOW TIME Adjust frequency trimming register Read CSB count registers no COUNT as expected? remark: count = CSB LOW TIME 1 yes fosc_trimmed End frequency trimming Fig 7. (± 1 %) aaa-017534 Frequency trimming flow At the start of the sequence, the CSB low count feature is activated. It is done by setting the Cnt_CSB bit high in the frequency trimming control register (bit 3; register 0x00h). The device now measures the time with its internal time domain each time the CSB pin is low. It makes this information available in the CSB count registers. To allow an exact stable reading, set the Cnt_CSB bit low again with an accurately known CSB low time. Setting the bit low freezes the count registers. These registers store the last value, which in this case is the command that sets the Cnt_CSB bit low. The CSB count registers contain the count of the CSB low time of the last SPI command the CSB low count feature was enabled. CSB count register 1 contains the bits 7 to 0 of the counter, while the CSB count register 2 contains the bits 15:8. Table 20. ASL1500SHN Product data sheet CSB count register 1, address 0x41h Bit Symbol Description Value Function 7:0 CSB_cnt[7:0] CSB count low ... count value (bits 7:0) All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 14 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter Table 21. CSB count register 2, address 0x42h Bit Symbol Description Value 7:0 CSB_cnt[15:8] CSB count high ... Function count value (bits 15:8) The count, the CSB count register returns, should correspond to the real time of the CSB low time. 1 count should correspond with 1/ fosc_trimmed (see Table 39). When the count that the CSB count registers return, deviates from the applied CSB low time, the device internal timing must be adjusted by modifying the frequency trimming register. Table 22. Bit 7:6 5:0 Frequency trimming register, address 0x1Ch Symbol Description Value reserved Function not allowed Freq_trim[5:0] frequency trim bits 010001 default frequency 33.33 % 010011 default frequency 30.56 % 010101 default frequency 27.78 % 010111 default frequency 25.00 % 011001 default frequency 22.22 % 011011 default frequency 19.44 % 011101 default frequency 16.67 % 011111 default frequency 13.89 % 000001 default frequency 11.11 % 000011 default frequency 8.33 % 000101 default frequency 5.56 % 000111 default frequency 2.78 % 001001 default frequency 001011 default frequency + 2.78 % 001101 default frequency + 5.56 % 001111 default frequency + 8.33 % 110001 default frequency + 11.11 % 110011 default frequency + 13.89 % 110101 default frequency + 16.67 % 110111 default frequency + 19.44 % 111001 default frequency + 22.22 % 111011 default frequency + 25.00 % 111101 default frequency + 27.78 % 111111 default frequency + 30.56 % 100001 default frequency + 33.33 % 100011 default frequency + 36.11 % others not allowed To ensure that the adjustment had the desired effect, restart the procedure and check the count with the new settings in the frequency trimming register. When the device internal time matches the applied CSB low time, no further adjustment is needed and the trimming procedure is finished. ASL1500SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 15 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter 8.7 Gate voltage supply The ASL1500SHN has an integrated linear regulator to generate the supply voltage of the gate driver, which is internally connected to the pin VGG. The voltage generated by the linear regulator can be set via the VGG control register. Table 23. VGG control register, address 0x15h Bit Symbol Description Value Function 7:0 VGG[7:0] supply voltage for gate driver 0x00h not allowed ... not allowed 0x5Dh maximum output voltage = 10.04 V ... (255- VGG[7:0]) * 62 mV 0xB7h minimum output voltage = 4.46 V ... not allowed 0xFFh not allowed The actual value of VGG can deviate from the target setting due to the tolerances of the VGG regulation loop (see Vo(reg)acc in Table 38). When a setting between 0x00h and 0x5Dh is used, the resulting gate driver target voltage exceeds the limiting values of the IC. The limiting values of the VGG pin can also be violated with target settings of 0xA6h to 0x5Dh due to these tolerances. A violation of the limiting values with the actual VGG voltage must be avoided. To ensure that only allowed settings are used for the gate driver target voltage, an immediate read back of the programmed value is required after setting the registers. If a setting between 0xFFh and 0xB7h is used, the device may not start up VGG. If the device operates, parameters of VGG are not guaranteed. 8.7.1 Gate voltage supply diagnostics The diagnostic options for the gate voltage supply are: • VGG available. Details can be found in Section 8.10 • VGG protection active. Details can be found in Section 8.10 8.8 Supply voltage monitoring The ASL1500SHN is continuously measuring the voltage at pin VBAT, when the output is enabled and bit VGG_ok is set. It allows the system to monitor the supply voltage without additional external components. It also offers the option to put an automatic under- and/or overvoltage protection in place. Note: The VIN_UV and VIN_OV bits in the status register use the battery voltage measurement. Consequently the VIN_UV and VIN_OV bits are only reliable when the output is enabled. 