FDMC86244

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This literature is subject to all applicable copyright laws and is not for resale in any manner. FDMC86244 N-Channel Shielded Gate PowerTrench® MOSFET 150 V, 9.4 A, 134 mΩ Features General Description „ Shielded Gate MOSFET Technology This N-Channel MOSFET is produced using Fairchild Semiconductor‘s advanced PowerTrench® process that incorporates Shielded Gate technology. This process has been optimized for the on-state resistance and yet maintain superior switching performance. „ Max rDS(on) = 134 mΩ at VGS = 10 V, ID = 2.8 A „ Max rDS(on) = 186 mΩ at VGS = 6 V, ID = 2.4 A „ Low Profile - 1 mm max in Power 33 „ 100% UIL Tested Application „ RoHS Compliant „ DC - DC Conversion Bottom Top 8 1 7 6 D D D D 5 G S S S 2 3 4 S D S D S D G D MLP 3.3x3.3 MOSFET Maximum Ratings TA = 25 °C unless otherwise noted Symbol VDS Drain to Source Voltage Parameter VGS Gate to Source Voltage Drain Current -Continuous TC = 25°C -Continuous TA = 25°C ID TJ, TSTG ±20 V (Note 1a) 2.8 A 12 Single Pulse Avalanche Energy PD Units V 9.4 -Pulsed EAS Ratings 150 (Note 3) Power Dissipation TC = 25°C Power Dissipation TA = 25°C 12 26 (Note 1a) Operating and Storage Junction Temperature Range 2.3 -55 to + 150 mJ W °C Thermal Characteristics RθJC Thermal Resistance, Junction to Case 4.7 RθJA Thermal Resistance, Junction to Ambient (Note 1a) 125 °C/W Package Marking and Ordering Information Device Marking FDMC86244 Device FDMC86244 ©2012 Fairchild Semiconductor Corporation FDMC86244 Rev.C3 Package Power 33 1 Reel Size 13’’ Tape Width 12 mm Quantity 3000 units www.fairchildsemi.com FDMC86244 N-Channel Shielded Gate PowerTrench® MOSFET November 2013 Symbol Parameter Test Conditions Min Typ Max Units Off Characteristics BVDSS Drain to Source Breakdown Voltage ID = 250 μA, VGS = 0 V ΔBVDSS ΔTJ Breakdown Voltage Temperature Coefficient ID = 250 μA, referenced to 25 °C IDSS Zero Gate Voltage Drain Current VDS = 120 V, VGS = 0 V 1 μA IGSS Gate to Source Leakage Current VGS = ±20 V, VDS = 0 V ±100 nA 4 V 150 V 106 mV/°C On Characteristics VGS(th) Gate to Source Threshold Voltage VGS = VDS, ID = 250 μA ΔVGS(th) ΔTJ Gate to Source Threshold Voltage Temperature Coefficient ID = 250 μA, referenced to 25 °C VGS = 10 V, ID = 2.8 A 105 134 rDS(on) Static Drain to Source On Resistance VGS = 6 V, ID = 2.4 A 120 186 VGS = 10 V, ID = 2.8 A, TJ = 125 °C 199 254 gFS Forward Transconductance 2 VDD = 10 V, ID = 2.8 A 2.6 -9 mV/°C 8 mΩ S Dynamic Characteristics Ciss Input Capacitance Coss Output Capacitance Crss Reverse Transfer Capacitance VDS = 75 V, VGS = 0 V, f = 1 MHz 257 345 pF 32 45 pF 1.8 5 pF ns Switching Characteristics td(on) Turn-On Delay Time 5.3 11 tr Rise Time 10 ns td(off) Turn-Off Delay Time VDD = 75 V, ID = 2.8 A, VGS = 10 V, RGEN = 6 Ω 1.5 9.9 20 ns tf Fall Time 2.3 10 ns Qg(TOT) Total Gate Charge VGS = 0 V to 10 V 4.2 5.9 nC Qg(TOT) Total Gate Charge VGS = 0 V to 5 V 2.4 3.4 Qgs Total Gate Charge Qgd Gate to Drain “Miller” Charge VDD = 75 V, ID = 2.8 A 1.1 nC 1.0 nC Drain-Source Diode Characteristics VSD Source to Drain Diode Forward Voltage trr Reverse Recovery Time Qrr Reverse Recovery Charge VGS = 0 V, IS = 2.8 A (Note 2) 0.81 1.3 VGS = 0 V, IS = 2 A (Note 2) 0.79 1.2 IF = 2.8 A, di/dt = 100 A/μs V 48 76 ns 38 61 nC NOTES: 1. RθJA is determined with the device mounted on a 1 in2 pad 2 oz copper pad on a 1.5 x 1.5 in. board of FR-4 material. RθJC is guaranteed by design while RθCA is determined by the user's board design. a. 53 °C/W when mounted on a 1 in2 pad of 2 oz copper b. 125 °C/W when mounted on a minimum pad of 2 oz copper SS SF DS DF G SS SF DS DF G 2. Pulse Test: Pulse Width < 300 μs, Duty cycle < 2.0%. 