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FGD3N60LSDTM-T

FGD3N60LSDTM-T

  • 厂商:

    ONSEMI(安森美)

  • 封装:

    TO252-3

  • 描述:

    INTEGRATED CIRCUIT

  • 数据手册
  • 价格&库存
FGD3N60LSDTM-T 数据手册
FGD3N60LSD IGBT FGD3N60LSD IGBT Description Features • High Current Capability • Very Low Saturation Voltage : VCE(sat) = 1.2 V @ IC = 3A ON Semiconductor's Insulated Gate Bipolar Transistors (IGBTs) provide very low conduction losses. The device is designed for applica-tions where very low On-Voltage Drop is a required feature. • High Input Impedance Applications • HID Lamp Applications • Piezo Fuel Injection Applications C C G G D-PAK E E Absolute Maximum Ratings Symbol Description FGD3N60LSD Units VCES Collector-Emitter Voltage 600 V VGES Gate-Emitter Voltage ± 25 V IC Collector Current @ TC = 25°C 6 A Collector Current @ TC = 100°C 3 A 25 A 3 A ICM (1) Pulsed Collector Current IF Diode Continous Forward Current (1) @ TC = 100°C I FM Diode Maximum Forward Current PD Maximum Power Dissipation TJ Operating Junction Temperature Tstg Storage Temperature Range -55 to +150 °C TL Maximum Lead Temp. for Soldering Purposes, 1/8” from Case for 5 Seconds 250 °C 25 A 40 W 0.32 W/°C -55 to +150 °C @ TC = 25°C Derating Factor Notes : (1) Repetitive rating : Pulse width limited by max. junction temperature Thermal Characteristics Symbol RθJC (IGBT) RθJA Typ. Max. Units Thermal Resistance, Junction-to-Case Parameter -- 3.1 °C/W Thermal Resistance, Junction-to-Ambient (PCB Mount) (2) -- 100 °C/W Notes : (2) Mounted on 1” squre PCB (FR4 or G-10 Material) ©2006 Semiconductor Components Industries, LLC. October-2017,Rev. 2 Publication Order Number: FGD3N60LSD/D Device Marking Device Package Reel Size Tape Width Quantity FGD3N60LSD FGD3N60LSDTM D-PAK 380mm 16mm 2500 Electrical Characteristics of the IGBT Symbol Parameter TC = 25°C unless otherwise noted Test Conditions Min. Typ. Max. Units Off Characteristics BVCES Collector-Emitter Breakdown Voltage VGE = 0V, IC = 250uA 600 -- -- V ∆BVCES/ ∆TJ Temperature Coefficient of Breakdown Voltage VGE = 0V, IC = 1mA -- 0.6 -- V/°C ICES Collector Cut-Off Current VCE = VCES, VGE = 0V -- -- 250 uA IGES G-E Leakage Current VGE = VGES, VCE = 0V -- -- ± 100 nA IC = 3mA, VCE = VGE 2.5 3.2 5.0 V On Characteristics VGE(th) G-E Threshold Voltage VCE(sat) Collector to Emitter Saturation Voltage IC = 3A, VGE = 10V -- 1.2 1.5 V IC = 6A, VGE = 10V -- 1.8 -- V Dynamic Characteristics Cies Input Capacitance Coes Output Capacitance Cres Reverse Transfer Capacitance VCE = 25V, VGE = 0V, f = 1MHz -- 185 -- pF -- 20 -- pF -- 5.5 -- pF -- 40 -- ns Switching Characteristics td(on) Turn-On Delay Time tr Rise Time td(off) Turn-Off Delay Time tf Eon VCC = 480 V, IC = 3A, RG = 470Ω, VGE = 10V, Inductive Load, TC = 25°C -- 40 -- ns -- 600 -- ns Fall Time -- 600 -- ns Turn-On Switching Loss -- 250 -- uJ Eoff Turn-Off Switching Loss -- 1.00 -- mJ Ets Total Switching Loss -- 1.25 -- mJ -- 40 -- ns -- 45 -- ns td(on) Turn-On Delay Time tr Rise Time VCC = 480 V, IC = 3A, RG = 470Ω, VGE = 10V, Inductive Load, TC = 125°C td(off) Turn-Off Delay Time -- 620 -- ns tf Fall Time -- 800 -- ns Eon Turn-On Switching Loss -- 300 -- uJ Eoff Turn-Off Switching Loss -- 1.9 -- mJ -- 2.2 -- mJ -- 12.5 -- nC -- 2.8 -- nC -- 4.9 -- nC -- 7.5 -- nH Ets Total Switching Loss Qg Total Gate Charge Qge Gate-Emitter Charge Qgc Gate-Collector Charge Le Internal Emitter Inductance VCE = 480 V, IC = 3A, VGE = 10V Measured 5mm from PKG www.onsemi.com 2 FGD3N60LSD IGBT Package Marking and Ordering Information C Symbol VFM trr Irr Qrr = 25°C unless otherwise noted Parameter Diode Forward Voltage Diode Reverse Recovery Time Diode Peak Reverse Recovery Current Test Conditions IF = 3A IF = 3A, di/dt = 100A/us VR = 200V Diode Reverse Recovery Charge www.onsemi.com 3 Min. Typ. Max. Units V TC = 25°C -- 1.5 1.9 TC = 100°C -- 1.55 -- TC = 25°C -- 234 -- TC = 100°C -- -- -- TC = 25°C -- 2.64 -- TC = 100°C -- -- -- TC = 25°C -- 309 -- TC = 100°C -- -- -- ns A nC FGD3N60LSD IGBT Electrical Characteristics of DIODE T FGD3N60LSD IGBT Typical Performance Characteristics Figure 1. Typical Output Characteristics 30 Figure 2. Typical Output Characteristics 30 Common Emitter T C = 25 ° C 20V Common Emitter TC = 125°C 15V Collector Current, IC [A] Collector Current, IC [A] 24 10V 18 V GE = 8V 12 6 20V 24 15V 18 10V VGE = 8V 12 6 0 0 2 4 6 8 0 0 Collector-Emitter Voltage, V CE [V] Figure 3. Typical Output Characteristics 10 T C = 25 ° C Collector Current, IC [A] Collector Current, IC [A] Common Emitter V GE = 10V T C = 125 ° C 6 4 2 8 Common Emitter V CE = 20V T C = 25 °C T C = 125° C 6 4 2 0 0 0.1 1 10 1 Figure 5. Saturation Voltage vs. Case 3 Figure 6. Capacitance Characteristics 600 Comm on Emitter V GE = 10V Com m on Em itter V GE = 0V, f = 1MHz T C = 25 ° C Capacitance [pF] 500 2 IC = 6A IC = 3A 1 10 Gate-Emitter Voltage, V GE[V] Collector-Emitter Voltage, V CE[V] Collector-Emitter Voltage, VCE [V] 8 Figure 4. Transfer Characteristics 10 8 2 4 6 Collector-Emitter Voltage, VCE [V] IC = 1.5A 400 Cies 300 Coes 200 Cres 100 0 0 0 30 60 90 120 150 1 Case Temperature, T C [° C] 10 Collector - Emitter Voltage, V CE [V] www.onsemi.com 4 Figure 7. Gate Charge 12 Figure 8. Turn-On Characteristics vs. Gate Resistance 1000 C o m m o n E m itte r V CC = 4 8 0 V , V GE = 1 0 V Vcc = 480V T C = 25 ° C IC = 3 A Switching Time [ns] Gate - Emitter Voltage, VGE [V] (Continued) Com m on Em itter R L = 160 Ω 10 FGD3N60LSD IGBT Typical Performance Characteristics 8 6 4 T C = 25°C T C = 125°C T on 100 Tr 2 0 0 2 4 6 8 10 10 12 200 400 600 800 1000 G ate R esistance, R G [ Ω ] Gate Charge, Q g [nC] Figure 9. Turn-Off Characteristics vs. Gate Resistance Figure 10. Switching Loss vs. Gate Resistance 10000 10000 Com m on Em itter V CC = 480V, V GE = 10V IC = 3A Eoff T C = 125 ° C Switching Loss [µJ] Switching Time [ns] T C = 25 ° C Toff 1000 Tf 1000 Eon 100 Com m on Em itter V CC = 480V, V GE = 10V IC = 3A T C = 25 ° C 100 200 400 600 T C = 125 °C 10 800 1000 200 400 Gate Resistance, R G [ Ω ] Gate Resistance, R G [Ω ] Figure 11. Turn-On Characteristics vs. Collector Current 600 800 1000 Figure 12. Turn-Off Characteristics vs. Collector Current Common Emitter Vcc = 480V, V GE = 10V RG = 470 Ω 100 1000 T C = 125 ° C Toff Switching Time [ns] Switching Time [ns] T C = 25° C Ton Tr Tf Common Emitter Vcc = 480 V, VGE = 10V RG = 470Ω T C = 25 ° C T C = 125° C 10 2 3 Collector Current, IC [A] 100 4 2 www.onsemi.com 5 3 Collector Current, IC [A] 4 FGD3N60LSD IGBT Typical Performance Characteristics (Continued) Figure 13. Switching Loss vs. Collector Current Figure 14. Forward Characteristics 100 Tc = 25°C Tc = 100°C Common Emitter Vcc = 480 V, VGE = 10V RG = 470Ω TC = 25°C Forward Current, IF [A] Switching Loss [µJ] TC = 125°C Eoff 1000 Eon 10 1 100 0.1 2 3 Collector Current, IC [A] 0 4 Figure 15. Forward Voltage Drop Vs Tj 1 2 3 4 Forward Voltage Drop, VF [V] Figure 16. SOA Characteristics 100 2.8 Collector Current, Ic [A] 2.4 IF=6 A 2.0 1.6 IF=3 A 50µs 10 100µs Ic MAX (Continuous) 1ms 1 DC Operation Single Nonrepetitive Pulse Tc = 25°C Curves must be derated linearly with increase in temperature 0.1 IF=1.5 A 1.2 0.01 25 50 75 100 125 0.1 Junction Temperature, Tj [°C] 1 10 100 Collector - Emitter Voltage, VCE [V] Figure 17. Transient Thermal Impedance of IGBT 10 0 .5 Thermal Response [Zthjc] Forward Voltage Drop, VF [V] Ic MAX (Pulsed) 1 0 .2 0 .1 0 .0 5 0 .1 0 .0 2 Pdm s in g le p u ls e t1 0 .0 1 t2 0 .0 1 1 E -5 Duty factor D = t1 / t2 Peak Tj = Pdm × Zthjc + TC 1 E -4 1 E -3 0 .0 1 0 .1 R e c ta ngula r P uls e D ura tio n [s e c ] www.onsemi.com 6 1 10 1000 FGD3N60LSD IGBT Mechanical Dimensions D-PAK Dimensions in Millimeters www.onsemi.com 7 ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC dba ON Semiconductor or its subsidiaries in the United States and/or other countries. ON Semiconductor owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of ON Semiconductor’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. ON Semiconductor reserves the right to make changes without further notice to any products herein. ON Semiconductor makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does ON Semiconductor assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. Buyer is responsible for its products and applications using ON Semiconductor products, including compliance with all laws, regulations and safety requirements or standards, regardless of any support or applications information provided by ON Semiconductor. “Typical” parameters which may be provided in ON Semiconductor data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. ON Semiconductor does not convey any license under its patent rights nor the rights of others. ON Semiconductor products are not designed, intended, or authorized for use as a critical component in life support systems or any FDA Class 3 medical devices or medical devices with a same or similar classification in a foreign jurisdiction or any devices intended for implantation in the human body. Should Buyer purchase or use ON Semiconductor products for any such unintended or unauthorized application, Buyer shall indemnify and hold ON Semiconductor and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that ON Semiconductor was negligent regarding the design or manufacture of the part. ON Semiconductor is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor 19521 E. 32nd Pkwy, Aurora, Colorado 80011 USA Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada Email: orderlit@onsemi.com ❖ © Semiconductor Components Industries, LLC N. American Technical Support: 800−282−9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81−3−5817−1050 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative www.onsemi.com
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