8.8.1 Battery voltage measurement The ASL1500SHN is continuously measuring the voltage at pin VBAT. The measurement result is available in the battery voltage register when the output is enabled. ASL1500SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 16 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter Table 24. Battery voltage register, address 0x45h Bit Symbol Description Value Function 7:0 V_VBAT[7:0] battery voltage 0x00h battery voltage = 0 V ... battery voltage = 0.3606 *V_VBAT[7:0] 0xFFh maximum measurable battery voltage = 90 V 8.8.2 Undervoltage detection The ASL1500SHN offers a variable under voltage detection threshold. When the supply voltage drops below this threshold, the undervoltage detect bit is set and Fail silent mode is entered. The gate pin stops toggling and no more power is delivered to the output. Table 25. Undervoltage threshold register, address 0x1Bh Bit Symbol Description Value Function 7:0 V_VIN_UV[7:0] undervoltage detection threshold 0x00h undervoltage detection threshold = 0 V ... undervoltage detection threshold = 0.3606 *V_VIN_UV[7:0 0xFFh maximum undervoltage detection threshold = 90 V 8.8.3 Overvoltage detection The ASL1500SHN offers a variable overvoltage detection threshold. When the supply voltage rises above this threshold, the overvoltage detect bit is set, and Fail silent mode is entered. The gate pin stops toggling and no more power is delivered to the output. Table 26. Overvoltage threshold register, address 0x1Ah Bit Symbol Description 7:0 V_VIN_OV[7:0] overvoltage detection threshold Value Function 0x00h overvoltage detection threshold = 0 V ... overvoltage detection threshold = 0.3606 *V_VIN_OV[7:0 0xFFh maximum overvoltage detection threshold = 90 V 8.9 Junction temperature information The ASL1500SHN provides a measurement of the IC junction temperature. The measurement information is available in the junction temperature register. Table 27. ASL1500SHN Product data sheet Junction temperature register, address 0x46h Bit Symbol Description Value Function 7:0 T_junction[7:0] junction temperature ... device junction temperature below 40 C 0x18h device junction temperature = 40 C ... device junction temperature = T_junction[7:0] * (215/106) C  88 C 0x82h device junction temperature = 175 C All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 17 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter 8.10 Diagnostic information The diagnostic register contains useful information for diagnostic purposes. Details for each bit can be found in the following subchapters. Table 28. Undervoltage threshold register, address 0x0Fh Bit Symbol 7 Description Vout1_ok Vout1 regulated 6 reserved Value Function 0 Vout1 is deviating from the target value 1 Vout1 is regulated to the target value 0 Reserved; should remain clear for future use 5 VGG_ok VGG regulation OK 0 4 Tj_err device temperature 0 is too high 1 device temperature above Tsd(otp) no under voltage at VIN detected 1 VGG is not available VGG is available device temperature below Tsd(otp) 3 VIN_UV VIN under voltage 0 1 under voltage at VIN detected 2 VIN_OV VIN over voltage 0 no over voltage at VIN detected 1 over voltage at VIN detected 0 last SPI command was executed correctly 1 last SPI command was erroneous and has been discarded 0 VGG overload protection not active 1 VGG overload protection has turned on and VGG is deactivated 1 0 SPI_err VGG_err SPI error VGG error 8.10.1 Bit VIN_OV The bit VIN_OV depends on the battery monitoring functionality as described in Section 8.8. It indicates that the device has detected an overvoltage condition and entered Fail silent mode. A write access to the diagnostic register or when the Off mode has been entered, clears the bit. Independent of the clearing of the bit, the device stays in Fail silent mode. 8.10.2 Bit VIN_UV The bit VIN_UV depends on the battery monitoring functionality as described in Section 8.8. It indicates that the device has detected an undervoltage condition and entered Fail silent mode. A write access to the diagnostic register or when the Off mode has been entered, clears the bit. Independent of the clearing of the bit, the device stays in Fail silent mode. 8.10.3 Bit SPI_err The device is evaluating all SPI accesses to the device for the correctness of the commands. When the command is not allowed, the SPI_err bit is set. A write access to the diagnostic register or when the Off mode is entered, clears the bit. ASL1500SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 18 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter 8.10.4 Bit Tj_err The bit Tj_err indicates that the junction temperature has exceeded the maximum allowable temperature, and the device has entered Fail silent mode. A write access to the diagnostic register, or once Off mode has been entered, clears the bit. The device stays in Fail silent mode irrespective of the clearing of the bit. After leaving the OFF mode (at IC start-up), it is possible that bit Tj_err is set. To avoid wrong diagnostics, clear the diagnostic register before it is evaluated. 8.10.5 Bit VGG_err Bit VGG_err is set when the gate driver does not reach the VGG_ok _window (when VVGG is within range) within the regulator voltage start-up error time. Once bit VGG_err is set, it indicates that an error on the gate driver has been detected and the device has entered Fail silent mode. A write access to the diagnostic register, or once Off mode has been entered, clears the bit. The device stays in Fail silent mode irrespective of the clearing of the bit. 8.10.6 Bit VGG_ok The bit VGG_ok indicates that the gate driver is regulated to the target voltage and allows the gate driver to drive the gate driver pin. If the gate driver is outside the VGG_ok window after tstartup, and VVGG is within range, the device clears VGG_ok bit and enters Fail silent mode. 8.10.7 Bit Vout1_ok The bit Vout1_ok indicates whether the output voltage is regulated to the target value or deviating from the target value. The bit is set, as soon as the output is within the Vout_ok window (when VO is within the range) for more than Vout tfltr. The bit is cleared when the output is outside the Vout_ok window for more than Vout tfltr. 