-30V, -13A, 9mΩ
Features
General Description
Max rDS(on) = 9.3mΩ at VGS = -10V, ID = -13A
This P-Channel MOSFET is producted using ON
Semiconductor’s advanced PowerTrench process that has
been especially tailored to minimize the on-state
resistance.
Max rDS(on) = 14.8mΩ at VGS = -4.5V, ID = -11A
Extended VGS range (-25V) for battery applications
HBM ESD protection level of 6kV typical (note 3)
This device is well suited for Power Management and load
switching applications common in Notebook Computers
and Portable Battery Packs.
High performance trench technology for extremely low
rDS(on)
High power and current handing capability
RoHS Compliant
D
D
D
D
SO-8
S
S
S
G
5
4
6
3
7
2
8
1
MOSFET Maximum Ratings TA = 25°C unless otherwise noted
Symbol
VDS
Drain to Source Voltage
Parameter
VGS
Gate to Source Voltage
Drain Current -Continuous
ID
(Note 1a)
Units
V
±25
V
-13
-Pulsed
A
-65
Power Dissipation for Single Operation
PD
TJ, TSTG
Ratings
-30
(Note 1a)
2.5
(Note 1b)
1.2
(Note 1c)
1.0
Operating and Storage Temperature
W
-55 to +150
°C
Thermal Characteristics
RθJA
Thermal Resistance , Junction to Ambient (Note 1a)
50
°C/W
RθJC
Thermal Resistance , Junction to Case (Note 1)
25
°C/W
Package Marking and Ordering Information
Device Marking
FDS6679AZ
Device
FDS6679AZ
©2009 Semiconductor Components Industries, LLC.
October-2017, Rev. 2
Reel Size
13’’
1
Tape Width
12mm
Quantity
2500 units
Publication Order Number:
FDS6679AZ/D
FDS6679AZ P-Channel PowerTrench® MOSFET
FDS6679AZ
P-Channel PowerTrench® MOSFET
Symbol
Parameter
Test Conditions
Min
-30
Typ
Max
Units
Off Characteristics
BVDSS
Drain to Source Breakdown Voltage
ID = -250µA, VGS = 0V
∆BVDSS
∆TJ
Breakdown Voltage Temperature
Coefficient
ID = -250µA, referenced to
25°C
V
IDSS
Zero Gate Voltage Drain Current
VDS = -24V, VGS=0V
-1
µA
IGSS
Gate to Source Leakage Current
VGS = ±25V, VDS=0V
±10
µA
-3
V
-20
mV/°C
On Characteristics (Note 2)
VGS(th)
Gate to Source Threshold Voltage
VGS = VDS, ID = -250µA
∆VGS(th)
∆TJ
Gate to Source Threshold Voltage
Temperature Coefficient
ID = -250µA, referenced to
25°C
rDS(on)
gFS
Drain to Source On Resistance
Forward Transconductance
-1
-1.9
6.5
mV/°C
VGS = -10V, ID = -13A
7.7
9.3
VGS = -4.5V, ID = -11A
11.8
14.8
VGS = -10V, ID = -13A,
TJ = 125°C
10.7
13.4
VDS = -5V, ID = -13A
mΩ
55
S
Dynamic Characteristics
Ciss
Input Capacitance
Coss
Output Capacitance
Crss
Reverse Transfer Capacitance
VDS = -15V, VGS = 0V,
f = 1MHz
2890
3845
pF
500
665
pF
495
745
pF
13
24
ns
15
27
ns
210
336
ns
92
148
ns
68
96
nC
38
54
nC
Switching Characteristics (Note 2)
td(on)
Turn-On Delay Time
tr
Rise Time
td(off)
Turn-Off Delay Time
tf
Fall Time
Qg
Total Gate Charge
Qg
Total Gate Charge
Qgs
Gate to Source Gate Charge
Qgd
Gate to Drain Charge
VDD = -15V, ID = -1A
VGS = -10V, RGS = 6Ω
VDS = -15V, VGS = -10V,
ID = -13A
VDS = -15V, VGS = -5V,
ID = -13A
10
nC
17
nC
Drain-Source Diode Characteristic
VSD
Source to Drain Diode Forward Voltage VGS = 0V, IS = -2.1A
-1.2
V
trr
Reverse Recovery Time
IF = -13A, di/dt = 100A/µs
-0.7
40
ns
Qrr
Reverse Recovery Charge
IF = -13A, di/dt = 100A/µs
-31
nC
Notes:
1: RθJA is the sum of the junction-to-case and case-to-ambient thermal resistance where the case thermal reference is defined as the solder mounting surface of the
drain pins. RθJC is guaranteed by design while RθCA is determined by the user’s board design.
a) 50°C/W when
mounted on a 1 in2
pad of 2 oz copper
b)105°C/W when
mounted on a .04 in2
pad of 2 oz copper
Scale 1 : 1 on letter size paper
2: Pulse Test:Pulse Width
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