FCPF250N65S3R0L

FCPF250N65S3R0L MOSFET – Power, N-Channel, SUPERFET III, Easy Drive 650 V, 12 A, 250 mW Description SUPERFET III MOSFET is ON Semiconductor’s brand−new high voltage super−junction (SJ) MOSFET family that is utilizing charge balance technology for outstanding low on−resistance and lower gate charge performance. This advanced technology is tailored to minimize conduction loss, provides superior switching performance, and withstand extreme dv/dt rate. Consequently, SUPERFET III MOSFET Easy drive series helps manage EMI issues and allows for easier design implementation. www.onsemi.com VDSS RDS(ON) MAX ID MAX 650 V 250 m   V 12 A D Features • • • • • • 700 V @ TJ = 150°C Typ. RDS(on) = 210 m Ultra Low Gate Charge (Typ. Qg = 24 nC) Low Effective Output Capacitance (Typ. Coss(eff.) = 248 pF) 100% Avalanche Tested These Devices are Pb−Free and are RoHS Compliant G S POWER MOSFET Applications • • • • Computing / Display Power Supplies Telecom / Server Power Supplies Industrial Power Supplies Lighting / Charger / Adapter G D S TO−220F CASE 340BF MARKING DIAGRAM $Y&Z&3&K FCPF250 N65S3R0 $Y &Z &3 &K FCPF250N65S3R0 = ON Semiconductor Logo = Assembly Plant Code = Data Code (Year & Week) = Lot = Specific Device Code ORDERING INFORMATION See detailed ordering and shipping information on page 2 of this data sheet. © Semiconductor Components Industries, LLC, 2017 August, 2019 − Rev 4 1 Publication Order Number: FCPF250N65S3R0L/D FCPF250N65S3R0L ABSOLUTE MAXIMUM RATINGS (TC = 25°C, Unless otherwise noted) Symbol Parameter VDSS Drain to Source Voltage VGSS Gate to Source Voltage ID Drain Current Value Unit 650 V − DC ±30 V − AC (f > 1 Hz) ±30 − Continuous (TC = 25°C) 12* − Continuous (TC = 100°C) 7.6* − Pulsed (Note 1) A IDM Drain Current 30* A EAS Single Pulsed Avalanche Energy (Note 2) 57 mJ IAS Avalanche Current (Note 2) 2.3 A EAR Repetitive Avalanche Energy (Note 1) 0.31 mJ dv/dt MOSFET dv/dt 100 V/ns Peak Diode Recovery dv/dt (Note 3) 20 PD Power Dissipation (TC = 25°C) 31 W 0.25 W/°C −55 to +150 °C 300 °C − Derate Above 25°C TJ, TSTG TL Operating and Storage Temperature Range Maximum Lead Temperature for Soldering, 1/8″ from Case for 5 seconds Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality should not be assumed, damage may occur and reliability may be affected. *Drain current limited by maximum junction temperature. 1. Repetitive rating: pulse−width limited by maximum junction temperature. 2. IAS = 2.3 A, RG = 25 , starting TJ = 25°C. 3. ISD ≤ 6 A, di/dt ≤ 200 A/s, VDD ≤ 400 V, starting TJ = 25°C. THERMAL CHARACTERISTICS Symbol Parameter Value Unit RJC Thermal Resistance, Junction to Case, Max. 4.07 _C/W RJA Thermal Resistance, Junction to Ambient, Max. 62.5 PACKAGE MARKING AND ORDERING INFORMATION Part Number Top Marking Package Packing Method Reel Size Tape Width Quantity FCPF250N65S3R0L FCPF250N65S3R0 TO−220F Tube N/A N/A 50 Units www.onsemi.com 2 FCPF250N65S3R0L ELECTRICAL CHARACTERISTICS (TC = 25°C unless otherwise noted) Parameter Symbol Test Conditions Min. Typ. Max. Unit OFF CHARACTERISTICS BVDSS Drain to Source Breakdown Voltage VGS = 0 V, ID = 