8.11 SPI The ASL1500SHN uses an SPI interface to communicate with an external microcontroller. The SPI interface can be used for setting the LEDs current, reading and writing the control register. 8.11.1 Introduction The Serial Peripheral Interface (SPI) provides the communication link with the microcontroller, supporting multi-slave operations. The SPI is configured for full duplex data transfer, so status information is returned when new control data is shifted in. The interface also offers a read-only access option, allowing the application to read back the registers without changing the register content. The SPI uses four interface signals for synchronization and data transfer: • • • • CSB - SPI chip select; active LOW SCLK - SPI clock - default level is LOW due to low-power concept SDI - SPI data input SDO - SPI data output - floating when pin CSB is HIGH Bit sampling is performed on the falling clock edge and data is shifted on the rising clock edge as illustrated in Figure 8. ASL1500SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 19 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter SCLK CSB SDI b15 MSB b14 b13 b12 b11 b10 b9 b3 b2 b1 b0 SDO b15 MSB b14 b13 b12 b11 b10 b9 b3 b2 b1 b0 Sampling Edge Driving Edge aaa-016623 Format: * Steady state SCLK = 0 * Data driving edge = positive edge * Data sampling edge = negative edge Fig 8. SPI timing protocol The data bits of the ASL1500SHN are arranged in registers of one-byte length. Each register is assigned to a 7-bit address. For writing into a register, 2 bytes must be sent to the LED driver. The first byte is an identifier byte that consists of the 7-bit address and one read-only bit. For writing, the read-only bit must be set to 0. The second byte is the data that is written into the register. So an SPI access consists of at least 16 bit. Figure 9 together with Table 29 and Table 30 demonstrate the SPI frame format. R/W Address b15 b14 b13 b12 b11 b10 b9 Table 29. b8 b7 b6 b5 b15 = MSB = first transmitted bit R/W Fig 9. Data b4 b3 b2 b1 b0 aaa-016624 SPI frame format SPI frame format for a transition to the device Bit Symbol Description Value Function 15 b15 R/W bits 0 write access 1 read access 14:8 b14:8 address bits ... selected address 7:0 data bits ... transmitted data b7:0 ASL1500SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 20 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter Table 30. Bit SPI frame format for a transition from the device Symbol Description Value Function[1] 8:15 b8:15 diagnostic register ... content of diagnostic register 7:0 data bits ... when previous command was a valid read command, content of the register that is supposed to be read ... when previous command was a valid write command, new content of the register that was supposed to be written [1] b7:0 The first SPI command after leaving the Off mode, will return 0x00h. The Master initiates the command sequence. The sequence begins with CSB pin pulled low and lasts until it is asserted high. The ASL1500SHN also tolerates SPI accesses with a multiple of 16 bits. It allows a daisy chain configuration of the SPI. MOSI SDI CSB CSB SCLK SCLK ASL1500SHN SDO SOMI µC SDI CSB SCLK ASLxxxxSHN SDO SDI CSB SCLK ASLxxxxSHN SDO aaa-016625 Fig 10. Daisy chain configuration ASL1500SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 21 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter MOSI SDI CSB1 CSB SCLK SCLK ASL1500SHN SDO SOMI CSB2 µC CSB3 SDI CSB SCLK ASLxxxxSHN SDO SDI CSB SCLK ASLxxxxSHN SDO aaa-016626 Fig 11. Physical parallel slave connection During the SPI data transfer, the identifier byte and the actual content of the addressed registers is returned via the SDO pin. The same happens for pure read accesses. Here the read-only bit must be set on logic 1. The content of the data bytes that are transmitted to the ASL1500SHN is ignored. The ASL1500SHN monitors the number of data bits that are transmitted. If the number is not 16, or a multiple of 16, then a write access is ignored and the SPI error indication bit is set. 8.11.2 Typical use case illustration (Write/Read) Consider a daisy chain scheme with one master connected to 4 slaves in daisy chain fashion. The following commands are performed during one sequence (first sequence): • • • • ASL1500SHN Product data sheet Write data 0xFF to register 0x1A Slave 1 Read from register 0x02 of Slave 2 Write data 0xAF to register 0x2F of Slave 3 Read from register 0x44 of Slave 4 All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 22 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter 1st Sequence 2nd Sequence CSB SCLK 1 x 16 SCLK’s 2 x 16 SCLK’s 3 x 16 SCLK’s 4 x 16 SCLK’s 1 x 16 SCLK’s 2 x 16 SCLK’s 3 x 16 SCLK’s Next command for Slave4 Next command for Slave3 Next command for Slave2 Next command for Slave1 4 x 16 SCLK’s Master SDO/ Slave1 SDI b15 = 1 b14-b8 = 0x44 b7-b0 = xx b15 = 0 b14-b8 = 0x2F b7-b0 = 0xAF b15 = 1 b14-b8 = 0x2 b7-b0 = xx Slave 1 b15 = 0 b14-b8 = 0x1A b7-b0 = 0xFF Slave1 SDO/ Slave2 SDI XXX b15 = 1 b14-b8 = 0x44 b7-b0 = xx b15 = 0 b14-b8 = 0x2F b7-b0 = 0xAF Slave 2 b15 = 1 