3. Starting TJ = 25 °C; N-ch: L = 1.0 mH, IAS = 5.0 A, VDD = 135 V, VGS = 10 V. ©2012 Fairchild Semiconductor Corporation FDMC86244 Rev.C3 2 www.fairchildsemi.com FDMC86244 N-Channel Shielded Gate PowerTrench® MOSFET Electrical Characteristics TJ = 25 °C unless otherwise noted 5 VGS = 6 V VGS = 10 V VGS = 5 V VGS = 5.5 V ID, DRAIN CURRENT (A) NORMALIZED DRAIN TO SOURCE ON-RESISTANCE 12 9 PULSE DURATION = 80 μs DUTY CYCLE = 0.5% MAX 6 VGS = 4.5 V 3 0 VGS = 4 V 0 1 2 3 4 VGS = 4 V VGS = 5 V 3 2 VGS = 5.5 V 1 PULSE DURATION = 80 μs DUTY CYCLE = 0.5% MAX 0 5 0 3 6 9 12 Figure 2. Normalized On-Resistance vs Drain Current and Gate Voltage Figure 1. On Region Characteristics 2.4 500 ID = 2.8 A VGS = 10 V 2.2 2.0 rDS(on), DRAIN TO 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 -75 -50 SOURCE ON-RESISTANCE (mΩ) NORMALIZED DRAIN TO SOURCE ON-RESISTANCE VGS = 10 V VGS = 6 V ID, DRAIN CURRENT (A) VDS, DRAIN TO SOURCE VOLTAGE (V) IS, REVERSE DRAIN CURRENT (A) VDS = 5 V TJ = 150 oC 6 TJ = 25 oC 3 TJ = -55 oC 0 5 TJ = 125 oC 200 100 TJ = 25 oC 20 10 1 4 6 8 10 VGS = 0 V TJ = 150 oC TJ = 25 oC 0.1 TJ = -55 oC 0.01 0.001 0.2 6 0.4 0.6 0.8 1.0 1.2 VSD, BODY DIODE FORWARD VOLTAGE (V) VGS, GATE TO SOURCE VOLTAGE (V) Figure 6. Source to Drain Diode Forward Voltage vs Source Current Figure 5. Transfer Characteristics ©2012 Fairchild Semiconductor Corporation FDMC86244 Rev.C3 300 Figure 4. On-Resistance vs Gate to Source Voltage 9 4 ID = 2.8 A VGS, GATE TO SOURCE VOLTAGE (V) PULSE DURATION = 80 μs DUTY CYCLE = 0.5% MAX 3 400 2 12 2 PULSE DURATION = 80 μs DUTY CYCLE = 0.5% MAX 0 -25 0 25 50 75 100 125 150 TJ, JUNCTION TEMPERATURE (oC) Figure 3. Normalized On Resistance vs Junction Temperature ID, DRAIN CURRENT (A) VGS = 4.5 V 4 3 www.fairchildsemi.com FDMC86244 N-Channel Shielded Gate PowerTrench® MOSFET Typical Characteristics TJ = 25 °C unless otherwise noted VGS, GATE TO SOURCE VOLTAGE (V) 10 1000 VDD = 50 V ID = 2.8 A CAPACITANCE (pF) 8 VDD = 75 V 6 VDD = 100 V 4 Ciss 100 Coss 10 2 f = 1 MHz VGS = 0 V 0 0 1 2 3 4 Crss 1 0.1 5 1 10 100 VDS, DRAIN TO SOURCE VOLTAGE (V) Qg, GATE CHARGE (nC) Figure 7. Gate Charge Characteristics Figure 8. Capacitance vs Drain to Source Voltage 10 10 o 8 ID, DRAIN CURRENT (A) IAS, AVALANCHE CURRENT (A) RθJC = 4.7 C/W TJ = 25 oC 6 TJ = 100 oC 4 TJ = 125 oC 8 VGS = 10 V 6 VGS = 6 V 4 2 2 1 0.001 0.01 0.1 1 0 25 2 50 P(PK), PEAK TRANSIENT POWER (W) ID, DRAIN CURRENT (A) 150 1000 100 μs 1 1 ms 10 ms THIS AREA IS LIMITED BY rDS(on) 100 ms SINGLE PULSE TJ = MAX RATED 1s 10 s RθJA = 125 oC/W DC TA = 25 oC 0.001 0.1 125 Figure 10. Maximum Continuous Drain Current vs Case Temperature 20 10 0.01 100 o Figure 9. Unclamped Inductive Switching Capability 0.1 75 TC, CASE TEMPERATURE ( C) tAV, TIME IN AVALANCHE (ms) 1 10 100 500 10 SINGLE PULSE RθJA = 125 oC/W TA = 25 oC 1 0.5 -4 10 -3 10 -2 10 -1 10 1 100 10 1000 t, PULSE WIDTH (sec) VDS, DRAIN to SOURCE VOLTAGE (V) Figure 11. Forward Bias Safe Operating Area ©2012 Fairchild Semiconductor Corporation FDMC86244 Rev.C3 100 Figure 12. Single Pulse Maximum Power Dissipation 4 www.fairchildsemi.com FDMC86244 N-Channel Shielded Gate PowerTrench® MOSFET Typical Characteristics TJ = 25 °C unless otherwise noted 2 NORMALIZED THERMAL IMPEDANCE, ZθJA 1 0.1 DUTY CYCLE-DESCENDING ORDER D = 0.5 0.2 0.1 0.05 0.02 0.01 PDM t1 t2 0.01 0.001 -4 10 NOTES: DUTY FACTOR: D = t1/t2 PEAK TJ = PDM x ZθJA x RθJA + TA SINGLE PULSE o RθJA = 125 C/W -3 10 -2 10 -1 10 1 10 100 1000 t, RECTANGULAR PULSE DURATION (sec) Figure 13. Junction-to-Ambient Transient Thermal Response Curve ©2012 Fairchild Semiconductor Corporation FDMC86244 Rev.C3 5 www.fairchildsemi.com FDMC86244 N-Channel Shielded Gate PowerTrench® MOSFET Typical Characteristics TJ = 25 °C unless otherwise noted ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. 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