1 mA, TJ = 25_C 650 V VGS = 0 V, ID = 1 mA, TJ = 150_C 700 V BVDSS / TJ Breakdown Voltage Temperature Coefficient ID = 1 mA, Referenced to 25_C IDSS Zero Gate Voltage Drain Current VDS = 650 V, VGS = 0 V IGSS Gate to Body Leakage Current 0.67 V/_C 1 A ±100 nA 4.5 V 250 m 0.77 VDS = 520 V, TC = 125_C VGS = ±30 V, VDS = 0 V ON CHARACTERISTICS VGS(th) Gate Threshold Voltage VGS = VDS, ID = 0.29 mA RDS(on) Static Drain to Source On Resistance VGS = 10 V, ID = 6 A 210 Forward Transconductance VDS = 20 V, ID = 6 A 7.4 S 1010 pF 25 pF gFS 2.5 DYNAMIC CHARACTERISTICS Ciss Input Capacitance Coss Output Capacitance VDS = 400 V, VGS = 0 V, f = 1 MHz Coss(eff.) Effective Output Capacitance VDS = 0 V to 400 V, VGS = 0 V 248 pF Coss(er.) Energy Related Output Capacitance VDS = 0 V to 400 V, VGS = 0 V 33 pF Total Gate Charge at 10 V VDS = 400 V, ID = 6 A, VGS = 10 V (Note 4) 24 nC 6.1 nC Qg(tot) Qgs Gate to Source Gate Charge Qgd Gate to Drain “Miller” Charge ESR Equivalent Series Resistance 9.7 nC f = 1 MHz 1.1  VDD = 400 V, ID = 6 A, VGS = 10 V, Rg = 4.7  (Note 4) 15 ns 13 ns SWITCHING CHARACTERISTICS td(on) Turn-On Delay Time tr Turn-On Rise Time td(off) Turn-Off Delay Time 40 ns Turn-Off Fall Time 7.2 ns tf SOURCE-DRAIN DIODE CHARACTERISTICS Maximum Continuous Source to Drain Diode Forward Current 12 A ISM Maximum Pulsed Source to Drain Diode Forward Current 30 A VSD Source to Drain Diode Forward Voltage VGS = 0 V, ISD = 6 A 1.2 V trr Reverse Recovery Time Qrr Reverse Recovery Charge VDD = 400 V, ISD = 6 A, dIF/dt = 100 A/s IS 251 ns 3.4 C Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product performance may not be indicated by the Electrical Characteristics if operated under different conditions. 4. Essentially independent of operating temperature typical characteristics. www.onsemi.com 3 FCPF250N65S3R0L TYPICAL PERFORMANCE CHARACTERISTICS 30 VGS = 10.0 V 8.0 V 7.0 V 10 6.5 V 6.0 V 5.5 V ID, Drain Current (A) ID, Drain Current (A) 40 1 10 150°C 25°C −55°C 250 s Pulse Test TC = 25°C 0.1 0.2 1 10 VDS, Drain−Source Voltage (V) VDS = 20 V 250 s Pulse Test 1 20 3 Figure 1. On−Region Characteristics 100 TC = 25°C 0.6 0.4 VGS = 10 V VGS = 20 V 0.2 0.0 0 10 30 20 ID, Drain Current (A) 10 4 10 3 10 2 10 1 10 0 10 10 −55°C 0.01 Ciss −1 0 1 Crss 2 10 10 10 VDS, Drain−Source Voltage (V) 10 0.5 1.0 1.5 VSD, Body Diode Forward Voltage (V) Figure 4. Body Diode Forward Voltage Variation vs. Source Current and Temperature 10 VGS = 0 V f = 1 MHz Ciss = Cgs + Cgd (Cds = shorted) Coss = Cds + Cgd Crss = Cgd 25°C 0.1 0.001 0.0 40 Coss −1 150°C 1 VGS, Gate−Source Voltage (V) Capacitances (pF) 5 VGS = 0 V 250 s Pulse Test 10 Figure 3. On−Resistance Variation vs. Drain Current and Gate Voltage 10 9 Figure 2. Transfer Characteristics IS, Reverse Drain Current (A) RDS(ON), Drain−Source On−Resistance (W) 0.8 6 4 5 7 8 VGS, Gate−Source Voltage (V) Figure 5. Capacitance Characteristics VDS = 130 V 8 VDS = 400 V 6 4 2 0 3 ID = 6 A 0 6 12 18 24 Qg, Total Gate Charge (nC) 30 Figure 6. Gate Charge Characteristics www.onsemi.com 4 FCPF250N65S3R0L TYPICAL PERFORMANCE CHARACTERISTICS (continued) 3.0 VGS = 