b14-b8 = 0x2 b7-b0 = xx b15-b8 = Default read reg of slave1 b7-b0 = xx Next command for Slave4 Next command for Slave3 Next command for Slave2 Slave2 SDO/ Slave3 SDI XXX XXX b15 = 1 b14-b8 = 0x44 b7-b0 = xx Slave 3 b15 = 0 b14-b8 = 0x2F b7-b0 = 0xAF b15-b8 = Default read reg of slave2 b7-b0 = Data from 0x2 of Slave2 b15-b8 = Default read reg of slave1 b7-b0 = xx Next command for Slave4 Next command for Slave3 Slave3 SDO/ Slave4 SDI XXX XXX XXX Slave 4 b15 = 1 b14-b8 = 0x44 b7-b0 = xx b15-b8 = Default read reg of slave3 b7-b0 = xx b15-b8 = Default read reg of slave2 b7-b0 = Data from 0x2 of Slave2 b15-b8 = Default read reg of slave1 b7-b0 = xx Next command for Slave4 Slave4 SDO/ Master SDI XXX XXX XXX XXX b15-b8 = Default read reg of slave4 b7-b0 = Data from 0x44 of Slave4 b15-b8 = Default read reg of slave3 b7-b0 = xx b15-b8 = Default read reg of slave2 b7-b0 = Data from 0x2 of Slave4 b15-b8 = Default read reg of slave1 b7-b0 = xx Current sequence Command decoded by Slave Response from previous sequence aaa-016627 Fig 12. SPI frame format 8.11.3 Diagnostics for the SPI interface The device is evaluating all SPI access to the device for the correctness of the commands. When the command is not allowed, the SPI_err bit is set. The conditions that are considered as erratic accesses are: • SPI write is attempted to a read-only location or reserved location • SPI read is attempted from a reserved location • SPI command does not consist of a multiple of 16 clock counts If an SPI access is considered to be erratic, no modifications to a SPI register are made. The access after the erratic SPI command returns the diagnostic register and zero in the data field. For details about the SPI_err bit, see Section 8.10.3. 8.12 Register map The addressable register space amounts to 128 registers from 0x00 to 0x7F. They are separated in two groups as shown in Table 31. The register mapping is shown in Table 32, Table 33, Table 34 and Table 35. The functional description of each bit can be found in the dedicated chapter. ASL1500SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 23 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter Table 31. Register space grouping Address range Description Content 0x00 ... 0x1F control registers control registers 0x20 ... 0x7F diagnostic registers diagnostic information 8.12.1 Control registers Table 32 provides an overview of the control registers and their reset value. Table 32. Control register group overview Address Name Reset value 7 6 5 4 3 2 1 0 0x00h function control 0x00h - - - - Cnt_CSB - Vout1en[1] 0x01h gate driver enable 0x00h - - - - - - - 0x03h target voltage output 1 0x00h V_Vout_1[7:0] 0x05h limit voltage output 1 0x00h Vmax_Vout_1[7:0] 0x07h maximum phase current Vout1 0x46h I_max[7:0] 0x1Ch frequency trimming register 0x09h - - Cfg_dn EN_G1[2] Freq_trim[5:0] [1] Bit is locked with bit Cfg_dn is high. When bit Cfg_dn is low, bits can be changed. Read is always possible. [2] If the gate driver is enabled when bits Cfg_dn and VGG_ok are set high, it can be turned on and off during operation of the system. The gate driver, disabled when bits Cfg_dn and VGG_ok are set high, remains off, even when the gate enable bit is set high later. 8.12.2 Configuration registers Table 33 provides an overview of the configuration registers. The configuration registers inside the control block can only be written in configuration mode. In the other modes, this register can only be read. Table 33. Configuration register group overview Address Name Reset value 0x02h gate driver output 0x00h 0x09h clock divider for output 1 0x0Fh 0x0Bh internal phases output 1 0x0Fh - - - - EN_P4_1 EN_P3_1 EN_P2_1 EN_P1_1 0x0Ch internal phases output 2 0x0Fh - - - - EN_P4_2 EN_P3_2 EN_P2_2 EN_P1_2 0x0Dh phase off and delay output 1 0x39h 0x0Fh gate driver phase 0x00h 0x10h phase selection configuration 0xE4h 0x11h loop filter proportional configuration 0x00h - Prop1[3:0] 0x12h loop filter integral configuration 0x00h - Integ1[3:0] 0x13h slope compensation configuration 0x88h - Slpcmp1[3:0] 0x14h current sense slope resistor configuration 0x00h ASL1500SHN Product data sheet 7 6 - 5 - 4 - 3 2 - - 1 0 - - O_G1 Clkdiv1[7:0] Phdel1 - - - - - Phoff1 - - - All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 - - - - - O_GP1 Phsel1 Slpr1[1:0] © NXP Semiconductors N.V. 2017. All rights reserved. 24 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter Table 33. Configuration register group overview …continued Address Name Reset value 7 6 5 4 3 2 1 0x15h VGG control 0xFFh VGG[7:0] 0x1Ah over voltage detection threshold 0xFFh V_VIN_OV[7:0] 0x1Bh under voltage detection threshold 0x00h V_VIN_UV[7:0] 0 8.12.3 Internal registers The ASL1500SHN uses the SPI registers to control some internal functions. In order to avoid any unintended behavior of the device, do not modify these registers but leave them all at their default value. Table 34. Internal register overview Address Name Reset value 7 6 5 4 3 2 1 0 0x04h Internal 1 0x00h - - - - - - - - 0x06h Internal 2 0x00h - - - - - - - - 0x08h Internal 3 0x46h - - - - - - - - 0x0Ah Internal 4 0x0Fh - - - - - - - - 0x0Eh Internal 5 0x39h - - - - - - - - 0x19h Internal 6 0x82h - - - - - - - - 0x25h Internal 7 0x27h - - - - - - - - 0x26h Internal 8 0x3Bh - - - - - - - - 0x2Fh Internal 9 0xE8h - - - - - - - - 0x30h Internal 10 0x09h - - - - - - - - 8.12.4 Diagnostic registers The ASL1500SHN provides diagnostic data via some SPI registers. These registers are read only, but error bits can be cleared via a write access to the register. Table 35. Diagnostic register group overview Address Name 7 6 5 4 3 0x41h CSB count low CSB_cnt[7:0] 0x42h CSB count high CSB_cnt[15:8] 0x45h battery voltage 0x46h junction temperature 0x5Fh diagnostic Register ASL1500SHN Product data sheet 2 1 0 V_VBAT[7:0] T_junction[7:0] Vout1_ok - VGG_ok Tj_err VIN_UV All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 VIN_OV SPI_err VGG_err © NXP Semiconductors N.V. 2017. All rights reserved. 25 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter 9. Limiting values Table 36. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VBAT battery supply voltage EN = low 0.3 +60 V VVCC voltage on pin VCC VGND ground supply voltage VFBx 0.3 +40 V 0.3 +5.5 V voltage between ground pins 0.6 +0.6 V voltage on feedback pins FB1 0.3 +90 V VO output voltage programmed target voltage according to register 0x03h 10 +80 V VI(dig) digital input voltage voltage on digital pins SDO, SDI, CSB, SCLK and EN 0.3 +5.5 V VVGG voltage on pin VGG 0.3 +10 V Vsense sense voltage voltage on sense pins SNH1 and SNL1 0.3 +0.3 V VG voltage on gate pin G1 0.3 +10 V Vic voltage on internally connected pins i.c. 0.3 +1.8 V Tj junction temperature 40 +175 °C Tstg storage temperature 55 +175 °C at any pin 2 +2 kV at pin VBAT with 100 nF at pin 6 +6 kV 500 +500 V EN = high VESD HBM[1] electrostatic discharge voltage CDM[2] at any pin [1] Human Body Model (HBM): according to AEC-Q100-002 (100 pF, 1.5 k) [2] Charged Device Model (CDM): according to AEC-Q100-011 (field Induced charge; 4 pF). 10. Thermal characteristics Table 37. Symbol Parameter thermal resistance Rth [1] Thermal characteristics Conditions HVQFN32 package JEDEC[1] Typ Unit 37 K/W According to JEDEC JESD51-2, JESD51-5 and JESD51-7 at natural convection on 2s2p board. Board with two inner copper layers (thickness: 35 m) and thermal via array under the exposed pad connected to the first inner copper layer. ASL1500SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 26 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter 11. Static characteristics Table 38. Static characteristics Min and Max values are specified for the following conditions: VBAT = 5.5 V to 40 V, VEN = 4.5 V to 5.5 V, VVCC = 4.5 V to 5.5 V and Tj = 40 °C to +175 °C[1]. All voltages are defined with respect to ground, positive currents flow into the IC. Typical values are given at VVIN = 40 V. VEN = 5 V, VVCC = 5 V and Tj = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit operating; no load on VGG; Gate pins low; one phase; one output 5 13 - mA operating; no load on VGG; Gate pins low - 20 - mA EN = low - - 5 A - - 4.5 V Supply pin Vbat IDD supply current Ioff off-state current Vth(det)pon power-on detection threshold voltage Supply pin VCC IVCC supply current on pin VCC operating - - 250 A current on pin EN operating - - 2 mA 0.03  Vout1  0.721 - +0.03  Vout1 + 0.721 V Pin EN IEN Output voltage VO(acc) output voltage accuracy deviation from target set value VO output voltage bit Vout_ok is set when VO is within 5.4 the range with respect to the target value - +2.4 V VBAT  VVGG + Vdo(reg)VGG 4.46 - 10.04 V bit VGG_ok is set when VVGG is within the range regarding the target value 2.4 - +2.4 V Ireg  50 mA; regulator in saturation - 0.5 1.0 V Ireg  160 mA; regulator in saturation - 1.6 3.2 V 25 C to Tj(max) 5 - +5 % 40 C to +25 C 7 - +5 % Regulated voltage output VVGG Vdo(reg)VGG Vreg(acc)VGG voltage on pin VGG regulator dropout voltage on pin VGG regulator voltage accuracy on pin VGG Serial peripheral interface inputs; pins SDI, SCLK and CSB Vth(sw) switching threshold voltage 0.3  VVCC - 0.7  VVCC V Rpd(int)SCLK internal pull-down resistance on pin SCLK 40 - 80 k Rpd(int)CSB internal pull-down resistance on pin CSB 40 - 80 k Rpd(int)SDI internal pull-down resistance on pin SDI 40 - 80 k ASL1500SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 27 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter Table 38. Static characteristics …continued Min and Max values are specified for the following conditions: VBAT = 5.5 V to 40 V, VEN = 4.5 V to 5.5 V, VVCC = 4.5 V to 5.5 V and Tj = 40 °C to +175 °C[1]. All voltages are defined with respect to ground, positive currents flow into the IC. Typical values are given at VVIN = 40 V. VEN = 5 V, VVCC = 5 V and Tj = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Serial peripheral interface data output; pin SDO VOH HIGH-level output voltage IOH = 4 mA; VVCC = 4.5 V to 5.5 V VVCC  0.4 - - V VOL LOW-level output voltage IOL = 4 mA; VVCC = 4.5 V to 5.5 V - - 0.4 V ILOZ OFF-state output leakage VCSB = VVCC; VO = 0 V to VVCC current 5 - +5 A - +20 C C Temperature protection Tj junction temperature variation measurement provided via register 20 0x46h; Tj = 130C Tsd(otp) overtemperature protection shutdown temperature 150 175 200 0.035  VBAT  0.3606 - Vbat monitoring VBAT [1] battery voltage accuracy accuracy of VBAT measurement 0.035  VBAT  0.3606 V All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to cover the specified temperature and power supply voltage range. 