0 V ID = 10 mA RDS(on), Drain−Source On−Resistance (Normalized) BVDSS, Drain−Source Breakdown Voltage (Normalized) 1.2 1.1 1.0 0.9 0.8 −50 2.5 2.0 1.5 1.0 0.5 0.0 50 100 150 0 TJ, Junction Temperature (5C) VGS = 10 V ID = 6 A −50 0 50 100 150 TJ, Junction Temperature (5C) Figure 8. On−Resistance Variation vs. Temperature Figure 7. Breakdown Voltage Variation vs. Temperature 15 100 10 ID, Drain Current (A) ID, Drain Current (A) 10 s 100 s 1 ms 10 ms 1 DC Operation in this Area is Limited by RDS(on) TC = 25°C TJ = 150°C Single Pulse 0.1 0.01 1 10 100 VDS, Drain−Source Voltage (V) EOSS, (mJ) 4 2 130 260 390 520 VDS, Drain to Source Voltage (V) 50 75 100 125 TC, Case Temperature (5C) 150 Figure 10. Maximum Drain Current vs. Case Temperature 6 0 5 0 25 1000 Figure 9. Maximum Safe Operating Area 0 10 650 Figure 11. EOSS vs. Drain to Source Voltage www.onsemi.com 5 FCPF250N65S3R0L r(t), Normalized Effective Transient Thermal Resistance TYPICAL PERFORMANCE CHARACTERISTICS (continued) 2 1 0.1 DUTY CYCLE − DESCENDING ORDER D = 0.5 0.2 0.1 0.05 0.02 0.01 PDM t1 0.01 0.001 −5 10 ZJC(t) = r(t) x RJC RJC = 4.07°C/W Peak TJ = PDM x ZJC(t) + TC Duty Cycle, D = t1 / t2 SINGLE PULSE −4 10 t2 −3 10 −2 −1 10 10 t, Rectangular Pulse Duration (sec) 0 10 Figure 12. Transient Thermal Response Curve www.onsemi.com 6 1 10 2 10 FCPF250N65S3R0L VGS RL Qg VDS VGS Qgs Qgd DUT IG = Const. Charge Figure 13. Gate Charge Test Circuit & Waveform RL VDS VDS 90% 90% 90% VDD VGS RG VGS DUT VGS 10% td(on) 10% tr td(off) ton tf toff Figure 14. Resistive Switching Test Circuit & Waveforms L E AS + 1 @ LI AS 2 VDS BVDSS ID IAS RG VDD DUT VGS 2 ID(t) VDD VDS(t) tp tp Figure 15. Unclamped Inductive Switching Test Circuit & Waveforms www.onsemi.com 7 Time FCPF250N65S3R0L + DUT VDS − ISD L Driver RG Same Type as DUT VGS − dv/dt controlled by RG − ISD controlled by pulse period D+ VGS (Driver) VDD Gate Pulse Width Gate Pulse Period 10 V IFM, Body Diode Forward Current ISD (DUT) di/dt IRM Body Diode Reverse Current Body Diode Recovery dv/dt VDS (DUT) VDD VSD Body Diode Forward Voltage Drop Figure 16. Peak Diode Recovery dv/dt Test Circuit & Waveforms SUPERFET is a registered trademark of Semiconductor Components Industries, LLC (SCILLC) or its subsidiaries in the United States and/or other countries. www.onsemi.com 8 MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS TO−220 FULLPAK 3LD CASE 340BF ISSUE O DATE 31 AUG 2016 10.30 9.80 A 2.90 2.50 3.40 3.00 3.00 2.60 B 19.00 17.70 6.60 6.20 1 X 45° B 15.70 15.00 3.30 B 2.70 3 1 2.14 10.70 10.30 NOTES: 2.74 (2X) 2.34 4.60 4.30 DESCRIPTION: B 0.60 0.40 0.90 (3X) 0.50 0.50 M A 1.20 1.00 DOCUMENT NUMBER: 2.70 2.30 1.20(2X) 0.90 98AON13839G TO−220 FULLPAK 3LD A. EXCEPT WHERE NOTED CONFORMS TO EIAJ SC91A. B DOES NOT COMPLY EIAJ STD. VALUE. C. ALL DIMENSIONS ARE IN MILLIMETERS. D. DIMENSIONS ARE EXCLUSIVE OF BURRS, MOLD FLASH AND TIE BAR PROTRUSIONS. E. DIMENSION AND TOLERANCE AS PER ASME Y14.5−2009. Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. PAGE 1 OF 1 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. 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