12. Dynamic characteristics Table 39. Dynamic characteristics Min and Max values are specified for the following conditions: VVIN = 10 V to 80 V, VEN = 4.5 V to 5.5 V, VVCC = 4.5 V to 5.5 V and Tj = 40 °C to +175 °C[1]. All voltages are defined with respect to ground, positive currents flow into the IC. Typical values are given at VVIN = 40 V. VEN = 5 V, VVCC = 5 V and Tj = 25 °C unless otherwise specified. Symbol Parameter Conditions fDCDC DC-to-DC converter frequency f(DCDC)acc DC-to-DC converter  frequency accuracy fosc oscillator frequency Min Typ Max Unit 120 - 700 kHz operating, trimmed 5 - +5 % internal oscillator, untrimmed 130 - 250 MHz target frequency for trimmed operation - 180 - MHz Serial peripheral interface timing; pins CSB, SCLK, SDI and SDO fclk(int)/fSPI Internal clock frequency to SPI ratio between internal clock and SPI clock clock frequency ratio - 20:1 - 1 tcy(clk) clock cycle time 250 - - ns tSPILEAD SPI enable lead time 50 tSPILAG SPI enable lag time 50 - - ns tclk(H) clock HIGH time 125 tclk(L) clock LOW time 125 tsu(D) data input set-up time 50 th(D) data input hold time 50 tv(Q) data output valid time tWH(S) chip select pulse width HIGH ASL1500SHN Product data sheet pin SDO; CL = 20 pF Rev. 4 — 26 October 2017 ns - - - - ns ns 130 ns ns 250 All information provided in this document is subject to legal disclaimers. ns - ns © NXP Semiconductors N.V. 2017. All rights reserved. 28 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter Table 39. Dynamic characteristics …continued Min and Max values are specified for the following conditions: VVIN = 10 V to 80 V, VEN = 4.5 V to 5.5 V, VVCC = 4.5 V to 5.5 V and Tj = 40 °C to +175 °C[1]. All voltages are defined with respect to ground, positive currents flow into the IC. Typical values are given at VVIN = 40 V. VEN = 5 V, VVCC = 5 V and Tj = 25 °C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit Gate driver characteristics for pin G1 tch(G) gate charge time 20 % to 80 %; VVGG= 7.5 V; Cgate = 2000 pF - - 30 ns tdch(G) gate discharge time 80 % to 20 %; VVGG= 7.5 V; Cgate = 2000 pF - - 14 ns Regulated voltage tstartup start-up error time of VGG; fosc = 180 MHz - 2.5 - ms terr(startup) error detection time for VGG during operation; fosc = 180 MHz - 31.5 - s tfltr(ov) output voltage filter time for bit Vout1_ok and Vout2_ok; fosc = 180 MHz - 31.5 - s [1] All parameters are guaranteed over the virtual junction temperature range by design. Factory testing uses correlated test conditions to cover the specified temperature and power supply voltage range. CSB tSPILEAD tWH(S) tclk tSPILAG SCLK tclk(H) tclk(L) tSU(D) th(D) b15 MSB SDI b0 LSB tv(Q) SDO FLOATING b15 MSB b0 LSB FLOATING aaa-017537 Fig 13. SPI timing diagram ASL1500SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 29 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter 13. Application information Figure 14 provides an example for the ASL1500SHN in a typical 2-phase Boost converter IC with 1 output voltage. D8 battery C1 C2 VIN VGG VGG C16 L1 G1 D1 C15 BS1 G1 M1 L5 R5 LED1 C12 C8 SNH1 M5 C5 LX1 D9 PWM1 RH1 VBAT D10 PWM2 R1 SNL1 RL1 C18 D11 D5 FB1 VCC EN ASL1500SHN CSB G2 SDI BS2 SDO ASLxxxxSHN SCLK M6 L6 C6 R6 LED2 C13 LX2 D12 GND VCC EN RH2 D13 RL2 D14 CSB SDI D6 SDO SCLK C20 VCC VBAT RSTN C19 GND TJA1028 LIN LIN EN VCC EN_1 RSTN EN_2 TXD TXD RXD RXD GND CSB 1 EN CSB 2 µC SDI SDO GND SCLK PWM1 PWM2 aaa-017538 Fig 14. ASL1500SHN, single output boost converter 14. Test information 14.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q100 Rev-H - Failure mechanism-based stress test qualification for integrated circuits, and is suitable for use in automotive applications. ASL1500SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 30 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter 15. Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 5 x 5 x 0.85 mm A B D SOT617-12 terminal 1 index area E A A1 c detail X e1 1/2 e e 9 16 C C A B C v w b y1 C y L 8 17 e e2 Eh 1/2 e 1 24 terminal 1 index area 32 k 25 X Dh 0 5 mm scale Dimensions (mm are the original dimensions) Unit mm A A1 b max 1.00 0.05 0.30 nom 0.85 0.02 0.21 min 0.80 0.00 0.18 c D(1) Dh E(1) Eh e e1 e2 0.2 5.1 5.0 4.9 3.1 3.0 2.9 5.1 5.0 4.9 3.1 3.0 2.9 0.5 3.5 3.5 k L v 0.1 0.5 0.50 0.44 0.30 w y y1 0.05 0.05 0.1 Note 1. Plastic or metal protrusions of 0.075 mm maximum per side are not included. Outline version References IEC SOT617-12 JEDEC JEITA sot617-12_po European projection Issue date 13-10-14 13-11-05 MO-220 Fig 15. Package outline HVQFN32 ASL1500SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 31 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter 16. Revision history Table 40. Revision history Document ID Release date Data sheet status Change notice Supersedes ASL1500SHN v.4 20171026 Product data sheet - ASL1500SHN v.3 Modifications: ASL1500SHN v.3 Modifications: ASL1500SHN v.2 Modifications: ASL1500SHN v.1 ASL1500SHN Product data sheet • • • • • Section 8.7: clarified exceeding of limiting values Formula for voltage conversion updated Table 38: values of output voltage accuracy updated Table 38: values of regulator voltage accuracy on pin VGG updated Table 39: data output valid time updated 20160413 • • - ASL1500SHN v.2 Text has been corrected and aligned with the ASLxxxxSHN series of data sheets. 20150925 • • • • Product data sheet Minor corrections made to Figure 3 “State diagram” on page 6 . Product data sheet - ASL1500SHN v.1 Minor corrections made to Figure 2, Figure 3 and Figure 14. Text has been corrected and aligned with the ASLxxxxSHN series of data sheets. A number of symbols have been upgraded to NXP standards. Specification status upgraded to Product data sheet. 20150624 Preliminary data sheet - All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 - © NXP Semiconductors N.V. 2017. All rights reserved. 32 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter 17. Legal information 17.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 17.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. For detailed and full information see the relevant full data sheet, which is available on request via the local NXP Semiconductors sales office. In case of any inconsistency or conflict with the short data sheet, the full data sheet shall prevail. Product specification — The information and data provided in a Product data sheet shall define the specification of the product as agreed between NXP Semiconductors and its customer, unless NXP Semiconductors and customer have explicitly agreed otherwise in writing. In no event however, shall an agreement be valid in which the NXP Semiconductors product is deemed to offer functions and qualities beyond those described in the Product data sheet. 17.3 Disclaimers Limited warranty and liability — Information in this document is believed to be accurate and reliable. However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Right to make changes — NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. ASL1500SHN Product data sheet Suitability for use in automotive applications — This NXP Semiconductors product has been qualified for use in automotive applications. Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer’s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer’s applications and products planned, as well as for the planned application and use of customer’s third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer’s applications or products, or the application or use by customer’s third party customer(s). Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 33 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 17.4 Trademarks Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 18. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com ASL1500SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 34 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter 19. Tables Table 1. Table 2. Table 3. Table 4. Ordering information . . . . . . . . . . . . . . . . . . . . .2 Pin description[1] . . . . . . . . . . . . . . . . . . . . . . . .4 Operating modes . . . . . . . . . . . . . . . . . . . . . . . .6 Internal phase control enable for output 1, address 0x0Bh . . . . . . . . . . . . . . . . . . . . . . . . . .8 Table 5. Internal phase control enable for output 2, address 0x0Ch . . . . . . . . . . . . . . . . . . . . . . . . .9 Table 6. Gate driver output, address 0x02h . . . . . . . . . . .9 Table 7. Gate driver phase, address 0x0Fh . . . . . . . . . . .9 Table 8. Phase select configuration, address 0x10h . . . .9 Table 9. Gate driver enable, address 0x01h . . . . . . . . .10 Table 10. Clock divider for Vout1, address 0x09h . . . . . .10 Table 11. Phase-off time and phase delay of output 1, address 0x0Dh . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 12. Loop filter proportional configuration, Table 20. Table 21. Table 22. Table 23. Table 24. Table 25. address 0x11h . . . . . . . . . . . . . . . . . . . . . 11 Table 30. Table 13. Loop filter integral configuration, address 0x12h . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 14. Slope compensation configuration, address 0x13h . . . . . . . . . . . . . . . . . . . . . . . . . 11 Table 15. Current sense slope resistor configuration, address 0x14h . . . . . . . . . . . . . . . . . . . . . . . . .12 Table 16. Output voltage 1 register, address 0x03h . . . . .12 Table 17. Limit voltage output 1 register, address 0x05h .12 Table 18. Maximum phase current Vout1 register, address 0x07h . . . . . . . . . . . . . . . . . . . . . . . . .13 Table 19. Function control register, address 0x00h . . . . .13 Table 31. Table 32. Table 33. Table 34. Table 35. Table 36. Table 37. Table 38. Table 39. Table 40. Table 26. Table 27. Table 28. Table 29. CSB count register 1, address 0x41h . . . . . . . 14 CSB count register 2, address 0x42h . . . . . . . 15 Frequency trimming register, address 0x1Ch . 15 VGG control register, address 0x15h. . . . . . . . 16 Battery voltage register, address 0x45h. . . . . . 16 Undervoltage threshold register, address 0x1Bh . . . . . . . . . . . . . . . . . . . . . . . . . 17 Overvoltage threshold register, address 0x1Ah . . . . . . . . . . . . . . . . . . . . . . . . . 17 Junction temperature register, address 0x46h . . . . . . . . . . . . . . . . . . . . . . . . . 17 Undervoltage threshold register, address 0x0Fh . . . . . . . . . . . . . . . . . . . . . . . . . 18 SPI frame format for a transition to the device. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 SPI frame format for a transition from the device[1] . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Register space grouping . . . . . . . . . . . . . . . . . 24 Control register group overview . . . . . . . . . . . . 24 Configuration register group overview . . . . . . 24 Internal register overview. . . . . . . . . . . . . . . . . 25 Diagnostic register group overview . . . . . . . . . 25 Limiting values . . . . . . . . . . . . . . . . . . . . . . . . 26 Thermal characteristics . . . . . . . . . . . . . . . . . . 26 Static characteristics . . . . . . . . . . . . . . . . . . . . 27 Dynamic characteristics . . . . . . . . . . . . . . . . . 28 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 32 20. Figures Fig 1. Fig 2. Fig 3. Fig 4. Fig 5. Fig 6. Fig 7. Fig 8. Fig 9. Fig 10. Fig 11. Fig 12. Fig 13. Fig 14. Fig 15. Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . .3 Pin configuration . . . . . . . . . . . . . . . . . . . . . . . . . .4 State diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . .6 Phase of the boost converter with IC and application connections . . . . . . . . . . . . . . . . . . . . .7 Mapping of virtual phases (V1_1 to V2_4) to physical phase (G1) . . . . . . . . . . . . . . . . . . . . . . . .8 Phase control generator . . . . . . . . . . . . . . . . . . .10 Frequency trimming flow . . . . . . . . . . . . . . . . . . .14 SPI timing protocol. . . . . . . . . . . . . . . . . . . . . . . .20 SPI frame format . . . . . . . . . . . . . . . . . . . . . . . . .20 Daisy chain configuration. . . . . . . . . . . . . . . . . . .21 Physical parallel slave connection . . . . . . . . . . . .22 SPI frame format . . . . . . . . . . . . . . . . . . . . . . . . .23 SPI timing diagram . . . . . . . . . . . . . . . . . . . . . . .29 ASL1500SHN, single output boost converter . . .30 Package outline HVQFN32 . . . . . . . . . . . . . . . . .31 ASL1500SHN Product data sheet All information provided in this document is subject to legal disclaimers. Rev. 4 — 26 October 2017 © NXP Semiconductors N.V. 2017. All rights reserved. 35 of 36 ASL1500SHN NXP Semiconductors Single phase boost converter 21. Contents 1 2 3 4 5 6 7 7.1 7.2 8 8.1 8.1.1 8.1.2 8.1.3 8.1.4 8.2 8.2.1 8.2.2 8.2.3 8.2.4 8.2.5 8.2.6 8.3 8.3.1 8.3.2 8.4 8.5 8.6 8.7 8.7.1 8.8 8.8.1 8.8.2 8.8.3 8.9 8.10 8.10.1 8.10.2 8.10.3 8.10.4 8.10.5 8.10.6 8.10.7 8.11 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 2 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Pinning information . . . . . . . . . . . . . . . . . . . . . . 4 Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4 Functional description . . . . . . . . . . . . . . . . . . . 6 Operating modes . . . . . . . . . . . . . . . . . . . . . . . 6 Off mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Configuration mode . . . . . . . . . . . . . . . . . . . . . 6 Operation mode . . . . . . . . . . . . . . . . . . . . . . . . 7 Fail silent mode . . . . . . . . . . . . . . . . . . . . . . . . 7 Boost converter configuration . . . . . . . . . . . . . . 7 Configuration of the virtual phases . . . . . . . . . . 8 Association of physical phases to the output voltages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Association of connected phases to the internal phase generation . . . . . . . . . . . . . . . . . . . . . . . 9 Enabling of connected phases . . . . . . . . . . . . 10 Configuration of the boost converter frequencies . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Control loop parameter setting . . . . . . . . . . . . 11 Output voltage programmability . . . . . . . . . . . 12 Output voltage target programming . . . . . . . . 12 Output overvoltage protection programming . 12 Coil peak current limitation . . . . . . . . . . . . . . . 13 Enabling the output voltage . . . . . . . . . . . . . . 13 Frequency trimming . . . . . . . . . . . . . . . . . . . . 14 Gate voltage supply . . . . . . . . . . . . . . . . . . . . 16 Gate voltage supply diagnostics . . . . . . . . . . . 16 Supply voltage monitoring . . . . . . . . . . . . . . . 16 Battery voltage measurement. . . . . . . . . . . . . 16 Undervoltage detection. . . . . . . . . . . . . . . . . . 17 Overvoltage detection. . . . . . . . . . . . . . . . . . . 17 Junction temperature information . . . . . . . . . . 17 Diagnostic information . . . . . . . . . . . . . . . . . . 18 Bit VIN_OV . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Bit VIN_UV . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Bit SPI_err . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Bit Tj_err . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Bit VGG_err . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Bit VGG_ok. . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Bit Vout1_ok . . . . . . . . . . . . . . . . . . . . . . . . . . 19 SPI . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 8.11.1 8.11.2 8.11.3 8.12 8.12.1 8.12.2 8.12.3 8.12.4 9 10 11 12 13 14 14.1 15 16 17 17.1 17.2 17.3 17.4 18 19 20 21 Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . Typical use case illustration (Write/Read) . . . Diagnostics for the SPI interface . . . . . . . . . . Register map . . . . . . . . . . . . . . . . . . . . . . . . . Control registers. . . . . . . . . . . . . . . . . . . . . . . Configuration registers. . . . . . . . . . . . . . . . . . Internal registers . . . . . . . . . . . . . . . . . . . . . . Diagnostic registers . . . . . . . . . . . . . . . . . . . . Limiting values . . . . . . . . . . . . . . . . . . . . . . . . Thermal characteristics . . . . . . . . . . . . . . . . . Static characteristics . . . . . . . . . . . . . . . . . . . Dynamic characteristics. . . . . . . . . . . . . . . . . Application information . . . . . . . . . . . . . . . . . Test information . . . . . . . . . . . . . . . . . . . . . . . Quality information . . . . . . . . . . . . . . . . . . . . . Package outline. . . . . . . . . . . . . . . . . . . . . . . . Revision history . . . . . . . . . . . . . . . . . . . . . . . Legal information . . . . . . . . . . . . . . . . . . . . . . Data sheet status . . . . . . . . . . . . . . . . . . . . . . Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . Contact information . . . . . . . . . . . . . . . . . . . . Tables . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Figures . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 22 23 23 24 24 25 25 26 26 27 28 30 30 30 31 32 33 33 33 33 34 34 35 35 36 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2017. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 26 October 2017 Document identifier: ASL1500SHN
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